CN206795017U - A kind of welder of micro-channel heat sink for semi-conductor laser lamination - Google Patents
A kind of welder of micro-channel heat sink for semi-conductor laser lamination Download PDFInfo
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- CN206795017U CN206795017U CN201720166480.8U CN201720166480U CN206795017U CN 206795017 U CN206795017 U CN 206795017U CN 201720166480 U CN201720166480 U CN 201720166480U CN 206795017 U CN206795017 U CN 206795017U
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- heat sink
- lamination
- electrode block
- top electrode
- bottom electrode
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Abstract
The utility model embodiment provides a kind of welder of micro-channel heat sink for semi-conductor laser lamination, by the way that heat sink lamination is clamped between Top electrode block and bottom electrode block, power supply, Top electrode block, bottom electrode block and the heat sink lamination of clamping is set to form loop, loading current is in loop, due to having larger contact resistance on the contact surface between heat sink lamination, according to Joule's law Q=I2Rt produces Joule heat to carry out being heated to molten condition or mecystasis, illustrates to form metal combination between heat sink lamination, has reached the purpose of welding.Also, resistance heat is produced quickly after being powered, so as to improve production efficiency.In addition, the utility model embodiment is fixed heat sink lamination by Top electrode block, bottom electrode block, boss and alignment pin so that heat sink lamination keeps smooth state, is heated evenly, and then make it that welding is uniform.Therefore, the utility model embodiment solves existing welding manner and welds uneven, heat time length, the technical problem of low production efficiency.
Description
Technical field
It the utility model is related to micromachined field, more particularly to a kind of micro-channel heat sink for semi-conductor laser lamination
Welder.
Background technology
High-power semiconductor laser is widely used in industry, medical treatment, military and display field, and as it should
With the gradual extension of scope, the requirement of the Output optical power of noise spectra of semiconductor lasers also more and more higher, this also brings height accordingly
Dissipated power.If eliminating the heat converted by dissipated power not in time, certainly will cause certainly will cause junction temperature to raise, so as to
Raise the threshold current of laser, efficiency reduces, and serious temperature drift occurs for optical maser wavelength, and more fatal is the life-span for making laser
Decline.The micro-channel heat sink of the mainly liquid cooling to be radiated at present applied to high-power semiconductor laser.
The micro-channel heat sink of liquid cooling is typically to be made up of five layers of thin slice to come in every shape, as shown in Figure 1.Five layers of thin slice
It can generally be obtained by the methods of wire cutting, electrochemical etching, being then welded into an inside has the heat sink of microchannel.But
The welding quality of five layers of thin slice it is difficult to ensure that, therefore the welding technique to preparing the micro-channel heat sink with good welds quality proposes
Demand.
Welding the method for heat sink thin slice mainly includes diffusion welding (DW) and vacuum brazing etc..
The principle of diffusion welding (DW) makes mother metal close to each other with closing material as shown in Fig. 2 under certain temperature and pressure effect,
Locally it is plastically deformed, phase counterdiffusion is produced between atom, new diffusion layer is formed in interface, so as to realize what is be reliably connected
Process.
Process of Vacuum Brazing general principle using metal material more low-melting than mother metal as shown in figure 3, in a vacuum furnace, made
Solder, by weldment and solder heat to solder fusing point is higher than, less than mother metal melting temperature, mother metal is soaked using liquid solder, is filled out
The method filled play movement and connection weldment is realized with the counterdiffusion of mother metal phase.
Diffusion welding (DW) thermal cycle times are grown, and productivity ratio is low.Because itself be lean on atom between diffuse to form metallic bond, from
And connection is realized, the cycle is long, and not necessarily uniform and stable.
Vacuum brazing is prepared by face of weld and matching requirements are higher, requires particularly severe to mating surface.It is disposable to throw
Enter bigger, maintenance cost is very high.Before soldering forvacuum and cooling when need to take a significant amount of time, heat in a vacuum
Transmit it is relatively difficult, therefore the production cycle grow.
Therefore, either diffusion welding (DW) or vacuum brazing, production requirement can not all be met, and welding may be uneven,
The problems such as causing rosin joint, dry joint.Furthermore these welding manner heat times are grown, low production efficiency, cost is high.
In summary, existing welding manner welding is uneven, and heat time length, low production efficiency, cost is high, causes not
It is those skilled in the art's technical issues that need to address that production requirement, which can be met,.
Utility model content
The utility model embodiment provides a kind of welder of micro-channel heat sink for semi-conductor laser lamination, for solving
Certainly existing welding manner welding is uneven, and heat time length, low production efficiency, cost is high, causes that production requirement can not be met
Technical problem.
