CN108303853B - XY multiaxis movable light path direct-writing exposure machine of DMD structure - Google Patents
XY multiaxis movable light path direct-writing exposure machine of DMD structure Download PDFInfo
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- CN108303853B CN108303853B CN201611025099.6A CN201611025099A CN108303853B CN 108303853 B CN108303853 B CN 108303853B CN 201611025099 A CN201611025099 A CN 201611025099A CN 108303853 B CN108303853 B CN 108303853B
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- 238000000034 method Methods 0.000 abstract description 30
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 238000005192 partition Methods 0.000 abstract description 6
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
- G03F7/2055—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser for the production of printing plates; Exposure of liquid photohardening compositions
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Abstract
The invention discloses a XY multi-axis movable optical path direct-writing exposure machine with a DMD structure, and belongs to the technical field of direct-writing exposure. The XY multi-axis movable optical path direct writing exposure machine with the DMD structure is mainly improved on a vacuum chuck structure, and the problem of insufficient suction force caused by air leakage during production of small plates is effectively solved. Further, the air holes on the sucker are distributed in a manner of sparse in the middle and dense in the periphery, so that the problem of tilting of the edge of the plate is effectively solved, the number of the air holes is saved, and the cost is reduced. The XY multi-axis movable light path direct-writing exposure machine with the DMD structure can produce an oversized plate with 55 inches; and two groups of motion components are respectively connected to the left side and the right side below the sucker, and the motion axes of the two groups of motion components synchronously move, so that the exposure precision and the running stability are improved. Meanwhile, the accuracy of the image exposure position can be ensured by improving the partition alignment focusing method, and the image exposure is clear.
Description
Technical Field
The invention relates to a XY multi-axis movable optical path direct-writing exposure machine with a DMD structure, and belongs to the technical field of direct-writing exposure.
Background
A PCB (printed circuit board) is a support for electronic components and is also a carrier for electrical connection of the electronic components. Common PCB production equipment is provided with a traditional exposure machine, a laser direct writing exposure machine with a polygon prism structure, a laser direct writing exposure machine with a DMD structure and the like. The laser direct-writing exposure machine can directly image an image on the PCB, and compared with a traditional exposure machine, the laser direct-writing exposure machine does not need films, and the formed image is clearer.
As the market demands higher and higher functionality on PCB boards, the PCB boards become more complex, the higher the system compatibility, sometimes requiring a very large size substrate, but for oversized boards with widths greater than 48 inches, there is no technology and equipment available in the prior art that can be processed with high quality. The traditional exposure machine can produce oversized plates, but the processing precision is poor, and the requirements of high density and fine spacing are not met; the laser direct-writing exposure machine with the polygon prism structure cannot realize the movement of an optical path at present, the whole plate needs to be molded at one time, when the oversized plate with the size larger than 48 inches is processed, the whole width of the equipment can reach more than 3m, the size of the equipment is too large, the equipment is difficult to pass through the door of a common workshop, and the equipment is very heavy; therefore, the multi-prism LDI cannot produce PCB boards with a width of 48 inches or more. The conventional DMD structure laser direct writing exposure machine cannot produce oversized plates larger than 48 inches because the maximum width of the dimension of the suction cup which can be exposed is only 24 inches.
If the DMD structured laser direct writing exposure is prepared by increasing the size of the chuck that can be exposed, there are problems in that the required vacuum chuck size is relatively large, sometimes exceeding 55 inches: (1) When the actual size of the exposed PCB is smaller, the sucker structure supports a larger vacuum range, and for the area without covering the PCB, air leakage can occur, so that the suction of the sucker to the substrate is affected; (2) Because there may be the corner wane in the base plate transportation, if vacuum suction is not enough, the sucking disc can't be with the board suction level, can influence the quality of exposure PCB board, can cause the base plate to scrap. To solve this problem, there are three methods:
The method comprises the following steps: the problem is directly disregarded, but the requirement on the PCB of a customer factory is very high, the PCB is not flat, the PCB can be bent manually back and forth, and the production efficiency is seriously affected.
The second method is as follows: different sucker base plates are designed for plates with different sizes. The coverage area of the holes for sucking vacuum on the backing plate is consistent with the size of the plate. The method is simple and slightly troublesome to operate, but when 55-inch plates are produced, 55-inch backing plates need to be replaced, the difficulty is increased by times, the time for replacing the backing plates is increased by 150% -200%, and the production efficiency is seriously affected.
And a third method: for the areas of the board which are not covered with the vacuum-pumping areas, articles are used for plugging, and commonly used films are cut. The method is economical and practical, but is troublesome, the films are required to be cut into different sizes of PCB boards, and long-term accumulation of the films after cutting in a machine production area is caused, and the method is troublesome to find the required size.
Therefore, in the prior art, a mode of replacing a sucking disc with a proper size or searching a waste film with a proper shape and size to seal the leakage point is generally adopted, so that the production efficiency is greatly reduced.
In addition, in the PCB factory, a board with a large size of 52×40 inches is large, and the board is troublesome to carry and may be locally bent and deformed; when the board is very thin, the board can be manually broken off to be flat; the plate is thicker, for example, more than 3mm, and recovery after deformation is difficult. In addition, in actual exposure production, the substrate is dragged by a person to be placed on the sucker, the process cannot be completely accurate, more or less a rotation angle exists between the substrate and an electronic image, and thus the problems of image dislocation and the like can be caused in actual exposure; thirdly, in the traditional exposure, a CCD camera grabs 4 hole sites on the periphery of a PCB board, a clearest focal plane is searched through the CCD camera according to the 4 hole sites, an optimal focal plane and an exposure focal length are determined, focusing is completed, the focal plane is taken as a reference for exposure in the exposure process, but in the actual situation, the board cannot be in an ideal horizontal plane state, bulges or concaves can be generated in certain areas, the whole substrate can be inclined in the placement process, and the conditions can cause inaccurate focusing in the exposure of certain areas, so that the production quality is seriously affected.
In summary, the existing DMD structure laser direct writing exposure machine has the problems of incapability of producing oversized plates, air leakage of vacuum suction cups, inaccurate focusing and positioning in the exposure process, and the like, which are needed to be solved.
Disclosure of Invention
Aiming at the problems, the invention provides a vacuum chuck and a DMD structure XY multi-axis movable light path direct writing exposure machine containing the vacuum chuck, so as to solve the problems that an oversized plate cannot be produced, the vacuum chuck leaks air, focusing and positioning are inaccurate in the exposure process and the like in the prior art.
A first object of the present invention is to provide a vacuum chuck comprising a chuck body and a vacuum generating device; a certain number of air holes are distributed on the sucker main body in a row and a column mode, each row of air holes corresponds to one relay, and each column of air holes corresponds to one relay; an air hole switch is connected between each air hole and the vacuum generating device; the air hole switch is connected with the relay of the row where the air hole is located and the relay of the column where the air hole is located.
In one embodiment of the invention, the air vent switch is located on a vacuum line where the air vent is connected to the vacuum generating device.
In one embodiment of the present invention, the air vent switch is an electromagnetic switch.
In one embodiment of the invention, the relay is connected to a master control device.
In one embodiment of the invention, the air holes are distributed on the sucker main body in a mode of sparse middle and dense periphery.
In one embodiment of the invention, the row spacing and the column spacing of the air holes are uniformly reduced from the middle to the two sides of the sucker body.
In one embodiment of the invention, the row spacing or column spacing of the air holes in the central region of the chuck body is at most 1-3 inches and the row spacing or column spacing of the air holes in the peripheral region of the chuck body is at least 5-8mm.
In one embodiment of the present invention, the shape of the opening of the air hole on the sucker body may be any shape such as a circle, an ellipse, a square, a rectangle, etc.
In one embodiment of the invention, the opening area of the air hole on the sucker body is 10mm 2～500mm2.
In one embodiment of the invention, the suction cup body has a maximum width of 55 inches.
