CN116916543A - 用于基片集成波导转换的具有超宽频带波导的雷达组件 - Google Patents
用于基片集成波导转换的具有超宽频带波导的雷达组件 Download PDFInfo
- Publication number
- CN116916543A CN116916543A CN202310980983.9A CN202310980983A CN116916543A CN 116916543 A CN116916543 A CN 116916543A CN 202310980983 A CN202310980983 A CN 202310980983A CN 116916543 A CN116916543 A CN 116916543A
- Authority
- CN
- China
- Prior art keywords
- forming
- siw
- waveguide
- waveguide transition
- dielectric layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 18
- 238000006243 chemical reaction Methods 0.000 title claims abstract description 12
- 230000007704 transition Effects 0.000 claims abstract description 52
- 239000004020 conductor Substances 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims description 25
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000004378 air conditioning Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/12—Hollow waveguides
- H01P3/121—Hollow waveguides integrated in a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
- H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
- H01P5/024—Transitions between lines of the same kind and shape, but with different dimensions between hollow waveguides
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
- G01S13/02—Systems using reflection of radio waves, e.g. primary radar systems; Analogous systems
- G01S13/0209—Systems with very large relative bandwidth, i.e. larger than 10 %, e.g. baseband, pulse, carrier-free, ultrawideband
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Manufacturing & Machinery (AREA)
- Computer Networks & Wireless Communication (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Radar Systems Or Details Thereof (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Waveguide Aerials (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/427,769 | 2017-02-08 | ||
US15/427,769 US10468736B2 (en) | 2017-02-08 | 2017-02-08 | Radar assembly with ultra wide band waveguide to substrate integrated waveguide transition |
CN201810122408.4A CN108398665B (zh) | 2017-02-08 | 2018-02-07 | 用于基片集成波导转换的具有超宽频带波导的雷达组件 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810122408.4A Division CN108398665B (zh) | 2017-02-08 | 2018-02-07 | 用于基片集成波导转换的具有超宽频带波导的雷达组件 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN116916543A true CN116916543A (zh) | 2023-10-20 |
Family
ID=61024632
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202310980983.9A Pending CN116916543A (zh) | 2017-02-08 | 2018-02-07 | 用于基片集成波导转换的具有超宽频带波导的雷达组件 |
CN201810122408.4A Active CN108398665B (zh) | 2017-02-08 | 2018-02-07 | 用于基片集成波导转换的具有超宽频带波导的雷达组件 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810122408.4A Active CN108398665B (zh) | 2017-02-08 | 2018-02-07 | 用于基片集成波导转换的具有超宽频带波导的雷达组件 |
Country Status (3)
Country | Link |
---|---|
US (3) | US10468736B2 (zh) |
EP (1) | EP3361560A1 (zh) |
CN (2) | CN116916543A (zh) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL2017865B1 (en) * | 2016-11-24 | 2018-06-01 | The Antenna Company International N V | Waveguide for electromagnetic radiation |
US10468736B2 (en) * | 2017-02-08 | 2019-11-05 | Aptiv Technologies Limited | Radar assembly with ultra wide band waveguide to substrate integrated waveguide transition |
US10782388B2 (en) * | 2017-02-16 | 2020-09-22 | Magna Electronics Inc. | Vehicle radar system with copper PCB |
EP3450931B1 (de) * | 2017-08-28 | 2022-10-05 | VEGA Grieshaber KG | Hohlleitereinkopplung für ein füllstandradar |
US10680305B2 (en) * | 2018-02-08 | 2020-06-09 | Aptiv Technologies Limited | Signal handling device including a surface integrated waveguide and a resonating cavity formed in multiple substrate layers |
JP6950824B2 (ja) * | 2018-06-04 | 2021-10-13 | 日本電気株式会社 | 誘電体導波管線路と導波管との接続構造 |
US11527808B2 (en) | 2019-04-29 | 2022-12-13 | Aptiv Technologies Limited | Waveguide launcher |
WO2021123111A1 (de) | 2019-12-20 | 2021-06-24 | 2Pi-Labs Gmbh | Hohlleiteranordnung |
US11362436B2 (en) * | 2020-10-02 | 2022-06-14 | Aptiv Technologies Limited | Plastic air-waveguide antenna with conductive particles |
US11757166B2 (en) | 2020-11-10 | 2023-09-12 | Aptiv Technologies Limited | Surface-mount waveguide for vertical transitions of a printed circuit board |
US11626668B2 (en) | 2020-12-18 | 2023-04-11 | Aptiv Technologies Limited | Waveguide end array antenna to reduce grating lobes and cross-polarization |
US11901601B2 (en) | 2020-12-18 | 2024-02-13 | Aptiv Technologies Limited | Waveguide with a zigzag for suppressing grating lobes |
US11749883B2 (en) | 2020-12-18 | 2023-09-05 | Aptiv Technologies Limited | Waveguide with radiation slots and parasitic elements for asymmetrical coverage |
US11502420B2 (en) | 2020-12-18 | 2022-11-15 | Aptiv Technologies Limited | Twin line fed dipole array antenna |
US11681015B2 (en) | 2020-12-18 | 2023-06-20 | Aptiv Technologies Limited | Waveguide with squint alteration |
US11444364B2 (en) | 2020-12-22 | 2022-09-13 | Aptiv Technologies Limited | Folded waveguide for antenna |
US11668787B2 (en) | 2021-01-29 | 2023-06-06 | Aptiv Technologies Limited | Waveguide with lobe suppression |
US11721905B2 (en) | 2021-03-16 | 2023-08-08 | Aptiv Technologies Limited | Waveguide with a beam-forming feature with radiation slots |
US11616306B2 (en) | 2021-03-22 | 2023-03-28 | Aptiv Technologies Limited | Apparatus, method and system comprising an air waveguide antenna having a single layer material with air channels therein which is interfaced with a circuit board |
US11973268B2 (en) * | 2021-05-03 | 2024-04-30 | Aptiv Technologies AG | Multi-layered air waveguide antenna with layer-to-layer connections |
US11962085B2 (en) | 2021-05-13 | 2024-04-16 | Aptiv Technologies AG | Two-part folded waveguide having a sinusoidal shape channel including horn shape radiating slots formed therein which are spaced apart by one-half wavelength |
US11616282B2 (en) | 2021-08-03 | 2023-03-28 | Aptiv Technologies Limited | Transition between a single-ended port and differential ports having stubs that match with input impedances of the single-ended and differential ports |
Family Cites Families (95)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3462713A (en) * | 1967-07-19 | 1969-08-19 | Bell Telephone Labor Inc | Waveguide-stripline transducer |
US3579149A (en) * | 1969-12-08 | 1971-05-18 | Westinghouse Electric Corp | Waveguide to stripline transition means |
NL7609903A (nl) * | 1976-09-07 | 1978-03-09 | Philips Nv | Microgolfinrichting voor het omzetten van een golfpijp- in een microstripgeleiderstructuur. |
US4453142A (en) * | 1981-11-02 | 1984-06-05 | Motorola Inc. | Microstrip to waveguide transition |
US4562416A (en) * | 1984-05-31 | 1985-12-31 | Sanders Associates, Inc. | Transition from stripline to waveguide |
US5065123A (en) | 1990-10-01 | 1991-11-12 | Harris Corporation | Waffle wall-configured conducting structure for chip isolation in millimeter wave monolithic subsystem assemblies |
FR2700066A1 (fr) * | 1992-12-29 | 1994-07-01 | Philips Electronique Lab | Dispositif hyperfréquences comprenant au moins une transition entre une ligne de transmission intégrée sur un substrat et un guide d'onde. |
US5986527A (en) * | 1995-03-28 | 1999-11-16 | Murata Manufacturing Co., Ltd. | Planar dielectric line and integrated circuit using the same line |
JP3366552B2 (ja) * | 1997-04-22 | 2003-01-14 | 京セラ株式会社 | 誘電体導波管線路およびそれを具備する多層配線基板 |
US5982250A (en) * | 1997-11-26 | 1999-11-09 | Twr Inc. | Millimeter-wave LTCC package |
CA2292064C (en) | 1998-12-25 | 2003-08-19 | Murata Manufacturing Co., Ltd. | Line transition device between dielectric waveguide and waveguide, and oscillator and transmitter using the same |
JP3771094B2 (ja) | 1999-10-04 | 2006-04-26 | アルプス電気株式会社 | 衛星放送受信用コンバータ |
US6590477B1 (en) * | 1999-10-29 | 2003-07-08 | Fci Americas Technology, Inc. | Waveguides and backplane systems with at least one mode suppression gap |
US6958662B1 (en) | 2000-10-18 | 2005-10-25 | Nokia Corporation | Waveguide to stripline transition with via forming an impedance matching fence |
WO2002052674A1 (en) * | 2000-12-21 | 2002-07-04 | Paratek Microwave, Inc. | Waveguide to microstrip transition |
US6967347B2 (en) | 2001-05-21 | 2005-11-22 | The Regents Of The University Of Colorado | Terahertz interconnect system and applications |
JP2003243902A (ja) | 2002-02-18 | 2003-08-29 | Alps Electric Co Ltd | 衛星放送受信用コンバータ |
JP2003289201A (ja) | 2002-03-28 | 2003-10-10 | Anritsu Corp | ポスト壁導波管と空洞導波管の接続変換構造 |
DE10243671B3 (de) | 2002-09-20 | 2004-03-25 | Eads Deutschland Gmbh | Anordnung für einen Übergang zwischen einer Mikrostreifenleitung und einem Hohlleiter |
US7276988B2 (en) * | 2004-06-30 | 2007-10-02 | Endwave Corporation | Multi-substrate microstrip to waveguide transition |
US7098070B2 (en) | 2004-11-16 | 2006-08-29 | International Business Machines Corporation | Device and method for fabricating double-sided SOI wafer scale package with through via connections |
CN2796131Y (zh) * | 2005-05-30 | 2006-07-12 | 东南大学 | 多层基片集成波导椭圆响应滤波器 |
WO2007114391A1 (ja) | 2006-03-31 | 2007-10-11 | Kyocera Corporation | 誘電体導波路デバイス、これを備える移相器、高周波スイッチおよび減衰器、ならびに高周波送信器、高周波受信器、高周波送受信器およびレーダ装置、アレイアンテナ装置、誘電体導波路デバイスの製造方法 |
CN101915957B (zh) | 2006-06-12 | 2012-12-12 | 加利福尼亚太平洋生物科学公司 | 实施分析反应的基材 |
KR100846872B1 (ko) | 2006-11-17 | 2008-07-16 | 한국전자통신연구원 | 유전체 도파관 대 전송선의 밀리미터파 천이 장치 |
JP4365852B2 (ja) | 2006-11-30 | 2009-11-18 | 株式会社日立製作所 | 導波管構造 |
EP1936741A1 (en) * | 2006-12-22 | 2008-06-25 | Sony Deutschland GmbH | Flexible substrate integrated waveguides |
US8231284B2 (en) | 2007-03-26 | 2012-07-31 | International Business Machines Corporation | Ultra-high bandwidth, multiple-channel full-duplex, single-chip CMOS optical transceiver |
US7768457B2 (en) | 2007-06-22 | 2010-08-03 | Vubiq, Inc. | Integrated antenna and chip package and method of manufacturing thereof |
EP2224535B1 (en) * | 2007-12-28 | 2013-12-18 | Kyocera Corporation | High-frequency transmission line connection structure, wiring substrate, high-frequency module, and radar device |
CA2629035A1 (en) * | 2008-03-27 | 2009-09-27 | Her Majesty The Queen In Right Of Canada, As Represented By The Minister Of Industry, Through The Communications Research Centre Canada | Waveguide filter with broad stopband based on sugstrate integrated waveguide scheme |
JP5172481B2 (ja) * | 2008-06-05 | 2013-03-27 | 株式会社東芝 | ポスト壁導波路によるショートスロット方向性結合器とこれを用いたバトラーマトリクス及び車載レーダアンテナ |
US8278749B2 (en) | 2009-01-30 | 2012-10-02 | Infineon Technologies Ag | Integrated antennas in wafer level package |
US8089327B2 (en) * | 2009-03-09 | 2012-01-03 | Toyota Motor Engineering & Manufacturing North America, Inc. | Waveguide to plural microstrip transition |
JP5309209B2 (ja) * | 2009-03-31 | 2013-10-09 | 京セラ株式会社 | 導波構造体、ならびに、導波構造体を含む高周波モジュールおよびレーダ装置 |
CN201383535Y (zh) * | 2009-04-01 | 2010-01-13 | 惠州市硕贝德通讯科技有限公司 | 一种矩形波导-基片集成波导信号转换及功率分配器 |
JP5443594B2 (ja) | 2009-05-08 | 2014-03-19 | テレフオンアクチーボラゲット エル エム エリクソン(パブル) | チップから導波管ポートへの変換器 |
US8917151B2 (en) * | 2009-09-08 | 2014-12-23 | Siklu Communication ltd. | Transition between a laminated PCB and a waveguide through a cavity in the laminated PCB |
US8912859B2 (en) * | 2009-09-08 | 2014-12-16 | Siklu Communication ltd. | Transition between a laminated PCB and a waveguide including a lamina with a printed conductive surface functioning as a waveguide-backshort |
FR2953651B1 (fr) * | 2009-12-07 | 2012-01-20 | Eads Defence & Security Sys | Dispositif de transition hyperfrequence entre une ligne a micro-ruban et un guide d'onde rectangulaire |
US9774076B2 (en) | 2010-08-31 | 2017-09-26 | Siklu Communication ltd. | Compact millimeter-wave radio systems and methods |
US8674885B2 (en) | 2010-08-31 | 2014-03-18 | Siklu Communication ltd. | Systems for interfacing waveguide antenna feeds with printed circuit boards |
KR101761920B1 (ko) | 2011-02-16 | 2017-07-26 | 삼성전기주식회사 | 유전체 도파관 안테나 |
US9270005B2 (en) * | 2011-02-21 | 2016-02-23 | Siklu Communication ltd. | Laminate structures having a hole surrounding a probe for propagating millimeter waves |
EP2500978B1 (en) * | 2011-03-17 | 2013-07-10 | Sivers Ima AB | Waveguide transition |
GB2489950A (en) * | 2011-04-12 | 2012-10-17 | Filtronic Plc | A substrate integrated waveguide (SIW) to air filled waveguide transition comprising a tapered dielectric layer |
US9147924B2 (en) | 2011-09-02 | 2015-09-29 | The United States Of America As Represented By The Secretary Of The Army | Waveguide to co-planar-waveguide (CPW) transition |
US8680936B2 (en) * | 2011-11-18 | 2014-03-25 | Delphi Technologies, Inc. | Surface mountable microwave signal transition block for microstrip to perpendicular waveguide transition |
US8912634B2 (en) | 2012-03-29 | 2014-12-16 | International Business Machines Corporation | High frequency transition matching in an electronic package for millimeter wave semiconductor dies |
WO2013189513A1 (en) * | 2012-06-18 | 2013-12-27 | Huawei Technologies Co., Ltd. | Directional coupler waveguide structure and method |
JP5694246B2 (ja) * | 2012-07-13 | 2015-04-01 | 株式会社東芝 | 導波管接続構造、アンテナ装置およびレーダ装置 |
US20140106684A1 (en) | 2012-10-15 | 2014-04-17 | Qualcomm Mems Technologies, Inc. | Transparent antennas on a display device |
US20150357698A1 (en) | 2013-01-10 | 2015-12-10 | Nec Corporation | Wideband transition between a planar transmission line and a waveguide |
CN105190990B (zh) * | 2013-03-24 | 2018-01-26 | 瑞典爱立信有限公司 | 在siw和波导接口之间的过渡 |
CN103515682B (zh) * | 2013-07-24 | 2015-07-29 | 中国电子科技集团公司第五十五研究所 | 多层阶梯式基片集成波导实现微带至波导的垂直过渡结构 |
CN103650243B (zh) * | 2013-07-31 | 2016-03-30 | 华为技术有限公司 | 一种天线 |
EP2843758A1 (en) * | 2013-08-27 | 2015-03-04 | Microelectronics Technology Inc. | Multi-layer circuit board with waveguide to microstrip transition structure |
US10014566B2 (en) * | 2013-10-01 | 2018-07-03 | Sony Semiconductor Solutions Corporation | Connector apparatus and communication system |
US9059490B2 (en) | 2013-10-08 | 2015-06-16 | Blackberry Limited | 60 GHz integrated circuit to printed circuit board transitions |
JP6269127B2 (ja) | 2014-02-07 | 2018-01-31 | 富士通株式会社 | 高周波モジュール及びその製造方法 |
EP2945222A1 (en) | 2014-05-14 | 2015-11-18 | Gapwaves AB | A microwave or millimeter wave RF part using pin grid array (PGA) and/or ball grid array (BGA) technologies |
US10177430B2 (en) * | 2014-05-16 | 2019-01-08 | City University Of Hong Kong | Apparatus and a method for electromagnetic signal transition |
EP2950616B1 (en) | 2014-05-26 | 2018-11-07 | Electrolux Appliances Aktiebolag | Microwave oven with a waveguide including a reflector element |
US9620841B2 (en) | 2014-06-13 | 2017-04-11 | Nxp Usa, Inc. | Radio frequency coupling structure |
US10103447B2 (en) | 2014-06-13 | 2018-10-16 | Nxp Usa, Inc. | Integrated circuit package with radio frequency coupling structure |
US9583811B2 (en) | 2014-08-07 | 2017-02-28 | Infineon Technologies Ag | Transition between a plastic waveguide and a semiconductor chip, where the semiconductor chip is embedded and encapsulated within a mold compound |
KR101621480B1 (ko) * | 2014-10-16 | 2016-05-16 | 현대모비스 주식회사 | 도파관 대 유전체 도파관의 천이 구조 |
US9666930B2 (en) | 2014-10-23 | 2017-05-30 | Nxp Usa, Inc. | Interface between a semiconductor die and a waveguide, where the interface is covered by a molding compound |
US10522895B2 (en) | 2014-12-12 | 2019-12-31 | Sony Corporation | Microwave antenna apparatus, packing and manufacturing method |
US9537199B2 (en) | 2015-03-19 | 2017-01-03 | International Business Machines Corporation | Package structure having an integrated waveguide configured to communicate between first and second integrated circuit chips |
US10109604B2 (en) | 2015-03-30 | 2018-10-23 | Sony Corporation | Package with embedded electronic components and a waveguide cavity through the package cover, antenna apparatus including package, and method of manufacturing the same |
KR101689353B1 (ko) | 2015-04-13 | 2016-12-23 | 성균관대학교산학협력단 | 실리콘 밀리미터파 칩용 칩상 도파관 급전기 및 급전 방법 및, 이를 이용한 다중 입출력 밀리미터파 송수신 장치 |
CN104900956A (zh) * | 2015-05-06 | 2015-09-09 | 东南大学 | 一种波导到基片集成波导的转换装置 |
US10083923B2 (en) | 2015-09-21 | 2018-09-25 | Intel Corporation | Platform with thermally stable wireless interconnects |
CN105680133B (zh) * | 2016-01-11 | 2018-08-10 | 中国电子科技集团公司第十研究所 | 基片集成脊波导板间垂直互联电路结构 |
WO2017126327A1 (ja) | 2016-01-20 | 2017-07-27 | ソニー株式会社 | コネクタモジュール、通信基板、および電子機器 |
CN105609909A (zh) * | 2016-03-08 | 2016-05-25 | 电子科技大学 | 一种用于Ka波段矩形波导转基片集成波导的装置 |
CN208955165U (zh) | 2016-06-29 | 2019-06-07 | 日本电产株式会社 | 雷达装置 |
CN105958167B (zh) * | 2016-07-01 | 2019-03-05 | 北京交通大学 | 垂直基片集成波导及包括该波导的垂直连接结构 |
DE102016213202A1 (de) | 2016-07-19 | 2018-01-25 | Conti Temic Microelectronic Gmbh | Mehrschichtenplatine mit einem Übergangselement zum Transformieren einer Hohlleiterwelle auf eine leitungsgeführte Welle |
KR101963936B1 (ko) | 2016-11-08 | 2019-07-31 | 한국과학기술원 | 전자파 신호 송수신 안테나 및 em-터널이 내장된 구조를 갖는 인쇄회로기판 및 그 제작 방법 |
US9935065B1 (en) | 2016-12-21 | 2018-04-03 | Infineon Technologies Ag | Radio frequency device packages and methods of formation thereof |
US10468736B2 (en) | 2017-02-08 | 2019-11-05 | Aptiv Technologies Limited | Radar assembly with ultra wide band waveguide to substrate integrated waveguide transition |
EP3364457A1 (en) | 2017-02-15 | 2018-08-22 | Nxp B.V. | Integrated circuit package including an antenna |
US10317459B2 (en) | 2017-04-03 | 2019-06-11 | Nvidia Corporation | Multi-chip package with selection logic and debug ports for testing inter-chip communications |
DE102017111319A1 (de) | 2017-05-24 | 2018-11-29 | Miele & Cie. Kg | Einrichtung zur Erzeugung und Transmission von Hochfrequenzwellen (HF-Wellen) |
CN108987866A (zh) | 2017-06-05 | 2018-12-11 | 日本电产株式会社 | 波导装置以及具有该波导装置的天线装置 |
JP2019012999A (ja) | 2017-06-30 | 2019-01-24 | 日本電産株式会社 | 導波路装置モジュール、マイクロ波モジュール、レーダ装置およびレーダシステム |
US11183751B2 (en) | 2017-09-20 | 2021-11-23 | Aptiv Technologies Limited | Antenna device with direct differential input useable on an automated vehicle |
US10403954B2 (en) | 2017-12-30 | 2019-09-03 | Texas Instruments Incorporated | Printed circuit board with substrate-integrated waveguide transition |
