CN202323082U - Printed circuit board (PCB) copper deposition inserting and placing device - Google Patents
Printed circuit board (PCB) copper deposition inserting and placing device Download PDFInfo
- Publication number
- CN202323082U CN202323082U CN2011204673750U CN201120467375U CN202323082U CN 202323082 U CN202323082 U CN 202323082U CN 2011204673750 U CN2011204673750 U CN 2011204673750U CN 201120467375 U CN201120467375 U CN 201120467375U CN 202323082 U CN202323082 U CN 202323082U
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Abstract
The utility model discloses a printed circuit board (PCB) copper deposition inserting and placing device, which comprises a rectangular box body, wherein the rectangular box body consists of a front inserting frame plate, a rear inserting frame plate, a bottom frame plate and left and right frame plates; a plurality of mutually corresponding arrangement chutes are arranged on the inner sides of the front inserting frame plate and the rear inserting frame plate; and the included angles between the arrangement chutes and the bottom frame plate are 75 degrees. The mutually corresponding arrangement chutes are arranged on the opposite inner sides of the front inserting frame plate and the rear inserting frame plate, the horizontal included angles between the arrangement chutes and the bottom frame plate are 75 degrees, the arrangement chutes are used for clamping circuit boards with high longitudinal and transverse ratio, and the horizontal included angles between the circuit boards with the high longitudinal and transverse ratio and the bottom frame plate are 75 degrees. Because the circuit boards with the high longitudinal and transverse ratio are included for 75 degrees in the horizontal direction and are not vertical to the horizontal direction, the exchange capability of liquor in holes is improved; and bubbles in the holes are expelled under the action of swinging, so that the contact degree between the liquor and the hole walls is improved, and good production quality is ensured.
Description
Technical field
The utility model belongs to wiring board manufacturing technology field, and what be specifically related to is the heavy copper device for inserting and placing of a kind of PCB, is used for the wiring board of resolving aperture aspect ratio high (10: 1), and when electroplating, copper plate evenly covers the bigger problem of difficulty on the hole wall that is deposited on.
Background technology
Along with the PCB product constantly develops to multiple stratification, the direction that becomes more meticulous; Printed circuit board configuration densification, high aperture aspect ratioization and multiple stratification have become developing direction; Many products are broken through the traditional design mode of aperture aspect ratio >=6: 1, the aperture aspect ratio of novel PC B product even reach more than 10: 1.The novel electron product is the power that promotes high-end multilayer printed circuit board Manufacturing Technology Development.The printed circuit board production constantly develops to high aspect ratio (more than 6: 1), small-bore direction; The PCB of highly dense trace arrangements and high plate thickness, small-bore captures PCB market just gradually greatly; Become a member in the leading product of PCB market, they are widely used in fields such as giant-powered computer, automobile, aviation, communication.
Intensive for circuit, the aperture is small, thickness of slab increases; The aperture aspect ratio is at the printed circuit board more than 6: 1; Even the aperture aspect ratio is at the high-end printed circuit board more than 10: 1; Because aperture aspect ratio high (10: 1) if produce by the production technique of common high aspect ratio (6: 1), the phenomenon of copper will inevitably occur lacking in the hole.The plating of especially high aperture aspect ratio (10: 1) printed circuit board is difficulty comparatively, and copper plate covers equably that to be deposited on the hole wall difficulty very big, and its major cause is:
1, because the PCB aperture is little and dark, the exchange capacity of liquid medicine in the hole can't guarantee the sedimentation rate of copper with mobile very poor; It is thick blocked up Kong Biantong to occur thereupon; The thick thin excessively phenomenon of hole middle copper, even the phenomenon of Kong Zhongwu copper appears, thus influence product quality.
2, the hole metallization degree of electroless copper plating: because of the aperture of high aspect ratio plate less (0.25mm); When carrying out electroless copper plating; Have two factors can have a strong impact on the deposition degree of copper, promptly bubble in the hole and the hole in the exchange capacity of liquid medicine, because of the flowability and the exchange capacity of liquid medicine in the hole not enough; Cause easily that aperture copper is thick, central zone, hole copper is thin, even the phenomenon of disconnected copper.
In this case, how utilizing existing processes to equip to reach the integrity of the homogeneity that improves through-hole plating and hole wall coating is exactly present our technical issues that need to address.
The utility model content
For this reason; The purpose of the utility model is to provide a kind of PCB to sink the copper device for inserting and placing; To solve high aperture aspect ratio printed circuit board when electroplating, little and dark because of the aperture, the problem of copper is spared even do not had to the copper thickness ununiformity in the liquid medicine hole that exchange capacity causes with mobile difference in the hole.
For realizing above-mentioned purpose, the utility model mainly adopts following technical scheme:
A kind of PCB sinks the copper device for inserting and placing; Comprise a rectangle framework (1); Said rectangle framework (1) is inserted frame plate (3), underframe plate (5) and left and right sides frame plate by preceding slotting frame plate (2), back and is constituted; Insert slotting frame plate (3) inboard in frame plate (2) and back before said and be provided with a plurality of arrangement skewed slots (4) in correspondence with each other, the angle between said arrangement skewed slot (4) and the underframe plate (5) is 75 °.