In one embodiment of the invention, the disc surface of the sucker body is an integral disc surface or is formed by combining a plurality of disc surfaces.
In one embodiment of the present invention, the disc surface of the sucker main body is formed by combining two equal-sized disc surfaces.
In one embodiment of the present invention, the chuck body may be divided into a chuck support structure and a pad, or may be an integral structure in which the pad and the chuck support structure are integrated. When the sucker main body is in a structure that the sucker supporting structure and the base plate are separated, the base plate is arranged on the surface of the sucker supporting structure, air holes which are uniformly distributed are designed on the surface of the base plate, and a vacuum air passage connected with the air holes is arranged below the base plate.
A second object of the invention is to provide a device comprising a vacuum chuck according to the invention.
In one embodiment of the invention, the device may be various types of exposure machines.
The third object of the invention is to provide a DMD structure XY multiaxial movable optical path direct writing exposure machine containing the vacuum chuck of the invention.
In one embodiment of the invention, the XY multi-axis movable optical path direct writing exposure machine with the DMD structure further comprises a supporting structure, the DMD structure, a stepping shaft of the DMD structure and a plurality of moving components; each motion assembly comprises a stepping X axis, a scanning Y axis and a lifting Z axis; the vacuum chuck is positioned above the motion assembly.
In the invention, XY multiaxis means that the robot comprises more than two motion components, and the motion components comprise a stepping X axis, a scanning Y axis and a lifting Z axis; by moveable it is meant that the DMD structure is moveable along the track as the slider of the DMD structure steps on axis.
In one embodiment of the present invention, the DMD structure XY multi-axis movable optical path direct writing exposure machine is a DMD structure XY dual-axis movable optical path direct writing exposure machine, and includes two motion components.
In one embodiment of the invention, the step X axis is located below the elevation Z axis, and the scan Y axis is located below the step X axis;
in one embodiment of the invention, the vacuum chuck is connected to the lifting Z-axis of the motion assembly.
In one embodiment of the present invention, the plurality of motion units are arranged in parallel along the X-axis direction.
In one embodiment of the present invention, the number of the plurality of motion components is two.
In one embodiment of the invention, the disk surface of the sucker main body of the vacuum sucker is an integral disk surface or is formed by combining a plurality of disk surfaces. When combined by a plurality of disc surfaces, each disc surface corresponds to one or a plurality of motion components.
In one embodiment of the invention, the sucker main body of the vacuum sucker is formed by combining left and right disc surfaces with the same size; each disk surface corresponds to a motion assembly.
In one embodiment of the invention, the two disk surfaces are not connected by any connection, or are connected by a ball hinge structure, or are connected by hard connection.
In one embodiment of the present invention, the number of the step X axes is two, namely a first step X axis and a second step X axis.
In one embodiment of the present invention, the support structure is a gantry structure.
In one embodiment of the invention, the DMD structure is mounted on a DMD structure stepping shaft, and the slider of the DMD structure stepping shaft moves along the guide rail.
In one embodiment of the present invention, the DMD structured XY multi-axis movable optical path direct writing exposure machine further comprises a camera for focusing and positioning.
The fourth object of the invention is to provide a partition alignment focusing method, in particular to a partition alignment focusing method of a DMD structure XY multi-axis movable light path direct writing exposure machine of a vacuum chuck, which solves the problems of inaccurate positioning and inaccurate focusing caused by inaccurate board placement and board deformation in the production process.
