CN203423895U - Novel power source packaging structure - Google Patents
Novel power source packaging structure Download PDFInfo
- Publication number
- CN203423895U CN203423895U CN201320541518.7U CN201320541518U CN203423895U CN 203423895 U CN203423895 U CN 203423895U CN 201320541518 U CN201320541518 U CN 201320541518U CN 203423895 U CN203423895 U CN 203423895U
- Authority
- CN
- China
- Prior art keywords
- power supply
- power
- outer casing
- power source
- package structure
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004806 packaging method and process Methods 0.000 title abstract 5
- 230000005855 radiation Effects 0.000 claims abstract description 5
- 238000009434 installation Methods 0.000 claims description 9
- 230000000694 effects Effects 0.000 claims description 5
- 238000009423 ventilation Methods 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 230000007704 transition Effects 0.000 claims description 3
- 239000003292 glue Substances 0.000 abstract 1
- 230000000630 rising effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 6
- 238000009413 insulation Methods 0.000 description 4
- 230000011664 signaling Effects 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005194 fractionation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Landscapes
- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a novel power source packaging structure and belongs to the railway industry. The novel power source packaging structure comprises a power source casing, a main board, a base button cover and a fastening part, wherein a main board is mounted in the power source casing upside down and is fixed through the fastening part, the base button cover covers a bottom portion of the power source casing, and the power source casing, the main board, the base button cover and the fastening part are packaged into one body. The novel power source packaging structure improves a heat radiation area to meet heat radiation requirements and effectively reduces temperature rising of internal parts of a power source; the novel power source packaging structure is provided with an air vent, so weight of a product is reduced without abundant glue pouring internally, reliability is improved, protection on an internal circuit and the internal parts is realized, and requirements of the power source for a mounting space are greatly reduced.
Description
Technical field
The utility model belongs to railway territory, particularly a kind of novel power package structure for railway systems.
Background technology
In railway systems, signalling arrangement requires to have high safety and reliability, but the operational environment very severe of signalling arrangement, and its installing space is also extremely limited, this function to the power module constant power type equipment in signalling arrangement or device realizes and Reliability Assurance has proposed acid test.The power module encapsulation of attaching troops to a unit in railway systems signalling arrangement product cabinet mostly at present is bare board and bears extrudate radiator or adopt copper shell encapsulating.
But two kinds of method for packing above, its radiating effect is limited and temperature rise is higher; And bare board is born extrudate radiator, line device is all exposed, easily damages, divulges a secret and affect the normal operation of other equipment; The space needing while simultaneously installing is larger.
Utility model content
In order to address the above problem, the utility model provides a kind of novel power package structure, and this power package structure can be protected power supply internal circuit and device effectively, has increased area of dissipation, has reduced the temperature rise of power supply.
A power package structure, comprise outer casing of power supply, mainboard, end buckle closure and secure component;
Described mainboard back-off packs in outer casing of power supply, by secure component, is fixed, and end buckle closure covers outer casing of power supply bottom, and described outer casing of power supply, mainboard, end buckle closure and secure component are integral encapsulation.
Outer casing of power supply specifically comprises wing, and the height variation place employing oblique angle transition at the bottom of wing wing, has reduced height change to greatest extent on cross-ventilated impact, and the oblique angle that wherein height variation place at the bottom of wing wing adopts is 45 °.
Outer casing of power supply also comprises power device installed surface and louvre, with increasing heat radiation area, meets radiating requirements, and wherein said power device installed surface is provided with fixing hole, coordinates be convenient to power device to be fixed on described power device installed surface with secure component.
Louvre specifically comprises top heat dissipation hole and side louvre, to strengthen the cross-ventilation of enclosure interior, strengthens radiating effect.
Outer casing of power supply also has fixed installation hole, matches that described mainboard is fixed in outer casing of power supply with secure component.
Outer casing of power supply also leaves space, and the height of being convenient to device is laid, and removes and causes the too high hidden danger of this power supply internal components temperature rise because some devices are blocked.
The beneficial effects of the utility model are: the utility model provides a kind of novel power package structure; increased area of dissipation to meet radiating requirements; effectively reduce the temperature rise of power supply internal components; because this novel power package structure is provided with ventilation hole; inside does not need a large amount of encapsulatings to reduce the weight of product; improve reliability, realized the protection to internal circuit and device, also greatly reduced the requirement of power supply to installing space simultaneously.
Accompanying drawing explanation
Overall schematic after the novel power package construction packages that Fig. 1 provides for the utility model completes;
The fractionation schematic diagram of the novel power package structure that Fig. 2 provides for the utility model;
The schematic diagram of the outer casing of power supply of the novel power package structure that Fig. 3 provides for the utility model;
Another schematic diagram of the outer casing of power supply of the novel power package structure that Fig. 4 provides for the utility model.
