TWM419224U - Light source module structure of LED - Google Patents

Light source module structure of LED Download PDF

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Publication number
TWM419224U
TWM419224U TW100212066U TW100212066U TWM419224U TW M419224 U TWM419224 U TW M419224U TW 100212066 U TW100212066 U TW 100212066U TW 100212066 U TW100212066 U TW 100212066U TW M419224 U TWM419224 U TW M419224U
Authority
TW
Taiwan
Prior art keywords
light
frame
source module
substrate
light source
Prior art date
Application number
TW100212066U
Other languages
Chinese (zh)
Inventor
Tsung-Jen Liaw
Ding-Yuan Jheng
Ching-Lin Tseng
Cheng-Shih Lee
Original Assignee
Bright Led Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bright Led Electronics Corp filed Critical Bright Led Electronics Corp
Priority to TW100212066U priority Critical patent/TWM419224U/en
Publication of TWM419224U publication Critical patent/TWM419224U/en
Priority to CN2012200199933U priority patent/CN202585520U/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

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  • Led Device Packages (AREA)

Description

M419224 五、新型說明: 【新型所屬之技術領域】 本創作係為-種發光二極體光源模組結構,尤指—種可避免或減少該 紅光二極體晶片發出之紅光會被該螢光層其綠色螢光粉末遮蔽與吸收,而 可維持該紅光之強度與色度,因而可增加混光後光源之演色性與亮度,進 而可達到提升演色性與亮度之目的。 【先前技術】 藝 一般之發光二極體光源模組,請參閱第一圖所示,其包含有一底座1〇 與設於該底座ίο其容室n内之藍光二極體晶片12及數個紅光二極體晶片 13,該藍光二極體晶片12及紅光二極體晶片13周圍包覆有一包覆層14,該 包覆層14内包含有綠色螢光粉末141,又該包覆層14外周圍尚包覆有一封裝 層15 ;俾當該藍光二極體晶片12與紅光二極體晶片13接通電源而發光時, 該藍光二極體晶片12之光線會使該包覆層14内之綠色螢光粉末141受到激 發而發出綠色光,而可使紅光、綠光與藍光混合以發出白色光,進而使該 • 發光二極體光源模組可達到產生白光之目的。 S亥習用之發光二極體光源模組雖可達到產生白光之目的,但該紅光二 極體晶片13其光線也會直接照射到該包覆層14内之綠色螢光粉末141,由於 該紅光二極體晶片13並無激發該綠色螢光粉末141發光之功用’因此該紅光 二極體晶片13所發出之紅光會被該綠光螢光粉141所吸收與遮蔽而造成強 度與色度之农減,而使S玄發光一極體光源模組所產生之白光光源無法兼顧 其演色性(color rendering)與亮度(iuminance,或稱發光效率)等特 性,進而導致該發光一極體光源模組其演色性或亮度特性較差。 3 M419224 是故,如何將上述等缺失加以摒除,即為本案創作人所欲解決之技術 困難點之所在。 【新型内容】 有鑑於現有之發光二極體光源模組結構,因該紅光二極體晶片其光線 會J:接照射到該包覆層内之綠色螢光粉末,所以該紅光二極體晶片所發出 之紅光會被該綠光螢光粉所吸收與遮蔽而造成強度與色度之衰減,而使該 發光二極體光職崎產生之自絲源無絲顧其演色性與亮度等特性, 鲁進而導致該發光二極體光源模組其演色性或亮度特性較差,因此本創作之 目的在於提供-種發光二滅光賴組結構,藉由雜體内設有至少—隔 板’又該隔板為反光之不透光材f,而可避免該紅光二極體晶片發出之紅 光被該螢光層其綠色螢絲末舰與吸收,料,轉數光之強度與色 度’因而可增加混光後光源之演色性與亮度,進而使本創作可達到提升演 色性與亮度之目的。 為達成以上之目的,本創作係提供一種發光二極體光源模級结構复 籲包含: 、、 -框體’該框翻設有至少—隔板,該隔板可為反光之不透光材質, 該框體内設有至少-第-容室,該框體内設有至少—第二容室;貝’ 至少一基板,該基板與框體相固設,該基板上設有線路; 至夕第一發光組件,該第一發光組件固設於該框體其第一六—内 該第-發光組件尚包含有至少—藍光二極體晶片與—榮光層丨 至少一第二發光組件,該第二發光組件固設於該框體其第-内 該第二發光組件尚包含有至少—紅光二極體晶片與—封裝膠層;至内 4 M419224 藉由該框翻設有至少—隔板,又職板為反光之不透光材質,而可 避免該紅光二極體晶片發出之紅光被該螢光層其綠色螢光粉末遮蔽與吸 收’而可維持該紅光之強度與色度,因而可增加混級光源之演色性與亮 度,進而使本創作可逹到提升演色性與亮度之目的。 【實施方式】 為使貴審查貞:ίτ便雜瞭解摘作之其他特觀容與優點及其所達 成之功效能夠更為顯現,茲將本創作配合附圖,詳細說明如下: 鲁請參閱第二圖所示,本創作係提供一種發光二極體光源模組結構,其 包含: -框體3,該框體3内設有至少-隔板7,該隔板7可為反光之不透光 材質,該框體3内設有至少一第一容室31,該框體3内設有至少一第二容 室32 ; 至少-基板4,該基板4與該框體3相固設,且該基板4固設於該框體 3其隔板7下方’該基板4上設有線路41,又該基板4可為銘基板或為鋼 • 基板; 至少一第一發光組件5 ’該第一發光組件5固設於該框體3其第一容室 31内’該第-發光組件5尚包含有至少一藍光二極體晶片51與一榮光層 52,該藍光二極體晶片51與該基板4其線路41電性連接,該螢光層犯包 覆該藍光二極體晶片51’又該螢光層52内尚包含有封裝膠521與綠色螢光 粉末522’其中該封裝膠521可為矽膠(siUc〇n),又該綠色螢光粉末卯2 其成分可為氮化物或為氮氧化物或為矽酸鹽; 至少一第二發光組件6 ’該第二發光組件6固設於該框體3其第二容室 5 M419224 32内’該第二發光組件6尚包含有至少_ 62,該红本权μ 、先-極體明片61與-封裝膠層 體曰^-嶋61與嶋4其_ 41雜連接,又該紅光二極 二rw—發光崎5繼:鋪;51物,該封裝膠 包覆該紅光二極體晶㈣,又該透霄層62可為砂膠層;M419224 V. New description: [New technical field] This creation is a kind of light-emitting diode light source module structure, especially for avoiding or reducing the red light emitted by the red light-emitting diode chip. The phosphor layer is shielded and absorbed by the green fluorescent powder, and the intensity and chromaticity of the red light can be maintained, thereby increasing the color rendering and brightness of the light source after the light