CN108213016B - 晶圆清洗装置及晶圆清洗方法 - Google Patents
晶圆清洗装置及晶圆清洗方法 Download PDFInfo
- Publication number
- CN108213016B CN108213016B CN201711454885.2A CN201711454885A CN108213016B CN 108213016 B CN108213016 B CN 108213016B CN 201711454885 A CN201711454885 A CN 201711454885A CN 108213016 B CN108213016 B CN 108213016B
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- Prior art keywords
- turntable
- wafer
- cleaning
- bearing disc
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- 238000004140 cleaning Methods 0.000 title claims abstract description 82
- 238000000034 method Methods 0.000 title claims abstract description 26
- 235000012431 wafers Nutrition 0.000 claims abstract description 135
- 239000012459 cleaning agent Substances 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 5
- 238000005192 partition Methods 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 9
- 230000007547 defect Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000003344 environmental pollutant Substances 0.000 description 4
- 231100000719 pollutant Toxicity 0.000 description 4
- 229940095676 wafer product Drugs 0.000 description 4
- 238000005034 decoration Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000012864 cross contamination Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711454885.2A CN108213016B (zh) | 2017-12-28 | 2017-12-28 | 晶圆清洗装置及晶圆清洗方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711454885.2A CN108213016B (zh) | 2017-12-28 | 2017-12-28 | 晶圆清洗装置及晶圆清洗方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108213016A CN108213016A (zh) | 2018-06-29 |
CN108213016B true CN108213016B (zh) | 2020-07-24 |
Family
ID=62649325
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711454885.2A Active CN108213016B (zh) | 2017-12-28 | 2017-12-28 | 晶圆清洗装置及晶圆清洗方法 |
Country Status (1)
Country | Link |
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CN (1) | CN108213016B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109304318A (zh) * | 2018-11-30 | 2019-02-05 | 上海华力微电子有限公司 | 一种晶圆清洗装置及清洗方法 |
CN109686694B (zh) * | 2018-12-06 | 2021-03-02 | 德淮半导体有限公司 | 卡盘销以及卡盘销自清洗装置 |
CN113671358B (zh) * | 2021-10-25 | 2021-12-21 | 江苏卓远半导体有限公司 | 一种半导体测试设备 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104903992A (zh) * | 2013-01-08 | 2015-09-09 | 系统科技公司 | 半导体晶圆的连续处理方法 |
CN106054540A (zh) * | 2015-04-15 | 2016-10-26 | 苏斯微技术光刻有限公司 | 用于固化施加到基板的光刻胶的至少一部分的方法与设备 |
-
2017
- 2017-12-28 CN CN201711454885.2A patent/CN108213016B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104903992A (zh) * | 2013-01-08 | 2015-09-09 | 系统科技公司 | 半导体晶圆的连续处理方法 |
CN106054540A (zh) * | 2015-04-15 | 2016-10-26 | 苏斯微技术光刻有限公司 | 用于固化施加到基板的光刻胶的至少一部分的方法与设备 |
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Publication number | Publication date |
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CN108213016A (zh) | 2018-06-29 |
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GR01 | Patent grant | ||
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TR01 | Transfer of patent right |
Effective date of registration: 20221222 Address after: 223001 Room 318, Building 6, east of Zhenda Steel Pipe Company, south of Qianjiang Road, Huaiyin District, Huai'an City, Jiangsu Province Patentee after: Huaian Xide Industrial Design Co.,Ltd. Address before: 223300 no.599, East Changjiang Road, Huaiyin District, Huai'an City, Jiangsu Province Patentee before: HUAIAN IMAGING DEVICE MANUFACTURER Corp. |
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TR01 | Transfer of patent right |
Effective date of registration: 20240709 Address after: 214000 Building 2, 599-5 Jianzhu West Road, Binhu District, Wuxi City, Jiangsu Province 401-79 Patentee after: Wuxi Mingyan Intelligent Equipment Co.,Ltd. Country or region after: China Address before: 223001 Room 318, Building 6, east of Zhenda Steel Pipe Company, south of Qianjiang Road, Huaiyin District, Huai'an City, Jiangsu Province Patentee before: Huaian Xide Industrial Design Co.,Ltd. Country or region before: China |