CN108398665A - 用于基片集成波导转换的具有超宽频带波导的雷达组件 - Google Patents
用于基片集成波导转换的具有超宽频带波导的雷达组件 Download PDFInfo
- Publication number
- CN108398665A CN108398665A CN201810122408.4A CN201810122408A CN108398665A CN 108398665 A CN108398665 A CN 108398665A CN 201810122408 A CN201810122408 A CN 201810122408A CN 108398665 A CN108398665 A CN 108398665A
- Authority
- CN
- China
- Prior art keywords
- layer
- conversion
- component
- electromagnetic energy
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000006243 chemical reaction Methods 0.000 title claims abstract description 34
- 239000000758 substrate Substances 0.000 title claims abstract description 20
- 230000010354 integration Effects 0.000 title claims abstract description 16
- 239000004020 conductor Substances 0.000 claims abstract description 22
- 230000000644 propagated effect Effects 0.000 claims description 6
- 238000012512 characterization method Methods 0.000 claims description 4
- 230000001902 propagating effect Effects 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000002596 correlated effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/12—Hollow waveguides
- H01P3/121—Hollow waveguides integrated in a substrate
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
- G01S13/02—Systems using reflection of radio waves, e.g. primary radar systems; Analogous systems
- G01S13/0209—Systems with very large relative bandwidth, i.e. larger than 10 %, e.g. baseband, pulse, carrier-free, ultrawideband
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
- H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
- H01P5/024—Transitions between lines of the same kind and shape, but with different dimensions between hollow waveguides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Manufacturing & Machinery (AREA)
- Computer Networks & Wireless Communication (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Radar Systems Or Details Thereof (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Waveguide Aerials (AREA)
Abstract
公开了一种用于基片集成波导转换的具有超宽频带波导的雷达组件。一种雷达组件(10)包括矩形波导(12)(RWG(12))和印刷电路板(18)。所述矩形波导(12)(RWG(12))以横电波模式(TE10)且以第一方向(16)传播电磁能量(14)。所述印刷电路板(18)包括多个互相平行定向的导体层(20)。所述印刷电路板(18)限定以横电波模式(TE10)且以垂直于第一方向(16)的第二方向(26)传播所述电磁能量(14)的基片集成波导(24)(SIW(24)),并且限定将所述电磁能量(14)在所述矩形波导(12)和所述基片集成波导(24)之间传播的转换(30)。所述转换(30)包括由所述多个导体层中至少三个限定的孔(32)。
Description
技术领域
本公开大体涉及一种雷达组件,并且更具体地涉及矩形波导(RWG)和基片集成波导(SIW)之间的转换,其中转换包括由也限定SIW的印刷电路板的多个导体层中至少三个导体层限定的孔。
背景技术
宽频带转换被用于宽频带雷达系统,诸如汽车雷达。具有足够带宽的已知转换包括不期望地昂贵的波导法兰或金属结构,其中严格的容差增加成本。
发明内容
本文描述的是使用标准印刷电路板(PCB)工艺形成的宽频带转换,因此能够避免使用昂贵的波导法兰或金属结构。本文描述的非限制性示例提供矩形波导(RWG)和基片集成波导(SIW)之间的转换,该转换适用于例如在79GHz基本频率周围具有16GHz带宽的电磁能量。该转换适用于使用标准PCB制造工艺的超近程雷达(USRR)等紧凑的多层印刷电路板(PCB)结构。
根据一个实施例,提供了一种雷达组件。该组件包括矩形波导(RWG)和印刷电路板。矩形波导(RWG)以横电波模式(TE10)且以第一方向传播电磁能量。印刷电路板包括多个互相平行定向的导体层。印刷电路板限定以横电波模式(TE10)且以垂直于第一方向的第二方向传播电磁能量的基片集成波导(SIW),并且限定了将电磁能量在矩形波导和基片集成波导之间传播的转换。该转换包括由多个导体层中至少三个导体层限定的孔。
阅读优选实施例的下列详细描述并参考各个附图,进一步的特征和优点将更加显而易见,优选实施例只是作为非限制性示例给出的。
附图说明
现在将参考各个附图通过示例的方式来描述本发明,其中:
图1是根据一个实施例的雷达组件的等距视图;
图2是根据一个实施例的图1的雷达组件的一部分的俯视图;
图3是根据一个实施例的图1的雷达组件的一部分的横截面侧视图。
具体实施方式
图1、图2、和图3合作示出了雷达组件10(下文称为组件10)的非限制性示例。组件10可以是较大的雷达系统(未示出)的一部分,其中组件10在用于将电磁能量在雷达系统中从一个位置传播到另一个位置的不同类型的波导之间提供转换方式。
组件10包括将电磁能量14以横电波模式(TE10)并以第一方向16传播的矩形波导12或RWG 12。第一方向16被示出为双向箭头,因为,如本领域技术人员将认识到的,RWG 12可被用于将电磁能量14传播到(即,朝向)组件10,或传播出(即,远离)组件10。RWG 12的物理尺寸基于使用众所周知的设计规则的雷达系统的操作频率来选择。
组件10还包括印刷电路板18,该印刷电路板18包括多个互相平行定向的导体层20。用于介电层22和多个导体层20的物理尺寸和材料是基于使用众所周知的雷达系统的操作频率来选择的。作为示例而非限制,多个导体层20可包括八个导体层:L1、L2、L3、L4、L5、L6、L7、和L8(图3)。这些导体层中的一些(例如L3-L8)可被配置(例如,使用已知的光刻技术来处理)以限定基片集成波导24或SIW 24,该基片集成波导24或SIW 24将电磁能量14传播或使用横电波模式(TE10)将电磁能14以垂直于第一方向16的第二方向26传播。在这个示例中,层L8还被配置成限定槽式辐射器28,该槽式辐射器28可被用于将来自SIW 24的电磁能量14耦合到例如天线(未示出)。
组件10,或更具体地印刷电路板18,还包括或限定将电磁能量14在矩形波导12和基片集成波导24之间传播的转换30。如上所述,构想到,电磁能量14可以在任意方向;从矩形波导12到基片集成波导24,或从基片集成波导24到矩形波导12。转换30包括多个导体层30中至少三个导体层(例如L1-L3)限定的多个孔32。就是说,转换30包括孔的至少三个实例或由孔的至少三个实例限定。在这个示例中,转换30包括多个导体层20的与矩形波导12相邻或接触的第一层10A(L1)或由其限定。第一层20A限定由第一尺寸34表征的第一孔32A。转换30还包括多个导体层20的与基片集成波导24相邻的最后一层20B(L3),其中最后一层20B还限定基片集成波导24的水平边界36。相对于转换30,最后一层20B限定由大于第一尺寸34A的最后尺寸34B表征的最后一个孔32B。
转换30还包括位于转换30的第一层20A和最后一层20B之间的多个导体层20的中间层20C的一个或多个实例,或由其限定。中间层20C限定中间孔32C,中间孔34C由具有在第一尺寸34A和最后尺寸34B之间的值的中间尺寸34C表征。构想到,转换30可以在第一层20A和最后一层20B之间具有多于单个实例的中间层20C,使得转换30将包括孔32的多于三个实例或由其形成。就是说,构想到,除了第一孔32A和最后孔32B之间的中间孔32C外,转换30还可以包括附加孔。孔32的尺寸的数列或变化可以通过使用已知的设计技术来确定或优化。例如,孔32的尺寸可以在3D-EM软件HFSS上优化,以在宽频率范围上在RWG 12和SIW 24之间有效地传送能量和阻抗匹配。
为了减少从转换30漏出的电磁能量14的量,因此在矩形波导12和基片集成波导24之间不连通。转换30还可以包括用于限定转换30的垂直边界40的短壁38的一个或多个实例。短壁38可以由通孔42的布置形成,短壁可以是用于限定SIW 24的通孔42的一部分。
因此,提供了一种雷达组件(组件10)。组件10通过使用多层PCB(印刷电路板18)的内层提供了矩形波导12(RWG 12)和基片集成波导24(SIW 24)之间的宽频带转换(转换30),用于在电磁波谱的W带中操作。转换由穿过导电层的一系列孔(例如,L1至L3)形成。通过使用通常用于W带的标准PCB处理技术处理的多层PCB有利地且经济地提供了转换30。这样,不需要特殊的法兰或金属结构,因此避免了昂贵和严格容差的相关特征。
尽管已经根据本发明的优选实施例描述了本发明,但是并不旨在受限于此,而是仅受随后的权利要求书中所阐述的范围限制。
Claims (4)
1.一种雷达组件(10),包括:
矩形波导(12)(RWG(12)),以横电波模式(TE10)且以第一方向(16)传播电磁能量(14);以及
印刷电路板(18),包括互相平行定向的多个导体层(20),所述印刷电路板(18)限定以横电波模式(TE10)且以垂直于所述第一方向(16)的第二方向(26)传播电磁能量(14)的基片集成波导(24)(SIW(24)),并且限定将所述电磁能量(14)在所述矩形波导(12)和所述基片集成波导(24)之间传播的转换(30),其中所述转换(30)包括由所述多个导体层(20)中至少三个导体层限定的孔(32)。
2.根据权利要求1所述的组件(10),其中所述多个导体层(20)中的第一层(20A)与所述矩形波导(12)相邻,所述第一层(20A)限定由第一尺寸(34)表征的第一孔(32A),并且所述多个导体层(20)的最后一层(20B)与所述基片集成波导(24)相邻并且限定所述基片集成波导(24)的水平边界(36),所述最后一层(20B)限定由大于所述第一尺寸(34)的最后尺寸(34B)表征的最后孔(32B)。
3.根据权利要求2所述的组件(10),其中所述多个导体层(20)的中间层(20C)位于所述转换(30)的所述第一层(20A)和所述最后层(20B)之间,所述中间层(20C)限定由在所述最后尺寸(34B)和所述第一尺寸(34)之间的中间尺寸(34C)表征的中间孔(32C)。
4.根据权利要求1所述的组件(10),其中所述转换(30)包括限定所述转换(30)的垂直边界(40)的短壁。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202310980983.9A CN116916543A (zh) | 2017-02-08 | 2018-02-07 | 用于基片集成波导转换的具有超宽频带波导的雷达组件 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/427,769 US10468736B2 (en) | 2017-02-08 | 2017-02-08 | Radar assembly with ultra wide band waveguide to substrate integrated waveguide transition |
US15/427,769 | 2017-02-08 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202310980983.9A Division CN116916543A (zh) | 2017-02-08 | 2018-02-07 | 用于基片集成波导转换的具有超宽频带波导的雷达组件 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108398665A true CN108398665A (zh) | 2018-08-14 |
CN108398665B CN108398665B (zh) | 2023-07-21 |
Family
ID=61024632
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202310980983.9A Pending CN116916543A (zh) | 2017-02-08 | 2018-02-07 | 用于基片集成波导转换的具有超宽频带波导的雷达组件 |
CN201810122408.4A Active CN108398665B (zh) | 2017-02-08 | 2018-02-07 | 用于基片集成波导转换的具有超宽频带波导的雷达组件 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202310980983.9A Pending CN116916543A (zh) | 2017-02-08 | 2018-02-07 | 用于基片集成波导转换的具有超宽频带波导的雷达组件 |
