CN108296592A - Ultrasonic wave microseism equipment for Reflow Soldering - Google Patents
Ultrasonic wave microseism equipment for Reflow Soldering Download PDFInfo
- Publication number
- CN108296592A CN108296592A CN201710025766.9A CN201710025766A CN108296592A CN 108296592 A CN108296592 A CN 108296592A CN 201710025766 A CN201710025766 A CN 201710025766A CN 108296592 A CN108296592 A CN 108296592A
- Authority
- CN
- China
- Prior art keywords
- ultrasonic wave
- wiring board
- reflow soldering
- vibration
- clamping device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention relates to a kind of ultrasonic wave microseism equipment for Reflow Soldering, including：Circuit board clamping device, for wiring board to be clamped；Vibration of ultrasonic wave source, connect with circuit board clamping device, for generating ultrasonic wave, the bubble effusion in the ultrasonic exciting wiring board solder joint；Ultrasonic wave conducts regulating device, is connect with vibration of ultrasonic wave source, for adjusting conduction to the ultrasonic wave on wiring board.Compared with prior art, the present invention utilizes ultrasonic wave high-frequency vibration under the action of ultrasonic wave, to be automatically drained out, do not end up inside solder joint, realize the welding of real high quality by the micro-bubble inside solder joint, is preferably applicable in the demand in market.
Description
Technical field
The present invention relates to a kind of welding corollary equipments, more particularly, to a kind of ultrasonic wave microseism equipment for Reflow Soldering.
Background technology
Reflow soldering is to make solder(ing) paste is heated to melt to allow surface-pasted component by providing a kind of heating environment
Pass through solder(ing) paste alloy reliably combined equipment with circuit board.Reflow soldering is electronics manufacturing surface mounting technology
Key equipment, its quality and directly influence the qualities of final products using operation, and welding process is once complete, if
Repairing defective solder joint, component or circuit board will become extremely complex, expensive.
As the development of surface mounting technology and technique is more and more ripe, client also constantly proposes new want to reflow soldering
It asks, the welding of component can be completed in high quality by not requiring nothing more than reflow soldering, and to equipment capacity and corrective maintenance etc.
It proposes higher and faster requirement, pursues the maximization of economic benefit.Since component increasingly minimizes, solder joint is also increasingly
Small, the requirement of welding quality is with regard to higher and higher.In normal reflux welding, a large amount of micro-bubble is often had inside solder joint
In the presence of these micro-bubbles form cavity one by one, reduce welding quality, and also affect final wiring board uses the longevity
Life.
Invention content
It is an object of the present invention to overcome the above-mentioned drawbacks of the prior art and provide a kind of for Reflow Soldering
Ultrasonic wave microseism equipment.
The purpose of the present invention can be achieved through the following technical solutions：
A kind of ultrasonic wave microseism equipment for Reflow Soldering, including：
Circuit board clamping device, for wiring board to be clamped；
Vibration of ultrasonic wave source, connect with circuit board clamping device, for generating ultrasonic wave, ultrasonic exciting wiring board weldering
Bubble effusion in point；
Ultrasonic wave conducts regulating device, is connect with vibration of ultrasonic wave source, for adjusting conduction to the ultrasonic wave on wiring board.
The circuit board clamping device includes fixed side group and clamper, is provided in the fixed side group and is inserted for wiring board
The interpolation slit entered, the wiring board are inserted into after the interpolation slit by the gripper.
The length of the interpolation slit is consistent with the fixed length of side group.
The ultrasonic wave conduction regulating device includes for ultrasonic wave to be conducted the conduction mechanism to wiring board and is used for
Adjust the adjuster of ultrasound conductivity, the conduction mechanism and adjuster are connected with each other, the conduction mechanism also with ultrasonic wave
Vibroseis connects.
The ultrasonic wave microseism equipment further includes the transmission device for transmission lines plate, which is set to ultrasonic wave
The circuit board clamping device side of vibroseis.
Compared with prior art, the present invention has the following advantages：
1) ultrasonic wave high-frequency vibration is utilized under the action of ultrasonic wave, to be automatically drained out, no by the micro-bubble inside solder joint
Remain in inside solder joint, realize the welding of real high quality, is preferably applicable in the demand in market.
2) wiring board is clamped using interpolation slit in circuit board clamping device, easy to use.
3) length of interpolation slit is consistent with the fixed length of side group, and the lateral sliding slotting of wiring board may be implemented, be conducive to automation.
