TWI274618B - Method for fine tuning circuit and controlling impedance with laser process - Google Patents

Abstract

A method for actively controlling he fine-tuning and impedance matching using a laser process is provided, including the use of a laser process equipment, a monitor device, and a feedback controller. The laser process equipment is for performing laser soldering or laser etching. The monitor device is for monitoring the target metrics of the target circuits. The feedback controller is for receiving the feedback from the monitor device and issuing control signals to the laser process equipment. The method includes the following steps: (a) loading the target high frequency circuit to the laser process equipment for laser process; (b) monitoring the impedance of the circuit or the transmission/reflection signals and outputting a measured value; (c) determining whether the measured value equal to target value, computing an error signal as the difference between measured value and target value; if not, sending control signals to laser process equipment according to the error signal and proceeding to step (d), otherwise, proceeding to step (e); (d) performing the laser process on the target circuit according to the control signal, returning to step (c); and (e) unloading the target high frequency circuit from the laser process equipment.

Description

1274618 IX. Description of the Invention: [Technical Field] The present invention relates to a method for adjusting a high frequency circuit, and more particularly to a method for finely adjusting a high frequency circuit and impedance matching using a laser technique. [Prior Art]

In high-frequency circuits, impedance matching has a decisive influence on the quality of the transmitted signal. The ohmic impedance is the effect of signal transmission or reflection on a particular frequency. When the green at high frequencies is a 6-shaped impedance mismatch, the phase or amplitude of the signal may be distorted and even cause distortion in the time domain. In other words, impedance matching determines whether the transmission of the signal reaches the target quality. This phenomenon is especially important at high frequencies, for example, related products for optical communication. The package size of the first or second diode is large, and the difference caused by soldering at large volume is difficult to control, which also has an adverse effect on impedance matching, especially when the operating frequency is higher than 2.5 Gbps. U.S. Patent 4,381,441 discloses a method of modifying the sheet resistance to determine its resistance. On the other hand, laser technology is widely used in many semiconductor processes, such as 'Laser s〇ldering' and laser remnants such as (10) (4). The welding is a high-precision, high-surface, high-elastic processing method. Its biggest advantage is its ability to concentrate its heat. Another _ aspect, Lei d: 6 I274618 Shot etching is an environmentally friendly, highly flexible, low-cost processing method. U.S. Patent 5,742,025 discloses a method of using laser technology for the fabrication of flexible circuit boards. Since impedance matching is extremely important for frequency-frequency applications, it is necessary to develop an active and interactive impedance method that can accommodate sophisticated high-frequency lines. Due to the extremely precise laser technology, how to apply laser technology to the fine-tuning and impedance matching of high-frequency lines is an important issue. SUMMARY OF THE INVENTION The main object of the present invention is to provide a method that can be used for high frequency circuit trimming and impedance matching control. To achieve this goal, the first method of the present invention uses a direct measurement signal to fine-tune the laser to achieve impedance matching. The method of circuit adjustment and impedance control of the laser processing of the present invention uses a laser processing apparatus, a monitoring device, and a feedback controller. The laser processing equipment is used for laser welding or laser etching. The laser processing apparatus of the present invention is not limited to any particular form, and may be, for example, a high power diode or a Nd:YAG/Nd:YV04 laser or a frequency doubling laser thereof. The monitor is used to monitor the electrical characteristics of one of the circuits, such as impedance 戋 gas transmission and reflection values. The monitoring device of the present invention is not limited to any particular form, and may be, for example, an impedance measuring meter. The feedback controller is configured to receive the signal from the side monitoring device and generate a control signal to control the laser process of the laser processing device 7 1274618. The daily feedback control is fixed in any particular form, for example, a personal computer (pc). The method for circuit adjustment and impedance control of the laser processing of the present invention comprises the following steps: (4) placing a high frequency circuit on the laser processing device, (6) monitoring the impedance value of the high frequency circuit, and rotating the hard resistance value, (6) Determining whether the impedance value reaches the target impedance value, and calculating the difference value. If the target value has been reached, proceed to step (e), otherwise, 'send control signal to the laser processing device according to the difference value' and perform step (4), (4) performing field processing according to the control signal and returning to step (c), and (6) taking the line out of the laser processing apparatus to complete the process. For a more detailed understanding of the object, function and structural features of the present invention, the embodiment can be described with reference to the following: [Embodiment] Please refer to the first figure. The first figure shows the laser processing circuit of the present invention. The active laser processing system used in the method of peripheral and k-control includes a laser processing apparatus 110, a monitoring device 120, and a feedback controller 13A. The laser processing equipment is used for laser welding or laser remanufacturing. The laser processing apparatus of the present invention is not limited to any particular form, and may be, for example, a high power diode or a Nd:YAG/Nd:YV04 laser or a frequency doubling laser thereof. The monitoring device 120 is used to monitor electrical characteristics of one of the circuits, such as impedance or signal transmission and reflection values. The monitoring device 120 of the present invention is not limited to any particular form, and may be, for example, an impedance measuring meter. The feedback controller 13 is configured to receive signals from the monitoring device and generate control signals to control the laser processing of the laser processing device. The feedback control 130 of the present invention is not limited to any particular form, and may be, for example, a personal computer (pC). When the high-frequency circuit m is placed in the system for laser processing, correct

Please check the = value of the target signal of the high frequency circuit 1G1. If the impedance value has reached the target impedance value, the job beam processing system is light. Otherwise, a control signal is sent to the laser processing apparatus 11 for laser processing based on the difference between the gradually obtained impedance value and the target impedance value. Repeat this monitoring and processing, and the impedance value of the straight ride has reached the target impedance value before the laser processing process ends. The laser processing apparatus 110 can perform laser welding or mine machining. For laser welding, it can be used for the impedance of the old-age road. The control signals can be laser power, pulse length, point size, wavelength and repetition rate. For Ray engraving, the impedance can be fine-tuned for the pedestal and the high-frequency lines on the printed circuit board. The control signals can be spike 1 force rate, pulse length, point size, wavelength, and repetition rate. σ月茶考第—图. The second figure shows the flow of the laser processing belt of the present invention = adjustment and impedance control method. The laser of the turn is added = 2〇1 ^ 1274618 In the loading pain circuit, the high frequency circuit 1Q1 is placed on the laser processing apparatus n〇. In the target signal of the monitoring high frequency circuit of step 202, the monitoring device 120 monitors the impedance value of the target signal of the high frequency circuit 101 and outputs the impedance value. In step 2〇3, check whether the impedance value reaches a target resistance value, and the right has reached the target impedance value, proceed to step 205; otherwise, calculate the difference between the measured impedance value and the target impedance value, According to the difference value, the control is sent to the processing equipment. And the laser processing port further prepares 110 for laser processing according to the control signal, as shown in step 2〇4. After processing, return to step 2G2. In the step of moving, the pain circuit conforming to the target impedance value is taken out from the laser processing apparatus UQ to complete the process. In step 202, 203, 204, a repeating loop is formed until the impedance value of the measurement is secreted to the target impedance value. The #射加王 in step 204 can be laser welding or laser rhyme. For laser welding, the impedance of the solder line on the high-frequency line can be fine-tuned. The control signals can be laser power, pulse length, point size, wavelength, and repetition rate. In the preferred embodiment of the present invention, the laser power is about 10w', which can be 5W~5QW. The female is about n in length and can range from 2 〇 ms to 2 s. The diameter of the point is approximately the same. 5 coffee, the range can be 1mm 1mm. The wavelength is 8 〇 8 nm or 1 〇 64 nm. The repetition rate can be (3) or about 1', which ranges from about cw_5 〇 kHz.

10 1274618 For laser engraving, it can be used for the high-frequency line on the die base and the printed circuit board. The control position can be the power, pulse length, wavelength and repetition rate. In a preferred embodiment of the invention, the J. bee power is about 1 〇 kW' and can range from M to 100 kW. The pulse length is about 10 ns, and the range can be 〇〇. The diameter of the point is about 〇55mm Wei Wei can be 〇. The wavelength is touch (10) or 1 〇 64 nm. The repetition rate is approximately 10 kHz and ranges from approximately 1 kHz to 50 kHz. Through the above embodiments of the present invention, compared with the prior art, the present invention has the following advantages: m: the method in the measurement, micro-trimming by laser technology, can compensate for process differences, and greatly improve the quality. The purpose of impedance matching. . 2. The laser processing process is a high-precision, high-elastic processing process that meets the requirements of low cost and environmental protection. Therefore, the method for circuit adjustment and impedance control of the laser processing of the present invention can truly utilize the skill of the dew to achieve the purpose and effect of the riding, and to pay for the novelty, advancement and succinct requirements of the invention patent. . The illustrations and descriptions disclosed in the above are merely preferred embodiments of the invention, and are not intended to limit the implementation of the invention, and those skilled in the art are in accordance with the spirit of the invention. Changes or modifications shall be covered in the scope of the patents listed below. 1274618 BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a schematic diagram of an active laser processing system used in the method of circuit adjustment and impedance control of laser processing of the present invention. The second figure is a flow chart of the method for circuit adjustment and impedance control of the laser processing of the present invention. [Main component symbol description] 101 Southern frequency circuit 10 Laser processing equipment 120 Monitoring device 130 Feedback controller

Claims (1)

1274618 / X. The scope of application for patents: 1. The method of circuit adjustment and impedance control of a laser-assisted laser is to use a laser processing equipment, a monitoring device, and a back-to-back controller. The method includes: a) placing a high frequency circuit on the laser processing equipment; (b) monitoring the impedance value of the high frequency circuit and outputting the impedance value; (c) determining whether the residual resistance value is turned over the target impedance value, and calculating the difference value If it has reached the goal, go to step (e). Otherwise, according to the difference value, send the control signal to the laser processing equipment and perform step (4); (4) perform laser processing according to the control signal, and return Go to step (c); and (6) take the line out of the laser processing equipment to complete the process. 2. The method of claim i, wherein the laser processing apparatus is a south power diode laser. 3. The method of claim 3, wherein the #shooting equipment is a Nd:YAG/Nd:YV04 laser or a frequency doubled laser thereof. 4. The method of claim 1, wherein the monitoring device is an impedance measurement meter. 5. If you apply for the method described in the section of the special fiber, the controller of the town is a personal computer. 6. The method of claim i, wherein the laser processing process is laser welding. 7. The method of claim 6, wherein the control signal comprises a laser power, a pulse length, a point size, a wavelength, and a repetition rate. 13 1274618 - / 8. The method of claim 1, wherein the laser processing system is laser etched. 9. The method of claim 8 wherein the control signal comprises peak power, pulse length, dot size, wavelength, and repetition rate. 14