CN108386738A - 一种高显指柔性灯丝灯 - Google Patents

一种高显指柔性灯丝灯 Download PDF

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CN108386738A
CN108386738A CN201810134430.0A CN201810134430A CN108386738A CN 108386738 A CN108386738 A CN 108386738A CN 201810134430 A CN201810134430 A CN 201810134430A CN 108386738 A CN108386738 A CN 108386738A
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CN108386738B (zh
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任磊
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ANHUI FU XIN YA OPTOELECTRONICS TECHNOLOGY Co.,Ltd.
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Anhui Poetry Poplar Mdt Infotech Ltd
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
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    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
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    • C01INORGANIC CHEMISTRY
    • C01GCOMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
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    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/02Use of particular materials as binders, particle coatings or suspension media therefor
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/66Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing germanium, tin or lead
    • C09K11/664Halogenides
    • C09K11/665Halogenides with alkali or alkaline earth metals
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238Arrangement or mounting of circuit elements integrated in the light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90Methods of manufacture
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    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502Wavelength conversion materials
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

本发明公开一种高显指柔性灯丝灯,包括灯泡壳、灯头、灯柱、电极引线、LED柔性灯丝;所述LED柔性灯丝两端分别与两根电极引线一端连接,电极引线另一端连接到灯柱下表面的两个焊盘上,灯柱固定在灯头内,灯柱内部设置有驱动电路,两个焊盘通过驱动电路分别连接灯头上的正极、负极;所述灯泡壳与灯头封接。本发明具有显指高、稳定性好、能耗低、寿命长、外形美观的特点。本发明对量子点荧光粉通过修饰工艺,使量子点材料CsPbX3包覆在TiO2核上,并用TiO2包覆CsPbX3,使TiO2@CsPbX3@TiO2对水、氧的稳定性提升;再将TiO2@CsPbX3@TiO2制成LED柔性灯丝,组装成氦气保护的灯丝灯,进一步提升稳定性;量子点荧光粉填补了红光波段区域欠缺的光,提升LED灯的显指,同时灯丝灯增加LED灯的美观性。

Description

一种高显指柔性灯丝灯
技术领域
本发明涉及LED背光领域,具体为一种显指高、稳定性好、能耗低、寿命长、外形美观的高显指柔性灯丝灯。
背景技术
用蓝光LED激发萤光粉混合发岀白色光是当前白光LED的普遍采用的方法,选择不同品种的萤光粉,调整萤光粉涂层的厚度可以制成不同标称色温的白色光源,形成标称色温从低到高的系列产品。这些白光LED产品在显色性方面也已经可以满足一般的照明要求。当前市场上常见的标称色温5000K以下的优质低色温白光LED,其一般显指Ra己经可以达到90以上。但标称色温高于这范围的现有LED产品,其显色性(一般显指Ra)只能达到85甚至更低。作为普通照明,由于很少采用标称色温5000K以上的LED光源,因而用现有的LED产品取代现有的节能灯和萤光灯照明,其显色性水平已经可以满足要求。
但是灯光显指越高,对颜色表现能力也就越强。高显指能够还原颜色的真实性,减少灯光照射时的失真。在服装店、画室、装修、颜料、玉石行业,对高显指灯具的要求很高。一般专用照明光源的标准为至少一般显指Ra>92。
LED光源,因其具有发光亮度足、发光均匀,且耗电量少,因此已逐步取代使用达百年之久的钨丝灯。随着照明科技的进一步发展,LED光源从点光源逐渐变成条状光源,甚至是多种形状的长条状柔性灯丝;LED柔性灯丝可在同样面积的情况下,瓦数增加多倍甚至数倍,具备很强的实用性,这是传统的条状LED灯条所无法企及的;目前较为常见的为螺旋状LED柔性灯丝,其结构美观,发光瓦数大。
发明内容
本发明的目的在于客服现有技术的不足,提供了一种高显指柔性灯丝灯,具有显指高、稳定性好、能耗低、寿命长、外形美观的特点。
本发明的目的可以通过以下技术方案实现:
一种高显指柔性灯丝灯,包括灯泡壳、灯头、灯柱、电极引线、LED柔性灯丝;
所述LED柔性灯丝两端分别与两根电极引线一端连接,电极引线另一端连接到灯柱下表面的两个焊盘上,灯柱固定在灯头内,灯柱内部设置有驱动电路,两个焊盘通过驱动电路分别连接灯头上的正极、负极;所述灯泡壳与灯头封接;
所述灯泡壳内为干燥氦气;
所述LED柔性灯丝分为接线柱、柔性灯丝,接线柱分别设置在柔性灯丝的两端;柔性灯丝包括柔性基底、凹槽侧壁、LED芯片、金线、小焊盘、大焊盘、白条、荧光胶,柔性基底上表面设置有凹槽侧壁,凹槽侧壁与柔性基底形成等间距排列的LED支架,LED支架内的柔性基底上设置有LED芯片,LED芯片的上表面左右两侧分别设置有两个电极,两个电极分别通过金线连接到底部的小焊盘和大焊盘,小焊盘和大焊盘设置在柔性基底上;所述白条将小焊盘和大焊盘隔开;柔性基底上方覆盖有荧光胶;
所述荧光胶由热固型胶水和荧光粉混合热固而成,热固型胶水的材质为有机硅胶、有机树脂中的一种;荧光粉中含有量子点荧光粉,量子点荧光粉的材料为TiO2@CsPbX3@TiO2,TiO2@CsPbX3@TiO2为TiO2为核,CsPbX3包覆在TiO2核外面,在CsPbX3外面再用TiO2包覆;
所述TiO2@CsPbX3@TiO2为TiO2@CsPbCl3@TiO2、TiO2@CsPbBr3@TiO2、TiO2@CsPbI3@TiO2中的一种;
所述荧光粉中含有YAG粉、硅酸盐、氮化物荧光粉、KSF荧光粉、β-SiAlON中的一种或两种;
所述TiO2@CsPbX3@TiO2的制作方法,包括以下步骤:
步骤S01、将十八烯至于20~25℃的温水中,随后量取液态的十八烯和油酸,按体积比1:1.4~1.6混合;随后称取Cs2CO3粉末倒入混合液中,配成浓度为95~105mg/ml的混合溶液A,并将混合溶液A放入氦气氛围下,加热到120~150℃,保温1~2小时,得到油酸铯前驱体溶液;
步骤S02、将称量PbX2,并加入到十八烯溶液中,配成浓度为13~14mg/ml的混合溶液B,并将混合溶液A放入氦气氛围下,加热到120~150℃,保温1~2小时,随后向每1ml混合溶液B中,注入0.4~0.5ml油酸和0.5~0.6ml油胺至完全溶解,得到溶液C;
步骤S03、向每1ml溶液C中,加入P25粉末,经120℃氦气氛围,搅拌转速为500~800r/min,得到溶液D;随后抽取油酸铯前驱体溶液逐滴注入溶液D中,得到溶液E,每1ml油酸铯前驱体溶液对应0.4~0.6ml的溶液D;
步骤S04、将溶液E连同容器,快速置于冰水浴中,静置5~10s;随后经反复漂洗和离心,并冷冻干燥,得到TiO2@CsPbX3粉末;
步骤S05、称取TiO2@CsPbX3粉末加入无水乙醇中,经500r/min搅拌10min,并逐滴加入TiCl4溶液,形成TiO2@CsPbX3粉末、TiCl4的浓度分别为0.02~0.04mg/ml、0.05~0.1ml/ml的溶液F;
步骤S06、将溶液F置于空气中,经500r/min搅拌48~72h,再经乙醇漂洗、离心、冷冻干燥后,得到为TiO2@CsPbX3@TiO2粉末;
所述PbX2为PbCl2、PbBr2、PbI2中的一种;
该灯丝灯的制作方法,包括以下步骤:
步骤S11、将LED芯片固定在柔性基底上,将LED芯片上表面的电极通过金线分别与小焊盘和大焊盘相连;将荧光粉与热固胶混合后,涂布在柔性基底上方,通过烘烤后,形成荧光胶,根据所需形状,弯折成LED柔性灯丝;
步骤S12、将上述:LED柔性灯丝通过电极引线焊接在灯柱下表面的焊盘上;将灯柱固定在灯头内,形成发光组件;
步骤S13、将上述发光组件与灯泡壳组装在一起;将灯泡壳内的空气抽出,同时充入氦气,并进行封口,完成灯丝灯制作。
本发明提供了一种高显指柔性灯丝灯,具有显指高、稳定性好、能耗低、寿命长、外形美观的特点。本发明对量子点荧光粉通过修饰工艺,使量子点材料CsPbX3包覆在TiO2核上,并用TiO2包覆CsPbX3,使TiO2@CsPbX3@TiO2对水、氧的稳定性提升;再将TiO2@CsPbX3@TiO2制成LED柔性灯丝,组装成氦气保护的灯丝灯,在氦气保护下,量子点材料稳定性进一步提升;量子点荧光粉的引入,填补了传统LED灯红光波段区域欠缺的光,提升LED灯的显指,同时灯丝灯造型增加LED灯的美观性。
附图说明
为了便于本领域技术人员理解,下面结合附图对本发明作进一步的说明。
图1为本发明一种高显指柔性灯丝灯结构示意图;
图2为本发明一种高显指柔性灯丝灯的LED柔性灯丝结构示意图;
图3为本发明一种高显指柔性灯丝灯的柔性灯丝结构示意图。
具体实施方式
本发明的目的可以通过以下技术方案实现:
一种高显指柔性灯丝灯,参见图1-3,包括灯泡壳1、灯头2、灯柱3、电极引线4、LED柔性灯丝5;
所述LED柔性灯丝5两端分别与两根电极引线4一端连接,电极引线4另一端连接到灯柱3下表面的两个焊盘上,灯柱3固定在灯头2内,灯柱3内部设置有驱动电路,两个焊盘通过驱动电路分别连接灯头2上的正极、负极;所述灯泡壳1与灯头2封接;
所述灯泡壳1内为干燥氦气,干燥氦气隔绝量子点荧光粉与水汽、氧气接触,干燥氦气提升量子点荧光粉的稳定性;
所述LED柔性灯丝5分为接线柱51、柔性灯丝52,接线柱51分别设置在柔性灯丝52的两端;柔性灯丝52包括柔性基底521、凹槽侧壁522、LED芯片523、金线524、小焊盘525、大焊盘526、白条527、荧光胶528,柔性基底521上表面设置有凹槽侧壁522,凹槽侧壁522与柔性基底521形成等间距排列的LED支架,LED支架内的柔性基底521上设置有LED芯片523,LED芯片523的上表面左右两侧分别设置有两个电极,两个电极分别通过金线524连接到底部的小焊盘525和大焊盘526,小焊盘525和大焊盘526设置在柔性基底521上;所述白条527将小焊盘525和大焊盘526隔开;柔性基底521上方覆盖有荧光胶528;
所述荧光胶528由热固型胶水和荧光粉混合热固而成,热固型胶水的材质为有机硅胶、有机树脂中的一种;荧光粉中含有量子点荧光粉,量子点荧光粉的材料为TiO2@CsPbX3@TiO2,TiO2@CsPbX3@TiO2为TiO2为核,CsPbX3包覆在TiO2核外面,在CsPbX3外面再用TiO2包覆;
所述TiO2@CsPbX3@TiO2为TiO2@CsPbCl3@TiO2、TiO2@CsPbBr3@TiO2、TiO2@CsPbI3@TiO2中的一种;