Description of the drawings
Fig. 1 is the structural diagram of the present invention；
Wherein：1, fixed side group, 2, clamper, 3, vibration of ultrasonic wave source, 4, conduction mechanism, 5, adjuster, 11, interpolation slit.
Specific implementation mode
The present invention is described in detail with specific embodiment below in conjunction with the accompanying drawings.The present embodiment is with technical solution of the present invention
Premised on implemented, give detailed embodiment and specific operating process, but protection scope of the present invention is not limited to
Following embodiments.
A kind of ultrasonic wave microseism equipment for Reflow Soldering, as shown in Figure 1, including：
Circuit board clamping device, for wiring board to be clamped, can be reliable and stable receive ultrasonic wave, in small vibrations
Under, the micro-bubble on wiring board inside all solder joints can be discharged, and element itself does not deviate；
Vibration of ultrasonic wave source 3, connect with circuit board clamping device, constantly, reliable and stable for generating ultrasonic wave,
Bubble effusion in the ultrasonic exciting wiring board solder joint；
Ultrasonic wave conducts regulating device, is connect with vibration of ultrasonic wave source 3, for adjusting conduction to the ultrasound on wiring board
Wave.
Circuit board clamping device includes fixed side group 1 and clamper 2, is provided in fixed side group 1 and is inserted into for wiring board
Interpolation slit 11, wiring board are clamped after being inserted into interpolation slit 11 by clamper 2.
The length of interpolation slit 11 is consistent with the length of fixed side group 1.
Ultrasonic wave conduction regulating device includes for ultrasonic wave to be conducted to conduction mechanism 4 to wiring board and for adjusting
The adjuster 5 of ultrasound conductivity, conduction mechanism 4 and adjuster 5 are connected with each other, and conduction mechanism 4 also connects with vibration of ultrasonic wave source 3
It connects, matching adjusting can be carried out according to the size of client's difference wiring board, be applicable in different applications.
Ultrasonic wave microseism equipment further includes the transmission device (not shown) for transmission lines plate, which is set to super
The circuit board clamping device side in acoustic wave vibrations source 3 is simultaneously connect with wiring board, which there is independent power and program to control,
Realize stepping and operable control.When wiring board is when ultrasonic wave is handled, what which was off, when welding is tied
Beam, hermatic door are opened, which is transported to rear road by wiring board, is further processed.
Claims (5)
1. a kind of ultrasonic wave microseism equipment for Reflow Soldering, which is characterized in that including：
Circuit board clamping device, for wiring board to be clamped；
Vibration of ultrasonic wave source (3), connect with circuit board clamping device, for generating ultrasonic wave, ultrasonic exciting wiring board weldering
Bubble effusion in point；
Ultrasonic wave conducts regulating device, is connect with vibration of ultrasonic wave source (3), for adjusting conduction to the ultrasonic wave on wiring board.
2. a kind of ultrasonic wave microseism equipment for Reflow Soldering according to claim 1, which is characterized in that the wiring board
Clamping device includes fixed side group (1) and clamper (2), and the interpolation slit being inserted into for wiring board is provided on the fixed side group (1)
(11), the wiring board is clamped after being inserted into the interpolation slit (11) by the clamper (2).
3. a kind of ultrasonic wave microseism equipment for Reflow Soldering according to claim 2, which is characterized in that the interpolation slit
(11) length is consistent with the fixed length of side group (1).
4. a kind of ultrasonic wave microseism equipment for Reflow Soldering according to claim 1, which is characterized in that the ultrasonic wave
Conduction regulating device includes for ultrasonic wave to be conducted to conduction mechanism to wiring board and for adjusting ultrasound conductivity
Adjuster, the conduction mechanism and adjuster are connected with each other, and the conduction mechanism is also connect with vibration of ultrasonic wave source (3).