Number in the figure explanation: 1 is outer casing of power supply; 2 is mainboard; 3 is end buckle closure; 4 is secure component; 5 is wing; 6
For power device installed surface; 7 is louvre; 8 is fixed installation hole; 9 is space.
Embodiment
For the technical characterictic of utility model, object and effect being had more clearly, understand, now contrast accompanying drawing embodiment of the present utility model is described, following examples are only for the utility model is described, but can not be used for limiting protection range of the present utility model.In each figure, identical label represents the identical or structural similarity of structure but the identical parts of function.
The utility model provides a kind of novel power package structure; as shown in Figure 1, power package structure can be protected power supply internal circuit and device effectively, has increased area of dissipation; reduce the temperature rise of power supply, also reduced widely the requirement to installing space simultaneously.
Concrete, as shown in Figure 2, this power package structure comprises outer casing of power supply 1, mainboard 2, end buckle closure 3 and secure component 4; Described mainboard 2 back-offs pack in outer casing of power supply 1, by secure component 4, are fixed, and end buckle closure 3 covers outer casing of power supply 1 bottom, and described outer casing of power supply 1, mainboard 2, end buckle closure 3 are integral encapsulation with secure component 4.Wherein outer casing of power supply is the major part of the utility model power package structure, and end buckle closure is mainly used in insulation, pin explanation and protection, and the Main Function of secure component is to fix and position, the simple structure of this power package structure and be easy to assembling.
Further, as shown in Figure 3, Figure 4, the outer casing of power supply 1 in the utility model embodiment specifically comprises wing 5, power device installed surface 6, louvre 7 and fixed installation hole 8; Wherein the height variation place employing oblique angle transition at the bottom of wing 5 wings, reduces height change to greatest extent on cross-ventilated impact, and preferred in the present embodiment, the oblique angle that height variation place at the bottom of wing wing adopts is 45 °; Power device installed surface 6 is for installation power device, and power device installed surface is provided with fixing hole, coordinate with secure component 4 and be convenient to power device to be fixed on described power device installed surface, preferred, in the present embodiment, power device installed surface is provided with four fixing holes; Louvre 7 specifically comprises again top heat dissipation hole and side louvre, to strengthen the cross-ventilation of enclosure interior, strengthens radiating effect; Fixed installation hole 8 is used for matching that with secure component 4 described mainboard is fixed in outer casing of power supply.
The utility model specifically be take mainboard and is described as pcb board as example, first power device is fixed on power device installed surface in advance, specifically can adopt welding or other measures to ensure that power device can be fixed on relevant position accurately, as mounting limit reed or customization welding tooling, again pcb board back-off is packed in the outer casing of power supply of this utility model, pcb board is fixed on the fixed installation hole of this outer casing of power supply by secure component, concrete, four angles of this outer casing of power supply are equipped with fixed installation hole, therefore need four secure components to coordinate with this fixed installation hole, wherein secure component is specifically as follows trip bolt, further, pcb board can also be coated with one deck silica gel on pcb board surface before packing outer casing of power supply into, to optimize internal heat dissipation structures, preferred, the silica gel thickness 0.5mm-1.2mm smearing.
Accordingly, the utility model outer casing of power supply also leaves space 9, the height of being convenient to power supply internal components is laid, removal causes the too high hidden danger of power supply internal temperature rise because some devices are blocked, decorative border is laid in order to the visual effect of balance protrusion device and louvre in the top of outer casing of power supply simultaneously; Outer casing of power supply is aluminium die cast, the height laying, electric insulation gap, installing space size and the processing realizability that take into full account power, power-efficient, device are reasonably laid wing and power device mounting plane, and increasing heat radiation area meets radiating requirements.
In the utility model, the material of outer casing of power supply is aluminium alloy, the material of base plate cover is epoxy resin, the material of base plate cover also can be replaced by aluminium material simultaneously, and carry out laser welded seam rear surface and paste insulation spacer, when this power package structure need to be considered electromagnetic compatibility, can be fully closed by this power package structural modification, housing and end buckle are changed into aluminium material, copper material, copper-clad plate etc., in bottom, paste insulation spacer after having encapsulated.
The utility model provides a kind of novel power package structure; increased area of dissipation to meet radiating requirements; effectively reduce the temperature rise of power supply internal components; because this novel power package structure is provided with ventilation hole; inside does not need a large amount of encapsulatings to reduce the weight of product; improve reliability, realized the protection to internal circuit and device, also greatly reduced the requirement of power supply to installing space simultaneously.
