CN116916543A - 用于基片集成波导转换的具有超宽频带波导的雷达组件 - Google Patents

用于基片集成波导转换的具有超宽频带波导的雷达组件 Download PDF

Info

Publication number
CN116916543A
CN116916543A CN202310980983.9A CN202310980983A CN116916543A CN 116916543 A CN116916543 A CN 116916543A CN 202310980983 A CN202310980983 A CN 202310980983A CN 116916543 A CN116916543 A CN 116916543A
Authority
CN
China
Prior art keywords
forming
siw
waveguide
waveguide transition
dielectric layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310980983.9A
Other languages
English (en)
Inventor
S·N·曼盖阿咖利
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anbofu Technology Co ltd
Original Assignee
Delphi Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delphi Technologies Inc filed Critical Delphi Technologies Inc
Publication of CN116916543A publication Critical patent/CN116916543A/zh
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00Waveguides; Transmission lines of the waveguide type
    • H01P3/12Hollow waveguides
    • H01P3/121Hollow waveguides integrated in a substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00Coupling devices of the waveguide type
    • H01P5/02Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/024Transitions between lines of the same kind and shape, but with different dimensions between hollow waveguides
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01SRADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S13/00Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
    • G01S13/02Systems using reflection of radio waves, e.g. primary radar systems; Analogous systems
    • G01S13/0209Systems with very large relative bandwidth, i.e. larger than 10 %, e.g. baseband, pulse, carrier-free, ultrawideband
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01SRADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/02Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/001Manufacturing waveguides or transmission lines of the waveguide type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00Coupling devices of the waveguide type
    • H01P5/08Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/10Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4644Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Waveguide Aerials (AREA)

Abstract

公开了一种用于基片集成波导转换的具有超宽频带波导的雷达组件。一种雷达组件(10)包括矩形波导(12)(RWG(12))和印刷电路板(18)。所述矩形波导(12)(RWG(12))以横电波模式(TE10)且以第一方向(16)传播电磁能量(14)。所述印刷电路板(18)包括多个互相平行定向的导体层(20)。所述印刷电路板(18)限定以横电波模式(TE10)且以垂直于第一方向(16)的第二方向(26)传播所述电磁能量(14)的基片集成波导(24)(SIW(24)),并且限定将所述电磁能量(14)在所述矩形波导(12)和所述基片集成波导(24)之间传播的转换(30)。所述转换(30)包括由所述多个导体层中至少三个限定的孔(32)。

