CN116916543A - 用于基片集成波导转换的具有超宽频带波导的雷达组件 - Google Patents

用于基片集成波导转换的具有超宽频带波导的雷达组件 Download PDF

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CN116916543A
CN116916543A CN202310980983.9A CN202310980983A CN116916543A CN 116916543 A CN116916543 A CN 116916543A CN 202310980983 A CN202310980983 A CN 202310980983A CN 116916543 A CN116916543 A CN 116916543A
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S·N·曼盖阿咖利
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Anbofu Technology Co ltd
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/12—Hollow waveguides
    • H01P3/121—Hollow waveguides integrated in a substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/024—Transitions between lines of the same kind and shape, but with different dimensions between hollow waveguides
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    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
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    • G01S13/02—Systems using reflection of radio waves, e.g. primary radar systems; Analogous systems
    • G01S13/0209—Systems with very large relative bandwidth, i.e. larger than 10 %, e.g. baseband, pulse, carrier-free, ultrawideband
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

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Abstract

公开了一种用于基片集成波导转换的具有超宽频带波导的雷达组件。一种雷达组件(10)包括矩形波导(12)(RWG(12))和印刷电路板(18)。所述矩形波导(12)(RWG(12))以横电波模式(TE10)且以第一方向(16)传播电磁能量(14)。所述印刷电路板(18)包括多个互相平行定向的导体层(20)。所述印刷电路板(18)限定以横电波模式(TE10)且以垂直于第一方向(16)的第二方向(26)传播所述电磁能量(14)的基片集成波导(24)(SIW(24))，并且限定将所述电磁能量(14)在所述矩形波导(12)和所述基片集成波导(24)之间传播的转换(30)。所述转换(30)包括由所述多个导体层中至少三个限定的孔(32)。

