CN108508028B - 在晶片检验期间确定定位于收集孔隙中的光学元件的配置 - Google Patents

在晶片检验期间确定定位于收集孔隙中的光学元件的配置 Download PDF

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CN108508028B
CN108508028B CN201810473396.XA CN201810473396A CN108508028B CN 108508028 B CN108508028 B CN 108508028B CN 201810473396 A CN201810473396 A CN 201810473396A CN 108508028 B CN108508028 B CN 108508028B
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collection
wafer
aperture
images
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CN108508028A (zh
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P·科尔钦
M·奥利莱
魏军伟
D·卡普
G·陈
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KLA Corp
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KLA Tencor Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47—Scattering, i.e. diffuse reflection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95623—Inspecting patterns on the surface of objects using a spatial filtering method
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/066—Modifiable path; multiple paths in one sample
    • G01N2201/0668—Multiple paths; optimisable path length

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
CN201810473396.XA 2014-06-26 2015-06-26 在晶片检验期间确定定位于收集孔隙中的光学元件的配置 Active CN108508028B (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201462017264P 2014-06-26 2014-06-26
US62/017,264 2014-06-26
US201562111402P 2015-02-03 2015-02-03
US62/111,402 2015-02-03
US14/749,564 2015-06-24
US14/749,564 US9709510B2 (en) 2014-06-26 2015-06-24 Determining a configuration for an optical element positioned in a collection aperture during wafer inspection
CN201580029498.7A CN106415249B (zh) 2014-06-26 2015-06-26 在晶片检验期间确定定位于收集孔隙中的光学元件的配置

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CN201580029498.7A Division CN106415249B (zh) 2014-06-26 2015-06-26 在晶片检验期间确定定位于收集孔隙中的光学元件的配置

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CN108508028A CN108508028A (zh) 2018-09-07
CN108508028B true CN108508028B (zh) 2021-03-09

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CN201580029498.7A Active CN106415249B (zh) 2014-06-26 2015-06-26 在晶片检验期间确定定位于收集孔隙中的光学元件的配置

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US (2) US9709510B2 (enExample)
JP (1) JP6652511B2 (enExample)
KR (1) KR102269512B1 (enExample)
CN (2) CN108508028B (enExample)
IL (1) IL248647B (enExample)
WO (1) WO2015200856A1 (enExample)

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US11255797B2 (en) 2019-07-09 2022-02-22 Kla Corporation Strontium tetraborate as optical glass material
KR20220091544A (ko) 2019-11-04 2022-06-30 도쿄엘렉트론가부시키가이샤 복수의 웨이퍼 검사 시스템(wis) 모듈을 교정하는 시스템 및 방법
US11168978B2 (en) 2020-01-06 2021-11-09 Tokyo Electron Limited Hardware improvements and methods for the analysis of a spinning reflective substrates
JP7671558B2 (ja) 2020-03-10 2025-05-02 東京エレクトロン株式会社 トラックシステムに統合するための長波赤外線熱センサ
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US12072606B2 (en) 2021-07-30 2024-08-27 Kla Corporation Protective coating for nonlinear optical crystal
KR102695451B1 (ko) * 2021-12-03 2024-08-23 참엔지니어링(주) 하전입자를 이용한 시료 처리 장치
US11899338B2 (en) 2021-12-11 2024-02-13 Kla Corporation Deep ultraviolet laser using strontium tetraborate for frequency conversion
EP4339703A1 (en) * 2022-09-13 2024-03-20 ASML Netherlands B.V. Metrology method and associated metrology device
WO2024056296A1 (en) * 2022-09-13 2024-03-21 Asml Netherlands B.V. Metrology method and associated metrology device

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Publication number Publication date
US9709510B2 (en) 2017-07-18
KR102269512B1 (ko) 2021-06-24
US20170292918A1 (en) 2017-10-12
CN108508028A (zh) 2018-09-07
US20150377797A1 (en) 2015-12-31
CN106415249B (zh) 2018-06-12
JP2017527780A (ja) 2017-09-21
KR20170021830A (ko) 2017-02-28
IL248647A0 (en) 2017-01-31
JP6652511B2 (ja) 2020-02-26
CN106415249A (zh) 2017-02-15
IL248647B (en) 2020-05-31
US10215713B2 (en) 2019-02-26
WO2015200856A1 (en) 2015-12-30

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