Description

用于基片集成波导转换的具有超宽频带波导的雷达组件
本申请是申请日为2018-02-07,申请号为201810122408.4,题为“用于基片集成波导转换的具有超宽频带波导的雷达组件”的发明专利申请的分案申请。
技术领域
本公开大体涉及一种雷达组件,并且更具体地涉及矩形波导(RWG)和基片集成波导(SIW)之间的转换,其中转换包括由也限定SIW的印刷电路板的多个导体层中至少三个导体层限定的孔。
背景技术
宽频带转换被用于宽频带雷达系统,诸如汽车雷达。具有足够带宽的已知转换包括不期望地昂贵的波导法兰或金属结构,其中严格的容差增加成本。
发明内容
本文描述的是使用标准印刷电路板(PCB)工艺形成的宽频带转换,因此能够避免使用昂贵的波导法兰或金属结构。本文描述的非限制性示例提供矩形波导(RWG)和基片集成波导(SIW)之间的转换,该转换适用于例如在79GHz基本频率周围具有16GHz带宽的电磁能量。该转换适用于使用标准PCB制造工艺的超近程雷达(USRR)等紧凑的多层印刷电路板(PCB)结构。
根据一个实施例,提供了一种雷达组件。该组件包括矩形波导(RWG)和印刷电路板。矩形波导(RWG)以横电波模式(TE10)且以第一方向传播电磁能量。印刷电路板包括多个互相平行定向的导体层。印刷电路板限定以横电波模式(TE10)且以垂直于第一方向的第二方向传播电磁能量的基片集成波导(SIW),并且限定了将电磁能量在矩形波导和基片集成波导之间传播的转换。该转换包括由多个导体层中至少三个导体层限定的孔。
阅读优选实施例的下列详细描述并参考各个附图,进一步的特征和优点将更加显而易见,优选实施例只是作为非限制性示例给出的。
附图说明
现在将参考各个附图通过示例的方式来描述本发明,其中:
图1是根据一个实施例的雷达组件的等距视图;
图2是根据一个实施例的图1的雷达组件的一部分的俯视图;
图3是根据一个实施例的图1的雷达组件的一部分的横截面侧视图。
具体实施方式
图1、图2、和图3合作示出了雷达组件10(下文称为组件10)的非限制性示例。组件10可以是较大的雷达系统(未示出)的一部分,其中组件10在用于将电磁能量在雷达系统中从一个位置传播到另一个位置的不同类型的波导之间提供转换方式。
组件10包括将电磁能量14以横电波模式(TE10)并以第一方向16传播的矩形波导12或RWG 12。第一方向16被示出为双向箭头,因为,如本领域技术人员将认识到的,RWG 12可被用于将电磁能量14传播到(即,朝向)组件10,或传播出(即,远离)组件10。RWG 12的物理尺寸基于使用众所周知的设计规则的雷达系统的操作频率来选择。
组件10还包括印刷电路板18,该印刷电路板18包括多个互相平行定向的导体层20。用于介电层22和多个导体层20的物理尺寸和材料是基于使用众所周知的雷达系统的操作频率来选择的。作为示例而非限制,多个导体层20可包括八个导体层:L1、L2、L3、L4、L5、L6、L7、和L8(图3)。这些导体层中的一些(例如L3-L8)可被配置(例如,使用已知的光刻技术来处理)以限定基片集成波导24或SIW 24,该基片集成波导24或SIW 24将电磁能量14传播或使用横电波模式(TE10)将电磁能14以垂直于第一方向16的第二方向26传播。在这个示例中,层L8还被配置成限定槽式辐射器28,该槽式辐射器28可被用于将来自SIW 24的电磁能量14耦合到例如天线(未示出)。
组件10,或更具体地印刷电路板18,还包括或限定将电磁能量14在矩形波导12和基片集成波导24之间传播的转换30。如上所述,构想到,电磁能量14可以在任意方向;从矩形波导12到基片集成波导24,或从基片集成波导24到矩形波导12。转换30包括多个导体层30中至少三个导体层(例如L1-L3)限定的多个孔32。就是说,转换30包括孔的至少三个实例或由孔的至少三个实例限定。在这个示例中,转换30包括多个导体层20的与矩形波导12相邻或接触的第一层10A(L1)或由其限定。第一层20A限定由第一尺寸34表征的第一孔32A。转换30还包括多个导体层20的与基片集成波导24相邻的最后一层20B(L3),其中最后一层20B还限定基片集成波导24的水平边界36。相对于转换30,最后一层20B限定由大于第一尺寸34A的最后尺寸34B表征的最后一个孔32B。
转换30还包括位于转换30的第一层20A和最后一层20B之间的多个导体层20的中间层20C的一个或多个实例,或由其限定。中间层20C限定中间孔32C,中间孔34C由具有在第一尺寸34A和最后尺寸34B之间的值的中间尺寸34C表征。构想到,转换30可以在第一层20A和最后一层20B之间具有多于单个实例的中间层20C,使得转换30将包括孔32的多于三个实例或由其形成。就是说,构想到,除了第一孔32A和最后孔32B之间的中间孔32C外,转换30还可以包括附加孔。孔32的尺寸的数列或变化可以通过使用已知的设计技术来确定或优化。例如,孔32的尺寸可以在3D-EM软件HFSS上优化,以在宽频率范围上在RWG 12和SIW 24之间有效地传送能量和阻抗匹配。
为了减少从转换30漏出的电磁能量14的量,因此在矩形波导12和基片集成波导24之间不连通。转换30还可以包括用于限定转换30的垂直边界40的短壁38的一个或多个实例。短壁38可以由通孔42的布置形成,短壁可以是用于限定SIW 24的通孔42的一部分。
因此,提供了一种雷达组件(组件10)。组件10通过使用多层PCB(印刷电路板18)的内层提供了矩形波导12(RWG 12)和基片集成波导24(SIW 24)之间的宽频带转换(转换30),用于在电磁波谱的W带中操作。转换由穿过导电层的一系列孔(例如,L1至L3)形成。通过使用通常用于W带的标准PCB处理技术处理的多层PCB有利地且经济地提供了转换30。这样,不需要特殊的法兰或金属结构,因此避免了昂贵和严格容差的相关特征。
尽管已经根据本发明的优选实施例描述了本发明,但是并不旨在受限于此,而是仅受随后的权利要求书中所阐述的范围限制。

Claims (20)

