CN202169426U - Welding device for semiconductor components - Google Patents
Welding device for semiconductor components Download PDFInfo
- Publication number
- CN202169426U CN202169426U CN201120145623XU CN201120145623U CN202169426U CN 202169426 U CN202169426 U CN 202169426U CN 201120145623X U CN201120145623X U CN 201120145623XU CN 201120145623 U CN201120145623 U CN 201120145623U CN 202169426 U CN202169426 U CN 202169426U
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- China
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- worktable
- semiconductor components
- welding device
- ultrasonic transducer
- components
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Abstract
A welding device for semiconductor components relates to an improvement for the structure of a soldering device. Fine air gaps in fusion soldering are combined and can be discharged from solder. The welding device comprises the following components: a vacuum chamber, a worktable which is provided in the vacuum chamber, and a plurality of fixed-position welding molds for placing the semiconductor components. The worktable is provided in the vacuum chamber through an elastic bracket. The welding device further comprises an ultrasonic transducer which is provided at one side edge of the worktable. According to the welding device for the semiconductor components, the worktable is changed to a floating type connection mode, namely high-frequency (19.5-35KHz) mechanical vibration of the worktable is allowed. An edge of the worktable is provided with the ultrasonic transducer. After the ultrasonic transducer receives the energy of the ultrasonic wave, the worktable is driven for performing high-frequency small-amplitude vibration. The fine gaps in the fused soldering tin will be combined to larger air gaps under mechanical vibration and are finally discharged. According to the welding device for the semiconductor components, the components can be welded together with high reliability, and the quality of the finished components can be greatly improved.
Description
Technical field
The utility model relates to the welder of a kind of semiconductor, electronic devices and components, relates in particular to the improvement of soldering welder structure.
Background technology
Electronic devices and components, semiconductor components and devices generally are to adopt scolding tin to weld, and when batch is big, are that plurality of chips, scolder (scolding tin), pole piece etc. are placed on the workbench through location welding mould; Then, workbench integral body is placed in the heating furnace heats, after scolding tin melts, realize the fixed connection between the part.But when reality is used, find to have small air gap in the scolding tin, finally can cause the reduction of welding quality.So the applicant has set up the vacuum storehouse, be about to workbench and be placed in the vacuum storehouse, again vacuum storehouse integral body is inserted soldering furnace, utilize heat radiation that scolding tin is melted.This has significantly reduced the bubble in the scolding tin, has improved the quality of product.
But along with the further raising of present user to the semiconductor components and devices performance requirement, we find only to rely on the vacuum storehouse to be difficult to get rid of in the scolding tin more small, can't overcome the microgap that melts scolding tin tension force.And although very little to the components and parts Effect on Performance, still there is the quality flaw in the existence of these microgaps after all.
The utility model content
The utility model provides a kind of and can make small air gap " merging " in the fusion scolding tin to above problem, and then the welder of the semiconductor components and devices that can from scolder, discharge.
The technical scheme of the utility model is: comprise the vacuum storehouse, be arranged on workbench and some location welding moulds that is used to place said semiconductor components and devices in the vacuum storehouse, said workbench is arranged in the said vacuum storehouse through elastic support; Also comprise ultrasonic transducer, said ultrasonic transducer is arranged on the side of said workbench.
Also comprise supersonic generator, said supersonic generator is arranged in the said vacuum storehouse, links to each other with said ultrasonic transducer.
Also comprise supersonic generator; Said supersonic generator is arranged on outside the said vacuum storehouse; On said vacuum bulkhead, flexibly connect the bar that is useful on the conduction ultrasonic energy, the two ends of said bar link to each other with said ultrasonic transducer respectively at said supersonic generator.
The utility model at first changes workbench into floating type connection mode, promptly allows workbench can do the mechanical oscillation of high frequency (frequency 19.5-35KHz); Then, ultrasonic transducer is set, after transducer receives ultrasonic energy, promptly drives workbench and do high frequency, vibration a little at the ora terminalis of workbench; At last, the microgap in the scolding tin of fusion, under aforementioned mechanical oscillation, meeting " merging " is bigger air gap, the final discharge.The utility model is welded as a whole with making each parts high reliability, and then increases substantially the quality of finished product components and parts.
Description of drawings
Fig. 1 is the structural representation of the utility model,
Fig. 2 is the structural representation of heating furnace in the utility model,
1 is the vacuum storehouse among the figure, the 2nd, and Cang Gai, the 3rd, ultrasonic transducer, the 4th, workbench, the 5th, elastic support, the 6th, location welding mould, the 7th, heating furnace.
The specific embodiment
The utility model is as shown in Figure 1, comprises vacuum storehouse 1, is arranged on workbench 4 and some location welding moulds 6 that is used to place said semiconductor components and devices in the vacuum storehouse 1, and said workbench 4 is arranged in the said vacuum storehouse 1 through elastic support 5; Also comprise ultrasonic transducer 3, said ultrasonic transducer 3 is arranged on the side of said workbench 4.
First kind of scheme that supersonic generator is set of the utility model is: said supersonic generator is arranged in the said vacuum storehouse 1, links to each other with said ultrasonic transducer 3.
Second kind of scheme that supersonic generator is set of the utility model is: said supersonic generator is arranged on outside the said vacuum storehouse; On said vacuum bulkhead, flexibly connect the bar that is useful on the conduction ultrasonic energy, the two ends of said bar link to each other with said ultrasonic transducer respectively at said supersonic generator.
The utility model when work, insert components and parts in the location welding mould 6 after, close storehouse lid 2, vacuumize; Then, vacuum storehouse 1 integral body is inserted in the heating furnace 7, after temperature reaches the scolding tin melt temperature, opened ultrasonic unit, make workbench 4 dithers, can reduce the air gap in the scolding tin effectively.
Claims (3)
1. the welder of semiconductor components and devices comprises the vacuum storehouse, is arranged on workbench and some location welding moulds that is used to place said semiconductor components and devices in the vacuum storehouse, it is characterized in that said workbench is arranged in the said vacuum storehouse through elastic support; Also comprise ultrasonic transducer, said ultrasonic transducer is arranged on the side of said workbench.
2. the welder of semiconductor components and devices according to claim 1 is characterized in that, also comprises supersonic generator, and said supersonic generator is arranged in the said vacuum storehouse, links to each other with said ultrasonic transducer.
3. the welder of semiconductor components and devices according to claim 1; It is characterized in that; Also comprise supersonic generator; Said supersonic generator is arranged on outside the said vacuum storehouse, on said vacuum bulkhead, flexibly connects the bar that is useful on the conduction ultrasonic energy, and the two ends of said bar link to each other with said ultrasonic transducer respectively at said supersonic generator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120145623XU CN202169426U (en) | 2011-05-10 | 2011-05-10 | Welding device for semiconductor components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120145623XU CN202169426U (en) | 2011-05-10 | 2011-05-10 | Welding device for semiconductor components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202169426U true CN202169426U (en) | 2012-03-21 |
Family
ID=45827631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120145623XU Expired - Lifetime CN202169426U (en) | 2011-05-10 | 2011-05-10 | Welding device for semiconductor components |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202169426U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108296592A (en) * | 2017-01-13 | 2018-07-20 | 上海朗仕电子设备有限公司 | Ultrasonic wave microseism equipment for Reflow Soldering |
-
2011
- 2011-05-10 CN CN201120145623XU patent/CN202169426U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108296592A (en) * | 2017-01-13 | 2018-07-20 | 上海朗仕电子设备有限公司 | Ultrasonic wave microseism equipment for Reflow Soldering |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120321 |
|
| CX01 | Expiry of patent term |