mixing, thereby achieving the purpose of improving color rendering and brightness. [Prior Art] A general-purpose LED light source module, as shown in the first figure, includes a base 1 and a blue diode chip 12 and a plurality of the same in the cavity n of the substrate The red LED wafer 13 and the red LED wafer 13 are covered with a coating layer 14 containing green fluorescent powder 141. The outer periphery of the layer 14 is further covered with an encapsulation layer 15; when the blue dipole wafer 12 and the red dipole wafer 13 are powered on to emit light, the light of the blue dipole wafer 12 causes the cladding The green fluorescent powder 141 in the layer 14 is excited to emit green light, and the red light, the green light and the blue light can be mixed to emit white light, so that the light emitting diode light source module can achieve the purpose of generating white light. Although the light-emitting diode light source module of the S-hai can achieve the purpose of generating white light, the red light-emitting diode chip 13 directly illuminates the green fluorescent powder 141 in the cladding layer 14 due to the light. The red LED wafer 13 does not have the function of exciting the green phosphor powder 141. Therefore, the red light emitted by the red diode wafer 13 is absorbed and shielded by the green phosphor 141 to cause strength. Compared with the chromaticity reduction, the white light source generated by the S-light-emitting one-pole light source module cannot take into consideration the characteristics such as color rendering and luminescence (luminescence efficiency), thereby causing the luminescence The polar light source module has poor color rendering or brightness characteristics. 3 M419224 is the reason, how to eliminate the above-mentioned missing, that is, the technical difficulties that the creators of this case want to solve. [New content] In view of the existing structure of the light-emitting diode light source module, the red light diode is irradiated to the green fluorescent powder in the coating layer due to the light of the red light-emitting diode chip. The red light emitted by the bulk wafer is absorbed and shielded by the green fluorescent powder to cause attenuation of intensity and chromaticity, so that the light source of the light-emitting diode, Shizuoka, is produced by the silk source without regard to its color rendering property. The brightness and other characteristics, and thus the light-emitting diode light source module has poor color rendering or brightness characteristics. Therefore, the purpose of the present invention is to provide a light-emitting two-light-off structure, which is provided with at least a partition The plate is further a reflective opaque material f, and the red light emitted by the red diode chip can be prevented from being absorbed by the green layer of the fluorescent layer, and the intensity of the material is rotated. And the chromaticity 'thus can increase the color rendering and brightness of the light source after mixing, so that the creation can achieve the purpose of improving color rendering and brightness. In order to achieve the above objectives, the present invention provides a light-emitting diode source mode structure structure comprising: -, - frame - the frame is turned over at least - a partition, the partition can be a reflective opaque material The frame body is provided with at least a first-capacity chamber, the frame body is provided with at least a second chamber; at least one substrate, the substrate is fixed to the frame body, and the substrate is provided with a line; The first light-emitting component is fixed to the first light-emitting component of the frame, and the first light-emitting component further comprises at least a blue light-emitting diode chip and a glory layer, at least one second light-emitting component. The second light-emitting component is fixed in the first and second inner light-emitting components of the frame, and the second light-emitting component further includes at least a red-light diode chip and an encapsulation layer; and the inner M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M The partition plate and the service plate are reflective opaque materials, and the red light emitted from the red light-emitting diode chip can be prevented from being shielded and absorbed by the green fluorescent powder of the fluorescent layer to maintain the intensity of the red light. And chromaticity, thus increasing the color rendering and brightness of the mixed light source, thereby enabling the creation It can improve the color rendering and brightness. [Embodiment] In order to make your review 贞:ίτ, you can understand the other special features and advantages of the excerpt and the effect it achieves. This article is combined with the drawings and is described in detail as follows: As shown in the second figure, the present invention provides a light-emitting diode light source module structure, comprising: - a frame body 3, the frame body 3 is provided with at least a partition plate 7, and the partition plate 7 can be reflective. a light material, the frame body 3 is provided with at least one first chamber 31, and at least one second chamber 32 is disposed in the frame body 3; at least a substrate 4, the substrate 4 is fixed to the frame body 3, The substrate 4 is fixed to the frame 3 below the partition plate 7. The substrate 4 is provided with a line 41, and the substrate 4 can be a substrate or a steel substrate; at least one first light-emitting component 5' A light-emitting component 5 is fixed in the first cavity 31 of the frame 3. The first light-emitting component 5 further includes at least one blue-diode wafer 51 and a glory layer 52. The blue-polar diode 51 and The substrate 4 is electrically connected to the line 41. The fluorescent layer is coated with the blue LED wafer 51', and the fluorescent layer 52 further comprises an encapsulant 521. The green fluorescent powder 522' may be a silicone rubber (siUc〇n), and the green fluorescent powder 卯2 may be a nitride or an oxynitride or a bismuth hydride; at least a second luminescent The second light-emitting component 6 is fixed in the second housing 5 of the frame 3, M419224 32. The second light-emitting component 6 still contains at least _62, the red-right μ, the first-pole body The sheet 61 and the encapsulating layer body 曰^-嶋61 and the 嶋4 _41 miscellaneous connection, and the red light dipole two rw- illuminating saki 5 followed: paving; 51, the encapsulating plastic coating the red light two The polar body layer (4), and the permeable layer 62 may be a sand layer;

