CN108333745B - Mems微镜结构 - Google Patents
Mems微镜结构 Download PDFInfo
- Publication number
- CN108333745B CN108333745B CN201810379658.6A CN201810379658A CN108333745B CN 108333745 B CN108333745 B CN 108333745B CN 201810379658 A CN201810379658 A CN 201810379658A CN 108333745 B CN108333745 B CN 108333745B
- Authority
- CN
- China
- Prior art keywords
- micro
- frame
- mirror
- micro mirror
- solder ball
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910000679 solder Inorganic materials 0.000 claims description 61
- 238000000034 method Methods 0.000 claims description 17
- 238000005476 soldering Methods 0.000 claims description 11
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 4
- 230000003014 reinforcing effect Effects 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 11
- 230000003044 adaptive effect Effects 0.000 abstract description 2
- 238000003466 welding Methods 0.000 abstract description 2
- 230000001681 protective effect Effects 0.000 description 10
- 230000002787 reinforcement Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 238000002513 implantation Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000011089 mechanical engineering Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810379658.6A CN108333745B (zh) | 2018-04-25 | 2018-04-25 | Mems微镜结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810379658.6A CN108333745B (zh) | 2018-04-25 | 2018-04-25 | Mems微镜结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108333745A CN108333745A (zh) | 2018-07-27 |
CN108333745B true CN108333745B (zh) | 2024-03-12 |
Family
ID=62933693
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810379658.6A Active CN108333745B (zh) | 2018-04-25 | 2018-04-25 | Mems微镜结构 |
Country Status (1)
Country | Link |
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CN (1) | CN108333745B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023035289A1 (zh) * | 2021-09-13 | 2023-03-16 | 上海仁芯生物科技有限公司 | 一种介电层表面平整的微流控芯片及制备方法、制作模具 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102298207A (zh) * | 2011-08-16 | 2011-12-28 | 无锡微奥科技有限公司 | 一种微机电系统微镜封装 |
CN105800543A (zh) * | 2015-01-16 | 2016-07-27 | 台湾积体电路制造股份有限公司 | 衬底结构、半导体结构及其制造方法 |
CN208110163U (zh) * | 2018-04-25 | 2018-11-16 | 中科芯集成电路股份有限公司 | Mems微镜结构 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7203393B2 (en) * | 2002-03-08 | 2007-04-10 | Movaz Networks, Inc. | MEMS micro mirrors driven by electrodes fabricated on another substrate |
WO2010138968A2 (en) * | 2009-05-29 | 2010-12-02 | University Of Florida Research Foundation, Inc. | Method and apparatus for providing high-fill-factor micromirror/micromirror arrays with surface mounting capability |
DE102011086765A1 (de) * | 2011-11-22 | 2013-05-23 | Robert Bosch Gmbh | Chip mit mikro-elektromechanischer Struktur und Verfahren zum Herstellen eines Chips mit mikro-elektromechanischer Struktur |
-
2018
- 2018-04-25 CN CN201810379658.6A patent/CN108333745B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102298207A (zh) * | 2011-08-16 | 2011-12-28 | 无锡微奥科技有限公司 | 一种微机电系统微镜封装 |
CN105800543A (zh) * | 2015-01-16 | 2016-07-27 | 台湾积体电路制造股份有限公司 | 衬底结构、半导体结构及其制造方法 |
CN208110163U (zh) * | 2018-04-25 | 2018-11-16 | 中科芯集成电路股份有限公司 | Mems微镜结构 |
Also Published As
Publication number | Publication date |
---|---|
CN108333745A (zh) | 2018-07-27 |
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Legal Events
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: 214000 Jiangsu city of Wuxi province DiCui Binhu District Liyuan Development Zone, Road No. 100 building 9 layer 2 Applicant after: ZHONGKEXIN INTEGRATED CIRCUIT Co.,Ltd. Address before: 214000 Jiangsu city of Wuxi province DiCui Binhu District Liyuan Development Zone, Road No. 100 building 9 layer 2 Applicant before: CHINA KEY SYSTEM & INTEGRATED CIRCUIT Co.,Ltd. |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20200513 Address after: 214000 No.19, Erquan East Road, Xishan District, Wuxi City, Jiangsu Province Applicant after: Wuxi micro vision sensor technology Co.,Ltd. Address before: 214000 Jiangsu city of Wuxi province DiCui Binhu District Liyuan Development Zone, Road No. 100 building 9 layer 2 Applicant before: ZHONGKEXIN INTEGRATED CIRCUIT Co.,Ltd. |
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GR01 | Patent grant | ||
GR01 | Patent grant |