CN206415743U - Ultrasonic wave microseism equipment for Reflow Soldering - Google Patents
Ultrasonic wave microseism equipment for Reflow Soldering Download PDFInfo
- Publication number
- CN206415743U CN206415743U CN201720040905.0U CN201720040905U CN206415743U CN 206415743 U CN206415743 U CN 206415743U CN 201720040905 U CN201720040905 U CN 201720040905U CN 206415743 U CN206415743 U CN 206415743U
- Authority
- CN
- China
- Prior art keywords
- ultrasonic wave
- wiring board
- reflow soldering
- vibration
- clamping device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model is related to a kind of ultrasonic wave microseism equipment for Reflow Soldering, including：Circuit board clamping device, for clamping wiring board；Vibration of ultrasonic wave source, is connected with circuit board clamping device, for producing ultrasonic wave, the bubble effusion in the ultrasonic exciting wiring board solder joint；Ultrasonic wave conducts adjusting means, is connected with vibration of ultrasonic wave source, for adjusting conduction to the ultrasonic wave on wiring board.Compared with prior art, the utility model utilizes ultrasonic wave high-frequency vibration in the presence of ultrasonic wave, to be automatically drained out, do not end up inside solder joint by the micro-bubble inside solder joint, realizes real high-quality welding, is preferably applicable the demand in market.
Description
Technical field
The utility model is related to a kind of welding corollary equipment, is set more particularly, to a kind of ultrasonic wave microseism for Reflow Soldering
It is standby.
Background technology
Reflow soldering is by providing a kind of heating environment, to make solder(ing) paste is heated to melt to allow surface-pasted component
The equipment being reliably combined together by solder(ing) paste alloy with circuit board.Reflow soldering is electronics manufacturing surface mounting technology
Key equipment, its quality and directly influence the qualities of final products using operation, and welding process is once complete, if
Repairing defective solder joint, component or circuit board will become extremely complex, costly.
As the development of surface mounting technology and technique is more and more ripe, client also constantly proposes new want to reflow soldering
Ask, reflow soldering is not required nothing more than can complete the welding of component in high quality, and to equipment capacity and corrective maintenance in terms of
Higher and faster requirement is proposed, the maximization of economic benefit is pursued.Because component is increasingly minimized, solder joint is also increasingly
Small, the requirement of welding quality is with regard to more and more higher.In normal reflux welding, substantial amounts of micro-bubble is often had inside solder joint
In the presence of these micro-bubbles form cavity one by one, reduce welding quality, also have impact on the use longevity of final wiring board
Life.
Utility model content
The purpose of this utility model is exactly the defect in order to overcome above-mentioned prior art presence and provides a kind of for flowing back
The ultrasonic wave microseism equipment of weldering.
The purpose of this utility model can be achieved through the following technical solutions：
A kind of ultrasonic wave microseism equipment for Reflow Soldering, including：
Circuit board clamping device, for clamping wiring board；
Vibration of ultrasonic wave source, is connected with circuit board clamping device, for producing ultrasonic wave, ultrasonic exciting wiring board weldering
Bubble effusion in point；
Ultrasonic wave conducts adjusting means, is connected with vibration of ultrasonic wave source, for adjusting conduction to the ultrasonic wave on wiring board.
The circuit board clamping device includes being provided with fixed side base and clamper, the fixed side base to be inserted for wiring board
The interpolation slit entered, the wiring board is inserted into after the interpolation slit by the gripper.
The length of the interpolation slit is consistent with the length of fixed side base.
The ultrasonic wave conduction adjusting means includes being used to ultrasonic wave is conducted into the conduction mechanism to wiring board and is used for
Adjust the adjuster of ultrasound conductivity, the conduction mechanism and adjuster are connected with each other, the conduction mechanism also with ultrasonic wave
Vibroseis is connected.
The ultrasonic wave microseism equipment also includes the conveyer for transmission lines plate, and the conveyer is located at ultrasonic wave
The circuit board clamping device side of vibroseis.
Compared with prior art, the utility model has advantages below：
1) ultrasonic wave high-frequency vibration is utilized in the presence of ultrasonic wave, to be automatically drained out, no by the micro-bubble inside solder joint
Remain in inside solder joint, realize real high-quality welding, be preferably applicable the demand in market.
2) circuit board clamping device clamps wiring board using interpolation slit, easy to use.
3) length of interpolation slit is consistent with the length of fixed side base, it is possible to achieve lateral slide of wiring board is inserted, beneficial to automation.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model；
Wherein：1st, fixed side base, 2, clamper, 3, vibration of ultrasonic wave source, 4, conduction mechanism, 5, adjuster, 11, interpolation slit.
Embodiment
The utility model is described in detail with specific embodiment below in conjunction with the accompanying drawings.The present embodiment is with the utility model
Implemented premised on technical scheme, give detailed embodiment and specific operating process, but guarantor of the present utility model
Shield scope is not limited to following embodiments.
A kind of ultrasonic wave microseism equipment for Reflow Soldering, as shown in figure 1, including：
Circuit board clamping device, for clamping wiring board, can be reliable and stable receive ultrasonic wave, in small vibrations
Under, the micro-bubble on wiring board inside all solder joints can be discharged, and element does not deviate in itself；
Vibration of ultrasonic wave source 3, is connected with circuit board clamping device, for producing ultrasonic wave, constantly, reliable and stable,
Bubble effusion in the ultrasonic exciting wiring board solder joint；
Ultrasonic wave conducts adjusting means, is connected with vibration of ultrasonic wave source 3, for adjusting conduction to the ultrasound on wiring board
Ripple.
Circuit board clamping device includes being provided with what is inserted for wiring board in fixed side base 1 and clamper 2, fixed side base 1
Interpolation slit 11, wiring board is inserted into after interpolation slit 11 to be clamped by clamper 2.
The length of interpolation slit 11 is consistent with the length of fixed side base 1.
Ultrasonic wave conduction adjusting means includes being used for ultrasonic wave is conducted into conduction mechanism 4 to wiring board and for adjusting
The adjuster 5 of ultrasound conductivity, conduction mechanism 4 and adjuster 5 are connected with each other, and conduction mechanism 4 also connects with vibration of ultrasonic wave source 3
Connect, matching regulation can be carried out according to the size of the different wiring boards of client, be applicable different applications.
Ultrasonic wave microseism equipment also includes the conveyer (not shown) for transmission lines plate, and the conveyer is located at super
The circuit board clamping device side in acoustic wave vibrations source 3 is simultaneously connected with wiring board, and the device has independent power and programme-control,
Realize stepping and operable control.When wiring board is handled in ultrasonic wave, what the conveyer was off, when welding knot
Beam, hermatic door is opened, and wiring board is transported to rear road, is further processed by the conveyer.
Claims (5)
1. a kind of ultrasonic wave microseism equipment for Reflow Soldering, it is characterised in that including：
Circuit board clamping device, for clamping wiring board；
Vibration of ultrasonic wave source (3), is connected with circuit board clamping device, for producing ultrasonic wave, ultrasonic exciting wiring board weldering
Bubble effusion in point；
Ultrasonic wave conducts adjusting means, is connected with vibration of ultrasonic wave source (3), for adjusting conduction to the ultrasonic wave on wiring board.
2. a kind of ultrasonic wave microseism equipment for Reflow Soldering according to claim 1, it is characterised in that the wiring board
Clamping device includes being provided with the interpolation slit inserted for wiring board on fixed side base (1) and clamper (2), the fixed side base (1)
(11), the wiring board is inserted into after the interpolation slit (11) is clamped by the clamper (2).
3. a kind of ultrasonic wave microseism equipment for Reflow Soldering according to claim 2, it is characterised in that the interpolation slit
(11) length is consistent with the length of fixed side base (1).
