CN108565328B - 发光器件封装 - Google Patents

发光器件封装 Download PDF

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Publication number
CN108565328B
CN108565328B CN201810311516.6A CN201810311516A CN108565328B CN 108565328 B CN108565328 B CN 108565328B CN 201810311516 A CN201810311516 A CN 201810311516A CN 108565328 B CN108565328 B CN 108565328B
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China
Prior art keywords
light emitting
light
emitting device
region
substrate
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CN201810311516.6A
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English (en)
Chinese (zh)
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CN108565328A (zh
Inventor
金炳穆
小平洋
金夏罗
反田祐一郎
大关聪司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Liyu Semiconductor Co ltd
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LG Innotek Co Ltd
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Publication of CN108565328A publication Critical patent/CN108565328A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
CN201810311516.6A 2013-01-08 2014-01-08 发光器件封装 Active CN108565328B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020130002145A KR102071424B1 (ko) 2013-01-08 2013-01-08 발광소자 패키지
KR10-2013-0002145 2013-01-08
CN201410008737.8A CN103915543B (zh) 2013-01-08 2014-01-08 发光器件封装

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201410008737.8A Division CN103915543B (zh) 2013-01-08 2014-01-08 发光器件封装

Publications (2)

Publication Number Publication Date
CN108565328A CN108565328A (zh) 2018-09-21
CN108565328B true CN108565328B (zh) 2021-05-18

Family

ID=49886849

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201810311516.6A Active CN108565328B (zh) 2013-01-08 2014-01-08 发光器件封装
CN201410008737.8A Active CN103915543B (zh) 2013-01-08 2014-01-08 发光器件封装

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201410008737.8A Active CN103915543B (zh) 2013-01-08 2014-01-08 发光器件封装

Country Status (5)

Country Link
US (1) US9337403B2 (https=)
EP (1) EP2752896B1 (https=)
JP (2) JP6322416B2 (https=)
KR (1) KR102071424B1 (https=)
CN (2) CN108565328B (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9902644B2 (en) 2014-06-19 2018-02-27 Corning Incorporated Aluminosilicate glasses
CN109154762B (zh) * 2016-05-19 2021-10-26 苏州乐琻半导体有限公司 闪光灯模块和包括闪光灯模块的终端
CN109560461A (zh) * 2017-09-26 2019-04-02 青岛海信激光显示股份有限公司 一种激光器阵列
CN109491139A (zh) * 2018-10-31 2019-03-19 武汉华星光电技术有限公司 背光源的制作方法
US11468712B2 (en) * 2020-01-09 2022-10-11 AuthenX Inc. Liveness detection apparatus, system and method
US20210334505A1 (en) * 2020-01-09 2021-10-28 AuthenX Inc. Image capturing system and method for capturing image
CN114038973B (zh) * 2021-08-10 2023-06-16 重庆康佳光电技术研究院有限公司 发光器件及其制作方法和测试方法
FR3143721B1 (fr) * 2022-12-19 2024-12-13 Valeo Vision Dispositif lumineux pour véhicule automobile.