1.一种制造印刷电路板PCB的方法,所述印刷电路板被配置用于雷达组件中,所述方法包括:
形成底部基片集成波导SIW导电层,所述底部SIW导电层被配置用于与所述雷达组件的天线对接;
形成多个SIW介电层,所述多个SIW介电层在所述底部SIW导电层的顶部上与多个SIW导电层交错,以底部SIW介电层开始并以顶部SIW介电层结束,所述SIW介电层和所述SIW导电层形成SIW,所述SIW被配置用于在与所述PCB的平面平行的第一方向上传播电磁能量;以及
形成一个或多个波导转换导电层,所述一个或多个波导转换导电层在顶部SIW介电层的顶部上与一个或多个波导转换介电层交错,以波导转换导电层的底部波导转换导电层开始并以所述波导转换导电层的顶部波导转换导电层结束,所述波导转换导电层包括相应的孔,所述顶部波导转换导电层的孔被配置用于与矩形集成波导对接,所述矩形集成波导在与所述第一方向垂直并且与所述PCB的所述平面垂直的第二方向上传播所述电磁波,所述波导转换导电层和所述波导转换介电层形成转换,所述转换被配置用于在所述SIW和所述矩形波导之间引导所述电磁能量。
2.如权利要求1所述的方法,其中,形成所述导电层包括使用光刻技术。
3.如权利要求1所述的方法,其中,形成所述波导转换导电层包括形成至少三个波导转换导电层。
4.如权利要求1所述的方法,其中,形成所述介电层包括:形成所述介电层使得所述介电层中的至少两个具有不同的厚度。
5.如权利要求4所述的方法,其中,形成所述波导转换介电层包括:形成所述波导转换介电层使得所述波导转换介电层具有类似的厚度。
6.如权利要求1所述的方法,其中,形成所述SIW介电层包括:形成数量为所述波导转换介电层的数量至少双倍的所述SIW介电层。
7.如权利要求1所述的方法,其中,形成所述底部导电层包括形成槽辐射器,所述槽辐射器被配置用于将所述电磁能量从所述SIW耦合到所述天线。
8.如权利要求1所述的方法,进一步包括形成穿过所述介电层的通孔以有效地电耦合所述导电层。
9.如权利要求8所述的方法,其中,形成所述通孔包括利用导电材料填充在所述介电层中形成的通孔。
10.如权利要求8所述的方法,其中,形成所述通孔包括:形成多个通孔,所述多个通孔穿过所述介电层形成周向壁。
11.如权利要求10所述的方法,其中,形成所述通孔进一步包括:形成另外多个通孔,所述另外多个通孔穿过所述波导转换介电层形成短壁。
12.如权利要求11所述的方法,其中,所述短壁在所述孔附近将所述波导转换介电层一份为二。
13.如权利要求1所述的方法,其中,形成所述波导转换导电层包括:形成所述孔使得所述孔具有不同尺寸。
14.一种制造印刷电路板PCB的方法,所述印刷电路板被配置用于雷达组件中,所述方法包括:
形成一个或多个波导转换介电层,所述一个或多个波导转换介电层与多个波导转换导电层交错,以波导转换导电层的底部波导转换导电层开始并以所述波导转换导电层的顶部波导转换导电层结束,所述波导转换导电层包括相应的孔,所述底部波导转换导电层的孔被配置用于与所述雷达组件的矩形集成波导对接,所述矩形集成波导在与所述PCB的平面垂直的第一方向上传播电磁波;以及。
形成多个基片集成波导SIW介电层,所述多个SIW介电层在所述顶部波导转换导电层的顶部上与多个SIW导电层交错,以SIW介电层开始并以所述SIW导电层的顶部SIW导电层结束,所述SIW介电层和所述SIW导电层形成SIW,所述SIW被配置用于在与所述第一方面垂直并且与所述PCB的所述平面平行的第二方向上传播电磁能量,所述顶部SIW导电层被配置用于与所述雷达组件的天线对接。
15.如权利要求14所述的方法,其中,所述PCB被配置用于汽车使用。
16.如权利要求14所述的方法,其中,形成所述介电层包括:形成所述介电层使得所述介电层中的至少两个具有不同的厚度。
17.如权利要求14所述的方法,其中,形成所述波导转换导电层包括:形成所述孔使得所述孔具有不同尺寸。
18.如权利要求14所述的方法,其中,形成所述顶部SIW导电层包括形成槽辐射器,所述槽辐射器被配置用于将所述电磁能量从所述SIW耦合到所述天线。
19.如权利要求14所述的方法,进一步包括形成穿过所述介电层的通孔以有效地电耦合所述导电层,其中形成所述通孔包括:形成多个通孔,所述多个通孔穿过所述介电层形成周向壁。
20.如权利要求19所述的方法,其中,形成所述通孔进一步包括;形成另外多个通孔,所述另外多个通孔穿过所述波导转换介电层形成短壁并且在所述孔附近将所述波导转换介电层一分为二。
CN202310980983.9A 2017-02-08 2018-02-07 用于基片集成波导转换的具有超宽频带波导的雷达组件 Pending CN116916543A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/427,769 2017-02-08
US15/427,769 US10468736B2 (en) 2017-02-08 2017-02-08 Radar assembly with ultra wide band waveguide to substrate integrated waveguide transition
CN201810122408.4A CN108398665B (zh) 2017-02-08 2018-02-07 用于基片集成波导转换的具有超宽频带波导的雷达组件