Description

用于基片集成波导转换的具有超宽频带波导的雷达组件
本申请是申请日为2018-02-07，申请号为201810122408.4，题为“用于基片集成波导转换的具有超宽频带波导的雷达组件”的发明专利申请的分案申请。
技术领域
本公开大体涉及一种雷达组件，并且更具体地涉及矩形波导(RWG)和基片集成波导(SIW)之间的转换，其中转换包括由也限定SIW的印刷电路板的多个导体层中至少三个导体层限定的孔。
背景技术
宽频带转换被用于宽频带雷达系统，诸如汽车雷达。具有足够带宽的已知转换包括不期望地昂贵的波导法兰或金属结构，其中严格的容差增加成本。
发明内容
本文描述的是使用标准印刷电路板(PCB)工艺形成的宽频带转换，因此能够避免使用昂贵的波导法兰或金属结构。本文描述的非限制性示例提供矩形波导(RWG)和基片集成波导(SIW)之间的转换，该转换适用于例如在79GHz基本频率周围具有16GHz带宽的电磁能量。该转换适用于使用标准PCB制造工艺的超近程雷达(USRR)等紧凑的多层印刷电路板(PCB)结构。
根据一个实施例，提供了一种雷达组件。该组件包括矩形波导(RWG)和印刷电路板。矩形波导(RWG)以横电波模式(TE10)且以第一方向传播电磁能量。印刷电路板包括多个互相平行定向的导体层。印刷电路板限定以横电波模式(TE10)且以垂直于第一方向的第二方向传播电磁能量的基片集成波导(SIW)，并且限定了将电磁能量在矩形波导和基片集成波导之间传播的转换。该转换包括由多个导体层中至少三个导体层限定的孔。
阅读优选实施例的下列详细描述并参考各个附图，进一步的特征和优点将更加显而易见，优选实施例只是作为非限制性示例给出的。
附图说明
现在将参考各个附图通过示例的方式来描述本发明，其中：
图1是根据一个实施例的雷达组件的等距视图；
图2是根据一个实施例的图1的雷达组件的一部分的俯视图；
图3是根据一个实施例的图1的雷达组件的一部分的横截面侧视图。
具体实施方式
图1、图2、和图3合作示出了雷达组件10(下文称为组件10)的非限制性示例。组件10可以是较大的雷达系统(未示出)的一部分，其中组件10在用于将电磁能量在雷达系统中从一个位置传播到另一个位置的不同类型的波导之间提供转换方式。
组件10包括将电磁能量14以横电波模式(TE10)并以第一方向16传播的矩形波导12或RWG 12。第一方向16被示出为双向箭头，因为，如本领域技术人员将认识到的，RWG 12可被用于将电磁能量14传播到(即，朝向)组件10，或传播出(即，远离)组件10。RWG 12的物理尺寸基于使用众所周知的设计规则的雷达系统的操作频率来选择。
组件10还包括印刷电路板18，该印刷电路板18包括多个互相平行定向的导体层20。用于介电层22和多个导体层20的物理尺寸和材料是基于使用众所周知的雷达系统的操作频率来选择的。作为示例而非限制，多个导体层20可包括八个导体层：L1、L2、L3、L4、L5、L6、L7、和L8(图3)。这些导体层中的一些(例如L3-L8)可被配置(例如，使用已知的光刻技术来处理)以限定基片集成波导24或SIW 24，该基片集成波导24或SIW 24将电磁能量14传播或使用横电波模式(TE10)将电磁能14以垂直于第一方向16的第二方向26传播。在这个示例中，层L8还被配置成限定槽式辐射器28，该槽式辐射器28可被用于将来自SIW 24的电磁能量14耦合到例如天线(未示出)。
组件10，或更具体地印刷电路板18，还包括或限定将电磁能量14在矩形波导12和基片集成波导24之间传播的转换30。如上所述，构想到，电磁能量14可以在任意方向；从矩形波导12到基片集成波导24，或从基片集成波导24到矩形波导12。转换30包括多个导体层30中至少三个导体层(例如L1-L3)限定的多个孔32。就是说，转换30包括孔的至少三个实例或由孔的至少三个实例限定。在这个示例中，转换30包括多个导体层20的与矩形波导12相邻或接触的第一层10A(L1)或由其限定。第一层20A限定由第一尺寸34表征的第一孔32A。转换30还包括多个导体层20的与基片集成波导24相邻的最后一层20B(L3)，其中最后一层20B还限定基片集成波导24的水平边界36。相对于转换30，最后一层20B限定由大于第一尺寸34A的最后尺寸34B表征的最后一个孔32B。
转换30还包括位于转换30的第一层20A和最后一层20B之间的多个导体层20的中间层20C的一个或多个实例，或由其限定。中间层20C限定中间孔32C，中间孔34C由具有在第一尺寸34A和最后尺寸34B之间的值的中间尺寸34C表征。构想到，转换30可以在第一层20A和最后一层20B之间具有多于单个实例的中间层20C，使得转换30将包括孔32的多于三个实例或由其形成。就是说，构想到，除了第一孔32A和最后孔32B之间的中间孔32C外，转换30还可以包括附加孔。孔32的尺寸的数列或变化可以通过使用已知的设计技术来确定或优化。例如，孔32的尺寸可以在3D-EM软件HFSS上优化，以在宽频率范围上在RWG 12和SIW 24之间有效地传送能量和阻抗匹配。
为了减少从转换30漏出的电磁能量14的量，因此在矩形波导12和基片集成波导24之间不连通。转换30还可以包括用于限定转换30的垂直边界40的短壁38的一个或多个实例。短壁38可以由通孔42的布置形成，短壁可以是用于限定SIW 24的通孔42的一部分。
因此，提供了一种雷达组件(组件10)。组件10通过使用多层PCB(印刷电路板18)的内层提供了矩形波导12(RWG 12)和基片集成波导24(SIW 24)之间的宽频带转换(转换30)，用于在电磁波谱的W带中操作。转换由穿过导电层的一系列孔(例如，L1至L3)形成。通过使用通常用于W带的标准PCB处理技术处理的多层PCB有利地且经济地提供了转换30。这样，不需要特殊的法兰或金属结构，因此避免了昂贵和严格容差的相关特征。
尽管已经根据本发明的优选实施例描述了本发明，但是并不旨在受限于此，而是仅受随后的权利要求书中所阐述的范围限制。

Claims (20)