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* Cited by examiner, † Cited by third party
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JP4430264B2 (ja) * 2001-03-19 2010-03-10 日亜化学工業株式会社 表面実装型発光装置
JP2005038956A (ja) * 2003-07-17 2005-02-10 Matsushita Electric Ind Co Ltd 光部品とその製造方法
JP4228303B2 (ja) * 2004-04-12 2009-02-25 住友電気工業株式会社 半導体発光素子搭載部材と、それを用いた半導体発光装置
JP2005347564A (ja) * 2004-06-03 2005-12-15 Nec Compound Semiconductor Devices Ltd 気密封止パッケージ
KR100709890B1 (ko) * 2004-09-10 2007-04-20 서울반도체 주식회사 다중 몰딩수지를 갖는 발광다이오드 패키지
JP4661147B2 (ja) * 2004-09-24 2011-03-30 日亜化学工業株式会社 半導体装置
JP4890775B2 (ja) * 2005-03-23 2012-03-07 パナソニック株式会社 発光モジュール
JP2007080868A (ja) * 2005-09-09 2007-03-29 Matsushita Electric Works Ltd 発光装置
JP2007189031A (ja) * 2006-01-12 2007-07-26 Allied Material Corp 半導体素子搭載用部材とそれを用いた半導体装置および発光ダイオード
US7528422B2 (en) * 2006-01-20 2009-05-05 Hymite A/S Package for a light emitting element with integrated electrostatic discharge protection
DE102006015377B4 (de) * 2006-04-03 2018-06-14 Ivoclar Vivadent Ag Halbleiter-Strahlungsquelle sowie Lichthärtgerät
JP5233172B2 (ja) * 2007-06-07 2013-07-10 日亜化学工業株式会社 半導体発光装置
JP5136215B2 (ja) * 2008-05-29 2013-02-06 住友ベークライト株式会社 半導体装置
KR101266226B1 (ko) * 2008-07-09 2013-05-21 우시오덴키 가부시키가이샤 발광 장치 및 발광 장치의 제조 방법
US7800125B2 (en) * 2008-07-09 2010-09-21 Himax Display, Inc. Light-emitting diode package
JP2010177375A (ja) * 2009-01-28 2010-08-12 Citizen Electronics Co Ltd 発光装置及び発光装置の製造方法
JP2010251686A (ja) * 2009-03-26 2010-11-04 Harison Toshiba Lighting Corp 発光装置及びその製造方法
WO2010136920A1 (en) * 2009-05-28 2010-12-02 Koninklijke Philips Electronics N.V. Illumination device with an envelope enclosing a light source
JP2011014587A (ja) * 2009-06-30 2011-01-20 Nichia Corp 発光装置
WO2012053386A1 (ja) * 2010-10-21 2012-04-26 シーシーエス株式会社 発光装置の製造方法及び発光装置
CN103403894B (zh) * 2011-03-07 2016-10-26 皇家飞利浦有限公司 发光模块、灯、照明器和显示装置
TW201246615A (en) * 2011-05-11 2012-11-16 Siliconware Precision Industries Co Ltd Package structure and method of making same
JP5968674B2 (ja) * 2011-05-13 2016-08-10 エルジー イノテック カンパニー リミテッド 発光素子パッケージ及びこれを備える紫外線ランプ
US8860059B2 (en) * 2011-06-20 2014-10-14 Xiamen Sanan Optoelectronics Technology Co., Ltd. Light emitting devices, systems, and methods of manufacturing
JP2013016272A (ja) * 2011-06-30 2013-01-24 Canon Inc 表示装置
US9169017B2 (en) * 2012-02-15 2015-10-27 The Boeing Company Aircraft interior lighting system using structured micro lens arrays

Also Published As

Publication number Publication date
EP2752896A3 (en) 2016-07-20
JP6641407B2 (ja) 2020-02-05
JP2014135488A (ja) 2014-07-24
CN103915543B (zh) 2018-05-04
JP6322416B2 (ja) 2018-05-09
KR20140089984A (ko) 2014-07-16
US9337403B2 (en) 2016-05-10
EP2752896B1 (en) 2020-10-07
KR102071424B1 (ko) 2020-01-30
EP2752896A2 (en) 2014-07-09
CN108565328A (zh) 2018-09-21
CN103915543A (zh) 2014-07-09
US20140191276A1 (en) 2014-07-10
JP2018139298A (ja) 2018-09-06

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Effective date of registration: 20210802

Address after: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Patentee after: Suzhou Leyu Semiconductor Co.,Ltd.

Address before: Seoul City, Korea

Patentee before: LG INNOTEK Co.,Ltd.

TR01 Transfer of patent right
CP03 Change of name, title or address

Address after: 215499 No. 168, Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Patentee after: Suzhou Liyu Semiconductor Co.,Ltd.

Country or region after: China

Address before: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Patentee before: Suzhou Leyu Semiconductor Co.,Ltd.

Country or region before: China

CP03 Change of name, title or address