4. a kind of ultrasonic wave microseism equipment for Reflow Soldering according to claim 1, it is characterised in that the ultrasonic wave
Conduction adjusting means includes being used for ultrasonic wave is conducted into conduction mechanism to wiring board and for adjusting ultrasound conductivity
Adjuster, the conduction mechanism and adjuster are connected with each other, and the conduction mechanism is also connected with vibration of ultrasonic wave source (3).
5. a kind of ultrasonic wave microseism equipment for Reflow Soldering according to claim 1, it is characterised in that the ultrasonic wave
Microseism equipment also includes the conveyer for transmission lines plate, and the conveyer is located at the wiring board of vibration of ultrasonic wave source (3)
Clamping device side is simultaneously connected with wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720040905.0U CN206415743U (en) | 2017-01-13 | 2017-01-13 | Ultrasonic wave microseism equipment for Reflow Soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720040905.0U CN206415743U (en) | 2017-01-13 | 2017-01-13 | Ultrasonic wave microseism equipment for Reflow Soldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206415743U true CN206415743U (en) | 2017-08-18 |
Family
ID=59572538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720040905.0U Active CN206415743U (en) | 2017-01-13 | 2017-01-13 | Ultrasonic wave microseism equipment for Reflow Soldering |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206415743U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108296592A (en) * | 2017-01-13 | 2018-07-20 | 上海朗仕电子设备有限公司 | Ultrasonic wave microseism equipment for Reflow Soldering |
-
2017
- 2017-01-13 CN CN201720040905.0U patent/CN206415743U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108296592A (en) * | 2017-01-13 | 2018-07-20 | 上海朗仕电子设备有限公司 | Ultrasonic wave microseism equipment for Reflow Soldering |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102711391B (en) | High-efficiency soldering process of circuit board connector | |
| CN108337821B (en) | A kind of welding method of circuit board | |
| CN106604564A (en) | Surface mounting method for printed circuit board | |
| CN104159414A (en) | Circuit board assembly method | |
| CN103796446A (en) | High-efficiency manufacturing method of large-scale array type photoelectric transmit-receive sensor | |
| CN206415743U (en) | Ultrasonic wave microseism equipment for Reflow Soldering | |
| CN101257062A (en) | Method for preparing solar energy cell assembly with printed circuit paster technique | |
| CN105234517B (en) | The saturating welding hole of double-sided PCB board welds saturating tin method | |
| CN105234516A (en) | Reflow soldering process for electronic component printed circuit board | |
| CN208289211U (en) | Servo motor driven ultrasonic metal welding machine | |
| US20130248237A1 (en) | Printed circuit board | |
| CN108296592A (en) | Ultrasonic wave microseism equipment for Reflow Soldering | |
| CN112379134A (en) | Aluminum alloy small-caliber deep-cavity inner surface weldability test fixture | |
| CN204449554U (en) | A kind of board unit Reflow Soldering positioning tool | |
| CN105120602A (en) | Small and medium-sized PCB components mixed installing technology | |
| CN111774682B (en) | Welding method for special-shaped porous printed board | |
| CN205546222U (en) | Reflow soldering template, Stencil assembly and solder paste printing process device | |
| CN101652031B (en) | Method for reliably connecting bridge printed circuit boards of optical transceivers and positioning component | |
| CN103957663A (en) | Hollow-welding-column perpendicular interconnection structure of assembled plates and manufacturing method | |
| CN106535498A (en) | Circuit board patch welding method for LED lamp | |
| CN204721718U (en) | A kind of pad structure reducing Reflow Soldering Component Displacement | |
| CN207820470U (en) | A kind of novel PCB cuts foot jig | |
| CN204867914U (en) | Welding clamp | |
| CN219305136U (en) | ACF attaching clamp with single-sided adjustment | |
| CN112135424A (en) | High-frequency mixed-voltage circuit board and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |