CN108374185A - A kind of manufacture craft improving plating copper facing uniformity - Google Patents
A kind of manufacture craft improving plating copper facing uniformity Download PDFInfo
- Publication number
- CN108374185A CN108374185A CN201711308555.2A CN201711308555A CN108374185A CN 108374185 A CN108374185 A CN 108374185A CN 201711308555 A CN201711308555 A CN 201711308555A CN 108374185 A CN108374185 A CN 108374185A
- Authority
- CN
- China
- Prior art keywords
- baffle
- anode
- scaffold
- copper facing
- uniformity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention relates to the production fields that electroplating work procedure in PCB industries produces, a kind of manufacture craft improving plating copper facing uniformity is provided, it need to increase anode baffle at high potential area anode, cathode scaffold is equipped with scaffold baffle, hole is equipped in the anode baffle, scaffold baffle, the size in aperture is diameter 1.6cm, vertical setting of types spacing is 3.5cm, horizontally-arranged spacing is 2.5cm, most upper round back gauge edges of boards 2cm, and vertical setting of types tiltedly arranged with 60 degree of angle.The present invention is designed by the pore size of anode baffle and scaffold baffle and the mode arranged evenly in hole, directly improving plating, copper thickness is very poor and uniformity, and it is easy to make, cost of manufacture is fewer, it is very poor and uniformity improves significantly for plating copper thickness, it is provided to the design and producing of high precision fine circuit boards and makes foundation and guarantee.
Description
Technical field
The present invention relates to the making that electroplating work procedure in PCB industries produces, and in particular to improves copper facing uniformity
A kind of technique.
Background technology
PCB (printed Circuit Board) Chinese name printed circuit board, also known as printed wiring board, is important
Electronic unit is the supporter of electronic component, is the carrier of electronic component electric appliance connection.It is sent out with the high speed of information industry
Exhibition, as one in information industry indispensable mainstay-PCB printed circuit board also to small-bore, high density, multilayer
Several, fine rule road direction is developed, and high precision fine rule road is at main product.High precision fine rule road is produced then for line
Copper coin is carried out on road copper thickness distributing homogeneity before making wants high, this also just needs plating copper thickness and copper facing in being produced for plating
Uniformity will have higher requirement, therefore promote the common pursuit that electro-coppering cylinder copper facing uniformity is industry.
Invention content
The problem to be solved in the present invention, which is that high potential and low potential plating copper thickness are very poor big when overcoming existing electro-coppering, to be lacked
It falls into, a kind of process for making improving plating copper facing uniformity is provided.
In order to solve the above technical problems, the present invention specifically provides following technical solution：
1, the distribution of anode：It is blue that example anode titanium is averagely arranged according to the number of the size of cylinder body and anode titanium indigo plant, in cylinder body
By cylinder side, then sky stays two titanium indigo plant positions not hang on both sides；
2, the control of copper cylinder liquid level：The liquid level of copper cylinder liquid medicine cannot be too low, production plate cannot be allowed to expose liquid level, while also not
Can be too high, an edges of boards and anode baffle should be adjusted to and pressed from both sides in the same horizontal position；
3, the design of anode baffle：It is high potential area that point is pressed from both sides in copper facing, for that need to increase baffle at high potential area anode, is kept off
Plate at anode titanium indigo plant 1cm, above side and liquid level and cathode folder point flush, barrier width 15cm needs to drill on baffle,
To reduce the density of the copper facing power line in high potential area, the size in aperture is diameter 1.6cm, and two pitchs of holes are with hole centre-to-centre spacing
Standard, vertical setting of types spacing are 3.5cm, and horizontally-arranged spacing is 2.5cm, most upper round back gauge edges of boards 2cm, and vertical setting of types is oblique with 60 degree of angle
Row.
4, the design of cathode cylinder bottom scaffold：Cathode scaffold is fixed production, prevents plank with waving and inflate deviation
On one side, scaffold designs for V-shaped, and both sides are baffle, barrier width 12cm, on baffle plus drilling, to increase liquid medicine perforation frequency
Rate, increases copper facing efficiency, and the size in aperture is diameter 1.6cm, and two pitchs of holes are subject to hole centre-to-centre spacing, and heavily fortified point row's spacing is 3.5cm,
Horizontally-arranged spacing is 2.5cm, most upper round back gauge edges of boards 2cm, and heavily fortified point row is tiltedly arranged with 60 degree of angle.
The reached advantageous effect of the present invention is：The present invention is designed by the pore size of anode baffle and scaffold baffle and hole
Mode arranged evenly, directly improving plating, copper thickness is very poor and uniformity, and is easy to make, and cost of manufacture is fewer, for plating
Copper thickness is very poor and uniformity improves significantly, to the design and producing of high precision fine circuit boards provide make foundation and
It ensures.
Description of the drawings
Fig. 1 is the figure arranged evenly in hole on anode baffle of the present invention and scaffold baffle.
Specific implementation mode
Below in conjunction with the embodiment of the present invention, technical scheme of the present invention is clearly and completely described, it is clear that institute
The embodiment of description is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention,
Every other embodiment obtained by those of ordinary skill in the art without making creative efforts, belongs to this hair
The range of bright protection.