A kind of welder for micro-channel heat sink for semi-conductor laser lamination that the utility model embodiment provides, including：
Heat sink lamination, Top electrode block, bottom electrode block, power supply, detection module；
The heat sink lamination is clamped between the Top electrode block and the bottom electrode block；
The power supply connects the Top electrode block and the bottom electrode block, for passing through the Top electrode block and the lower electricity
Pole block loading current is to the heat sink lamination；
The detection module aligns with the heat sink lamination, between the contact surface for detecting the heat sink lamination whether be
Molten condition or mecystasis.
Preferably, the heat sink lamination is specially five layers of heat sink lamination.
Preferably, the utility model embodiment also includes mobile module, servomotor；
The Top electrode block is fixed on the mobile module,
The servomotor connects the mobile module, for by controlling the mobile module movement by the Top electrode
Block is pressed in the heat sink lamination so that the heat sink lamination is clamped between the Top electrode block and the bottom electrode block.
Preferably, the utility model embodiment also includes alignment pin；
The alignment pin is fixedly connected through the heat sink lamination with the bottom electrode block, for the heat sink lamination to be consolidated
Due to the bottom electrode block.
Preferably, the Top electrode block also includes boss；
The boss is arranged at the square boss of the Top electrode block, for withstanding the heat sink lamination.
Preferably, the Top electrode block also includes positioning hole；
The positioning hole is fixedly connected with the alignment pin, for fixing the alignment pin.
A kind of use of the welder for micro-channel heat sink for semi-conductor laser lamination that the utility model embodiment provides
Method, including：
Heat sink lamination is compacted between electrode；
Loading current is to the electrode so that the electric current passes through the heat sink lamination；
Whether be molten condition or mecystasis, if so, then terminating institute if detecting between the contact surface of the heat sink lamination
The loading of electric current is stated, after persistently clamping heat sink lamination preset time, electrode is discharged, takes out heat sink lamination.
Preferably, the electrode includes Top electrode block and bottom electrode block, described that heat sink lamination is compacted between two electrodes
Including：
Heat sink lamination is fixed on by the bottom electrode block by alignment pin；
By Top electrode block described in Serve Motor Control by the heat sink lamination be clamped in the Top electrode block with it is described under
Between electrode block.
Preferably, before the loading current or after the loading current, by servomotor according to default electrode
Preload pressure control the Top electrode block that the heat sink lamination is clamped between the Top electrode block and the bottom electrode block.
Preferably, before the loading current or after the loading current, by connect the power supply of the electrode according to
Default size of current and default conduction time control size of current and the conduction time of the loading current.
As can be seen from the above technical solutions, the utility model embodiment has advantages below：
The utility model embodiment by the way that heat sink lamination is clamped between Top electrode block and bottom electrode block, make power supply, on
Electrode block, bottom electrode block and the heat sink lamination of clamping form loop, and loading current is in loop, due to connecing between heat sink lamination
There is larger contact resistance in contacting surface, according to Joule's law Q=I2Rt produces Joule heat to be heated, and is examined by detection module
Whether it is molten condition or mecystasis between the contact surface of the heavy lamination of calorimetric, if being off loading current, continues in upper electricity
Apply pressure between pole block and bottom electrode block, heat sink lamination is can be taken off after continuing for some time, shape between final heat sink lamination
Into metal combination, the purpose of welding is reached.Also, resistance heat is produced quickly after being powered, so as to improve production efficiency.
In addition, the utility model embodiment is fixed heat sink lamination by Top electrode block, bottom electrode block, boss and alignment pin so that heat
Heavy lamination keeps very smooth state, is heated evenly it, and then make it that welding is uniform.Therefore, the utility model embodiment solution
Having determined, existing welding manner welding is uneven, and heat time length, low production efficiency, cost is high, causes to meet that production will
The technical problem asked.
Brief description of the drawings
, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art
Or the required accompanying drawing used is briefly described in description of the prior art, it should be apparent that, drawings in the following description are only
It is some embodiments of the utility model, for those of ordinary skill in the art, before creative labor is not paid
Put, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the schematic diagram that the utility model embodiment is used to illustrate heat sink lamination；
Fig. 2 is the schematic diagram that the utility model embodiment is used to illustrate diffusion welding (DW)；
Fig. 3 is the schematic diagram that the utility model embodiment is used to illustrate vacuum brazing；
Fig. 4 is a kind of welder for micro-channel heat sink for semi-conductor laser lamination that the utility model embodiment provides
The schematic diagram of one embodiment；
Fig. 5 is a kind of welder for micro-channel heat sink for semi-conductor laser lamination that the utility model embodiment provides
The schematic diagram of another embodiment；
Fig. 6 is a kind of welder for micro-channel heat sink for semi-conductor laser lamination that the utility model embodiment provides
The structure chart of Top electrode block in another embodiment；
Fig. 7 is a kind of welder for micro-channel heat sink for semi-conductor laser lamination that the utility model embodiment provides
The structure chart of bottom electrode block in another embodiment；
Fig. 8 is a kind of welder for micro-channel heat sink for semi-conductor laser lamination that the utility model embodiment provides
The schematic diagram of application method；
Wherein, reference is as follows：
1st, heat sink lamination；2nd, bottom electrode block；3rd, Top electrode block；4th, mobile module；5th, alignment pin；6th, boss；7th, positioning hole.