料職輸,細第—發辦5纖:極㈣Η與第 組件6其紅光二極體晶片61接通電源而發光時,藉由該框體3内設 至少1板7 ’該隔板7歧光之猶赌質,而可避免該第二發光組件 其紅光二極體晶片61發出之紅光被該第一發光組件5其螢光層於之綠色 螢祕末⑽舰與吸收,而可維紅光之賊與色度,_可增加該 第—發光組件5與第二發光組件6混光後其光狀演色性與亮度,進而使 本創作可達到提升演色性與亮度之目的。 請再參閱第四®所示,藉由該框體3設有第―容錢與第二容室犯, 俾使該第一容室31可供一個或數個藍光二極體晶片51 _,該第二容室 也可ί、個或數個紅光二極體晶片61固設,而可分別控制該藍光二極體 曰曰片51與紅光二極體晶片61之發光強度,而可達到使用者所需之色溫與 色度,進而使本創作可達到調整色溫與色度之功效。 請參閱第五圖所示,其中該隔板7其高度可低於該框體3之高度又 該框體3尚可包含有-封膠層33,該封膠層33 &覆於該第—容室31與第 二容室32及隔板7之上方,藉由該封膠層33包覆於該第一容室31與第二 容室32及隔板7之上方’而可增加光線折射以提升光色之均勻性,進而使 本創作可達到提升光色均勻性之功效。 請參閱第六圖所示,其中該隔板7也可為半透光材質,此處之半透光 M419224 可進,步絲為該隔板7受波長45Qnm以上之光線照射時,該統對該隔 板7之穿透率可達_以上但未達職,藉由該隔板7為半透光材質俾 使該藍光二極體晶片51之藍光與綠色螢光粉末您之綠光混合後之光線可 經過抓板7而與紅光二極體晶片61之紅光相混合而可達到更佳之均勾 性及混光效果,進而使本創作可達到更佳均句性及混光效果之功效。 為使本創作更續現^其進步性與實雜,該習⑽—比較分析如 下: φ 習用技術: 1、 紅光會文綠錄紐末舰與魏而導致紐能度衰減。 2、 光源之演色性與亮度較差。 本創作優點: 1、 紅光不會被綠光螢光粉末遮蔽與吸收,強度與色度不會衰減。 2、 光源之演色性與亮度較佳。 3藍光一極體曰曰片與紅光二極體晶片的數量與組合可經由線路設計方 # 式不同而有較靈活的運用方式。 4、隔板可依應用需求之不同,而有高低與反光度,透光度上的變化有 別於傳統凹杯型式的制式化。 【圖式簡單說明】 第一圖係為習用之側面剖視示意圓。 第二圖係為本創作之側面剖視示意圖。 第三圖係為本創作之動作示意圖。 第四圖係為本創作藉由調整藍光二極體晶片與紅光二極體晶片數量改變色 M419224 溫與色度之示意圖。 第五圖係為本創作其第二實施例之示意圖。 第六圖係為本創作其第三實施例之示意圖。 【主要元件符號說明】 10…底座 ll···容室 12…藍光二極體晶片 13…紅光二極體晶片 14···包覆層 141…綠色營光粉末 15…封裝層 3…框體 31…第一容室 32…第二容室 33…封膠層 4…基板 41…線路 5…第一發光組件 51…藍光二極體晶片 52…榮光層 521…封裝膠 522…綠色營光粉末 6···第二發光組件 61…紅光二極體晶片 62…封裝膠層 7…隔板Material delivery, detailing - sending 5 fiber: pole (four) Η and the component 6 of the red diode chip 61 when the power is turned on and the light is emitted, by the frame 3 is provided with at least 1 plate 7 'the partition 7 The gambling is gambling, and the red light emitted by the red LED chip 61 of the second illuminating component can be prevented from being absorbed by the fluorescent layer of the first illuminating component 5 on the green fluorescing (10). The thief and the chromaticity of the red light can increase the light color rendering and brightness of the first light-emitting component 5 and the second light-emitting component 6 after mixing, so that the creation can achieve the purpose of improving color rendering and brightness. Referring to the fourth example, the frame 3 is provided with the first volume and the second chamber, so that the first chamber 31 can be provided with one or several blue diode chips 51 _, The second chamber can also be fixed by one or a plurality of red diode chips 61, and the luminous intensity of the blue diode chip 51 and the red diode chip 61 can be separately controlled. The color temperature and chromaticity required by the user are achieved, so that the creation can achieve the effects of adjusting the color temperature and the chromaticity. Please refer to the fifth figure, wherein the partition 7 has a height lower than the height of the frame 3, and the frame 3 may further include a sealant layer 33, and the sealant layer 33 & - above the chamber 31 and the second chamber 32 and the partition 7, the cover layer 33 is covered by the first chamber 31 and the second chamber 32 and the partition 7 to increase the light Refraction enhances the uniformity of light color, which in turn enables the creation of light color uniformity. Please refer to the sixth figure, wherein the partition plate 7 can also be a semi-transparent material, wherein the semi-transmissive M419224 can be inserted, and the step wire is when the partition plate 7 is irradiated with light having a wavelength of 45 Qnm or more. The transmittance of the spacer 7 can be up to _ but not achieved, and the baffle 7 is a semi-transmissive material, and the blue light of the blue diode chip 51 is mixed with the green fluorescent powder. The light can be mixed with the red light of the red diode chip 61 through the scratching plate 7 to achieve better uniformity and light mixing effect, thereby enabling the creation to achieve better uniformity and light mixing effect. efficacy. In order to make this creation more renewed, its progress and complexity, the study (10) - comparative analysis is as follows: φ Conventional technology: 1, the red light will be recorded in the end of the game, and Wei will cause the attenuation of the energy. 2. The color rendering and brightness of the light source are poor. The advantages of this creation: 1. Red light will not be covered and absorbed by green fluorescent powder, and the intensity and color will not be attenuated. 2. The color rendering and brightness of the light source are better. The number and combination of 3 blue-polar diodes and red-light diode chips can be flexibly operated by different line design methods. 4, the partition can be different according to the application requirements, but there are high and low and reflective, the change in transmittance is different from the traditional concave cup type. [Simple description of the diagram] The first figure is a schematic cross-section of the circle. The second picture is a schematic side view of the creation. The third picture is a schematic diagram of the action of this creation. The fourth figure is a schematic diagram of the temperature and chromaticity of the color change M419224 by adjusting the number of blue diode chips and red photodiode wafers. The fifth drawing is a schematic view of the second embodiment of the creation. The sixth drawing is a schematic view of the third embodiment of the creation. [Description of main component symbols] 10: pedestal ll··· chamber 12... blue diode chip 13... red photodiode wafer 14·· cladding layer 141... green camping powder 15... encapsulation layer 3... frame Body 31...first chamber 32...second chamber 33...sealant layer 4...substrate 41...line 5...first light-emitting assembly 51...blue diode wafer 52...glory layer 521...encapsulated rubber 522...green camp light Powder 6···Second light-emitting assembly 61...Red light-emitting diode chip 62...Packaging layer 7...Separator

Claims (1)

六、申請專利範圍: 1、一種發光二極體光源模組結構,其包含: —框體,馳體内設有至少_隔板,該隔板可為反光之不透光材質, 雜體内&有至少—第—容室,該框體内設有至少—第二容室; 至;一基板,該基板與框體相固設,該基板上設有線路; 至'第發光組件,該第一發光組件固設於該框體其第一容室内, 該第-發光組件尚包含有至少—Μ二極體晶片與—螢光層,該藍光二極 _體曰曰片與該基板其線路電性連接,該登光層包覆該藍光二極體晶片; 至夕發光組件’該第二發光組件固設於該框體其第二容室内, 該第二發敏件喊含註少—紅光二減晶4與—雜縣,該紅光二 極體晶片與該基板其線路電性連接,該封裝膠層包覆該紅光二極體晶片。 ,2如申凊專利範圍第i項所述之發光二極體光源模組結構 ,其中該藍 光二極體晶片與江光二極體晶片相串聯。 3、如申請專利範,項所述之發光二極體光源模組結構,其中該隔 • 板之高度低於框體之高度。 申月專她圍第丨至3項中任—項所述之發光二極體光源模組結 構,其中該框體尚包含有_封膠層。 申月專他圍第1至3項中任—項所述之發光二極體光源模組結 構’其中該螢光層尚包含有封裝膠與綠色螢光粉末。 6、一種發光二極體光源模組結構,其包含: —框體,絲㈣設有至少―隔板,該隔板可為半透級質,該框體 内設有至少一第一容室,該框體内設有至少-第二容室; 9 财19224 至少一基板,該基板與框體相固設,該基板上設有線路; 至少一第-發光叙件,該第-發光組件固設於該框體其第一容室内, 該第-發光組件尚包含有至少—藍光二極體晶片與1光層,該藍光二極 體晶片與該基板其線路電性連接,該螢光層包覆該觀二極體晶片; 至少一第二發光組件,該第二發光組件固設於該框體其第二容室内, 該第二發光組件尚包含有至少—紅光二極體晶片與—封裝膠層,該紅光二 極體晶片與該基板其祕電性麟,觸歸層包覆該紅光二極體晶片。 7、 如申請專利範圍帛6項所述之發光二極體光源模組結構,其中該隔 板党波長450nm以上之光線照射時,該光線對該隔板之穿透率可達8⑽以上 但未達100%。 8、 如申請專利範圍第6項所述之發光二極體光源模組結構,其中該隔 板之高度低於框體之高度。 9、 如申請專利範圍第6至8項中任一項所述之發光二極體光源模組結 構’其中該框體尚包含有一封膠層。 10、 如申請專利範圍第6至8項中任一項所述之發光二極體光源模組 結構,其中該螢光層尚包含有封裝膠與綠色螢光粉末。Sixth, the scope of application for patents: 1. A light-emitting diode light source module structure, comprising: - a frame body, at least _ partition plate is provided in the body, the partition plate can be a reflective opaque material, and the body is & having at least a - a chamber, the frame is provided with at least a second chamber; to; a substrate, the substrate is fixed to the frame, the substrate is provided with a line; to the 'light emitting component, The first illuminating component is fixed in the first housing of the frame, and the first illuminating component further comprises at least a Μ diode wafer and a phosphor layer, the blue diopter body and the substrate The second light-emitting component is fixed in the second cavity of the frame, and the second light-sensitive component is called with a note. The red-light dimorph crystal 4 and the miscellaneous county, the red photodiode wafer is electrically connected to the substrate, and the encapsulant layer covers the red photodiode wafer. [2] The structure of a light-emitting diode light source module according to item ii of the patent application scope, wherein the blue light diode chip is connected in series with the Jiangguang diode chip. 3. The structure of the light-emitting diode light source module according to the patent application, wherein the height of the spacer is lower than the height of the frame. Shen Yue specializes in the structure of the light-emitting diode light source module described in the third item, which includes the _ sealant layer. Shen Yue specializes in the structure of the light-emitting diode light source module described in any one of items 1 to 3, wherein the fluorescent layer further comprises an encapsulant and a green fluorescent powder. A light-emitting diode light source module structure comprising: a frame body, wherein the wire (4) is provided with at least a partition plate, the partition plate may be semi-permeable, and the frame body is provided with at least one first chamber The frame body is provided with at least a second chamber; at least one substrate, the substrate is fixed to the frame body, and the substrate is provided with a line; at least one first-light-emitting item, the first light-emitting component The first light-emitting component is further disposed in the first housing of the frame, and the first light-emitting component further includes at least a blue-light diode chip and a light layer, and the blue-diode wafer is electrically connected to the substrate, and the fluorescent light is electrically connected. The second light-emitting component is fixed on the second light-emitting component, the second light-emitting component is fixed in the second cavity of the frame, and the second light-emitting component further includes at least a red light-emitting diode chip. And the encapsulating adhesive layer, the red photodiode wafer and the substrate are electrically conductive, and the red light diode chip is covered by the touch layer. 7. The structure of the light-emitting diode light source module according to claim 6, wherein the light transmittance of the light source to the partition plate is up to 8 (10) or more when the light of the partition wavelength of 450 nm or more is irradiated. Up to 100%. 8. The structure of a light-emitting diode light source module according to claim 6, wherein the height of the spacer is lower than the height of the frame. 9. The structure of a light-emitting diode light source module according to any one of claims 6 to 8, wherein the frame further comprises a glue layer. 10. The structure of a light-emitting diode light source module according to any one of claims 6 to 8, wherein the phosphor layer further comprises an encapsulant and a green fluorescent powder.
TW100212066U 2011-07-01 2011-07-01 Light source module structure of LED TWM419224U (en)

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CN106328642A (en) * 2016-10-18 2017-01-11 深圳成光兴光电技术股份有限公司 Chip LED for mixed light source
CN107482101A (en) * 2017-09-18 2017-12-15 广东晶科电子股份有限公司 A kind of LED packagings with more glasss of supports and preparation method thereof
CN108766221A (en) * 2018-02-10 2018-11-06 深圳市海司恩科技有限公司 display module, display and electronic equipment
CN112289910B (en) * 2020-10-19 2021-06-25 刘成禹 LED stepless color temperature regulation light source and manufacturing process thereof

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