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201810122408.4A Division CN108398665B (zh) 2017-02-08 2018-02-07 用于基片集成波导转换的具有超宽频带波导的雷达组件

Publications (1)

Publication Number Publication Date
CN116916543A true CN116916543A (zh) 2023-10-20

Family

ID=61024632

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202310980983.9A Pending CN116916543A (zh) 2017-02-08 2018-02-07 用于基片集成波导转换的具有超宽频带波导的雷达组件
CN201810122408.4A Active CN108398665B (zh) 2017-02-08 2018-02-07 用于基片集成波导转换的具有超宽频带波导的雷达组件

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201810122408.4A Active CN108398665B (zh) 2017-02-08 2018-02-07 用于基片集成波导转换的具有超宽频带波导的雷达组件

Country Status (3)

Country Link
US (3) US10468736B2 (zh)
EP (1) EP3361560A1 (zh)
CN (2) CN116916543A (zh)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2017865B1 (en) * 2016-11-24 2018-06-01 The Antenna Company International N V Waveguide for electromagnetic radiation
US10468736B2 (en) * 2017-02-08 2019-11-05 Aptiv Technologies Limited Radar assembly with ultra wide band waveguide to substrate integrated waveguide transition
US10782388B2 (en) * 2017-02-16 2020-09-22 Magna Electronics Inc. Vehicle radar system with copper PCB
EP3450931B1 (de) * 2017-08-28 2022-10-05 VEGA Grieshaber KG Hohlleitereinkopplung für ein füllstandradar
US10680305B2 (en) * 2018-02-08 2020-06-09 Aptiv Technologies Limited Signal handling device including a surface integrated waveguide and a resonating cavity formed in multiple substrate layers
JP6950824B2 (ja) * 2018-06-04 2021-10-13 日本電気株式会社 誘電体導波管線路と導波管との接続構造
US11527808B2 (en) 2019-04-29 2022-12-13 Aptiv Technologies Limited Waveguide launcher
WO2021123111A1 (de) 2019-12-20 2021-06-24 2Pi-Labs Gmbh Hohlleiteranordnung
US11362436B2 (en) * 2020-10-02 2022-06-14 Aptiv Technologies Limited Plastic air-waveguide antenna with conductive particles
US11757166B2 (en) 2020-11-10 2023-09-12 Aptiv Technologies Limited Surface-mount waveguide for vertical transitions of a printed circuit board
US11626668B2 (en) 2020-12-18 2023-04-11 Aptiv Technologies Limited Waveguide end array antenna to reduce grating lobes and cross-polarization
US11901601B2 (en) 2020-12-18 2024-02-13 Aptiv Technologies Limited Waveguide with a zigzag for suppressing grating lobes
US11749883B2 (en) 2020-12-18 2023-09-05 Aptiv Technologies Limited Waveguide with radiation slots and parasitic elements for asymmetrical coverage
US11502420B2 (en) 2020-12-18 2022-11-15 Aptiv Technologies Limited Twin line fed dipole array antenna
US11681015B2 (en) 2020-12-18 2023-06-20 Aptiv Technologies Limited Waveguide with squint alteration
US11444364B2 (en) 2020-12-22 2022-09-13 Aptiv Technologies Limited Folded waveguide for antenna
US11668787B2 (en) 2021-01-29 2023-06-06 Aptiv Technologies Limited Waveguide with lobe suppression
US11721905B2 (en) 2021-03-16 2023-08-08 Aptiv Technologies Limited Waveguide with a beam-forming feature with radiation slots
US11616306B2 (en) 2021-03-22 2023-03-28 Aptiv Technologies Limited Apparatus, method and system comprising an air waveguide antenna having a single layer material with air channels therein which is interfaced with a circuit board
US11973268B2 (en) * 2021-05-03 2024-04-30 Aptiv Technologies AG Multi-layered air waveguide antenna with layer-to-layer connections
US11962085B2 (en) 2021-05-13 2024-04-16 Aptiv Technologies AG Two-part folded waveguide having a sinusoidal shape channel including horn shape radiating slots formed therein which are spaced apart by one-half wavelength
US11616282B2 (en) 2021-08-03 2023-03-28 Aptiv Technologies Limited Transition between a single-ended port and differential ports having stubs that match with input impedances of the single-ended and differential ports