Embodiment
The utility model embodiment provides a kind of welder of micro-channel heat sink for semi-conductor laser lamination, for solving
Certainly existing welding manner welding is uneven, and heat time length, low production efficiency, cost is high, causes that production requirement can not be met
Technical problem.
, below will knot to enable purpose of utility model of the present utility model, feature, advantage more obvious and understandable
The accompanying drawing in the utility model embodiment is closed, the technical scheme in the embodiment of the utility model is clearly and completely described,
Obviously, the embodiments described below are only the utility model part of the embodiment, and not all embodiment.Based on this reality
With the embodiment in new, those of ordinary skill in the art are obtained all other under the premise of creative work is not made
Embodiment, belong to the scope of the utility model protection.
A kind of referring to Fig. 4, welding for micro-channel heat sink for semi-conductor laser lamination that the utility model embodiment provides
One embodiment of device, including：Heat sink lamination 1, Top electrode block 3, bottom electrode block 2, power supply, detection module；
Heat sink lamination 1 is clamped between Top electrode block 3 and bottom electrode block 2；
Power supply connection Top electrode block 3 and bottom electrode block 2, for passing through Top electrode block 3 and the loading current of bottom electrode block 2 to heat
Heavy lamination 1；
Detection module aligns with heat sink lamination 1, between the contact surface for detecting heat sink lamination 1 whether be molten condition or
Person's mecystasis.
The utility model embodiment by the way that heat sink lamination 1 is clamped between Top electrode block 3 and bottom electrode block 2, make power supply,
Top electrode block 3, bottom electrode block 2 and clamp heat sink lamination 1 formed loop, loading current in loop, due to heat sink lamination 1 it
Between contact surface on have larger contact resistance, according to Joule's law Q=I2Rt produces Joule heat to be heated, and passes through detection
Whether module is molten condition or mecystasis between detecting the contact surface of heat sink lamination 1, if being off loading current, is continued
Apply pressure between Top electrode block 3 and bottom electrode block 2, heat sink lamination 1 is can be taken off after continuing for some time, it is final heat sink folded
Metal combination is formd between piece 1, has reached the purpose of welding.Also, resistance heat is produced quickly after being powered, so as to improve
Production efficiency.In addition, the utility model embodiment will be heat sink folded by Top electrode block 3, bottom electrode block 2, boss 6 and alignment pin 5
Piece 1 is fixed so that heat sink lamination 1 keeps very smooth state, is heated evenly it, and then make it that welding is uniform.Therefore, this reality
Solve that the welding of existing welding manner is uneven, and heat time length, low production efficiency, cost is high, causes with new embodiment
The technical problem of production requirement can not be met.
Above is a kind of welding of the micro-channel heat sink for semi-conductor laser lamination provided the utility model embodiment fills
The one embodiment put is described in detail, below that a kind of semiconductor laser provided the utility model embodiment is micro-
Another embodiment of the welder of passage is heat sink lamination is described in detail.
A kind of referring to Fig. 5, welding for micro-channel heat sink for semi-conductor laser lamination that the utility model embodiment provides
Another embodiment of device, including：Heat sink lamination 1, Top electrode block 3, bottom electrode block 2, power supply, detection module；
Heat sink lamination 1 is clamped between Top electrode block 3 and bottom electrode block 2；
Power supply connection Top electrode block 3 and bottom electrode block 2, for passing through Top electrode block 3 and the loading current of bottom electrode block 2 to heat
Heavy lamination 1；
Detection module aligns with heat sink lamination 1, between the contact surface for detecting heat sink lamination 1 whether be molten condition or
Person's mecystasis.
Heat sink lamination 1 is specially five layers of heat sink lamination 1.
The utility model embodiment also includes mobile module 4, servomotor；
Top electrode block 3 is fixed on mobile module 4,
The mobile module 4 of servomotor connection, for heat sink by controlling mobile module 4 to move to be pressed in Top electrode block 3
Lamination 1 so that heat sink lamination 1 is clamped between Top electrode block 3 and bottom electrode block 2.