所述荧光粉中含有YAG粉、硅酸盐、氮化物荧光粉、KSF荧光粉、β-SiAlON中的一种或两种;
所述TiO2@CsPbX3@TiO2的制作方法,包括以下步骤:
步骤S01、将十八烯至于20~25℃的温水中,随后量取液态的十八烯和油酸,按体积比1:1.4~1.6混合;随后称取Cs2CO3粉末倒入混合液中,配成浓度为95~105mg/ml的混合溶液A,并将混合溶液A放入氦气氛围下,加热到120~150℃,保温1~2小时,得到油酸铯前驱体溶液;
步骤S02、将称量PbX2,并加入到十八烯溶液中,配成浓度为13~14mg/ml的混合溶液B,并将混合溶液A放入氦气氛围下,加热到120~150℃,保温1~2小时,随后向每1ml混合溶液B中,注入0.4~0.5ml油酸和0.5~0.6ml油胺至完全溶解,得到溶液C;
步骤S03、向每1ml溶液C中,加入P25粉末,经120℃氦气氛围,搅拌转速为500~800r/min,得到溶液D;随后抽取油酸铯前驱体溶液逐滴注入溶液D中,得到溶液E,每1ml油酸铯前驱体溶液对应0.4~0.6ml的溶液D;
步骤S04、将溶液E连同容器,快速置于冰水浴中,静置5~10s;随后经反复漂洗和离心,并冷冻干燥,得到TiO2@CsPbX3粉末;
步骤S05、称取TiO2@CsPbX3粉末加入无水乙醇中,经500r/min搅拌10min,并逐滴加入TiCl4溶液,形成TiO2@CsPbX3粉末、TiCl4的浓度分别为0.02~0.04mg/ml、0.05~0.1ml/ml的溶液F;
步骤S06、将溶液F置于空气中,经500r/min搅拌48~72h,再经乙醇漂洗、离心、冷冻干燥后,得到为TiO2@CsPbX3@TiO2粉末;
所述PbX2为PbCl2、PbBr2、PbI2中的一种;
该灯丝灯的制作方法,包括以下步骤:
步骤S11、将LED芯片523固定在柔性基底521上,将LED芯片523上表面的电极通过金线分别与小焊盘525和大焊盘526相连;将荧光粉与热固胶混合后,涂布在柔性基底521上方,通过烘烤后,形成荧光胶528,根据所需形状,弯折成LED柔性灯丝5;
步骤S12、将上述:LED柔性灯丝5通过电极引线4焊接在灯柱3下表面的焊盘上;将灯柱3固定在灯头2内,形成发光组件;
步骤S13、将上述发光组件与灯泡壳1组装在一起;将灯泡壳1内的空气抽出,同时充入氦气,并进行封口,完成灯丝灯制作。
工作原理:
传统白光LED,一般采用蓝光LED激发YAG:Ce荧光粉获得白光输出,因为欠缺红光波段,与白炽灯光相比相对不自然,即显指偏低,若能将显指提高至90或以上,LED的照明应用领域将会更为宽广;量子点荧光粉具有独特的量子效应和介电限域效应,因而比传统荧光粉的发光效率更高、使用寿命更长、颜色的纯度更好,且其具有尺寸可控的能量带隙和发光波长,通过改变量子点荧光粉的尺寸和化学组成可以使其荧光发射波长覆盖整个可见光区。
本发明提供了一种高显指柔性灯丝灯,具有显指高、稳定性好、能耗低、寿命长、外形美观的特点。本发明对量子点荧光粉通过修饰工艺,使量子点材料CsPbX3包覆在TiO2核上,并用TiO2包覆CsPbX3,使TiO2@CsPbX3@TiO2对水、氧的稳定性提升;再将TiO2@CsPbX3@TiO2制成LED柔性灯丝,组装成氦气保护的灯丝灯,在氦气保护下,量子点材料稳定性进一步提升;量子点荧光粉的引入,填补了传统LED灯红光波段区域欠缺的光,提升LED灯的显指,同时灯丝灯造型增加LED灯的美观性。
以上内容仅仅是对本发明结构所作的举例和说明,所属本技术领域的技术人员对所描述的具体实施例做各种各样的修改或补充或采用类似的方式替代,只要不偏离发明的结构或者超越本权利要求书所定义的范围,均应属于本发明的保护范围。

Claims (9)

1.一种高显指柔性灯丝灯,包括灯泡壳(1)、灯头(2)、灯柱(3)、电极引线(4)、LED柔性灯丝(5),其特征在于:
所述LED柔性灯丝(5)两端分别与两根电极引线(4)一端连接,电极引线(4)另一端连接到灯柱(3)下表面的两个焊盘上,灯柱(3)固定在灯头(2)内,灯柱(3)内部设置有驱动电路,两个焊盘通过驱动电路分别连接灯头(2)上的正极、负极;所述灯泡壳(1)与灯头(2)封接。
2.根据权利要求1所述的一种高显指柔性灯丝灯,其特征在于,所述灯泡壳(1)内为干燥氦气。