Family Cites Families (95)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3462713A (en) * 1967-07-19 1969-08-19 Bell Telephone Labor Inc Waveguide-stripline transducer
US3579149A (en) * 1969-12-08 1971-05-18 Westinghouse Electric Corp Waveguide to stripline transition means
NL7609903A (nl) * 1976-09-07 1978-03-09 Philips Nv Microgolfinrichting voor het omzetten van een golfpijp- in een microstripgeleiderstructuur.
US4453142A (en) * 1981-11-02 1984-06-05 Motorola Inc. Microstrip to waveguide transition
US4562416A (en) * 1984-05-31 1985-12-31 Sanders Associates, Inc. Transition from stripline to waveguide
US5065123A (en) 1990-10-01 1991-11-12 Harris Corporation Waffle wall-configured conducting structure for chip isolation in millimeter wave monolithic subsystem assemblies
FR2700066A1 (fr) * 1992-12-29 1994-07-01 Philips Electronique Lab Dispositif hyperfréquences comprenant au moins une transition entre une ligne de transmission intégrée sur un substrat et un guide d'onde.
US5986527A (en) * 1995-03-28 1999-11-16 Murata Manufacturing Co., Ltd. Planar dielectric line and integrated circuit using the same line
JP3366552B2 (ja) * 1997-04-22 2003-01-14 京セラ株式会社 誘電体導波管線路およびそれを具備する多層配線基板
US5982250A (en) * 1997-11-26 1999-11-09 Twr Inc. Millimeter-wave LTCC package
CA2292064C (en) 1998-12-25 2003-08-19 Murata Manufacturing Co., Ltd. Line transition device between dielectric waveguide and waveguide, and oscillator and transmitter using the same
JP3771094B2 (ja) 1999-10-04 2006-04-26 アルプス電気株式会社 衛星放送受信用コンバータ
US6590477B1 (en) * 1999-10-29 2003-07-08 Fci Americas Technology, Inc. Waveguides and backplane systems with at least one mode suppression gap
US6958662B1 (en) 2000-10-18 2005-10-25 Nokia Corporation Waveguide to stripline transition with via forming an impedance matching fence
WO2002052674A1 (en) * 2000-12-21 2002-07-04 Paratek Microwave, Inc. Waveguide to microstrip transition
US6967347B2 (en) 2001-05-21 2005-11-22 The Regents Of The University Of Colorado Terahertz interconnect system and applications
JP2003243902A (ja) 2002-02-18 2003-08-29 Alps Electric Co Ltd 衛星放送受信用コンバータ
JP2003289201A (ja) 2002-03-28 2003-10-10 Anritsu Corp ポスト壁導波管と空洞導波管の接続変換構造
DE10243671B3 (de) 2002-09-20 2004-03-25 Eads Deutschland Gmbh Anordnung für einen Übergang zwischen einer Mikrostreifenleitung und einem Hohlleiter
US7276988B2 (en) * 2004-06-30 2007-10-02 Endwave Corporation Multi-substrate microstrip to waveguide transition
US7098070B2 (en) 2004-11-16 2006-08-29 International Business Machines Corporation Device and method for fabricating double-sided SOI wafer scale package with through via connections
CN2796131Y (zh) * 2005-05-30 2006-07-12 东南大学 多层基片集成波导椭圆响应滤波器
WO2007114391A1 (ja) 2006-03-31 2007-10-11 Kyocera Corporation 誘電体導波路デバイス、これを備える移相器、高周波スイッチおよび減衰器、ならびに高周波送信器、高周波受信器、高周波送受信器およびレーダ装置、アレイアンテナ装置、誘電体導波路デバイスの製造方法
CN101915957B (zh) 2006-06-12 2012-12-12 加利福尼亚太平洋生物科学公司 实施分析反应的基材
KR100846872B1 (ko) 2006-11-17 2008-07-16 한국전자통신연구원 유전체 도파관 대 전송선의 밀리미터파 천이 장치
JP4365852B2 (ja) 2006-11-30 2009-11-18 株式会社日立製作所 導波管構造
EP1936741A1 (en) * 2006-12-22 2008-06-25 Sony Deutschland GmbH Flexible substrate integrated waveguides
US8231284B2 (en) 2007-03-26 2012-07-31 International Business Machines Corporation Ultra-high bandwidth, multiple-channel full-duplex, single-chip CMOS optical transceiver
US7768457B2 (en) 2007-06-22 2010-08-03 Vubiq, Inc. Integrated antenna and chip package and method of manufacturing thereof
EP2224535B1 (en) * 2007-12-28 2013-12-18 Kyocera Corporation High-frequency transmission line connection structure, wiring substrate, high-frequency module, and radar device
CA2629035A1 (en) * 2008-03-27 2009-09-27 Her Majesty The Queen In Right Of Canada, As Represented By The Minister Of Industry, Through The Communications Research Centre Canada Waveguide filter with broad stopband based on sugstrate integrated waveguide scheme