The utility model is provided with arrangement skewed slot in correspondence with each other through inserting frame plate inboard in opposite directions at the preceding slotting frame plate of rectangle framework with the back; These horizontal sextant angles of arranging between skewed slot and the underframe plate are 75 °; Said arrangement skewed slot is used for the wiring board of holding high aspect ratio, and to make the horizontal sextant angle between the corresponding and underframe plate of the wiring board of high aspect ratio be 75 °.Compared with prior art; The utility model since the high aspect ratio wiring board from the horizontal by 75 ° of inclinations; And non-perpendicular, therefore improved the exchange capacity of liquid medicine in the hole, and can drive the bubble that exists in the hole out of through the effect of waving; Increase the exposure level of liquid medicine and hole wall, guaranteed good production quality.
Description of drawings
Fig. 1 is the structural representation of the utility model.
Identifier declaration among the figure: rectangle framework 1, preceding slotting frame plate 2, back are inserted frame plate 3, are arranged skewed slot 4, underframe plate 5.
Embodiment
For setting forth the thought and the purpose of the utility model, will combine accompanying drawing and specific embodiment that the utility model is done further explanation below.
See also shown in Figure 1ly, Fig. 1 is the structural representation of the utility model.The utility model provides a kind of PCB to sink the copper device for inserting and placing; Be mainly used in and solve present high aperture aspect ratio printed circuit board when electroplating; Because the aperture is little and dark, cause liquid medicine exchange capacity in the hole and to make copper thickness ununiformity in the hole spare even not have the problem of copper easily with mobile poor.
Wherein this device mainly includes a rectangle framework 1; Said rectangle framework 1 is inserted frame plate 3, underframe plate 5 and left and right sides frame plate and is constituted by preceding slotting frame plate 2, back; The inboard of inserting frame plate 2 and the slotting frame plate 3 in back before said is provided with a plurality of arrangement skewed slots 4 in correspondence with each other; Be used for the high aperture of inlay card aspect ratio printed circuit board, and these horizontal sextant angles of arranging between skewed slot 4 and the underframe plate 5 are 75 °.
Arranging skewed slot 4 can be processed by iron plate, and insert frame plate 2 before being welded on, inboard that frame plate 3 is inserted in the back, and preceding slotting frame plate 2, back to insert the inboard arrangement skewed slot of frame plate 3 corresponding one by one.
The utility model can insert every PCB in arranging skewed slot when high aperture aspect ratio printed circuit board being sunk the copper processing, because the utility model is arranged skewed slot from the horizontal by 75 ° of inclinations; And it is non-perpendicular; Therefore when PCB when sink the copper processing, the hole on the PCB is in inclination accordingly, and the angle of inclination is when being in 75 °; The exchange capacity of liquid medicine is best in the hole; And the bubble that this angle will remain in the hole more easily discharges, and can effectively increase the exposure level of electroplating liquid medicine and hole wall, can guarantee good electroplating quality.
More than be that the heavy copper device for inserting and placing of a kind of PCB that the utility model is provided has carried out detailed introduction; Used concrete example among this paper the structural principle and the embodiment of the utility model are set forth, above embodiment just is used to help to understand the method and the core concept thereof of the utility model; Simultaneously, for one of ordinary skill in the art, according to the thought of the utility model, the part that on embodiment and range of application, all can change, in sum, this description should not be construed as the restriction to the utility model.
Claims (1)
1. the heavy copper device for inserting and placing of a PCB; It is characterized in that comprising a rectangle framework (1); Said rectangle framework (1) is inserted frame plate (3), underframe plate (5) and left and right sides frame plate by preceding slotting frame plate (2), back and is constituted; Insert slotting frame plate (3) inboard in frame plate (2) and back before said and be provided with a plurality of arrangement skewed slots (4) in correspondence with each other, the angle between said arrangement skewed slot (4) and the underframe plate (5) is 75 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204673750U CN202323082U (en) | 2011-11-21 | 2011-11-21 | Printed circuit board (PCB) copper deposition inserting and placing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204673750U CN202323082U (en) | 2011-11-21 | 2011-11-21 | Printed circuit board (PCB) copper deposition inserting and placing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202323082U true CN202323082U (en) | 2012-07-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204673750U Expired - Fee Related CN202323082U (en) | 2011-11-21 | 2011-11-21 | Printed circuit board (PCB) copper deposition inserting and placing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202323082U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107835586A (en) * | 2017-09-15 | 2018-03-23 | 深圳崇达多层线路板有限公司 | A kind of method for preventing back drill orifice plate turmeric plating leakage |
-
2011
- 2011-11-21 CN CN2011204673750U patent/CN202323082U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107835586A (en) * | 2017-09-15 | 2018-03-23 | 深圳崇达多层线路板有限公司 | A kind of method for preventing back drill orifice plate turmeric plating leakage |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120711 Termination date: 20141121 |
|
| EXPY | Termination of patent right or utility model |