The invention discloses a partition alignment focusing method, namely a four-point partition automatic focusing and positioning method, which comprises the following steps:
(1) Before exposure, after the CCD camera grabs coordinates of positioning holes at four corners of the PCB, the coordinates of the positioning holes are compared with corresponding coordinates of the positioning holes in an electronic grade graphic file, and an actual corresponding relation between the electronic grade graphic and the PCB is established; if the coordinates of the positioning holes grabbed by the CCD camera are consistent with the corresponding coordinates in the electronic file, performing the step (2); if the coordinates of the positioning holes grabbed by the CCD camera are inconsistent with the corresponding coordinates in the electronic file, adjusting the electronic file to keep consistent with the coordinates of the positioning holes grabbed by the CCD camera, determining the initial position of light path exposure, and continuing to perform the step (2);
(2) Before exposure, dividing the area to be exposed into M multiplied by N subareas;
(3) Respectively calculating the optimal focal plane distances of four vertexes of each sub-area; if the maximum difference value of the optimal focal plane distances of the four vertexes is within the allowable error range, taking the average value of the optimal focal plane distances of the four vertexes as the focal plane distance of the sub-region exposure; if the maximum difference value of the best focal plane distances of the four vertexes is not within the allowable error range, dividing the subarea into A multiplied by B secondary subareas, calculating the best focal plane distances of the four vertexes of each secondary subarea, and repeating the step until the best focal plane distance in each subarea is within the error range.
In one embodiment of the invention, when the light path starts to expose from the initial position and enters into different sub-areas at different levels, if the optimal focal plane distances are different, the height is adjusted to the optimal exposure focal plane of the sub-area through the lifting Z axis, so that all exposure areas are exposed at the optimal focal plane, and the line width uniformity and the exposure quality of the whole plate are ensured.
In one embodiment of the present invention, the method for determining the optimal focal plane includes: and identifying the aperture of the hole on the PCB by using a CCD camera, and if the identified aperture is inconsistent with the actual aperture, continuously identifying the diameter of the hole by using the camera by changing the height of the lifting Z axis up and down, and finding out the height of the lifting axis which is closest to the height of the lifting axis corresponding to the actual diameter after the lifting Z axis moves for a complete stroke, wherein the height is the optimal focal plane corresponding to the hole.
The invention has the advantages and effects that:
(1) The invention relates to a DMD structure XY multiaxial movable light path direct writing exposure machine, which is mainly used for improving a vacuum chuck structure. The vacuum chuck is an automatic vacuum chuck, a series of air holes are distributed on the surface of the chuck, when the PCB is covered on the air holes, the air hole passage works, and when the PCB is not covered on the air holes, the air holes are closed, so that the problem of insufficient suction force caused by air leakage when producing small plates is effectively solved. Further, the air holes on the sucker are distributed in a sparse and four-week manner, so that the edge part of the PCB with different sizes is always provided with the air holes when the PCB is placed, the problem of tilting of the edge of the PCB is effectively solved, the number of the air holes can be saved in the middle of the PCB without too many air holes, the cost is reduced, and the efficiency is improved.
(2) The XY multi-axis movable light path direct writing exposure machine with the DMD structure has the advantages that the width of the sucker of the exposure machine can be set to 55 inches, an oversized plate with 55 inches can be produced, and meanwhile, the requirements of high precision, high density, fine line distance and the like can be met; and the lower part of the sucker is connected with a plurality of groups of moving components, the moving shafts of the plurality of groups of moving components synchronously move, the exposure precision and the running stability are improved, the exposure line distance can be less than 30 microns, and the exposure reject ratio is reduced to less than 0.1%.
(3) According to the zonal alignment focusing method provided by the invention, four-point zonal focusing and positioning are carried out before the exposure of the PCB, so that the accuracy of the image exposure position can be ensured, the alignment error can be controlled below 12 microns, and the image exposure is clear.
(4) The upper DMD structure stepping shaft and the lower stepping X shaft are combined, the DMD structure and the vacuum chuck can freely move along the transverse direction, the transverse exposure range is expanded to the maximum extent, and the flexibility and the maneuverability of exposure are increased; adopt the design of many motion subassembly, make vacuum chuck possess a plurality of strong points, make the sucking disc have better stability in the motion process, avoid the single subassembly simultaneously to support the unstable problem of connection that probably appears when great sucking disc.