5. a kind of ultrasonic wave microseism equipment for Reflow Soldering according to claim 1, which is characterized in that the ultrasonic wave
Microseism equipment further includes the transmission device for transmission lines plate, which is set to the wiring board of vibration of ultrasonic wave source (3)
Clamping device side is simultaneously connect with wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710025766.9A CN108296592A (en) | 2017-01-13 | 2017-01-13 | Ultrasonic wave microseism equipment for Reflow Soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710025766.9A CN108296592A (en) | 2017-01-13 | 2017-01-13 | Ultrasonic wave microseism equipment for Reflow Soldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108296592A true CN108296592A (en) | 2018-07-20 |
Family
ID=62872133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710025766.9A Pending CN108296592A (en) | 2017-01-13 | 2017-01-13 | Ultrasonic wave microseism equipment for Reflow Soldering |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108296592A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101396751A (en) * | 2007-09-27 | 2009-04-01 | 比亚迪股份有限公司 | Solder-reflow soldering method |
| US20100006624A1 (en) * | 2008-07-10 | 2010-01-14 | Hitachi, Ltd. | Soldering method and soldering apparatus |
| CN202169426U (en) * | 2011-05-10 | 2012-03-21 | 扬州扬杰电子科技股份有限公司 | Welding device for semiconductor components |
| CN103639558A (en) * | 2013-12-12 | 2014-03-19 | 哈尔滨工业大学 | Thermal-ultrasonic-electromagnetic field combination reflow soldering method |
| CN105072823A (en) * | 2015-08-10 | 2015-11-18 | 浙江佳明天和缘光伏科技有限公司 | Reflow soldering process of surface-mount electronic component |
| CN206415743U (en) * | 2017-01-13 | 2017-08-18 | 上海朗仕电子设备有限公司 | Ultrasonic wave microseism equipment for Reflow Soldering |
-
2017
- 2017-01-13 CN CN201710025766.9A patent/CN108296592A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101396751A (en) * | 2007-09-27 | 2009-04-01 | 比亚迪股份有限公司 | Solder-reflow soldering method |
| US20100006624A1 (en) * | 2008-07-10 | 2010-01-14 | Hitachi, Ltd. | Soldering method and soldering apparatus |
| CN202169426U (en) * | 2011-05-10 | 2012-03-21 | 扬州扬杰电子科技股份有限公司 | Welding device for semiconductor components |
| CN103639558A (en) * | 2013-12-12 | 2014-03-19 | 哈尔滨工业大学 | Thermal-ultrasonic-electromagnetic field combination reflow soldering method |
| CN105072823A (en) * | 2015-08-10 | 2015-11-18 | 浙江佳明天和缘光伏科技有限公司 | Reflow soldering process of surface-mount electronic component |
| CN206415743U (en) * | 2017-01-13 | 2017-08-18 | 上海朗仕电子设备有限公司 | Ultrasonic wave microseism equipment for Reflow Soldering |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1931183A2 (en) | Electronic device | |
| CN106604564A (en) | Surface mounting method for printed circuit board | |
| CN104507271A (en) | Plug-in component technology and surface mount technology combination based PCBA (printed circuit board assembly) machining method and PCBA | |
| CN102818689B (en) | Board-level circuit General clamp for vibration test device | |
| WO2003003455A3 (en) | Using the wave soldering process to attach motherboard chipset heat sinks | |
| CN206415743U (en) | Ultrasonic wave microseism equipment for Reflow Soldering | |
| CN207534127U (en) | A kind of ic core welding device | |
| WO2007074594A1 (en) | Soldering mounting structure, production method and device for the same, electronic apparatus, and wiring board | |
| CN105234516A (en) | Reflow soldering process for electronic component printed circuit board | |
| CN103108498A (en) | Method of placing parts on printed circuit board (PCB) circuit board surfaces | |
| CN108296592A (en) | Ultrasonic wave microseism equipment for Reflow Soldering | |
| CN105234517B (en) | The saturating welding hole of double-sided PCB board welds saturating tin method | |
| US20130248237A1 (en) | Printed circuit board | |
| TW201628748A (en) | Damping and isolating vibration during ultrasonic welding | |
| CN203895415U (en) | Device for detecting bond force | |
| CN103957663A (en) | Hollow-welding-column perpendicular interconnection structure of assembled plates and manufacturing method | |
| CN105120602A (en) | Small and medium-sized PCB components mixed installing technology | |
| CN206479857U (en) | Cooling control system is processed based on SMT pasters | |
| CN205546222U (en) | Reflow soldering template, Stencil assembly and solder paste printing process device | |
| CN206952317U (en) | Wave soldering carrier | |
| CN207573735U (en) | A kind of through-hole tin cream fills chromatography tooling | |
| CN106535498A (en) | Circuit board patch welding method for LED lamp | |
| CN105323982A (en) | Welding technology and protective jig for mix-assembled printed circuit board | |
| CN204657871U (en) | A kind of pin vibratory sieve | |
| TWI274618B (en) | Method for fine tuning circuit and controlling impedance with laser process |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |