CN108386738A - 一种高显指柔性灯丝灯 - Google Patents
一种高显指柔性灯丝灯 Download PDFInfo
- Publication number
- CN108386738A CN108386738A CN201810134430.0A CN201810134430A CN108386738A CN 108386738 A CN108386738 A CN 108386738A CN 201810134430 A CN201810134430 A CN 201810134430A CN 108386738 A CN108386738 A CN 108386738A
- Authority
- CN
- China
- Prior art keywords
- tio
- cspbx
- solution
- led
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G21/00—Compounds of lead
- C01G21/006—Compounds containing, besides lead, two or more other elements, with the exception of oxygen or hydrogen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
- C09K11/025—Use of particular materials as binders, particle coatings or suspension media therefor non-luminescent particle coatings or suspension media
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/66—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing germanium, tin or lead
- C09K11/664—Halogenides
- C09K11/665—Halogenides with alkali or alkaline earth metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810134430.0A CN108386738B (zh) | 2018-02-09 | 2018-02-09 | 一种高显指柔性灯丝灯 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810134430.0A CN108386738B (zh) | 2018-02-09 | 2018-02-09 | 一种高显指柔性灯丝灯 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108386738A true CN108386738A (zh) | 2018-08-10 |
CN108386738B CN108386738B (zh) | 2019-11-22 |
Family
ID=63075542
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810134430.0A Expired - Fee Related CN108386738B (zh) | 2018-02-09 | 2018-02-09 | 一种高显指柔性灯丝灯 |
Country Status (1)
Country | Link |
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CN (1) | CN108386738B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109411589A (zh) * | 2018-09-17 | 2019-03-01 | 旭宇光电(深圳)股份有限公司 | 一种led灯丝 |
CN115784301A (zh) * | 2023-02-10 | 2023-03-14 | 武汉理工大学 | 一种CsPbBr3@TiO2核壳异质结、其制备方法及应用 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104282831A (zh) * | 2014-09-24 | 2015-01-14 | 惠州市英吉尔光电科技有限公司 | 一种led封装结构及封装工艺 |
CN104409607A (zh) * | 2014-11-04 | 2015-03-11 | 常州晶玺照明有限公司 | 一种高显指、360°发光led灯丝灯 |
CN204756527U (zh) * | 2015-06-19 | 2015-11-11 | 陕西光电科技有限公司 | 一种led灯泡 |
US20170012182A1 (en) * | 2015-07-09 | 2017-01-12 | Dun-Hua Cao | White Light LED Filament Having Blue Light Emitting Units and a Strip-Shaped Fluorescent Wafer |
CN106895282A (zh) * | 2017-03-13 | 2017-06-27 | 上海应用技术大学 | 将荧光薄膜用于led灯丝制作球泡灯的方法 |
CN107270147A (zh) * | 2017-07-18 | 2017-10-20 | 浙江阳光美加照明有限公司 | 一种低频闪的led灯丝球泡灯 |
-
2018
- 2018-02-09 CN CN201810134430.0A patent/CN108386738B/zh not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104282831A (zh) * | 2014-09-24 | 2015-01-14 | 惠州市英吉尔光电科技有限公司 | 一种led封装结构及封装工艺 |
CN104409607A (zh) * | 2014-11-04 | 2015-03-11 | 常州晶玺照明有限公司 | 一种高显指、360°发光led灯丝灯 |
CN204756527U (zh) * | 2015-06-19 | 2015-11-11 | 陕西光电科技有限公司 | 一种led灯泡 |
US20170012182A1 (en) * | 2015-07-09 | 2017-01-12 | Dun-Hua Cao | White Light LED Filament Having Blue Light Emitting Units and a Strip-Shaped Fluorescent Wafer |
CN106895282A (zh) * | 2017-03-13 | 2017-06-27 | 上海应用技术大学 | 将荧光薄膜用于led灯丝制作球泡灯的方法 |
CN107270147A (zh) * | 2017-07-18 | 2017-10-20 | 浙江阳光美加照明有限公司 | 一种低频闪的led灯丝球泡灯 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109411589A (zh) * | 2018-09-17 | 2019-03-01 | 旭宇光电(深圳)股份有限公司 | 一种led灯丝 |
CN115784301A (zh) * | 2023-02-10 | 2023-03-14 | 武汉理工大学 | 一种CsPbBr3@TiO2核壳异质结、其制备方法及应用 |
CN115784301B (zh) * | 2023-02-10 | 2023-06-30 | 武汉理工大学 | 一种CsPbBr3@TiO2核壳异质结、其制备方法及应用 |
Also Published As
Publication number | Publication date |
---|---|
CN108386738B (zh) | 2019-11-22 |
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PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
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TA01 | Transfer of patent application right |
Effective date of registration: 20191029 Address after: North Road on the west side of science and technology in Anhui province jiangshang road 236400 Fuyang City County Economic Development Zone Applicant after: ANHUI FU XIN YA OPTOELECTRONICS TECHNOLOGY Co.,Ltd. Address before: Room 1-2302, Fengshang International Apartment, 727 Changjiang West Road, Hefei High-tech Zone, Anhui Province Applicant before: Anhui poetry poplar Mdt InfoTech Ltd |
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GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: High color rendering index flexible filament lamp Effective date of registration: 20200320 Granted publication date: 20191122 Pledgee: Linquan County small and medium-sized enterprises financing Company limited by guarantee Pledgor: ANHUI FU XIN YA OPTOELECTRONICS TECHNOLOGY Co.,Ltd. Registration number: Y2020980000910 |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191122 Termination date: 20210209 |