DE102019200893B4 (de) | 2019-01-21 | 2023-06-15 | Infineon Technologies Ag | Verfahren zum Erzeugen eines Hohlleiters, Schaltungsvorrichtung und Radarsystem |
CN109750201B (zh) | 2019-02-22 | 2020-07-07 | 中国科学院长春应用化学研究所 | 一种高成型性能微合金化镁合金薄板及其制备方法 |
CN209389219U (zh) | 2019-02-25 | 2019-09-13 | 贵州航天电子科技有限公司 | 一种适用于增材制造的波导缝隙阵列天线结构 |
US10775573B1 (en) | 2019-04-03 | 2020-09-15 | International Business Machines Corporation | Embedding mirror with metal particle coating |
US11527808B2 (en) | 2019-04-29 | 2022-12-13 | Aptiv Technologies Limited | Waveguide launcher |
-
2017
- 2017-02-08 US US15/427,769 patent/US10468736B2/en active Active
-
2018
- 2018-01-24 EP EP18153137.7A patent/EP3361560A1/en not_active Withdrawn
- 2018-02-07 CN CN202310980983.9A patent/CN116916543A/zh active Pending
- 2018-02-07 CN CN201810122408.4A patent/CN108398665B/zh active Active
-
2019
- 2019-09-26 US US16/583,867 patent/US10833385B2/en active Active
-
2020
- 2020-10-16 US US17/073,254 patent/US11670829B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP3361560A1 (en) | 2018-08-15 |
US20180226709A1 (en) | 2018-08-09 |
US20200021001A1 (en) | 2020-01-16 |
US10468736B2 (en) | 2019-11-05 |
US20210036393A1 (en) | 2021-02-04 |
US11670829B2 (en) | 2023-06-06 |
US10833385B2 (en) | 2020-11-10 |
CN108398665A (zh) | 2018-08-14 |
CN108398665B (zh) | 2023-07-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN108398665B (zh) | 用于基片集成波导转换的具有超宽频带波导的雷达组件 | |
US10582608B2 (en) | Interconnection between printed circuit boards | |
US8089327B2 (en) | Waveguide to plural microstrip transition | |
CN101496219B (zh) | 波导管的连接结构 | |
EP2979321B1 (en) | A transition between a siw and a waveguide interface | |
CN102414920A (zh) | 结构体、印刷板、天线、传输线波导转换器、阵列天线和电子装置 | |
JP2016220029A (ja) | アンテナ装置、無線通信装置、及びレーダ装置 | |
US7821361B2 (en) | Second-order band-pass filter and wireless apparatus using the same | |
CN109346834A (zh) | Sigw圆极化缝隙天线 | |
CA3096346C (en) | Array antenna apparatus and communication device | |
US11303004B2 (en) | Microstrip-to-waveguide transition including a substrate integrated waveguide with a 90 degree bend section | |
EP3525282B1 (en) | Signal handling device including multiple substrate layers | |
CN109616764A (zh) | 基片集成间隙波导圆极化天线 | |
US20040217830A1 (en) | RF multilayer circuit board | |
EP1936739B1 (en) | Improvement to radiating slot planar antennas | |
CN112055914A (zh) | 滤波器电路和通信设备 | |
US12003026B2 (en) | Antenna device and vehicle comprising an antenna device | |
US10044087B2 (en) | Switchable radiators and operating method for the same | |
CN112544015B (zh) | 波导管缝隙天线 | |
KR100814294B1 (ko) | 밴드 스톱 필터 | |
JP4799238B2 (ja) | 開口面アンテナ | |
CN111602289B (zh) | 天线和通信设备 | |
US10777899B2 (en) | Transmission line coupling system | |
Wang et al. | Design of gap waveguide PMC packaging for a SIW power combiner | |
CN114128037A (zh) | 耦合部件、微波器件及电子设备 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20240415 Address after: Jiraum, Luxembourg, Luxembourg J. 12C Kroll Street Applicant after: Anbofu Manufacturing Management Services Co.,Ltd. Country or region after: Luxembourg Address before: Babado J San Michaele Applicant before: Delphi Technologies, Inc. Country or region before: Barbados |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20240424 Address after: 2 Pestaroz Street, Schaffhausen, Switzerland Applicant after: Anbofu Technology Co.,Ltd. Country or region after: Switzerland Address before: Jiraum, Luxembourg, Luxembourg J. 12C Kroll Street Applicant before: Anbofu Manufacturing Management Services Co.,Ltd. Country or region before: Luxembourg |
|
TA01 | Transfer of patent application right |