Clear, complete description, certainly, described embodiment are carried out to the technical solution in patent of invention example below
The only a part of embodiment of the present invention, instead of all the embodiments.Based on embodiment in the present invention, ordinary skill
Personnel do not make the every other embodiment obtained under the premise of creative work, belong to the scope of the present invention.
Referring to attached drawing：
The distribution of anode：It is blue that example anode titanium is averagely arranged according to the number of the size of cylinder body and anode titanium indigo plant, the two of cylinder body
Then sky stays two titanium indigo plant positions not hang while by cylinder；
The control of copper cylinder liquid level：The liquid level of copper cylinder liquid medicine cannot be too low, production plate cannot be allowed to expose liquid level, while can not
It is too high, an edges of boards and anode baffle should be adjusted to and pressed from both sides in the same horizontal position；
The design of anode baffle：It is high potential area that point is pressed from both sides in copper facing, for that need to increase baffle, baffle at high potential area anode
Close to the place anode titanium indigo plant 1cm, above side press from both sides point with liquid level and cathode and flush, barrier width 15cm needs to drill on baffle, with
Reducing the density of the copper facing power line in high potential area, the size in aperture is diameter 1.6cm, and two pitchs of holes are subject to hole centre-to-centre spacing,
Vertical setting of types spacing is 3.5cm, and horizontally-arranged spacing is 2.5cm, most upper round back gauge edges of boards 2cm, and vertical setting of types tiltedly arranged with 60 degree of angle.
The design of cathode cylinder bottom scaffold：Cathode scaffold is fixed production, prevents plank with waving and inflate deviation one
Side, scaffold design for V-shaped, and both sides are baffle, barrier width 12cm, and on baffle plus drilling, frequency is penetrated through to increase liquid medicine,
Increase copper facing efficiency, the size in aperture is diameter 1.6cm, and two pitchs of holes are subject to hole centre-to-centre spacing, and heavily fortified point row's spacing is 3.5cm, horizontal
Row's spacing is 2.5cm, most upper round back gauge edges of boards 2cm, and heavily fortified point row is tiltedly arranged with 60 degree of angle.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
Understanding without departing from the principles and spirit of the present invention can carry out these embodiments a variety of variations, modification, replace
And modification, the scope of the present invention is defined by the appended.
Claims (5)
1. a kind of manufacture craft improving plating copper facing uniformity, it is characterised in that：Anode gear need to be increased at high potential area anode
Plate, cathode scaffold are equipped with scaffold baffle, hole are equipped in the anode baffle, scaffold baffle, the size in aperture is diameter
1.6cm, vertical setting of types spacing are 3.5cm, and horizontally-arranged spacing is 2.5cm, and most upper round back gauge edges of boards 2cm, vertical setting of types is with 60 degree of angle
Degree is tiltedly arranged.
2. the manufacture craft according to claim 1 for improving plating copper facing uniformity, it is characterised in that：The distribution root of anode
Example anode titanium indigo plant is averagely arranged according to the number of size and the anode titanium indigo plant of cylinder body, then sky stays two titanium indigo plants by cylinder side on the both sides of cylinder body
Position is not hung.
3. the manufacture craft according to claim 1 for improving plating copper facing uniformity, it is characterised in that：The liquid of copper cylinder liquid medicine
Position cannot be too low, production plate cannot be allowed to expose liquid level, while can not be too high, should be adjusted to and press from both sides an edges of boards and anode baffle exists
The same horizontal position.
4. the manufacture craft according to claim 1 for improving plating copper facing uniformity, it is characterised in that：Point is pressed from both sides in copper facing
High potential area, the anode plate washer are located at high potential area anode, baffle at anode titanium indigo plant 1cm, above side and liquid level and
Cathode folder point flushes, barrier width 15cm.
5. the manufacture craft according to claim 1 for improving plating copper facing uniformity, it is characterised in that：The cathode scaffold
It is designed for V-shaped, both sides are baffle, barrier width 12cm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711308555.2A CN108374185A (en) | 2017-12-11 | 2017-12-11 | A kind of manufacture craft improving plating copper facing uniformity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711308555.2A CN108374185A (en) | 2017-12-11 | 2017-12-11 | A kind of manufacture craft improving plating copper facing uniformity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108374185A true CN108374185A (en) | 2018-08-07 |
Family
ID=63015802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711308555.2A Pending CN108374185A (en) | 2017-12-11 | 2017-12-11 | A kind of manufacture craft improving plating copper facing uniformity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108374185A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101260553A (en) * | 2008-04-18 | 2008-09-10 | 深圳市兴森快捷电路科技股份有限公司 | Electroplating device for printed breadboard |
| CN202705525U (en) * | 2012-04-27 | 2013-01-30 | 惠州中京电子科技股份有限公司 | Circuit board pattern plating device |
-
2017
- 2017-12-11 CN CN201711308555.2A patent/CN108374185A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101260553A (en) * | 2008-04-18 | 2008-09-10 | 深圳市兴森快捷电路科技股份有限公司 | Electroplating device for printed breadboard |
| CN202705525U (en) * | 2012-04-27 | 2013-01-30 | 惠州中京电子科技股份有限公司 | Circuit board pattern plating device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180807 |
|
| RJ01 | Rejection of invention patent application after publication |