1.一种制造印刷电路板PCB的方法，所述印刷电路板被配置用于雷达组件中，所述方法包括：
形成底部基片集成波导SIW导电层，所述底部SIW导电层被配置用于与所述雷达组件的天线对接；
形成多个SIW介电层，所述多个SIW介电层在所述底部SIW导电层的顶部上与多个SIW导电层交错，以底部SIW介电层开始并以顶部SIW介电层结束，所述SIW介电层和所述SIW导电层形成SIW，所述SIW被配置用于在与所述PCB的平面平行的第一方向上传播电磁能量；以及
形成一个或多个波导转换导电层，所述一个或多个波导转换导电层在顶部SIW介电层的顶部上与一个或多个波导转换介电层交错，以波导转换导电层的底部波导转换导电层开始并以所述波导转换导电层的顶部波导转换导电层结束，所述波导转换导电层包括相应的孔，所述顶部波导转换导电层的孔被配置用于与矩形集成波导对接，所述矩形集成波导在与所述第一方向垂直并且与所述PCB的所述平面垂直的第二方向上传播所述电磁波，所述波导转换导电层和所述波导转换介电层形成转换，所述转换被配置用于在所述SIW和所述矩形波导之间引导所述电磁能量。
2.如权利要求1所述的方法，其中，形成所述导电层包括使用光刻技术。
3.如权利要求1所述的方法，其中，形成所述波导转换导电层包括形成至少三个波导转换导电层。
4.如权利要求1所述的方法，其中，形成所述介电层包括：形成所述介电层使得所述介电层中的至少两个具有不同的厚度。
5.如权利要求4所述的方法，其中，形成所述波导转换介电层包括：形成所述波导转换介电层使得所述波导转换介电层具有类似的厚度。
6.如权利要求1所述的方法，其中，形成所述SIW介电层包括：形成数量为所述波导转换介电层的数量至少双倍的所述SIW介电层。
7.如权利要求1所述的方法，其中，形成所述底部导电层包括形成槽辐射器，所述槽辐射器被配置用于将所述电磁能量从所述SIW耦合到所述天线。
8.如权利要求1所述的方法，进一步包括形成穿过所述介电层的通孔以有效地电耦合所述导电层。
9.如权利要求8所述的方法，其中，形成所述通孔包括利用导电材料填充在所述介电层中形成的通孔。
10.如权利要求8所述的方法，其中，形成所述通孔包括：形成多个通孔，所述多个通孔穿过所述介电层形成周向壁。
11.如权利要求10所述的方法，其中，形成所述通孔进一步包括：形成另外多个通孔，所述另外多个通孔穿过所述波导转换介电层形成短壁。
12.如权利要求11所述的方法，其中，所述短壁在所述孔附近将所述波导转换介电层一份为二。
13.如权利要求1所述的方法，其中，形成所述波导转换导电层包括：形成所述孔使得所述孔具有不同尺寸。
14.一种制造印刷电路板PCB的方法，所述印刷电路板被配置用于雷达组件中，所述方法包括：
形成一个或多个波导转换介电层，所述一个或多个波导转换介电层与多个波导转换导电层交错，以波导转换导电层的底部波导转换导电层开始并以所述波导转换导电层的顶部波导转换导电层结束，所述波导转换导电层包括相应的孔，所述底部波导转换导电层的孔被配置用于与所述雷达组件的矩形集成波导对接，所述矩形集成波导在与所述PCB的平面垂直的第一方向上传播电磁波；以及。
形成多个基片集成波导SIW介电层，所述多个SIW介电层在所述顶部波导转换导电层的顶部上与多个SIW导电层交错，以SIW介电层开始并以所述SIW导电层的顶部SIW导电层结束，所述SIW介电层和所述SIW导电层形成SIW，所述SIW被配置用于在与所述第一方面垂直并且与所述PCB的所述平面平行的第二方向上传播电磁能量，所述顶部SIW导电层被配置用于与所述雷达组件的天线对接。
15.如权利要求14所述的方法，其中，所述PCB被配置用于汽车使用。
16.如权利要求14所述的方法，其中，形成所述介电层包括：形成所述介电层使得所述介电层中的至少两个具有不同的厚度。
17.如权利要求14所述的方法，其中，形成所述波导转换导电层包括：形成所述孔使得所述孔具有不同尺寸。
18.如权利要求14所述的方法，其中，形成所述顶部SIW导电层包括形成槽辐射器，所述槽辐射器被配置用于将所述电磁能量从所述SIW耦合到所述天线。
19.如权利要求14所述的方法，进一步包括形成穿过所述介电层的通孔以有效地电耦合所述导电层，其中形成所述通孔包括：形成多个通孔，所述多个通孔穿过所述介电层形成周向壁。
20.如权利要求19所述的方法，其中，形成所述通孔进一步包括；形成另外多个通孔，所述另外多个通孔穿过所述波导转换介电层形成短壁并且在所述孔附近将所述波导转换介电层一分为二。
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