Although this specification is described according to each embodiment, but not each embodiment only comprises an independently technical scheme, this narrating mode of specification is only for clarity sake, those skilled in the art should make specification as a whole, technical scheme in each embodiment also can, through appropriately combined, form other execution modes that it will be appreciated by those skilled in the art that.This specification is only illustrating for feasibility embodiment of the present utility model; they are not in order to limit protection range of the present utility model; all any modifications of doing, be equal to replacement, improvement etc., within all should being included in protection range of the present utility model within spirit of the present utility model and principle.
Claims (8)
1. a novel power package structure, it is characterized in that, described power package structure comprises outer casing of power supply, mainboard, end buckle closure and secure component, described mainboard back-off packs in outer casing of power supply, by secure component, be fixed, end buckle closure covers outer casing of power supply bottom, and described outer casing of power supply, mainboard, end buckle closure and secure component are integral encapsulation.
2. power package structure as claimed in claim 1, is characterized in that, described outer casing of power supply specifically comprises wing, and the height variation place employing oblique angle transition at the bottom of wing wing, has reduced height change to greatest extent on cross-ventilated impact.
3. power package structure as claimed in claim 2, is characterized in that, the oblique angle that height variation place at the bottom of described wing wing adopts is 45 °.
4. power package structure as claimed in claim 1, it is characterized in that, described outer casing of power supply also comprises power device installed surface and louvre, with increasing heat radiation area, meet radiating requirements, wherein said power device installed surface is provided with fixing hole, coordinates be convenient to power device to be fixed on described power device installed surface with secure component.
5. power package structure as claimed in claim 4, is characterized in that, described louvre specifically comprises top heat dissipation hole and side louvre, to strengthen the cross-ventilation of enclosure interior, strengthens radiating effect.
6. power package structure as claimed in claim 1, is characterized in that, described outer casing of power supply also has fixed installation hole, matches that described mainboard is fixed in outer casing of power supply with secure component.
7. the power package structure as described in claim 4 or 6, is characterized in that, described secure component is screw.
8. power package structure as claimed in claim 1, is characterized in that, described outer casing of power supply also leaves space, and the height of being convenient to device is laid, and removes and causes the too high hidden danger of this power supply internal components temperature rise because some devices are blocked.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320541518.7U CN203423895U (en) | 2013-09-03 | 2013-09-03 | Novel power source packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320541518.7U CN203423895U (en) | 2013-09-03 | 2013-09-03 | Novel power source packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203423895U true CN203423895U (en) | 2014-02-05 |
Family
ID=50022984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320541518.7U Expired - Fee Related CN203423895U (en) | 2013-09-03 | 2013-09-03 | Novel power source packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203423895U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104377940A (en) * | 2014-12-11 | 2015-02-25 | 四川升华电源科技有限公司 | Well-radiating module power supply |
| CN104602479A (en) * | 2015-01-22 | 2015-05-06 | 广州金升阳科技有限公司 | Manufacturing method of power supply module with radiating substrate, shell and assembled semi-finished product thereof, and power supply module |
-
2013
- 2013-09-03 CN CN201320541518.7U patent/CN203423895U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104377940A (en) * | 2014-12-11 | 2015-02-25 | 四川升华电源科技有限公司 | Well-radiating module power supply |
| CN104377940B (en) * | 2014-12-11 | 2016-03-16 | 四川升华电源科技有限公司 | The modular power source that a kind of thermal diffusivity is good |
| CN104602479A (en) * | 2015-01-22 | 2015-05-06 | 广州金升阳科技有限公司 | Manufacturing method of power supply module with radiating substrate, shell and assembled semi-finished product thereof, and power supply module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: BEIJING JIAODA SINUO TECHNOLOGY CO., LTD. Free format text: FORMER NAME: JIAODA SINUO SCIENCE AND TECHNOLOGY CO., LTD., BEIJING |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 100081 Beijing city Haidian District Daliushu Road Fuhai Center Building 2, Fuhai building 1608 Patentee after: BEIJING JIAODA SIGNAL TECHNOLOGY Co.,Ltd. Patentee after: BEIJING XIGENUO TECHNOLOGY Co.,Ltd. Address before: 100081 Beijing city Haidian District Daliushu Road Fuhai Center Building 2, Fuhai building 1608 Patentee before: BEIJING JIAODA SIGNAL TECHNOLOGY Co.,Ltd. Patentee before: Beijing Xigenuo Technology Co.,Ltd. |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160106 Address after: 100081 Beijing City, Haidian District Road No. 2 building Daliushu center Fuhai Fuhai building room 1608 Patentee after: BEIJING JIAODA SIGNAL TECHNOLOGY Co.,Ltd. Address before: 100081 Beijing city Haidian District Daliushu Road Fuhai Center Building 2, Fuhai building 1608 Patentee before: BEIJING JIAODA SIGNAL TECHNOLOGY Co.,Ltd. Patentee before: Beijing Xigenuo Technology Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140205 Termination date: 20210903 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |