CN108183999A - Electronic device - Google Patents
Electronic device Download PDFInfo
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- CN108183999A CN108183999A CN201711437455.XA CN201711437455A CN108183999A CN 108183999 A CN108183999 A CN 108183999A CN 201711437455 A CN201711437455 A CN 201711437455A CN 108183999 A CN108183999 A CN 108183999A
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- Prior art keywords
- light
- infrared
- lamp
- close
- electronic device
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/70—Circuitry for compensating brightness variation in the scene
- H04N23/74—Circuitry for compensating brightness variation in the scene by influencing the scene brightness using illuminating means
Abstract
Electronic device disclosed by the invention includes casing, output module, mainboard, imaging modules, proximity sensor, display screen and optical flame detector.Output module, mainboard, imaging modules and display screen are installed on casing.It exports module and includes encapsulating housing, infrared light compensating lamp and close to infrared lamp, encapsulating housing includes package substrate, and infrared light compensating lamp close to infrared lamp with being encapsulated in encapsulating housing and being carried on package substrate.Mainboard is formed with installation gap corresponding with imaging modules.Proximity sensor is incorporated on mainboard and stretches into installation gap from the edge of installation gap.Along along the depth direction of installation gap, proximity sensor partly overlaps with imaging modules.Display screen is formed with light transmission entity area and including the front that can show picture and the back side opposite with front.Optical flame detector is arranged on the side where the back side of display screen and corresponding with light transmission entity area.Output module integrated level is higher and proximity sensor sets compacter with imaging modules, has saved electronic device inner space.
Description
Technical field
The present invention relates to consumer electronics technical fields, more specifically, are related to a kind of electronic device.
Background technology
As the function that mobile phone is supported is more and more rich and varied, mobile phone needs the type and quantity of function element set
It is more and more, in order to realize the functions such as the facial 3D feature recognitions of distance detection, environment light detection and user, need to set in electronics
The function elements such as standby middle configuration proximity sensor, ambient light sensor, infrared pick-up head, structured light projector, and for cloth
Numerous function elements is put, the excessive space of mobile phone can be occupied.
Invention content
Embodiment of the present invention provides a kind of electronic device.
The electronic device of embodiment of the present invention includes：
Casing；
Module is exported, on the housing, the output module includes encapsulating housing, infrared benefit for the output module installation
Light lamp and close to infrared lamp, the encapsulating housing includes package substrate, and the infrared light compensating lamp is encapsulated with described close to infrared lamp
In the encapsulating housing and carry on the package substrate, the infrared light compensating lamp with it is described can be with not close to infrared lamp
Same power emits infrared light outside the encapsulating housing；
Mainboard, the mainboard are mounted in the casing and are formed with installation gap；
Imaging modules, the imaging modules are mounted in the casing and corresponding with the installation gap；
Proximity sensor, the proximity sensor are incorporated on the mainboard, and are stretched into from the edge of the installation gap
The installation gap, along the depth direction of the installation gap, the proximity sensor partly overlaps with the imaging modules；
Display screen, on the housing, the display screen is formed with light transmission entity area and including energy for the display screen setting
Enough show the front of picture and the back side opposite with the front；And
Optical flame detector, the optical flame detector are arranged on the side where the back side of the display screen, the optical flame detector and institute
Light transmission entity area correspondence is stated, the optical flame detector is used to receive the light being incident on the optical flame detector and the mesh for exporting the light
Mark light intensity.
In some embodiments, the output module further includes chip, and the infrared light compensating lamp is with described close to infrared
Lamp is formed on one chip.
In some embodiments, the encapsulating housing further includes package wall and encapsulation top, and the package wall is certainly
The package substrate extends and is connected at the top of the encapsulation between the package substrate, and light filling is formed at the top of the encapsulation
Window and close to window, the light filling window is corresponding with the infrared light compensating lamp, it is described close to window with it is described close to infrared lamp
It is corresponding.
In some embodiments, the output module further includes light-supplementing lamp lens, and the light-supplementing lamp lens are arranged on institute
It states in encapsulating housing and corresponding with the infrared light compensating lamp；And/or
The output module is further included close to lamp lens, it is described be arranged in the encapsulating housing close to lamp lens and with institute
It states and is corresponded to close to infrared lamp.
In some embodiments, the output module further include the light-supplementing lamp lens that are arranged in the encapsulating housing and
Close to lamp lens, the light-supplementing lamp lens are corresponding with the infrared light compensating lamp, described close to lamp lens and described close to infrared lamp
Corresponding, the light-supplementing lamp lens are located at close to lamp lens on same transparent base with described.
In some embodiments, the output module further includes metal shutter, and the metal shutter is located at described
In encapsulating housing and positioned at the infrared light compensating lamp and described close between infrared lamp.
In some embodiments, the output module further includes the optics sealing cover made of translucent material, the optics
Sealing cover is formed on the package substrate and in the encapsulating housing, and the optics sealing cover wraps the infrared light compensating lamp
It is and described close to infrared lamp.
In some embodiments, the output module further includes out light clapboard, it is described go out light clapboard be formed in the light
It learns in sealing cover and positioned at the infrared light compensating lamp and described close between infrared lamp.
In some embodiments, grounding pin, light compensating lamp pin are formed with and close to lamp pin on the output module,
When the grounding pin and the light compensating lamp pin are enabled, the infrared light compensating lamp emits infrared light；The grounding pin
With it is described close to lamp pin be enabled when, it is described close to infrared lamp emit infrared light.
In some embodiments, the electronic device further includes the cover board of light transmission, and the casing offers casing and approaches
Through-hole and casing light filling through-hole, it is described corresponding close to through-hole with the casing close to infrared lamp, the light filling infrared lamp with it is described
Casing light filling through-hole corresponds to, and the cover board setting is on the housing.
In some embodiments, the electronic device further includes the cover board of light transmission, and the casing offers casing and approaches
Through-hole and casing light filling through-hole, it is described corresponding close to through-hole with the casing close to infrared lamp, the light filling infrared lamp with it is described
Casing light filling through-hole corresponds to, and on the housing, the cover board is formed with the surface that the casing is combined for the cover board setting
The infrared through ink of infrared light is only transmitted, the infrared ink that penetrates blocks the casing close to through-hole and the casing light filling
At least one of through-hole.
In some embodiments, the light transmission entity area includes image pixel, and the electronic device further includes processor,
The optical flame detector receives the light to export the initial beam intensity of the environmental light intensity information including the external electronic device；It is described
Processor is used to handle the initial beam intensity to obtain the institute for the environmental light intensity information for only including the external electronic device
State target light intensity.
In some embodiments, the initial beam intensity includes the environmental light intensity information and the display screen shows image
When display intensity signal, the processor is used to obtain the display intensity signal when display screen shows image in real time, and
The display intensity signal is removed when handling the initial beam intensity to obtain the target light intensity.
In some embodiments, the light transmission entity area does not include image pixel and is surrounded by multiple images pixel.
In some embodiments, the imaging modules include at least one in visible image capturing head and infrared pick-up head
Kind.
In some embodiments, the imaging modules include infrared pick-up head and visible image capturing head, the electronics
Device further includes receiver and structured light projector, the output module, the infrared pick-up head, the visible image capturing
The center of head, the receiver and the structured light projector is located on same line segment, from one end of the line segment to the other end
It is followed successively by：
The output module, the structured light projector, the receiver, the infrared pick-up head, the visible ray
Camera；Or
The output module, the infrared pick-up head, the receiver, the visible image capturing head, the structure light
The projector；Or
The infrared pick-up head, the output module, the receiver, the visible image capturing head, the structure light
The projector；Or
The infrared pick-up head, the visible image capturing head, the receiver, the output module, the structure light
The projector.
In some embodiments, the imaging modules include infrared pick-up head and visible image capturing head, the electronics
Device further includes receiver, structured light projector and the cover board of light transmission, and on the housing, the casing is opened for the cover board setting
Equipped with casing sound outlet hole, the cover board offers cover board sound outlet hole, the receiver and the cover board sound outlet hole and the casing
The position of sound outlet hole corresponds to, and the output module, the infrared pick-up head, the visible image capturing head and the structure light are thrown
The center of emitter is located on same line segment, and the receiver is between the line segment and the top of the casing.
Output module in the electronic device of embodiment of the present invention is by infrared light compensating lamp with being integrated into one close to infrared lamp
A list package body structure has gathered transmitting infrared light with the function of infrared distance measurement and infrared light filling, therefore, has exported the integrated of module
Higher, small volume is spent, output module has saved the space of the function of the infrared light filling of realization and infrared distance measurement.In addition, due to red
Outer light compensating lamp and be carried on same package substrate close to infrared lamp, compared to traditional handicraft infrared light compensating lamp with close to red
Outer lamp, which needs to be respectively adopted in different wafer manufacture recombinants to PCB substrate, to be encapsulated, and improves packaging efficiency.Meanwhile optical flame detector
The side where the back side of display screen is arranged on, so as to which optical flame detector will not occupy the sky between display platen edge and envelope edge
Between, show that the gap between platen edge and envelope edge be can be made smaller, in other words, the display area of display screen can increase
Greatly, to improve the screen accounting of electronic device.Furthermore since imaging modules and proximity sensor are on the depth direction of installation gap
It partly overlaps, proximity sensor sets compacter with imaging modules, and the horizontal space that the two occupies jointly is smaller, has saved electricity
Space inside sub-device.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partly will be from following
Description in become apparent or recognized by the practice of embodiments of the present invention.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change
It obtains significantly and is readily appreciated that, wherein：
Fig. 1 is the structure diagram of the electronic device of certain embodiments of the present invention；
Fig. 2 is the stereoscopic schematic diagram of the output module of the electronic device of certain embodiments of the present invention；
Fig. 3 is the schematic cross-section of the output module of the electronic device of certain embodiments of the present invention；
Fig. 4 is the stereoscopic schematic diagram of the output module of the electronic device of certain embodiments of the present invention；
Fig. 5 is the partial sectional schematic view along V-V lines of the electronic device of Fig. 1；
Fig. 6 is the schematic cross-section along line VI -- VI of the electronic device of Fig. 1；
Fig. 7 is the proximity sensor of the electronic device of certain embodiments of the present invention and the stereoscopic schematic diagram of imaging modules；
Fig. 8 is the arrangement schematic diagram of the electronic component of the electronic device of certain embodiments of the present invention；
Fig. 9 is the schematic cross-section of the output module of the electronic device of certain embodiments of the present invention；
Figure 10 is the structure diagram of the electronic device of certain embodiments of the present invention；
Figure 11 is that the electronic device of certain embodiments of the present invention is cut along with V-V lines corresponding position intercepts in Fig. 1 part
Face schematic diagram；
Figure 12 is that the electronic device of another embodiment of the present invention is cut along with V-V lines corresponding position intercepts in Fig. 1 part
Face schematic diagram；With
Figure 13 to Figure 20 is the proximity sensor of the electronic device of certain embodiments of the present invention and the solid of imaging modules
Schematic diagram；
Figure 21 is that proximity sensor, imaging modules and the three-dimensional of mainboard of the electronic device of embodiment of the present invention are illustrated
Figure；With
Figure 22 is the partial sectional schematic view of the electronic device of embodiment of the present invention.
Specific embodiment
Embodiments of the present invention are described further below in conjunction with attached drawing.Same or similar label is from beginning in attached drawing
To the whole element for representing same or similar element or there is same or like function.
In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, it is only used for explaining the present invention's
Embodiment, and be not considered as limiting the invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature can be with "above" or "below" second feature
It is that the first and second features are in direct contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature right over second feature or oblique upper or be merely representative of
Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be
One feature is immediately below second feature or obliquely downward or is merely representative of fisrt feature level height less than second feature.
Referring to Fig. 1, the electronic device 100 of embodiment of the present invention includes casing 20, cover board 30, display screen 90 and electronics
Component.Electronic component includes output module 10, proximity sensor 51 (as shown in Figure 7), optical flame detector 52, imaging modules 60
(as shown in Figure 7), receiver 70 and structured light projector 80.Electronic device 100 can be mobile phone, tablet computer, notebook electricity
Brain, smartwatch, Intelligent bracelet, automatic teller machine etc., the embodiment of the present invention are illustrated so that electronic device 100 is mobile phone as an example, can
To understand, the concrete form of electronic device 100 can be other, and this is not restricted.
Fig. 2 and Fig. 3 are please referred to, output module 10 is single package body structure, including encapsulating housing 11,12 and of infrared light compensating lamp
Close to infrared lamp 13.
Encapsulating housing 11 for encapsulating infrared light compensating lamp 12 and close to infrared lamp 13, in other words, infrared light compensating lamp 12 simultaneously
It is encapsulated in encapsulating housing 11 simultaneously with close to infrared lamp 13.Encapsulating housing 11 includes package substrate 111,112 and of package wall
Encapsulation top 113.Encapsulating housing 11 can be shielded by electromagnetic interference (Electromagnetic Interference, EMI)
Material is made, and output module 10 is had an impact to avoid extraneous electromagnetic interference.
Package substrate 111 is for carrying infrared light compensating lamp 12 and close to infrared lamp 13.It is infrared when manufacture exports module 10
Light compensating lamp 12 and can be formed on a piece of chip 14 close to infrared lamp 13, then by infrared light compensating lamp 12, close to 13 and of infrared lamp
Chip 14 is set along on package substrate 111, and specifically, chip 14 can be bonded on package substrate 111.Meanwhile it seals
Dress substrate 111 can be used for and other parts of electronic device 100 (such as the casing 20 of electronic device 100, mainboard 110
(as shown in figure 21) etc.) connection, module 10 will be exported and be fixed in electronic device 100.
Package wall 112 can surround infrared light compensating lamp 12 and be set close to infrared lamp 13, and package wall 112 encapsulates base certainly
Plate 111 extends, and package wall 112 can be combined with package substrate 111, preferably, package wall 112 is can with package substrate 111
It releasably connects, in order to remove to infrared light compensating lamp 12 after package wall 112 and overhauled close to infrared lamp 13.Package-side
The making material of wall 112 can be the material of impermeable infrared light, be sent out to avoid infrared light compensating lamp 12 or close to infrared lamp 13
Infrared light passes through package wall 112.
Encapsulation top 113 is opposite with package substrate 111, and encapsulation top 113 is connect with package wall 112.Encapsulation top 113
It is formed with light filling window 1131 and close to window 1132, light filling window 1131 is corresponding with infrared light compensating lamp 12, infrared light compensating lamp 12
The infrared light of transmitting is pierced by from light filling window 1131；It is corresponding with close to infrared lamp 13 close to window 1132, it is sent out close to infrared lamp 13
The infrared light penetrated is pierced by from close to window 1132.Encapsulation top 113 integrally formed can be obtained with package wall 112, can also
Split shapes to obtain.In one example, light filling window 1131 and close to window 1132 be through-hole, encapsulation top 113 making
Material is the material of impermeable infrared light.In another example, 113 material by impermeable infrared light of encapsulation top and saturating infrared light
Material co-manufactured forms, and specifically, light filling window 1131 and is made close to window 1132 of the material of saturating infrared light, remaining part
Position is made of the material of impermeable infrared light, further, light filling window 1131 and could be formed with lens knot close to window 1132
Structure, to improve the infrared light emission angle from light filling window 1131 and close to the injection of window 1132, such as 1131 shape of light filling window
Into there is concavees lens structure, so that the divergence of beam across light filling window 1131 projects outward；Convex lens is formed with close to window 1132
Mirror structure, so as to gather outside injection across the light close to window 1132.
Infrared light compensating lamp 12 further reduces infrared light compensating lamp with that can be formed on a piece of chip 14 close to infrared lamp 13
12 with the volume close to infrared lamp 13 after integrated, and preparation process is simpler.Infrared light compensating lamp 12 can emit infrared light, infrared light
Across light filling window 1131 to project body surface, the infrared pick-up head 62 of electronic device 100 is (as shown in Figure 1) to receive quilt
The infrared light of object reflection is to obtain the image information of object (at this point, infrared light compensating lamp 12 be used for infrared light filling).Close to infrared
Lamp 13 can emit infrared light, and infrared light passes through close to window 1132 and reaches body surface, the proximity sensor of electronic device 100
The infrared light that 51 receptions (as shown in Figure 7) are reflected by the object is with the distance of detection object to electronic device 100 (at this point, close to red
Outer lamp 13 is used for infrared distance measurement).
Infrared light compensating lamp 12 can emit infrared light with different power from close to infrared lamp 13 outside encapsulating housing 11,
Specifically, infrared light compensating lamp 12 with that can emit infrared light simultaneously close to infrared lamp 13, and output module 10 is simultaneously for infrared
Light filling and infrared distance measurement；Can also infrared light compensating lamp 12 emit light and do not emit light close to infrared lamp 13, export module 10
It is only used for infrared light filling；Can also infrared light compensating lamp 12 do not emit light and close to infrared lamp 13 emit light, export module 10
It is only used for infrared distance measurement.Incorporated by reference to Fig. 4, in embodiments of the present invention, export and be formed with grounding pin 15, light compensating lamp on module 10
Pin 16 and close to lamp pin 17.Grounding pin 15, light compensating lamp pin 16 and it can be formed in package substrate close to lamp pin 17
On 111, when grounding pin 15 and light compensating lamp pin 16 are enabled (that is, grounding pin 15 and light compensating lamp pin 16 access circuit
During conducting), infrared light compensating lamp 12 emits infrared light；When grounding pin 15 and when being enabled close to lamp pin 17 (that is, grounding lead
Foot 15 and close to lamp pin 17 access circuit turn-on when), close to infrared lamp 13 emit infrared light.
It please refers to Fig.1, Fig. 5 and Fig. 6, casing 20 in other words, can export module as the installation carrier of output module 10
10 can be arranged in casing 20.Casing 20 includes top 21 and bottom 22, in the state of user's normal use electronic device 100
Under, top 21 is located at the top of bottom 22, as shown in Figure 1.Output module 10 is arranged between top 21 and bottom 22.Casing 20
Mounting groove 25 is offered, mounting groove 25 is opened between top 21 and bottom 22.Casing 20 can be the middle shell of electronic device 100
Or shell.
Referring to Fig. 6, display screen 90 is arranged on casing 20 and closes mounting groove 25 to form the installation space of closing.It is aobvious
Display screen 90 is formed with light transmission entity area 91 and alternatively non-transparent district 94, and light transmission entity area 91 does not include image pixel and by multiple images picture
Element surrounds, and image pixel is distributed in alternatively non-transparent district 94, and in other words, alternatively non-transparent district 94 is the viewing area of display screen 90, non-transparent
Area 94 is used to implement the display function of display screen 90.The material in light transmission entity area 91 includes but not limited to glass.Electronic device 100
Outer light may pass through light transmission entity area 91 and enter electronic device 100, without destroying the integrality of display screen 90.Display screen 90
Including can show picture front 92 and with the positive 92 opposite back sides 93.Specifically, when display screen 90 shines and shows picture
During face, the light that display screen 90 is sent out projects display screen 90 from front 92；When display screen 90 is installed on casing 20, mounting groove
25 are located at the opposite both sides (that is, the back side 93 is located between front 92 and mounting groove 25) at the back side 93 with front 92.Of the invention real
It applies in example, output module 10 can be arranged between display screen pane edge and top 21, due to the output of embodiment of the present invention
Module 10 can occupy smaller volume, therefore, for setting the volume of display screen 90 that can correspond to increase in casing 20, with
Improve the screen accounting of electronic device 100.In other embodiments, display screen 90 can be that screen opens up jagged, display comprehensively
Screen 90 surrounds output module 10, and exports module 10 and expose from the notch of display screen 90.In some embodiments, light transmission is real
94 uniform thickness of alternatively non-transparent district of body area 91 and surrounding and continuous.
It please refers to Fig.1 and Fig. 5, casing 20 is further opened with casing close to through-hole 23 and casing light filling through-hole 24.Export module
10 when being arranged in casing 20, and corresponding close to through-hole 23 with casing close to infrared lamp 13, infrared light compensating lamp 12 is led to casing light filling
Hole 24 corresponds to.It wherein can be from casing close to the corresponding light sent out close to infrared lamp 13 that refers to of through-hole 23 close to infrared lamp 13 and casing
It is passed through close to through-hole 23, can be close to 23 face of through-hole or close to infrared close to infrared lamp 13 with casing specifically
The light that lamp 13 emits passes through casing close to through-hole 23 after light-guide device acts on.Infrared light compensating lamp 12 and casing light filling through-hole 24
It corresponds to similarly, therefore not to repeat here.In the embodiment as shown in fig.5, casing can close to through-hole 23 and casing light filling through-hole 24
Be apart from one another by, certainly, in other embodiments, casing close to through-hole 23 and casing light filling through-hole 24 can also be mutual
Connection.
Cover board 30 can be light transmission, and the material of cover board 30 can be glass, resin, plastics of light transmission etc..Cover board 30 is set
It puts on casing 20, the inner surface 32 and the outer surface 31 opposite with inner surface 32 that cover board 30 includes with casing 20 is combined are defeated
Go out after the light that module 10 is sent out sequentially passes through inner surface 32 and outer surface 31 and be pierced by cover board 30.In embodiment as shown in Figure 5
In, cover board 30 covers casing light filling through-hole 24 and casing close to through-hole 23, and infrared transmission is coated on the inner surface 32 of cover board 30
Ink 40, it is infrared to have higher transmitance to infrared light through ink 40, such as 85% or more is can reach, and have to visible ray
Higher attenuation rate, such as can reach more than 70% so that user during normal use, is visually difficult to see that electronic device 100
On by the infrared region covered through ink 40.Specifically, it is infrared through ink 40 can cover on inner surface 32 not with display
Shield 90 corresponding regions.
It is infrared to block casing close at least one of through-hole 23 and casing light filling through-hole 24 through ink 40,
That is, infrared can cover casing close to through-hole 23 and casing light filling through-hole 24 (as shown in Figure 5), Yong Hunan simultaneously through ink 40
To see the internal structure of electronic device 100 close to through-hole 23 and casing light filling through-hole 24 by casing, electronic device 100 it is outer
Shape is more beautiful；It is infrared to cover casing close to through-hole 23, and do not cover casing light filling through-hole 24 through ink 40；It is or red
It is outer to cover casing light filling through-hole 24, and do not cover casing close to through-hole 23 through ink 40.
Referring to Fig. 6, optical flame detector 52 is single packaging body.Optical flame detector 52 is mounted in mounting groove 25 and positioned at display screen 90
Side where the back side 93, in other words, optical flame detector 52 is located at the lower section of display screen 90.Optical flame detector 52 and light transmission entity area 91 are right
Should, specifically, the visible ray outside electronic device 100 can pass through light transmission entity area 91 and be transmitted on optical flame detector 52.Optical flame detector
52 receive the visible ray in ambient light, and detect the intensity of visible ray, using the foundation of the display brightness as control display screen 90.
In present embodiment, optical flame detector 52 is first mounted in mounting groove 25 and display screen 90 is installed on casing 20 again, and optical flame detector 52 can
To contact or be arranged at intervals with display screen 90.In other embodiments, optical flame detector 52 can first be mounted on display screen 90 and make
Optical flame detector 52 is corresponding with light transmission entity area 91, is then again installed to display screen 90 and optical flame detector 52 on casing 20 simultaneously.
It please refers to Fig.1 and Fig. 7, proximity sensor 51 is single packaging body.The infrared light sent out close to infrared lamp 13, quilt
After external object reflection, received by proximity sensor 51, proximity sensor 51 is sentenced according to the infrared light reflected received
Disconnected the distance between external object and electronic device 100.
It please refers to Fig.1 and Fig. 7, imaging modules 60 can be visible image capturing head 61 and one in infrared pick-up head 62
Or two.Imaging modules 60 include microscope base 63, lens barrel 64 and imaging sensor 65.Lens barrel 64 is mounted on microscope base 63, and image passes
Sensor 65 is housed in microscope base 63.Microscope base 63 includes mounting surface 631, mounting surface 631 be located at lens barrel 64 and imaging sensor 65 it
Between.In the embodiment as shown in figure 7, proximity sensor 51 is arranged on mounting surface 631, and specifically, proximity sensor 51 exists
Plane orthographic projection where mounting surface 631 is at least partly dropped on mounting surface 631, in this way, proximity sensor 51 and imaging mould
Group 60 sets compacter, and the horizontal space that the two occupies jointly is smaller.
Referring to Fig. 1, receiver 70 is for sending out acoustic signals when being encouraged by power supply, user can by by
Words device 70 is conversed.Structured light projector 80 is used for outside emitting structural light, on project structured light to testee after it is anti-
It penetrates, the structure light reflected can be received by infrared pick-up head 62, and the processor of electronic device 100 is further analyzed by infrared light
The structure light that camera 62 receives, to obtain the depth information of testee.
In the embodiment shown in fig. 1, imaging modules 60 include visible image capturing head 61 and infrared pick-up head 62, defeated
Go out the center of module 10, infrared pick-up head 62, visible image capturing head 61, receiver 70 and structured light projector 80 positioned at same
On line segment.Specifically, output module 10, structured light projector 80, receiver 70, red is followed successively by from one end of line segment to the other end
Outer light video camera head 62, visible image capturing head 61 (as shown in Figure 8), at this point, visible image capturing head 61 and infrared pick-up head 62 can
To form double photography/videography heads (as shown in Figure 17 and 18)；Or output module 10, red is followed successively by from one end of line segment to the other end
Outer light video camera head 62, receiver 70, visible image capturing head 61, structured light projector 80 (as shown in Figure 1)；Or one from line segment
The other end is held to be followed successively by infrared pick-up head 62, output module 10, receiver 70, visible image capturing head 61, project structured light
Device 80；Or infrared pick-up head 62, visible image capturing head 61, receiver 70, defeated is followed successively by from one end of line segment to the other end
Go out module 10, structured light projector 80, at this point, visible image capturing head 61 and infrared pick-up head 62 can form double photography/videography heads
(as shown in Figure 17 and 18).Certainly, module 10, infrared pick-up head 62, receiver 70, visible image capturing head 61, structure are exported
The arrangement mode of light projector 80 is not limited to above-mentioned citing, can also there is other, such as the center arrangement of each electronic component
In the arc-shaped, center arranges the shapes such as rectangular.
Further, incorporated by reference to Fig. 7, proximity sensor 51 can be arranged on the mounting surface 631 of infrared pick-up head 62,
It can also be arranged on the mounting surface 631 of visible image capturing head 61, certainly, proximity sensor 51 can not also be arranged on mounting surface
On 631, proximity sensor 51 can be disposed adjacent with output module 10, and proximity sensor 51 is readily received by close to infrared lamp
13 transmittings, and the infrared light being reflected back by external object；Proximity sensor 51 can also be disposed adjacent with receiver 70, work as user
When receiving calls, proximity sensor 51 is readily detected the ear of user close to receiver 70.
To sum up, in the electronic device 100 of embodiment of the present invention, output module 10 by infrared light compensating lamp 12 with close to infrared
Lamp 13 is integrated into a single package body structure, has gathered transmitting infrared light with the function of infrared distance measurement and infrared light filling, therefore, defeated
The integrated level for going out module 10 is higher, small volume, and output module 10 has saved the function of the infrared light filling of realization and infrared distance measurement
Space.In addition, since infrared light compensating lamp 12 close to infrared lamp 13 with being carried on same package substrate 111, compared to tradition
The infrared light compensating lamp 12 of technique is sealed from needing to be respectively adopted in different wafer manufacture recombinants to PCB substrate close to infrared lamp 13
Dress, improves packaging efficiency.Meanwhile optical flame detector 52 is arranged on the side at 93 place of the back side of display screen 90 (in display screen 90
Lower section), so as to which optical flame detector 52 will not occupy the space between 20 edge of display screen pane edge and casing, display screen pane edge and machine
Gap between 20 edge of shell be can be made smaller, and in other words, the display area of display screen 90 can increase, to improve electronics
The screen accounting of device 100.
Referring to Fig. 3, in some embodiments, output module 10 further includes light-supplementing lamp lens 18 and close to lamp lens
19.Light-supplementing lamp lens 18 are arranged in encapsulating housing 11 and corresponding with infrared light compensating lamp 12.Encapsulation is arranged on close to lamp lens 19
It is in housing 11 and corresponding with close to infrared lamp 13.The infrared light that infrared light compensating lamp 12 emits converges under the action of light-supplementing lamp lens 18
Gather and projected in light filling window 1131, reduce the light quantity in other regions for being emitted to package wall 112 and encapsulation top 113.Together
Reason, the infrared light emitted close to infrared lamp 13 are projected being converged to close under the action of lamp lens 19 close in window 1132, are subtracted
It is emitted to the light quantity in other regions at package wall 112 and encapsulation top 113 less.Specifically, light-supplementing lamp lens 18 with close to lamp
Lens 19 can be located at same transparent base on, more specifically, light-supplementing lamp lens 18 with can be transparent with this close to lamp lens 19
Matrix, which is integrally formed, to be made.Certainly, output module 10 can also be provided only with light-supplementing lamp lens 18 and close in lamp lens 19
One, light-supplementing lamp lens 18 can not also be set and close to lamp lens 19.
Referring to Fig. 3, in some embodiments, output module 10 further includes metal shutter 1a, metal shutter 1a
In encapsulating housing 11, and metal shutter 1a is located at infrared light compensating lamp 12 and close between infrared lamp 13.Metal shutter
1a is located at infrared light compensating lamp 12 and close between infrared lamp 13, metal shutter 1a on the one hand can shield infrared light compensating lamp 12 with
The electromagnetic interference mutual close to infrared lamp 13, infrared light compensating lamp 12 will not with the luminous intensity and sequential close to infrared lamp 13
Interact, another aspect metal shutter 1a can be used for completely cutting off 12 place cavity of infrared light compensating lamp with close to 13 institute of infrared lamp
Cavity, light will not enter another cavity from a cavity.
Referring to Fig. 9, in some embodiments, output module 10 further includes optics sealing cover 1b.Optics sealing cover 1b is by saturating
Luminescent material is made, and optics sealing cover 1b is formed on package substrate 111 and in encapsulating housing 11.Optics sealing cover 1b wraps red
Outer light compensating lamp 12 and close to infrared lamp 13.Specifically, optics sealing cover 1b can be formed by encapsulating injection molding and forming technology, optics envelope
Cover 1b may be used transparent thermosetting epoxy resin and be made, and to be not easy to soften in use, optics sealing cover 1b can fix red
Outer light compensating lamp 12 and close to the relative position between infrared lamp 13, and cause infrared light compensating lamp 12 with being encapsulated close to infrared lamp 13
It is not easy to shake in housing 11.
In addition, referring to Fig. 9, output module 10 further include out light clapboard 1c, go out light clapboard 1c and be formed in optics sealing cover 1b
It is interior and positioned at infrared light compensating lamp 12 and close between infrared lamp 13.Go out light clapboard 1c to can be used for interval infrared light compensating lamp 12 and approach
Infrared lamp 13, the light that infrared light compensating lamp 12 is sent out will not be pierced by from close to window 1132, the light sent out close to infrared lamp 13
Line will not be pierced by from light filling window 1131.
It please refers to Fig.1 and Fig. 6, in some embodiments, light transmission entity area 91 includes image pixel, electronic device 100
Further include processor 96, optical flame detector 52 receives the light that is incident on optical flame detector 52 to export including outside electronic device 100
The initial beam intensity of environmental light intensity information.Processor 96 is only included with obtaining outside electronic device 100 for handling initial beam intensity
The target light intensity of environmental light intensity information.Processor 96 is mounted on mainboard 110.In some embodiments, processor 96 also may be used
To handle the structure light received by the infrared pick-up head 62 of the above embodiment.
Specifically, light transmission entity area 91 includes image pixel, and light transmission entity area 91 can be used for showing image information, meanwhile,
Ambient light can be from light transmission entity area 91 across and into electronic device 100.In some embodiments, light transmission entity area 91
Light transmittance can be more than or equal to 50%.It is appreciated that the light being incident on optical flame detector 52 had both included across light transmission entity area 91
Ambient light part, and include the image pixel in light transmission entity area 91 when showing content to the inside of electronic device 100
The part of the display light of transmitting.Processor 96 can determine that optical flame detector 52 receives according to the content that light transmission entity area 91 is shown
The display light that emits to optical flame detector 52 of light transmission entity area 91, so as to which processor 96 can be according to initial beam intensity and optical flame detector
52 receive the target light that the light intensity that display light generates determines to only include the environmental light intensity information outside electronic device 100 jointly
By force.The electronic device 100 of present embodiment can obtain the environmental light intensity information outside electronic device 100, to be shown as control
The foundation of the display brightness of display screen 90.
It please refers to Fig.1 and Fig. 6, in some embodiments, initial beam intensity includes environmental light intensity information and display screen 90 is aobvious
Diagram as when the display intensity signal that receives of optical flame detector 52, processor 96 shows the image time for obtaining display screen 90 in real time
The display intensity signal that sensor 52 receives, and removal shows intensity signal to obtain target light intensity when handling initial beam intensity.
Referring to Fig. 10, in some embodiments, casing 20 is further opened with casing sound outlet hole (not shown), and cover board 30 is also
Cover board sound outlet hole 35 is offered, receiver 70 is corresponding with the position of cover board sound outlet hole 35 and casing sound outlet hole.Export module 10, red
The center of outer light video camera head 62, visible image capturing head 61 and structured light projector 80 is located on same line segment, and receiver 70 is located at
Between the line segment and the top 21 of casing 20.
The center of receiver 70 is not located on the line segment, and it is (output module 10, red to have saved each electronic component on cover board 30
Outer light video camera head 62, visible image capturing head 61, structured light projector 80 etc.) occupy horizontal space.In reality as shown in Figure 10
It applies in example, cover board sound outlet hole 35 is opened in the marginal position of cover board 30, and casing sound outlet hole is opened up close to top 21.
Referring again to Figure 11, cover board light filling through-hole 34, cover board can also be offered in some embodiments, on cover board 30
Light filling through-hole 34 is corresponding with casing light filling through-hole 24, and the infrared light that infrared light compensating lamp 12 emits can after passing through casing light filling through-hole 24
To be pierced by electronic device 100 from cover board light filling through-hole 34.It at this point, can close to 23 corresponding position of through-hole with casing on cover board 30
With set it is infrared penetrate ink 40, user be difficult to close to through-hole 23 see by casing the inside of electronic device 100 close to red
Outer lamp 13, the shape of electronic device 100 are more beautiful.
2 are please referred to Fig.1, cover board can also be opened up in some embodiments, on cover board 30 close to through-hole 33, cover board approaches
Through-hole 33 is corresponding close to through-hole 23 with casing, and the infrared light emitted close to infrared lamp 13 passes through casing can be from close to after through-hole 23
Cover board is pierced by electronic device 100 close in through-hole 33.At this point, it can be set with 24 corresponding position of casing light filling through-hole on cover board 30
Infrared transmission ink 40 is put, user is difficult to see by casing light filling through-hole 24 infrared light compensating lamp of the inside of electronic device 100
12, the shape of electronic device 100 is more beautiful.
3 are please referred to Fig.1, in some embodiments, imaging modules 60 further include substrate 66, and imaging sensor 65 is arranged on
On substrate 66, proximity sensor 51 may be also secured on substrate 66.Specifically, it is provided with FPC on substrate 66, the one of substrate 66
Part is located in microscope base 63, and another part is stretched out out of microscope base 63, and one end of FPC is located in microscope base 63 and for carrying image biography
Sensor 65, the other end can be connect with the mainboard 110 of electronic device 100.When proximity sensor 51 is arranged on substrate 66, approach
Sensor 51 is arranged on outside microscope base 63, and proximity sensor 51 can also be connect with FPC.