Drawings
FIG. 1 is a schematic view of a vacuum chuck according to the present invention; wherein, the sucker body 1, the air hole 3, the relay 4 and the total control device 6;
FIG. 2 is a schematic diagram showing the connection between the vacuum generating device and the air hole of the vacuum chuck; wherein, 2 the vacuum generating device, 5 air hole switches;
FIG. 3 is a schematic view of a conventional vacuum chuck after placing a substrate; wherein, 14 base plate;
FIG. 4 is a schematic view of a structure of the vacuum chuck of the present invention after placing a substrate;
FIG. 5 is a schematic view of a structure after adjusting the position of a substrate on a vacuum chuck according to the present invention;
FIG. 6 is a schematic diagram of a DMD structure XY biaxial movable optical path direct writing exposure machine incorporating the vacuum chuck of the present invention; wherein, 7 supporting structure, 8 DMD structure, 9 DMD structure step shaft, 10 vacuum chuck; 11 steps X axis, 12 scans Y axis, 13 lifts Z axis;
FIG. 7 is a schematic diagram of the correspondence of images before alignment;
FIG. 8 is a schematic diagram of the correspondence of the aligned images;
FIG. 9 is a schematic view of zoned focus exposure zone division;
fig. 10 is a schematic diagram after repartitioning the exposure area.
Detailed description of the preferred embodiments
DMD structure: a complete set of light path system taking DMD as a core device comprises a laser light source, the DMD, an optical lens and other components.
PCB: printed Circuit Board, a printed circuit board, is an important electronic component, is a support for electronic components, and is a carrier for electrical connection of electronic components.
DMD structure step axis: and the linear motor system is characterized in that the optical path is arranged on the moving part of the motor and is used for performing stepping movement.
Step X axis: also known as an X-axis motion stage or a stepping axis, may be used for a step motion or a continuous scanning motion.
Scanning a Y axis: also called the scan axis or Y axis, for continuous scanning movement at a constant speed.
Lifting a Z axis: also called lifting shaft or Z shaft, is used for controlling lifting of the sucker.
Suction cup: and the objective table is used for adsorbing and fixing the PCB.
The present invention will be described in detail below.
Example 1: vacuum chuck
The vacuum chuck structure of the present invention is shown in fig. 1-2.
The invention relates to a vacuum sucker, which comprises a sucker main body 1 and a vacuum generating device 2; a certain number of air holes 3 are distributed on the sucker main body 1 in a row and a column mode, each row of air holes 3 corresponds to one relay 4, and each column of air holes 3 corresponds to one relay 4; an air hole switch 5 is connected between each air hole 3 and the vacuum generating device 2; the air vent switch 5 is connected to both the relay 4 in which the air vent 3 is located and the relay 4 in which the air vent 3 is located.
Each relay 4 is connected to a general control device 6. The air hole switch 5 is positioned on a vacuum pipe connected with the air hole 3 and the vacuum generating device 2. The air vent switch 5 may be an electromagnetic switch. The air holes 3 may be uniformly distributed on the sucker body 1.
By adopting the structure and the connection mode, when the vacuum chuck works, a substrate with a certain size is placed on the vacuum chuck, and for the row or the row of air holes covered by the substrate, the relay passage corresponding to the row or the row is provided; for a certain air hole, only when the relays corresponding to the row and the column are all the paths, the air hole switch of the air hole is opened, and then the vacuum generating device is communicated with the air hole, and the air hole works. In this case, the air vent switch of the air vent not covered by the substrate is in the off state, thereby solving the problem of air leakage when the vacuum chuck is used to produce the PCB.
Example 2: vacuum chuck
The vacuum chuck of this embodiment is modified from that of embodiment 1 as shown in fig. 1-2.
The air holes 3 are distributed on the sucker main body 1 in a mode of sparse middle and dense periphery.