3.根据权利要求1所述的一种高显指柔性灯丝灯,其特征在于,所述LED柔性灯丝(5)分为接线柱(51)、柔性灯丝(52),接线柱(51)分别设置在柔性灯丝(52)的两端;柔性灯丝(52)包括柔性基底(521)、凹槽侧壁(522)、LED芯片(523)、金线(524)、小焊盘(525)、大焊盘(526)、白条(527)、荧光胶(528),柔性基底(521)上表面设置有凹槽侧壁(522),凹槽侧壁(522)与柔性基底(521)形成等间距排列的LED支架,LED支架内的柔性基底(521)上设置有LED芯片(523),LED芯片(523)的上表面左右两侧分别设置有两个电极,两个电极分别通过金线(524)连接到底部的小焊盘(525)和大焊盘(526),小焊盘(525)和大焊盘(526)设置在柔性基底(521)上;所述白条(527)将小焊盘(525)和大焊盘(526)隔开;柔性基底(521)上方覆盖有荧光胶(528)。
4.根据权利要求3所述的一种高显指柔性灯丝灯,其特征在于,所述荧光胶(528)由热固型胶水和荧光粉混合热固而成,热固型胶水的材质为有机硅胶、有机树脂中的一种;荧光粉中含有量子点荧光粉,量子点荧光粉的材料为TiO2@CsPbX3@TiO2,TiO2@CsPbX3@TiO2为TiO2为核,CsPbX3包覆在TiO2核外面,在CsPbX3外面再用TiO2包覆。
5.根据权利要求4所述的一种高显指柔性灯丝灯,其特征在于,所述TiO2@CsPbX3@TiO2为TiO2@CsPbCl3@TiO2、TiO2@CsPbBr3@TiO2、TiO2@CsPbI3@TiO2中的一种。
6.根据权利要求4所述的一种高显指柔性灯丝灯,其特征在于,所述荧光粉中含有YAG粉、硅酸盐、氮化物荧光粉、KSF荧光粉、β-SiAlON中的一种或两种。
7.根据权利要求4所述的一种高显指柔性灯丝灯,其特征在于,所述TiO2@CsPbX3@TiO2的制作方法,包括以下步骤:
步骤S01、将十八烯至于20~25℃的温水中,随后量取液态的十八烯和油酸,按体积比1:1.4~1.6混合;随后称取Cs2CO3粉末倒入混合液中,配成浓度为95~105mg/ml的混合溶液A,并将混合溶液A放入氦气氛围下,加热到120~150℃,保温1~2小时,得到油酸铯前驱体溶液;
步骤S02、将称量PbX2,并加入到十八烯溶液中,配成浓度为13~14mg/ml的混合溶液B,并将混合溶液A放入氦气氛围下,加热到120~150℃,保温1~2小时,随后向每1ml混合溶液B中,注入0.4~0.5ml油酸和0.5~0.6ml油胺至完全溶解,得到溶液C;
步骤S03、向每1ml溶液C中,加入P25粉末,经120℃氦气氛围,搅拌转速为500~800r/min,得到溶液D;随后抽取油酸铯前驱体溶液逐滴注入溶液D中,得到溶液E,每1ml油酸铯前驱体溶液对应0.4~0.6ml的溶液D;
步骤S04、将溶液E连同容器,快速置于冰水浴中,静置5~10s;随后经反复漂洗和离心,并冷冻干燥,得到TiO2@CsPbX3粉末;
步骤S05、称取TiO2@CsPbX3粉末加入无水乙醇中,经500r/min搅拌10min,并逐滴加入TiCl4溶液,形成TiO2@CsPbX3粉末、TiCl4的浓度分别为0.02~0.04mg/ml、0.05~0.1ml/ml的溶液F;
步骤S06、将溶液F置于空气中,经500r/min搅拌48~72h,再经乙醇漂洗、离心、冷冻干燥后,得到为TiO2@CsPbX3@TiO2粉末。
8.根据权利要求7所述的一种高显指柔性灯丝灯,其特征在于,所述PbX2为PbCl2、PbBr2、PbI2中的一种。
9.根据权利要求1所述的一种高显指柔性灯丝灯,其特征在于,该灯丝灯的制作方法,包括以下步骤:
步骤S11、将LED芯片(523)固定在柔性基底(521)上,将LED芯片(523)上表面的电极通过金线分别与小焊盘(525)和大焊盘(526)相连;将荧光粉与热固胶混合后,涂布在柔性基底(521)上方,通过烘烤后,形成荧光胶(528),根据所需形状,弯折成LED柔性灯丝(5);
步骤S12、将上述:LED柔性灯丝(5)通过电极引线(4)焊接在灯柱(3)下表面的焊盘上;将灯柱(3)固定在灯头(2)内,形成发光组件;
步骤S13、将上述发光组件与灯泡壳(1)组装在一起;将灯泡壳(1)内的空气抽出,同时充入氦气,并进行封口,完成灯丝灯制作。
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