Country Status (3)
Country | Link |
---|---|
US (3) | US10468736B2 (zh) |
EP (1) | EP3361560A1 (zh) |
CN (2) | CN116916543A (zh) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL2017865B1 (en) * | 2016-11-24 | 2018-06-01 | The Antenna Company International N V | Waveguide for electromagnetic radiation |
US10468736B2 (en) * | 2017-02-08 | 2019-11-05 | Aptiv Technologies Limited | Radar assembly with ultra wide band waveguide to substrate integrated waveguide transition |
US10782388B2 (en) * | 2017-02-16 | 2020-09-22 | Magna Electronics Inc. | Vehicle radar system with copper PCB |
EP3450931B1 (de) * | 2017-08-28 | 2022-10-05 | VEGA Grieshaber KG | Hohlleitereinkopplung für ein füllstandradar |
US10680305B2 (en) * | 2018-02-08 | 2020-06-09 | Aptiv Technologies Limited | Signal handling device including a surface integrated waveguide and a resonating cavity formed in multiple substrate layers |
US11404759B2 (en) * | 2018-06-04 | 2022-08-02 | Nec Corporation | Connection structure including a coupling window between a dielectric waveguide line in a substrate and a waveguide and having plural recesses formed in the connection structure |
US11527808B2 (en) | 2019-04-29 | 2022-12-13 | Aptiv Technologies Limited | Waveguide launcher |
WO2021123111A1 (de) | 2019-12-20 | 2021-06-24 | 2Pi-Labs Gmbh | Hohlleiteranordnung |
US11362436B2 (en) * | 2020-10-02 | 2022-06-14 | Aptiv Technologies Limited | Plastic air-waveguide antenna with conductive particles |
US11757166B2 (en) | 2020-11-10 | 2023-09-12 | Aptiv Technologies Limited | Surface-mount waveguide for vertical transitions of a printed circuit board |
US11749883B2 (en) | 2020-12-18 | 2023-09-05 | Aptiv Technologies Limited | Waveguide with radiation slots and parasitic elements for asymmetrical coverage |
US11626668B2 (en) | 2020-12-18 | 2023-04-11 | Aptiv Technologies Limited | Waveguide end array antenna to reduce grating lobes and cross-polarization |
US11502420B2 (en) | 2020-12-18 | 2022-11-15 | Aptiv Technologies Limited | Twin line fed dipole array antenna |
US11901601B2 (en) | 2020-12-18 | 2024-02-13 | Aptiv Technologies Limited | Waveguide with a zigzag for suppressing grating lobes |
US11681015B2 (en) | 2020-12-18 | 2023-06-20 | Aptiv Technologies Limited | Waveguide with squint alteration |
US11444364B2 (en) | 2020-12-22 | 2022-09-13 | Aptiv Technologies Limited | Folded waveguide for antenna |
US11668787B2 (en) | 2021-01-29 | 2023-06-06 | Aptiv Technologies Limited | Waveguide with lobe suppression |
US11721905B2 (en) | 2021-03-16 | 2023-08-08 | Aptiv Technologies Limited | Waveguide with a beam-forming feature with radiation slots |
US11616306B2 (en) | 2021-03-22 | 2023-03-28 | Aptiv Technologies Limited | Apparatus, method and system comprising an air waveguide antenna having a single layer material with air channels therein which is interfaced with a circuit board |
US11973268B2 (en) * | 2021-05-03 | 2024-04-30 | Aptiv Technologies AG | Multi-layered air waveguide antenna with layer-to-layer connections |
US11962085B2 (en) | 2021-05-13 | 2024-04-16 | Aptiv Technologies AG | Two-part folded waveguide having a sinusoidal shape channel including horn shape radiating slots formed therein which are spaced apart by one-half wavelength |
US11616282B2 (en) | 2021-08-03 | 2023-03-28 | Aptiv Technologies Limited | Transition between a single-ended port and differential ports having stubs that match with input impedances of the single-ended and differential ports |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003289201A (ja) * | 2002-03-28 | 2003-10-10 | Anritsu Corp | ポスト壁導波管と空洞導波管の接続変換構造 |
CN1620738A (zh) * | 2000-10-18 | 2005-05-25 | 诺基亚公司 | 波导到带状线转接 |
CN2796131Y (zh) * | 2005-05-30 | 2006-07-12 | 东南大学 | 多层基片集成波导椭圆响应滤波器 |
US20090243762A1 (en) * | 2008-03-27 | 2009-10-01 | Xiao-Ping Chen | Waveguide filter |
CN201383535Y (zh) * | 2009-04-01 | 2010-01-13 | 惠州市硕贝德通讯科技有限公司 | 一种矩形波导-基片集成波导信号转换及功率分配器 |
CN102696145A (zh) * | 2009-12-07 | 2012-09-26 | 卡西迪安有限公司 | 微带线和矩形波导间的微波转换设备 |
CN103515682A (zh) * | 2013-07-24 | 2014-01-15 | 中国电子科技集团公司第五十五研究所 | 多层阶梯式基片集成波导实现微带至波导的垂直过渡结构 |
CN104900956A (zh) * | 2015-05-06 | 2015-09-09 | 东南大学 | 一种波导到基片集成波导的转换装置 |
CN105098295A (zh) * | 2014-05-16 | 2015-11-25 | 香港城市大学 | 用于电磁信号转换的装置和方法 |
CN105609909A (zh) * | 2016-03-08 | 2016-05-25 | 电子科技大学 | 一种用于Ka波段矩形波导转基片集成波导的装置 |
CN105680133A (zh) * | 2016-01-11 | 2016-06-15 | 中国电子科技集团公司第十研究所 | 基片集成脊波导板间垂直互联电路结构 |
CN105958167A (zh) * | 2016-07-01 | 2016-09-21 | 北京交通大学 | 垂直基片集成波导及包括该波导的垂直连接结构 |
Family Cites Families (83)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3462713A (en) * | 1967-07-19 | 1969-08-19 | Bell Telephone Labor Inc | Waveguide-stripline transducer |
US3579149A (en) * | 1969-12-08 | 1971-05-18 | Westinghouse Electric Corp | Waveguide to stripline transition means |
NL7609903A (nl) * | 1976-09-07 | 1978-03-09 | Philips Nv | Microgolfinrichting voor het omzetten van een golfpijp- in een microstripgeleiderstructuur. |
US4453142A (en) * | 1981-11-02 | 1984-06-05 | Motorola Inc. | Microstrip to waveguide transition |
US4562416A (en) * | 1984-05-31 | 1985-12-31 | Sanders Associates, Inc. | Transition from stripline to waveguide |
US5065123A (en) | 1990-10-01 | 1991-11-12 | Harris Corporation | Waffle wall-configured conducting structure for chip isolation in millimeter wave monolithic subsystem assemblies |
FR2700066A1 (fr) * | 1992-12-29 | 1994-07-01 | Philips Electronique Lab | Dispositif hyperfréquences comprenant au moins une transition entre une ligne de transmission intégrée sur un substrat et un guide d'onde. |
US5986527A (en) * | 1995-03-28 | 1999-11-16 | Murata Manufacturing Co., Ltd. | Planar dielectric line and integrated circuit using the same line |
JP3366552B2 (ja) * | 1997-04-22 | 2003-01-14 | 京セラ株式会社 | 誘電体導波管線路およびそれを具備する多層配線基板 |
US5982250A (en) * | 1997-11-26 | 1999-11-09 | Twr Inc. | Millimeter-wave LTCC package |
CA2292064C (en) | 1998-12-25 | 2003-08-19 | Murata Manufacturing Co., Ltd. | Line transition device between dielectric waveguide and waveguide, and oscillator and transmitter using the same |
JP3771094B2 (ja) | 1999-10-04 | 2006-04-26 | アルプス電気株式会社 | 衛星放送受信用コンバータ |
US6590477B1 (en) * | 1999-10-29 | 2003-07-08 | Fci Americas Technology, Inc. | Waveguides and backplane systems with at least one mode suppression gap |
EP1346431A1 (en) * | 2000-12-21 | 2003-09-24 | Paratek Microwave, Inc. | Waveguide to microstrip transition |
US6967347B2 (en) | 2001-05-21 | 2005-11-22 | The Regents Of The University Of Colorado | Terahertz interconnect system and applications |
JP2003243902A (ja) | 2002-02-18 | 2003-08-29 | Alps Electric Co Ltd | 衛星放送受信用コンバータ |
DE10243671B3 (de) | 2002-09-20 | 2004-03-25 | Eads Deutschland Gmbh | Anordnung für einen Übergang zwischen einer Mikrostreifenleitung und einem Hohlleiter |
US7276988B2 (en) * | 2004-06-30 | 2007-10-02 | Endwave Corporation | Multi-substrate microstrip to waveguide transition |
US7098070B2 (en) | 2004-11-16 | 2006-08-29 | International Business Machines Corporation | Device and method for fabricating double-sided SOI wafer scale package with through via connections |
KR101168608B1 (ko) | 2006-03-31 | 2012-07-30 | 쿄세라 코포레이션 | 유전체 도파로 디바이스와, 이것을 구비하는 이상기, 고주파 스위치 및 감쇠기와, 고주파 송신기, 고주파 수신기, 고주파 송수신기, 레이더 장치, 어레이 안테나 장치, 및 유전체 도파로 디바이스의 제조 방법 |
EP2027253A4 (en) | 2006-06-12 | 2014-04-30 | Pacific Biosciences California | SUBSTATES FOR EFFECTING ANALYSIS REACTIONS |
KR100846872B1 (ko) | 2006-11-17 | 2008-07-16 | 한국전자통신연구원 | 유전체 도파관 대 전송선의 밀리미터파 천이 장치 |
JP4365852B2 (ja) | 2006-11-30 | 2009-11-18 | 株式会社日立製作所 | 導波管構造 |
EP1936741A1 (en) * | 2006-12-22 | 2008-06-25 | Sony Deutschland GmbH | Flexible substrate integrated waveguides |
US8231284B2 (en) | 2007-03-26 | 2012-07-31 | International Business Machines Corporation | Ultra-high bandwidth, multiple-channel full-duplex, single-chip CMOS optical transceiver |
US7768457B2 (en) | 2007-06-22 | 2010-08-03 | Vubiq, Inc. | Integrated antenna and chip package and method of manufacturing thereof |
WO2009084697A1 (ja) * | 2007-12-28 | 2009-07-09 | Kyocera Corporation | 高周波伝送線路の接続構造、配線基板、高周波モジュールおよびレーダ装置 |
JP5172481B2 (ja) * | 2008-06-05 | 2013-03-27 | 株式会社東芝 | ポスト壁導波路によるショートスロット方向性結合器とこれを用いたバトラーマトリクス及び車載レーダアンテナ |
US8278749B2 (en) | 2009-01-30 | 2012-10-02 | Infineon Technologies Ag | Integrated antennas in wafer level package |
US8089327B2 (en) * | 2009-03-09 | 2012-01-03 | Toyota Motor Engineering & Manufacturing North America, Inc. | Waveguide to plural microstrip transition |
WO2010114078A1 (ja) * | 2009-03-31 | 2010-10-07 | 京セラ株式会社 | 導波構造体、ならびに、導波構造体を含む高周波モジュールおよびレーダ装置 |
US8901719B2 (en) | 2009-05-08 | 2014-12-02 | Optis Cellular Technology, Llc | Transition from a chip to a waveguide port |
US8917151B2 (en) * | 2009-09-08 | 2014-12-23 | Siklu Communication ltd. | Transition between a laminated PCB and a waveguide through a cavity in the laminated PCB |
US8912859B2 (en) * | 2009-09-08 | 2014-12-16 | Siklu Communication ltd. | Transition between a laminated PCB and a waveguide including a lamina with a printed conductive surface functioning as a waveguide-backshort |
US8674885B2 (en) | 2010-08-31 | 2014-03-18 | Siklu Communication ltd. | Systems for interfacing waveguide antenna feeds with printed circuit boards |
US9774076B2 (en) | 2010-08-31 | 2017-09-26 | Siklu Communication ltd. | Compact millimeter-wave radio systems and methods |
KR101761920B1 (ko) | 2011-02-16 | 2017-07-26 | 삼성전기주식회사 | 유전체 도파관 안테나 |
US9270005B2 (en) * | 2011-02-21 | 2016-02-23 | Siklu Communication ltd. | Laminate structures having a hole surrounding a probe for propagating millimeter waves |
EP2500978B1 (en) * | 2011-03-17 | 2013-07-10 | Sivers Ima AB | Waveguide transition |
GB2489950A (en) * | 2011-04-12 | 2012-10-17 | Filtronic Plc | A substrate integrated waveguide (SIW) to air filled waveguide transition comprising a tapered dielectric layer |
US9147924B2 (en) | 2011-09-02 | 2015-09-29 | The United States Of America As Represented By The Secretary Of The Army | Waveguide to co-planar-waveguide (CPW) transition |
US8680936B2 (en) * | 2011-11-18 | 2014-03-25 | Delphi Technologies, Inc. | Surface mountable microwave signal transition block for microstrip to perpendicular waveguide transition |
US8912634B2 (en) | 2012-03-29 | 2014-12-16 | International Business Machines Corporation | High frequency transition matching in an electronic package for millimeter wave semiconductor dies |
EP2862230B1 (en) * | 2012-06-18 | 2016-08-10 | Huawei Technologies Co., Ltd. | Directional coupler waveguide structure and method |
JP5694246B2 (ja) * | 2012-07-13 | 2015-04-01 | 株式会社東芝 | 導波管接続構造、アンテナ装置およびレーダ装置 |
US20140106684A1 (en) | 2012-10-15 | 2014-04-17 | Qualcomm Mems Technologies, Inc. | Transparent antennas on a display device |
WO2014108934A1 (en) | 2013-01-10 | 2014-07-17 | Nec Corporation | Wideband transition between a planar transmission line and a waveguide |
WO2014154232A1 (en) * | 2013-03-24 | 2014-10-02 | Telefonaktiebolaget L M Ericsson (Publ) | A transition between a siw and a waveguide interface |
CN103650243B (zh) * | 2013-07-31 | 2016-03-30 | 华为技术有限公司 | 一种天线 |
EP2843758A1 (en) * | 2013-08-27 | 2015-03-04 | Microelectronics Technology Inc. | Multi-layer circuit board with waveguide to microstrip transition structure |
CN105580195B (zh) * | 2013-10-01 | 2019-07-16 | 索尼半导体解决方案公司 | 连接器装置和通信系统 |
US9059490B2 (en) | 2013-10-08 | 2015-06-16 | Blackberry Limited | 60 GHz integrated circuit to printed circuit board transitions |
JP6269127B2 (ja) | 2014-02-07 | 2018-01-31 | 富士通株式会社 | 高周波モジュール及びその製造方法 |
EP2945222A1 (en) | 2014-05-14 | 2015-11-18 | Gapwaves AB | A microwave or millimeter wave RF part using pin grid array (PGA) and/or ball grid array (BGA) technologies |
EP2950616B1 (en) | 2014-05-26 | 2018-11-07 | Electrolux Appliances Aktiebolag | Microwave oven with a waveguide including a reflector element |
US10103447B2 (en) | 2014-06-13 | 2018-10-16 | Nxp Usa, Inc. | Integrated circuit package with radio frequency coupling structure |
US9620841B2 (en) | 2014-06-13 | 2017-04-11 | Nxp Usa, Inc. | Radio frequency coupling structure |
US9583811B2 (en) | 2014-08-07 | 2017-02-28 | Infineon Technologies Ag | Transition between a plastic waveguide and a semiconductor chip, where the semiconductor chip is embedded and encapsulated within a mold compound |
KR101621480B1 (ko) * | 2014-10-16 | 2016-05-16 | 현대모비스 주식회사 | 도파관 대 유전체 도파관의 천이 구조 |
US9666930B2 (en) | 2014-10-23 | 2017-05-30 | Nxp Usa, Inc. | Interface between a semiconductor die and a waveguide, where the interface is covered by a molding compound |
DE112015005575T5 (de) | 2014-12-12 | 2017-09-28 | Sony Corporation | Mikrowellenantennenvorrichtung, einheit und herstellungsverfahren |
US9537199B2 (en) | 2015-03-19 | 2017-01-03 | International Business Machines Corporation | Package structure having an integrated waveguide configured to communicate between first and second integrated circuit chips |
US10109604B2 (en) | 2015-03-30 | 2018-10-23 | Sony Corporation | Package with embedded electronic components and a waveguide cavity through the package cover, antenna apparatus including package, and method of manufacturing the same |
KR101689353B1 (ko) | 2015-04-13 | 2016-12-23 | 성균관대학교산학협력단 | 실리콘 밀리미터파 칩용 칩상 도파관 급전기 및 급전 방법 및, 이를 이용한 다중 입출력 밀리미터파 송수신 장치 |
US10083923B2 (en) | 2015-09-21 | 2018-09-25 | Intel Corporation | Platform with thermally stable wireless interconnects |
CN108475833A (zh) | 2016-01-20 | 2018-08-31 | 索尼公司 | 连接器模块、通信电路板和电子装置 |
CN208955165U (zh) | 2016-06-29 | 2019-06-07 | 日本电产株式会社 | 雷达装置 |
DE102016213202A1 (de) | 2016-07-19 | 2018-01-25 | Conti Temic Microelectronic Gmbh | Mehrschichtenplatine mit einem Übergangselement zum Transformieren einer Hohlleiterwelle auf eine leitungsgeführte Welle |
KR101963936B1 (ko) | 2016-11-08 | 2019-07-31 | 한국과학기술원 | 전자파 신호 송수신 안테나 및 em-터널이 내장된 구조를 갖는 인쇄회로기판 및 그 제작 방법 |
US9935065B1 (en) | 2016-12-21 | 2018-04-03 | Infineon Technologies Ag | Radio frequency device packages and methods of formation thereof |
US10468736B2 (en) | 2017-02-08 | 2019-11-05 | Aptiv Technologies Limited | Radar assembly with ultra wide band waveguide to substrate integrated waveguide transition |
EP3364457A1 (en) | 2017-02-15 | 2018-08-22 | Nxp B.V. | Integrated circuit package including an antenna |
US10317459B2 (en) | 2017-04-03 | 2019-06-11 | Nvidia Corporation | Multi-chip package with selection logic and debug ports for testing inter-chip communications |
DE102017111319A1 (de) | 2017-05-24 | 2018-11-29 | Miele & Cie. Kg | Einrichtung zur Erzeugung und Transmission von Hochfrequenzwellen (HF-Wellen) |
CN108987866A (zh) | 2017-06-05 | 2018-12-11 | 日本电产株式会社 | 波导装置以及具有该波导装置的天线装置 |
JP2019012999A (ja) | 2017-06-30 | 2019-01-24 | 日本電産株式会社 | 導波路装置モジュール、マイクロ波モジュール、レーダ装置およびレーダシステム |
US11183751B2 (en) | 2017-09-20 | 2021-11-23 | Aptiv Technologies Limited | Antenna device with direct differential input useable on an automated vehicle |
US10403954B2 (en) | 2017-12-30 | 2019-09-03 | Texas Instruments Incorporated | Printed circuit board with substrate-integrated waveguide transition |
DE102019200893B4 (de) | 2019-01-21 | 2023-06-15 | Infineon Technologies Ag | Verfahren zum Erzeugen eines Hohlleiters, Schaltungsvorrichtung und Radarsystem |
CN109750201B (zh) | 2019-02-22 | 2020-07-07 | 中国科学院长春应用化学研究所 | 一种高成型性能微合金化镁合金薄板及其制备方法 |
CN209389219U (zh) | 2019-02-25 | 2019-09-13 | 贵州航天电子科技有限公司 | 一种适用于增材制造的波导缝隙阵列天线结构 |
US10775573B1 (en) | 2019-04-03 | 2020-09-15 | International Business Machines Corporation | Embedding mirror with metal particle coating |
US11527808B2 (en) | 2019-04-29 | 2022-12-13 | Aptiv Technologies Limited | Waveguide launcher |
-
2017
- 2017-02-08 US US15/427,769 patent/US10468736B2/en active Active
-
2018
- 2018-01-24 EP EP18153137.7A patent/EP3361560A1/en not_active Withdrawn
- 2018-02-07 CN CN202310980983.9A patent/CN116916543A/zh active Pending
- 2018-02-07 CN CN201810122408.4A patent/CN108398665B/zh active Active
-
2019
- 2019-09-26 US US16/583,867 patent/US10833385B2/en active Active
-
2020
- 2020-10-16 US US17/073,254 patent/US11670829B2/en active Active
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1620738A (zh) * | 2000-10-18 | 2005-05-25 | 诺基亚公司 | 波导到带状线转接 |
JP2003289201A (ja) * | 2002-03-28 | 2003-10-10 | Anritsu Corp | ポスト壁導波管と空洞導波管の接続変換構造 |
CN2796131Y (zh) * | 2005-05-30 | 2006-07-12 | 东南大学 | 多层基片集成波导椭圆响应滤波器 |
US20090243762A1 (en) * | 2008-03-27 | 2009-10-01 | Xiao-Ping Chen | Waveguide filter |
CN201383535Y (zh) * | 2009-04-01 | 2010-01-13 | 惠州市硕贝德通讯科技有限公司 | 一种矩形波导-基片集成波导信号转换及功率分配器 |
CN102696145A (zh) * | 2009-12-07 | 2012-09-26 | 卡西迪安有限公司 | 微带线和矩形波导间的微波转换设备 |
CN103515682A (zh) * | 2013-07-24 | 2014-01-15 | 中国电子科技集团公司第五十五研究所 | 多层阶梯式基片集成波导实现微带至波导的垂直过渡结构 |
CN105098295A (zh) * | 2014-05-16 | 2015-11-25 | 香港城市大学 | 用于电磁信号转换的装置和方法 |
CN104900956A (zh) * | 2015-05-06 | 2015-09-09 | 东南大学 | 一种波导到基片集成波导的转换装置 |
CN105680133A (zh) * | 2016-01-11 | 2016-06-15 | 中国电子科技集团公司第十研究所 | 基片集成脊波导板间垂直互联电路结构 |
CN105609909A (zh) * | 2016-03-08 | 2016-05-25 | 电子科技大学 | 一种用于Ka波段矩形波导转基片集成波导的装置 |
CN105958167A (zh) * | 2016-07-01 | 2016-09-21 | 北京交通大学 | 垂直基片集成波导及包括该波导的垂直连接结构 |
Also Published As
Publication number | Publication date |
---|---|
US20200021001A1 (en) | 2020-01-16 |
US10833385B2 (en) | 2020-11-10 |
CN116916543A (zh) | 2023-10-20 |
US20210036393A1 (en) | 2021-02-04 |
EP3361560A1 (en) | 2018-08-15 |
CN108398665B (zh) | 2023-07-21 |
US20180226709A1 (en) | 2018-08-09 |
US10468736B2 (en) | 2019-11-05 |
US11670829B2 (en) | 2023-06-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN108398665A (zh) | 用于基片集成波导转换的具有超宽频带波导的雷达组件 | |
KR101146969B1 (ko) | 메타물질을 이용한 전송선 설계 방법 | |
JP2016220029A (ja) | アンテナ装置、無線通信装置、及びレーダ装置 | |
US9041489B2 (en) | Signal transmission cable and flexible printed board | |
US20120112976A1 (en) | Antenna | |
CN102414920A (zh) | 结构体、印刷板、天线、传输线波导转换器、阵列天线和电子装置 | |
WO2007000749B1 (en) | Integrated tunable micro-antenna with small electrical dimensions and manufacturing method thereof | |
US8253025B2 (en) | Printed circuit board having electromagnetic bandgap structure | |
US8227704B2 (en) | Printed circuit board having electromagnetic bandgap structure | |
EP3968450A1 (en) | Wireless communication module | |
US8242377B2 (en) | Printed circuit board having electromagnetic bandgap structure | |
US20090243941A1 (en) | Half-mode substrate integrated antenna structure | |
US8314341B2 (en) | Printed circuit board having electromagnetic bandgap structure | |
CN112055914A (zh) | 滤波器电路和通信设备 | |
CN111602289B (zh) | 天线和通信设备 | |
CN209804867U (zh) | 一种w波段siw功分器 | |
JP4203404B2 (ja) | 導波管構造体の分岐構造およびアンテナ基板 | |
US9525213B2 (en) | Antenna device | |
JP2009111837A (ja) | 基板貫通導波管 | |
US20200083606A1 (en) | Antenna device and printed circuit board | |
JP6437779B2 (ja) | 回路基板 | |
KR20220170176A (ko) | 전송선로 구조체 | |
KR20240013641A (ko) | 안테나 모듈 | |
JP2005353889A (ja) | 高周波多層集積回路 | |
CN116264762A (zh) | Rf组件和方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20181207 Address after: Babado J San Michaele Applicant after: Delphi Technologies, Inc. Address before: michigan Applicant before: DELPHI TECHNOLOGIES, Inc. |
|
GR01 | Patent grant | ||
GR01 | Patent grant |