In conventional vacuum chucks, the air holes are generally uniformly distributed, and when a smaller PCB is produced, the edge of the substrate 14 may be located far from the air holes on both sides (as shown in fig. 3) after the substrate is placed on the chuck body, so that the edge portion may be tilted due to no vacuum suction, which affects the production. After the distribution form of the middle thinning and surrounding sealing is adopted, as shown in fig. 4-5, when a smaller substrate is placed on the vacuum chuck, the substrate is placed close to the edge of the chuck main body, and if the edge of the substrate close to the middle area on the chuck main body is far away from the air holes on two sides, the edge of the substrate can be moved to the nearest row or column of air holes to be covered; because the air holes around the sucker body are denser, the movement can not cause the phenomenon that the edge of the other side of the substrate is far away from the air holes.
Optionally, the row spacing and the column spacing of the air holes are uniformly decreased from the middle to the two sides of the sucker body.
Alternatively, the row or column spacing of the air holes in the central region of the chuck body is at most 1-3 inches and the row or column spacing of the air holes in the peripheral region of the chuck body is at least 5-8mm. The shape of the opening of the air hole on the sucker body can be any shape such as a circle, an ellipse, a square, a rectangle and the like. The opening area of the air hole on the sucker body can be arbitrary, such as 10mm 2～500mm2.
Optionally, the disc surface of the sucker main body is an integral disc surface or is formed by combining a plurality of disc surfaces.
Example 3: XY double-shaft movable light path direct writing exposure machine with DMD structure
The DMD structure XY biaxial movable optical path direct writing exposure machine having two moving components is exemplified.
As shown in fig. 6, the DMD structure XY biaxial movable optical path direct writing exposure machine containing the vacuum chuck of the present invention.
The XY double-shaft movable light path direct-writing exposure machine with the DMD structure comprises a supporting structure 7, the DMD structure 8, a DMD structure stepping shaft 9, a plurality of moving assemblies and a vacuum chuck 10; each motion assembly includes a step X-axis 11, a scan Y-axis 12, and a lift Z-axis 13; the vacuum chuck 10 is located above the moving assembly.
The DMD structure 8 is mounted on a DMD structure step shaft 9, which is movable along a rail along with the slider of the DMD structure step shaft 9. The step X axis 11 is positioned below the lifting Z axis 13, and the scanning Y axis 12 is positioned below the step X axis 11; the vacuum chuck 10 is connected with a lifting Z-axis 13 of the motion assembly. The vacuum chuck changes its position with the movement of the step X, scan Y, and Z axes 13.
Optionally, the disc surface of the sucker main body of the vacuum sucker is an integral disc surface.
Optionally, the plurality of motion components are arranged in parallel along the X-axis direction and are uniformly distributed and installed below the vacuum chuck 10. Through setting up a plurality of motion subassembly, when producing great PCB board, synchronous operation between each subassembly compares with single motion subassembly, can guarantee better stability.
Optionally, the plurality of motion assemblies is 2; correspondingly, the number of the stepping X axes is two, namely a first stepping X axis and a second stepping X axis.
Optionally, the support structure is a gantry structure. The structural characteristics of the marble gantry structure are used for supporting the framework of the whole system, so that the stability of the movement of the platform can be well maintained, and the marble gantry structure has good shock insulation performance.
Example 4: XY double-shaft movable light path direct writing exposure machine with DMD structure
The DMD structure XY biaxial movable optical path direct writing exposure machine having two moving components is exemplified.
The XY biaxial movable optical path direct writing exposure machine with the DMD structure of the embodiment is improved on the basis of the embodiment 3.
The disc surface of the sucker main body of the vacuum sucker is formed by combining a plurality of disc surfaces; each disk surface corresponds to one or more motion components.
Optionally, the sucker main body of the vacuum sucker is formed by combining left and right disc surfaces with the same size; each disk surface corresponds to a motion assembly.
The two disc surfaces forming the sucker main body are not connected by any way, or are connected by adopting a ball hinge structure, or are connected by hard connection.
In order to produce 55 x 40 inch PCB, because of the limitation of domestic processing technology level, the sucking disc with high precision and large area cannot be produced, so that only a mode of splicing two sucking disc surfaces can be adopted. In the invention, the left sucker and the right sucker are respectively fixed on the corresponding Z-axis installation surface by a plurality of screws, and then the connection mode between the two suckers can be as follows:
(1) The suckers do not adopt any connection, and the precision of two Y axes is controlled by the platform only. The plate production device has the advantages of simple structure, economy, and more flexible size of the produced plate, and is more close to the use requirement of customers, when the plate with the size less than 24 inches is produced, only one sucker range is required to be exposed, and two suckers are not required to be exposed.
(2) The suction cups are connected by adopting a ball hinge structure, the two suction cups can have slight height inconsistency in the Z direction, and consistency is realized by controlling a platform in the Y direction movement process. The Y-axis unlocking mechanism has the advantages that once a certain Y-axis unlocking occurs, the other Y-axis unlocking can be driven through the connection of the two suckers, and the damage of the plate is effectively avoided. Since the conventional method for measuring the height difference of two Z axes is not capable of measuring the height difference to the micron level, a certain height difference exists more or less. The method can effectively reduce the situation that the Z axis is blocked when the Z axis moves due to inconsistent Z axis heights;
(3) The two suckers are fixedly connected by hard connection, namely screws and the like. The advantages are that the board is not scrapped no matter the Y-axis is suddenly powered off or the Z-axis is inconsistent in height.
The three connection methods can be selected to connect according to actual conditions.
Example 5: image partition alignment and focusing method
In the conventional exposure process, when the PCB substrate is placed on the vacuum chuck, there may be a problem of incorrect placement, as shown in fig. 7, if the electronic document pattern is directly exposed on the substrate, the actual pattern exposed on the PCB substrate is inconsistent with the electronic document pattern, thereby causing poor quality or rejection of the board. In addition, in the traditional exposure process, the whole substrate is exposed by adopting the same focal plane distance, and the focal distance is not adjusted; however, in practical situations, the substrate may not be in an ideal horizontal plane state, some areas may be raised or recessed, the whole substrate may be inclined during the placement process, and these situations may cause inaccurate focusing when some areas are exposed, which seriously affects the production quality.
The zone alignment focusing method of the invention, namely a four-point zone automatic focusing and positioning method, as shown in fig. 7-10, comprises the following steps:
(1) Before exposure, after the CCD camera grabs coordinates of positioning holes at four corners of the PCB, the coordinates of the positioning holes are compared with corresponding coordinates of the positioning holes in an electronic grade graphic file, and an actual corresponding relation between the electronic grade graphic and the PCB is established; if the coordinates of the positioning holes grabbed by the CCD camera are consistent with the corresponding coordinates in the electronic file, performing the step (2); if the coordinates of the positioning holes grabbed by the CCD camera are inconsistent with the corresponding coordinates in the electronic file, adjusting the electronic file to keep consistent with the coordinates of the positioning holes grabbed by the CCD camera, determining the initial position of light path exposure, and continuing to perform the step (2);
(2) Prior to exposure, the area to be exposed is divided into m×n sub-areas (as in fig. 9);
(3) Respectively calculating the optimal focal plane distances of four vertexes of each sub-area; if the maximum difference value of the optimal focal plane distances of the four vertexes is within the allowable error range, taking the average value of the optimal focal plane distances of the four vertexes as the focal plane distance of the sub-region exposure; if the maximum difference of the best focal plane distances of the four vertexes is not within the allowable error range, the sub-region is subdivided into A multiplied by B secondary sub-regions (as shown in figure 10), the best focal plane distances of the four vertexes of each secondary sub-region are calculated, and the step is repeated until the best focal plane distance in each sub-region is within the error range.
When the light path starts to expose from the initial position and enters into different sub-areas, if the optimal focal plane distances are different, the height is adjusted to the optimal exposure focal plane of the sub-areas through the lifting Z axis, so that all exposure areas are exposed on the optimal focal plane, and the line width uniformity and the exposure quality of the whole plate are ensured.