JP5172481B2 (ja) * 2008-06-05 2013-03-27 株式会社東芝 ポスト壁導波路によるショートスロット方向性結合器とこれを用いたバトラーマトリクス及び車載レーダアンテナ
US8278749B2 (en) 2009-01-30 2012-10-02 Infineon Technologies Ag Integrated antennas in wafer level package
US8089327B2 (en) * 2009-03-09 2012-01-03 Toyota Motor Engineering & Manufacturing North America, Inc. Waveguide to plural microstrip transition
JP5309209B2 (ja) * 2009-03-31 2013-10-09 京セラ株式会社 導波構造体、ならびに、導波構造体を含む高周波モジュールおよびレーダ装置
CN201383535Y (zh) * 2009-04-01 2010-01-13 惠州市硕贝德通讯科技有限公司 一种矩形波导-基片集成波导信号转换及功率分配器
JP5443594B2 (ja) 2009-05-08 2014-03-19 テレフオンアクチーボラゲット エル エム エリクソン(パブル) チップから導波管ポートへの変換器
US8917151B2 (en) * 2009-09-08 2014-12-23 Siklu Communication ltd. Transition between a laminated PCB and a waveguide through a cavity in the laminated PCB
US8912859B2 (en) * 2009-09-08 2014-12-16 Siklu Communication ltd. Transition between a laminated PCB and a waveguide including a lamina with a printed conductive surface functioning as a waveguide-backshort
FR2953651B1 (fr) * 2009-12-07 2012-01-20 Eads Defence & Security Sys Dispositif de transition hyperfrequence entre une ligne a micro-ruban et un guide d'onde rectangulaire
US9774076B2 (en) 2010-08-31 2017-09-26 Siklu Communication ltd. Compact millimeter-wave radio systems and methods
US8674885B2 (en) 2010-08-31 2014-03-18 Siklu Communication ltd. Systems for interfacing waveguide antenna feeds with printed circuit boards
KR101761920B1 (ko) 2011-02-16 2017-07-26 삼성전기주식회사 유전체 도파관 안테나
US9270005B2 (en) * 2011-02-21 2016-02-23 Siklu Communication ltd. Laminate structures having a hole surrounding a probe for propagating millimeter waves
EP2500978B1 (en) * 2011-03-17 2013-07-10 Sivers Ima AB Waveguide transition
GB2489950A (en) * 2011-04-12 2012-10-17 Filtronic Plc A substrate integrated waveguide (SIW) to air filled waveguide transition comprising a tapered dielectric layer
US9147924B2 (en) 2011-09-02 2015-09-29 The United States Of America As Represented By The Secretary Of The Army Waveguide to co-planar-waveguide (CPW) transition
US8680936B2 (en) * 2011-11-18 2014-03-25 Delphi Technologies, Inc. Surface mountable microwave signal transition block for microstrip to perpendicular waveguide transition
US8912634B2 (en) 2012-03-29 2014-12-16 International Business Machines Corporation High frequency transition matching in an electronic package for millimeter wave semiconductor dies
WO2013189513A1 (en) * 2012-06-18 2013-12-27 Huawei Technologies Co., Ltd. Directional coupler waveguide structure and method
JP5694246B2 (ja) * 2012-07-13 2015-04-01 株式会社東芝 導波管接続構造、アンテナ装置およびレーダ装置
US20140106684A1 (en) 2012-10-15 2014-04-17 Qualcomm Mems Technologies, Inc. Transparent antennas on a display device
US20150357698A1 (en) 2013-01-10 2015-12-10 Nec Corporation Wideband transition between a planar transmission line and a waveguide
CN105190990B (zh) * 2013-03-24 2018-01-26 瑞典爱立信有限公司 在siw和波导接口之间的过渡
CN103515682B (zh) * 2013-07-24 2015-07-29 中国电子科技集团公司第五十五研究所 多层阶梯式基片集成波导实现微带至波导的垂直过渡结构
CN103650243B (zh) * 2013-07-31 2016-03-30 华为技术有限公司 一种天线
EP2843758A1 (en) * 2013-08-27 2015-03-04 Microelectronics Technology Inc. Multi-layer circuit board with waveguide to microstrip transition structure
US10014566B2 (en) * 2013-10-01 2018-07-03 Sony Semiconductor Solutions Corporation Connector apparatus and communication system
US9059490B2 (en) 2013-10-08 2015-06-16 Blackberry Limited 60 GHz integrated circuit to printed circuit board transitions
JP6269127B2 (ja) 2014-02-07 2018-01-31 富士通株式会社 高周波モジュール及びその製造方法
EP2945222A1 (en) 2014-05-14 2015-11-18 Gapwaves AB A microwave or millimeter wave RF part using pin grid array (PGA) and/or ball grid array (BGA) technologies
US10177430B2 (en) * 2014-05-16 2019-01-08 City University Of Hong Kong Apparatus and a method for electromagnetic signal transition