The utility model embodiment also includes alignment pin 5；
Alignment pin 5 is fixedly connected through heat sink lamination 1 with bottom electrode block 2, for heat sink lamination 1 to be fixed on into bottom electrode block
2。
Referring to Fig. 7, it should be noted that Fig. 7 is top view, wherein alignment pin 5 is in bottom electrode block 2, figure
The example of three alignment pins 5 or one, two or more alignment pins 5 fix heat sink lamination 1.
Referring to Fig. 6, Top electrode block 3 also includes boss 6；
Boss 6 is arranged at the square boss of Top electrode block 3, for withstanding heat sink lamination 1.
It should be noted that there is Top electrode block 3 one side of boss 6 to be used to withstand heat sink lamination 1.
Top electrode block 3 also includes positioning hole 7；
Positioning hole 7 is fixedly connected with alignment pin 5, for fixed locating stud 5.
It should be noted that positioning hole 7 can be specifically three holes matched to alignment pin 5, when alignment pin 5 is through heat sink
When lamination 1 is fixedly connected with bottom electrode block 2, connection can also be matched with positioning hole 7, in positioning hole 7 corresponding to reeve so that heat
Heavy lamination 1 securely fixes, and now boss 6 clamps heat sink lamination 1 with bottom electrode block 2 so that and heat sink lamination 1 is very smooth, by
Hot uniform and welding is uniform.
The utility model embodiment is directed to welding in the heat sink welding process of lamination 1 may be uneven, causes rosin joint, dry joint etc.
Problem, special electrode block is designed, no matter making it be pressurized or producing resistance heat all evenly；The utility model embodiment utilizes
Resistance heat is welded caused by electric resistance welding, and the heat time is short, and heat ratio is relatively concentrated, and production efficiency is higher, and electric resistance welding
There is no packing material and a protective gas, cost is relatively low.
Mainly using electric resistance welding it is to compress welded piece between two electrodes in the utility model, and passes to electricity
Stream, using electric current flow through work piece interface and close region caused by resistance heat be worked into melting or mecystasis, be allowed to
Form metal to combine, reach the purpose of welding.Can be with by adjusting the parameters such as electrode preload pressure, electrical current, conduction time
Reach the purpose of control lamination welded condition.
Lamination is passed sequentially through alignment pin 5 first and is fixed on bottom electrode block 2 by the utility model embodiment.Pass through servo electricity
The mobile module 4 of machine control drives the Top electrode block 3 with lamination matching size set to move, the preload pressure certain to lamination fastening one
Under, boss 6 withstands lamination, it is completely fixed on bottom electrode block 2, and positioning is more accurate.Then it is powered by power supply, electricity
Source, loop is formed between electrode block, lamination.There is very big connect between contact surface between electrode block and lamination, lamination and lamination
Get an electric shock resistance, using electric current flow through work piece interface and close region caused by resistance heat be worked into melting or mecystasis,
It is allowed to form metal combination, reaches the purpose of welding.By adjusting the parameters such as electrode preload pressure, electrical current, conduction time
The purpose of control lamination welded condition can be reached.Resistance heat is produced after being powered quickly, so as to improve production efficiency.
The characteristics of the utility model embodiment concentrates heat production fast using electric resistance welding heat welds lamination；By power supply and watch
The parameters such as preload pressure, electrical current, conduction time can be accurately controlled by taking motor, can control the size of energy to control
The state of welding；With the supporting electrode of lamination lamination can be made to keep very smooth state in the utility model embodiment, make it
It is heated evenly, improves welding quality.
The utility model embodiment is quickly concentrated by the use of electric resistance welding as machining energy source, heat production, greatly improves lamination
Welding efficiency；For the electrode holder of lamination size design, it is possible to achieve it is accurately positioned, while improves the flatness on surface,
It is heated evenly, improves welding quality；Each electrical parameter and pressure can be controlled by servomotor, power supply etc., ensured more preferable
Welding quality.
Above is a kind of welding of the micro-channel heat sink for semi-conductor laser lamination provided the utility model embodiment fills
The one embodiment put is described in detail, below that a kind of semiconductor laser provided the utility model embodiment is micro-
Another embodiment of the welder of passage is heat sink lamination is described in detail.
A kind of referring to Fig. 8, welding for micro-channel heat sink for semi-conductor laser lamination that the utility model embodiment provides
The application method of device, including：
101：Heat sink lamination is compacted between electrode；
102：Loading current is to the electrode so that the electric current passes through the heat sink lamination；
103：Whether be molten condition or mecystasis, if so, then tying if detecting between the contact surface of the heat sink lamination
The loading of Shu Suoshu electric currents, after persistently clamping heat sink lamination preset time, electrode is discharged, takes out heat sink lamination.
Electrode includes Top electrode block and bottom electrode block,
Above-mentioned heat sink lamination is compacted between two electrodes specifically includes：
Heat sink lamination is fixed on by the bottom electrode block by alignment pin；
By Top electrode block described in Serve Motor Control by the heat sink lamination be clamped in the Top electrode block with it is described under
Between electrode block.
Before loading current or after loading current, institute is controlled according to the preload pressure of default electrode by servomotor
State Top electrode block the heat sink lamination is clamped between the Top electrode block and the bottom electrode block.
It should be noted that the preload pressure of electrode refers to the pressure between electrode and heat sink lamination.
Persistently clamp after referring to ending current loading after heat sink lamination preset time, to continue through servomotor in electricity
Apply pressure for a period of time between pole, then can just discharge electrode, take out exemplar.
Before loading current or after loading current, by connect the power supply of the electrode according to default size of current and
Default conduction time controls size of current and the conduction time of the loading current.
It is apparent to those skilled in the art that for convenience and simplicity of description, the system of foregoing description,
The specific work process of device and unit, the corresponding process in preceding method embodiment is may be referred to, will not be repeated here.
Described above, above example is only to illustrate the technical solution of the utility model, rather than its limitations；Although ginseng
The utility model is described in detail according to previous embodiment, it will be understood by those within the art that：It is still
Technical scheme described in foregoing embodiments can be modified, or which part technical characteristic is equally replaced
Change；And these modifications or replacement, the essence of appropriate technical solution is departed from various embodiments of the utility model technical scheme
Spirit and scope.
Claims (6)
- A kind of 1. welder of micro-channel heat sink for semi-conductor laser lamination, it is characterised in that including：Heat sink lamination, upper electricity Pole block, bottom electrode block, power supply, detection module；The heat sink lamination is clamped between the Top electrode block and the bottom electrode block；The power supply connects the Top electrode block and the bottom electrode block, for passing through the Top electrode block and the bottom electrode block Loading current is to the heat sink lamination；Whether the detection module aligns with the heat sink lamination, be melting between the contact surface for detecting the heat sink lamination State or mecystasis.
- A kind of 2. welder of micro-channel heat sink for semi-conductor laser lamination according to claim 1, it is characterised in that The heat sink lamination is specially five layers of heat sink lamination.
- A kind of 3. welder of micro-channel heat sink for semi-conductor laser lamination according to claim 1, it is characterised in that Also include mobile module, servomotor；The Top electrode block is fixed on the mobile module,The servomotor connects the mobile module, for by controlling the mobile module movement by the Top electrode block pressure Tightly in the heat sink lamination so that the heat sink lamination is clamped between the Top electrode block and the bottom electrode block.
- A kind of 4. welder of micro-channel heat sink for semi-conductor laser lamination according to claim 1, it is characterised in that Also include alignment pin；The alignment pin is fixedly connected through the heat sink lamination with the bottom electrode block, for the heat sink lamination to be fixed on The bottom electrode block.
- A kind of 5. welder of micro-channel heat sink for semi-conductor laser lamination according to claim 1, it is characterised in that The Top electrode block also includes boss；The boss is arranged at the square boss of the Top electrode block, for withstanding the heat sink lamination.
- A kind of 6. welder of micro-channel heat sink for semi-conductor laser lamination according to claim 4, it is characterised in that The Top electrode block also includes positioning hole；The positioning hole is fixedly connected with the alignment pin, for fixing the alignment pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201720166480.8U CN206795017U (en) | 2017-02-23 | 2017-02-23 | A kind of welder of micro-channel heat sink for semi-conductor laser lamination |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201720166480.8U CN206795017U (en) | 2017-02-23 | 2017-02-23 | A kind of welder of micro-channel heat sink for semi-conductor laser lamination |
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| CN206795017U true CN206795017U (en) | 2017-12-26 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107160019A (en) * | 2017-02-23 | 2017-09-15 | 广东工业大学 | The welder and method of a kind of micro-channel heat sink for semi-conductor laser lamination |
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2017
- 2017-02-23 CN CN201720166480.8U patent/CN206795017U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107160019A (en) * | 2017-02-23 | 2017-09-15 | 广东工业大学 | The welder and method of a kind of micro-channel heat sink for semi-conductor laser lamination |
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| CF01 | Termination of patent right due to non-payment of annual fee |