The method for determining the optimal focal plane comprises the following steps: and identifying the aperture of the hole on the PCB by using a CCD camera, and if the identified aperture is inconsistent with the actual aperture, continuously identifying the diameter of the hole by using the camera by changing the height of the lifting Z axis up and down, and finding out the height of the lifting axis which is closest to the height of the lifting axis corresponding to the actual diameter after the lifting Z axis moves for a complete stroke, wherein the height is the optimal focal plane corresponding to the hole.
While the invention has been described with reference to the preferred embodiments, it is not limited thereto, and various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (9)
1. A vacuum chuck, characterized in that the vacuum chuck comprises a chuck main body and a vacuum generating device; a certain number of air holes are distributed on the sucker main body in a row and a column mode, each row of air holes corresponds to one relay, and each column of air holes corresponds to one relay; an air hole switch is connected between each air hole and the vacuum generating device; the air hole switch is connected with the relay of the row where the air hole is located and the relay of the column where the air hole is located.
2. The vacuum chuck according to claim 1, wherein the air holes are distributed in a dense manner in the middle and the periphery of the chuck body.
3. The vacuum chuck of claim 1, wherein the vent switch is located on a vacuum line where the vent is connected to the vacuum generating device.
4. The vacuum chuck according to claim 1, wherein the row and column spacing of the air holes is uniformly tapered from the center to the two sides of the chuck body.
5. The vacuum chuck according to claim 1, wherein the chuck body has a unitary chuck surface or is formed by a plurality of chuck surfaces.
6. The vacuum chuck according to claim 1, wherein the row or column spacing of the gas holes in the central region of the chuck body is at most 1-3 inches and the row or column spacing of the gas holes in the peripheral region of the chuck body is at least 5-8mm.
7. A device comprising a vacuum chuck according to any one of claims 1 to 6.
8. The XY multi-axis movable optical path direct-writing exposure machine of the DMD structure is characterized in that the XY multi-axis movable optical path direct-writing exposure machine of the DMD structure comprises the vacuum chuck according to any one of claims 1 to 6; the XY multi-axis movable light path direct-writing exposure machine of the DMD structure further comprises a supporting structure, the DMD structure, a DMD structure stepping shaft and a plurality of moving assemblies; each motion assembly comprises a stepping X axis, a scanning Y axis and a lifting Z axis; the vacuum chuck is positioned above the motion assembly.
9. The XY multi-axis movable optical path direct-writing exposure machine with a DMD structure according to claim 8, wherein the plurality of moving components are arranged in parallel along the X-axis direction; the vacuum chuck is connected with the lifting Z shaft of the motion assembly.
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| CN201611025099.6A CN108303853B (en) | 2016-11-22 | 2016-11-22 | XY multiaxis movable light path direct-writing exposure machine of DMD structure |
| CN202410146078.8A CN117872688A (en) | 2016-11-22 | 2016-11-22 | Partition alignment focusing method of exposure machine |
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| CN201611025099.6A CN108303853B (en) | 2016-11-22 | 2016-11-22 | XY multiaxis movable light path direct-writing exposure machine of DMD structure |
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| CN202410146078.8A Division CN117872688A (en) | 2016-11-22 | 2016-11-22 | Partition alignment focusing method of exposure machine |
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| CN201611025099.6A Active CN108303853B (en) | 2016-11-22 | 2016-11-22 | XY multiaxis movable light path direct-writing exposure machine of DMD structure |
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| CN108873620B (en) * | 2018-07-25 | 2020-09-25 | 江苏影速集成电路装备股份有限公司 | Method for improving energy uniformity in direct-writing photoetching machine |
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| CN108303853A (en) | 2018-07-20 |
| CN117872688A (en) | 2024-04-12 |
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Address after: 221000 west side of Hengshan Road, Pizhou City, Xuzhou City, Jiangsu Province Applicant after: Jiangsu Yingsu integrated circuit equipment Co.,Ltd. Address before: 221300 Huashan Road, Pizhou Economic Development Zone, Jiangsu, China, Xuzhou Applicant before: JIANGSU YINGSU PHOTOELECTRIC TECHNOLOGY Co.,Ltd. |
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