EP2950616B1 (en) 2014-05-26 2018-11-07 Electrolux Appliances Aktiebolag Microwave oven with a waveguide including a reflector element
US9620841B2 (en) 2014-06-13 2017-04-11 Nxp Usa, Inc. Radio frequency coupling structure
US10103447B2 (en) 2014-06-13 2018-10-16 Nxp Usa, Inc. Integrated circuit package with radio frequency coupling structure
US9583811B2 (en) 2014-08-07 2017-02-28 Infineon Technologies Ag Transition between a plastic waveguide and a semiconductor chip, where the semiconductor chip is embedded and encapsulated within a mold compound
KR101621480B1 (ko) * 2014-10-16 2016-05-16 현대모비스 주식회사 도파관 대 유전체 도파관의 천이 구조
US9666930B2 (en) 2014-10-23 2017-05-30 Nxp Usa, Inc. Interface between a semiconductor die and a waveguide, where the interface is covered by a molding compound
US10522895B2 (en) 2014-12-12 2019-12-31 Sony Corporation Microwave antenna apparatus, packing and manufacturing method
US9537199B2 (en) 2015-03-19 2017-01-03 International Business Machines Corporation Package structure having an integrated waveguide configured to communicate between first and second integrated circuit chips
US10109604B2 (en) 2015-03-30 2018-10-23 Sony Corporation Package with embedded electronic components and a waveguide cavity through the package cover, antenna apparatus including package, and method of manufacturing the same
KR101689353B1 (ko) 2015-04-13 2016-12-23 성균관대학교산학협력단 실리콘 밀리미터파 칩용 칩상 도파관 급전기 및 급전 방법 및, 이를 이용한 다중 입출력 밀리미터파 송수신 장치
CN104900956A (zh) * 2015-05-06 2015-09-09 东南大学 一种波导到基片集成波导的转换装置
US10083923B2 (en) 2015-09-21 2018-09-25 Intel Corporation Platform with thermally stable wireless interconnects
CN105680133B (zh) * 2016-01-11 2018-08-10 中国电子科技集团公司第十研究所 基片集成脊波导板间垂直互联电路结构
WO2017126327A1 (ja) 2016-01-20 2017-07-27 ソニー株式会社 コネクタモジュール、通信基板、および電子機器
CN105609909A (zh) * 2016-03-08 2016-05-25 电子科技大学 一种用于Ka波段矩形波导转基片集成波导的装置
CN208955165U (zh) 2016-06-29 2019-06-07 日本电产株式会社 雷达装置
CN105958167B (zh) * 2016-07-01 2019-03-05 北京交通大学 垂直基片集成波导及包括该波导的垂直连接结构
DE102016213202A1 (de) 2016-07-19 2018-01-25 Conti Temic Microelectronic Gmbh Mehrschichtenplatine mit einem Übergangselement zum Transformieren einer Hohlleiterwelle auf eine leitungsgeführte Welle
KR101963936B1 (ko) 2016-11-08 2019-07-31 한국과학기술원 전자파 신호 송수신 안테나 및 em-터널이 내장된 구조를 갖는 인쇄회로기판 및 그 제작 방법
US9935065B1 (en) 2016-12-21 2018-04-03 Infineon Technologies Ag Radio frequency device packages and methods of formation thereof
US10468736B2 (en) 2017-02-08 2019-11-05 Aptiv Technologies Limited Radar assembly with ultra wide band waveguide to substrate integrated waveguide transition
EP3364457A1 (en) 2017-02-15 2018-08-22 Nxp B.V. Integrated circuit package including an antenna
US10317459B2 (en) 2017-04-03 2019-06-11 Nvidia Corporation Multi-chip package with selection logic and debug ports for testing inter-chip communications
DE102017111319A1 (de) 2017-05-24 2018-11-29 Miele & Cie. Kg Einrichtung zur Erzeugung und Transmission von Hochfrequenzwellen (HF-Wellen)
CN108987866A (zh) 2017-06-05 2018-12-11 日本电产株式会社 波导装置以及具有该波导装置的天线装置
JP2019012999A (ja) 2017-06-30 2019-01-24 日本電産株式会社 導波路装置モジュール、マイクロ波モジュール、レーダ装置およびレーダシステム
US11183751B2 (en) 2017-09-20 2021-11-23 Aptiv Technologies Limited Antenna device with direct differential input useable on an automated vehicle
US10403954B2 (en) 2017-12-30 2019-09-03 Texas Instruments Incorporated Printed circuit board with substrate-integrated waveguide transition
DE102019200893B4 (de) 2019-01-21 2023-06-15 Infineon Technologies Ag Verfahren zum Erzeugen eines Hohlleiters, Schaltungsvorrichtung und Radarsystem
CN109750201B (zh) 2019-02-22 2020-07-07 中国科学院长春应用化学研究所 一种高成型性能微合金化镁合金薄板及其制备方法
CN209389219U (zh) 2019-02-25 2019-09-13 贵州航天电子科技有限公司 一种适用于增材制造的波导缝隙阵列天线结构
US10775573B1 (en) 2019-04-03 2020-09-15 International Business Machines Corporation Embedding mirror with metal particle coating
US11527808B2 (en) 2019-04-29 2022-12-13 Aptiv Technologies Limited Waveguide launcher

Also Published As

Publication number Publication date
EP3361560A1 (en) 2018-08-15
US20180226709A1 (en) 2018-08-09
US20200021001A1 (en) 2020-01-16
US10468736B2 (en) 2019-11-05
US20210036393A1 (en) 2021-02-04
US11670829B2 (en) 2023-06-06
US10833385B2 (en) 2020-11-10
CN108398665A (zh) 2018-08-14
CN108398665B (zh) 2023-07-21

Similar Documents

Publication Publication Date Title
CN108398665B (zh) 用于基片集成波导转换的具有超宽频带波导的雷达组件
US10582608B2 (en) Interconnection between printed circuit boards
US8089327B2 (en) Waveguide to plural microstrip transition
CN101496219B (zh) 波导管的连接结构
EP2979321B1 (en) A transition between a siw and a waveguide interface
CN102414920A (zh) 结构体、印刷板、天线、传输线波导转换器、阵列天线和电子装置
JP2016220029A (ja) アンテナ装置、無線通信装置、及びレーダ装置
US7821361B2 (en) Second-order band-pass filter and wireless apparatus using the same
CN109346834A (zh) Sigw圆极化缝隙天线
CA3096346C (en) Array antenna apparatus and communication device
US11303004B2 (en) Microstrip-to-waveguide transition including a substrate integrated waveguide with a 90 degree bend section
EP3525282B1 (en) Signal handling device including multiple substrate layers
CN109616764A (zh) 基片集成间隙波导圆极化天线
US20040217830A1 (en) RF multilayer circuit board
EP1936739B1 (en) Improvement to radiating slot planar antennas
CN112055914A (zh) 滤波器电路和通信设备
US12003026B2 (en) Antenna device and vehicle comprising an antenna device
US10044087B2 (en) Switchable radiators and operating method for the same
CN112544015B (zh) 波导管缝隙天线
KR100814294B1 (ko) 밴드 스톱 필터
JP4799238B2 (ja) 開口面アンテナ
CN111602289B (zh) 天线和通信设备
US10777899B2 (en) Transmission line coupling system
Wang et al. Design of gap waveguide PMC packaging for a SIW power combiner
CN114128037A (zh) 耦合部件、微波器件及电子设备

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right

Effective date of registration: 20240415

Address after: Jiraum, Luxembourg, Luxembourg J. 12C Kroll Street

Applicant after: Anbofu Manufacturing Management Services Co.,Ltd.

Country or region after: Luxembourg

Address before: Babado J San Michaele

Applicant before: Delphi Technologies, Inc.

Country or region before: Barbados

TA01 Transfer of patent application right
TA01 Transfer of patent application right

Effective date of registration: 20240424

Address after: 2 Pestaroz Street, Schaffhausen, Switzerland

Applicant after: Anbofu Technology Co.,Ltd.

Country or region after: Switzerland

Address before: Jiraum, Luxembourg, Luxembourg J. 12C Kroll Street

Applicant before: Anbofu Manufacturing Management Services Co.,Ltd.

Country or region before: Luxembourg

TA01 Transfer of patent application right