CN1084529C - 电路板接线柱的连接件 - Google Patents

电路板接线柱的连接件 Download PDF

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CN1084529C
CN1084529C CN96199882A CN96199882A CN1084529C CN 1084529 C CN1084529 C CN 1084529C CN 96199882 A CN96199882 A CN 96199882A CN 96199882 A CN96199882 A CN 96199882A CN 1084529 C CN1084529 C CN 1084529C
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circuit board
connector
conductor
pressure
flexible circuit
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CN1208506A (zh
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迈克尔·P·托德
安德鲁·Z·格洛瓦斯基
彼得·J·辛库那斯
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Ford Motor Co
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/59Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits
    • H05K3/365Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10393Clamping a component by an element or a set of elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10598Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/167Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment

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  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

一种接线柱连接件(10),包括:一细长主体(11);从所述主体(11)延伸的卡扣臂(13);从主体(11)延伸、用于施加压力的凸起(14)。每一个卡扣臂(13)位于主体(11)的一端上,位于所述卡扣臂(13)之间的是若干凸起(14),这些凸起(14)用于产生压力点,所述压力点之间具有间隔,所述压力点与导电体对剂,从而对所说的这些导电体施加压力而实现电连接。

Description

电路板接线柱的连接件
本发明涉及电连接的形成。
将基片上所形成的印刷的铜导体与其它导电体连接起来这是已知的。已有的技术是使用一种被拴附在电路板上的连接件或者一种模压的互连装置。另外,将诸如电容器、集成电路以及电阻等电组件连接到沿基片布置的导电体上这也是已知的。这样的电连接要使用热和焊剂才能做出。由于要花费时间和成本,并且在这样一个处理过程中可能引起零部件的损坏,所以使用热和焊剂有缺点。
此外,用机械压制的方法也可形成电连接,这也是已知的。然而,在采用机械压制的方法时,在提供均匀压力和保证有足够的压力来形成电连接以及使其在各种操作条件下(例如在振动和温度变化的条件下)均具有可靠的功能等诸多方面均存在困难。
从DE-A 4136204中可知这种类型的电连接装置,它包括:一个可拆卸的连接件,一个柔性电路片,其所具有的第一构型为带有平行的条状导体;一个电路板,其所具有的第二构型为带有平行的条状导体;用于把所说的连接件卡固在所说的电路板上的卡固装置,电路板上的导体与柔性电路片上的导体对齐并面对着柔性电路片上的导体,并且所说的第一和第二构型通常是彼此相一致的,所说的连接件所具有的形状适于在柔性电路片与电路板之间施加压力,所说的连接件具有一个带压力点的细长体,所述压力点从所述细长体朝着所说的柔性电路片延伸,并与所说的条状导体对齐,以把压力集中在所说的条状导体上,所说的电路板还包括用于接纳卡固装置的开口,所说的柔性电路片与所说的电路板上具有对齐的开口,它们用于接纳从所说的连接件上延伸的校准销。在这种装置中,连接件是一个单独的部件,在连接件主体的每一端用螺钉将该连接件卡固到电路板上。
需要有一种机械连接能以更加易于装配并提供可靠的压制力的形式来提供足够的压力。
按照本发明,提供了一种电连接装置,其包括:一个可拆卸的连接件;一个柔性电路片,其所具有的第一构型为带有平行的条状导体;一个电路板,其所具有的第二构型为带有平行的条状导体;用于装所说的连接件连接到所说的电路板上的卡固装置;电路板上的导体与柔性电路片上的导体对齐,并且面对着柔性电路片上的导体;所说的第一和第二构型是彼此相一致的;所说连接件具有的形状适于在柔性电路片与电路板之间施加压力;所说的连接件具有一个带有压力点的细长主体,所述压力点从细长主体朝着所说的柔性的电路片延伸,并与所说的条状导体对齐,从而将压力集中在所说的条状导体上;所说的电路板还包括用于接纳卡固装置的开口,所说的柔性电路片和所说的电路板上具有用于接纳从所说的连接件延伸的校准销的校准口;其特征在于:该连接件与所述电路板整体模压而成,该连接件包括从连接件主体的每一端延伸的锁卡扣臂,所说的锁卡扣臂构成所说的卡固装置,所说的卡扣臂与所说的电路板上的接纳用的开口对齐,并穿过该开口而与电路板相卡合,以在该装置的部件之间施加压力。
本发明的接线柱连接件不需要焊接到基板上,也消除了对传统连接件的需要,并省去了与之相关的花费。在接线柱连接件作为一个较大的塑料组件的一部分被模压的情况下,当从残余的材料上模压所述的接线柱连接件时,基本不会增加该卡紧装置的成本。
现在将通过举例、并参照附图来进一步描述本发明,其中:
图1是本发明实施例所述的接线柱连接件的侧视图;
图2是用于接纳接线柱连接件的、带有导电体的柔性电路片的平面图;
图3是在未装配状态下接线柱连接件和接纳连接件的基片的侧视图;
图4是在装配状态下接线柱连接件和基片的侧视图;
图5是在未装配状态下接线柱连接件和接纳连接件的基片的立体图。
参照图1,一个卡紧装置10包含一个细长的主体11,细长的主体11的每一端都有一个导引销12和一个卡扣臂13。沿着主体11,在与导引销12相同的一侧有若干压力点14,这些压力点14足够硬,以对导电体施加压力,从而确保电连接。主体11的两端之间的距离最好小于15厘米(6英寸),以便沿主体11的长度方向施加基本均匀的压力。主体11不必是平面的,它可以包含一个曲线部分。这样的一个曲线部分适用于同安装在一个相似的曲线表面上的导电体相匹配。
参照图2,一个柔性电路片20上具有若干与压力点14对齐的导电体21。导引孔22位于这些导电体21的两端并接纳导引销12。柔性基片20的边缘是这样的,即,卡扣13能够环绕着该边缘咬住基片并且使卡紧装置10紧固到电路片20上。
有利的是,卡扣13之间的间隔足够小,以使得对于由压力点14向导电体21施加压力不足的点来说主体11不会弯曲。用于卡紧装置10的典型材料是工程热塑性聚合物,例如:丙烯腈丁二烯苯乙烯共聚物(ABS),聚丙烯,聚苯乙烯,聚醚酰亚胺(polyetherimide),聚醚砜(polyethersulfone),但并不局限于上述这些聚合物;或者是热固性聚合物,例如:苯醛树脂,聚氨酯,或者是环氧树脂,但并不局限于这些聚合物。所有这样的系统可使用填充材料,以有利地增加材料模量并减少对蠕变的灵敏度。
参见图3、图4和图5,接线柱连接件10被连在一个电路板30上,电路板30具有压力扣件接纳孔31,该孔31用来接纳压力卡扣件13。电路板30还具有一对间隔开的校准口32,当校准销12穿过柔性电路片20的校准口22时,所述校准口32用于接纳校准销12。柔性电路片20上的铜导体21与电路板30上的铜导体33以及接线柱连接件10上的压力点14对齐。其结果是,一个快速有效的组装过程可用于产生可靠的电连接而无需使用热能。有利的是,密封时接线柱连接件10与电路板30的间隔是这样的,即,当处在较佳的情况下,压力点14对柔性电路片20上的导体21和电路板30上的导体33施加的压力约为35-700kPa(每平方英寸5-100磅)。

Claims (2)

1.一种电连接装置,包括:
一个可拆卸的连接件(10);一个柔性电路片(20),其所具有的第一构型为带有平行的条状导体(21);一个电路板(30),其所具有的第二构型为带有平行的条状导体(33);用于将所说的连接件(10)连接到所说的电路板上的卡固装置(13);电路板(30)上的导体(33)与柔性电路片(20)上的导体(21)对齐,并且面对着柔性电路片(20)上的导体(21);所说的第一和第二构型是彼此相一致的;所说连接件(10)所具有的形状适于在柔性电路片(20)与电路板(30)之间施加压力;
所说的连接件(10)具有一个带有压力点(14)的细长主体(11),所述压力点(14)从细长主体(11)朝着所说的柔性电路片延伸,并与所说的条状导体对齐,从而将压力集中在所说的条状导体上;
所说的电路板(30)还包括用于接纳卡固装置(13)的开口(31),所说的柔性电路片(20)和所说的电路板(30)上具有用于接纳从所说的连接件(10)延伸的校准销(12)的校准口;
其特征在于:
该连接件(10)与所述电路板整体模压而成,该连接件(10)包括从连接件主体(11)的每一端延伸的锁卡扣臂(13),所说的锁卡扣臂(13)构成所说的卡固装置,所说的卡扣臂与所说的电路板上的接纳用的开口(31)对齐,并穿过该开口(31)而与电路板(30)相卡合,以在该装置的部件之间施加压力。
2.如权利要求1所述的电连接装置,其特征在于:连接件主体(11)包含一个曲线部分,该曲线部分适用于与安装在一个相似的曲线表面上的导电体相匹配。
CN96199882A 1996-02-05 1996-12-11 电路板接线柱的连接件 Expired - Fee Related CN1084529C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/596,841 US5752851A (en) 1996-02-05 1996-02-05 Circuit clip connector
US08/596,841 1996-02-05

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CN1084529C true CN1084529C (zh) 2002-05-08

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US (1) US5752851A (zh)
EP (1) EP0879489B1 (zh)
JP (1) JPH09223530A (zh)
CN (1) CN1084529C (zh)
AU (2) AU1104197A (zh)
CA (1) CA2196627A1 (zh)
DE (1) DE69607216T2 (zh)
ES (1) ES2143247T3 (zh)
WO (1) WO1997029526A1 (zh)

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US5752851A (en) 1998-05-19
WO1997029526A1 (en) 1997-08-14
CN1208506A (zh) 1999-02-17
AU1241897A (en) 1997-08-14
EP0879489A1 (en) 1998-11-25
CA2196627A1 (en) 1997-08-06
EP0879489B1 (en) 2000-03-15
DE69607216D1 (de) 2000-04-20
AU724007B2 (en) 2000-09-07
ES2143247T3 (es) 2000-05-01
DE69607216T2 (de) 2000-11-23
JPH09223530A (ja) 1997-08-26

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