Imaging modules 60 can be visible image capturing head 61 and one or two in infrared pick-up head 62.Specifically,
Proximity sensor 51 can be fixed on the substrate 66 of visible image capturing head 61；Alternatively, proximity sensor 51 can be fixed on it is red
On the substrate 66 of outer light video camera head 62.
Further, substrate 66 further includes stiffening plate, and stiffening plate is arranged on the side opposite with proximity sensor 51, to increase
Add the integral strength of substrate 66 so that FPC is not susceptible to around folding, while when proximity sensor 51 is arranged on substrate 66 is not easy to send out
It is raw to shake.In one example, proximity sensor 51 may be also secured on the lateral wall of microscope base 63, such as pass through cohesive side
Formula is fixed on the lateral wall of microscope base 63.
4 are please referred to Fig.1, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace
It is changed to lower structure：Imaging modules 60 include imaging sensor 65, camera case 67 and camera lens module 68.The top of camera case 67
Face 670 is cascaded surface, and top surface 670 includes the first sub- top surface 671, the second sub- top surface 672 and the sub- top surface 673 of third, the second son top
672 and first sub- top surface 671 of face tilts connection and forms notch 675, the sub- top surface 673 and second of third with the first sub- top surface 671
Sub- top surface 672 tilts connection, and the second sub- top surface 672 is between the first sub- top surface 671 and the sub- top surface 673 of third to connect first
Sub- top surface 671 and the sub- top surface 673 of third.Angle between second sub- 672 and first sub- top surface 671 of top surface can be obtuse angle or straight
Angle, the angle between the second sub- top surface 672 and the sub- top surface 673 of third can be obtuse angle or right angle.Notch 675 is opened in camera shell
On one end of body 67, that is to say, that notch 675 is located at the marginal position of top surface 670.The sub- top surface 673 of third offers out
Light through-hole 674, camera lens module 68 are housed in camera case 67 and corresponding with light extraction through-hole 674.Imaging sensor 65 is housed in
In camera case 67 and corresponding with camera lens module 68, the light outside electronic device 100 can pass through light extraction through-hole 674 and camera lens mould
Group 68 is simultaneously transmitted on imaging sensor 65, and imaging sensor 65 converts optical signals to electric signal.Proximity sensor 51 is set
At the first sub- top surface 671.In present embodiment, imaging modules 60 can be visible image capturing head 61.In other embodiment
In, imaging modules 60 can be infrared pick-up head 62.
The imaging modules 60 of present embodiment offer notch 675, and proximity sensor 51 is arranged on the first son and is pushed up
On face 671, proximity sensor 51 is made to set compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, section
Installation space about in electronic device 100.
Please continue to refer to Figure 14, in some embodiments, the proximity sensor 51 of the above embodiment is arranged on first
On sub- top surface 671 and positioned at the outside of camera case 67, specifically, entire proximity sensor 51 is along perpendicular to the first sub- top surface
671 projection can be located in the first sub- top surface 671 (as shown in figure 14)；Alternatively, part proximity sensor 51 along perpendicular to
The projection of first sub- top surface 671 is located in the first sub- top surface 671.It is located at that is, proximity sensor 51 is at least part of
The surface of first sub- top surface 671, in this way, proximity sensor 51 sets compacter with imaging modules 60, the two occupies jointly
Horizontal space it is smaller, further save the installation space in electronic device 100.
5 are please referred to Fig.1, the first sub- top surface 671 of the above embodiment offers loophole 676, proximity sensor 51
It is in camera case 67 and corresponding with loophole 676.Light outside electronic device 100 can pass through loophole 676 and transmit
Onto proximity sensor 51.The proximity sensor 51 of present embodiment is arranged in camera case 67, make proximity sensor 51 with
The structure of camera case 67 is more stablized and convenient for proximity sensor 51 and imaging modules 60 is installed on casing 20.
6 are please referred to Fig.1, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole
676, proximity sensor 51 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, image
Sensor 65 is arranged on substrate 66, and proximity sensor 51 may be also secured on substrate 66 and be housed in camera case 67.
Specifically, FPC is provided on substrate 66, one end of FPC is located in camera case 67 and for carrying imaging sensor 65, another
End can be connect with the mainboard 110 of electronic device 100.In other embodiments, proximity sensor 51 can also connect with FPC
It connects.
The proximity sensor 51 of present embodiment is arranged in camera case 67, makes proximity sensor 51 and camera case 67
Structure more stablize and convenient for proximity sensor 51 and imaging modules 60 are installed on casing 20；Meanwhile imaging modules 60
Proximity sensor 51 is simultaneously arranged on substrate 66 by setting substrate 66, and proximity sensor 51 is enable to be firmly mounted to camera shell
In body 67.
7 are please referred to Fig.1, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace
It is changed to lower structure：Imaging modules 60 take the photograph module to be double, including two imaging sensors 65, camera case 67 and two camera lens moulds
Group 68.The top surface 670 of camera case 67 is cascaded surface, and top surface 670 includes the first tread 677, second less than the first tread 677
678 and first joint face 679a of tread.First joint face 679a and the second tread 678 tilt connection and with 678 shape of the second tread
Into notch 675, the first joint face 679a and the first tread 677, which tilt, to be connected, the first joint face 679a be located at the first tread 677 with
With the first tread 677 of connection and the second tread 678 between second tread 678.Between first joint face 679a and the first tread 677
Angle can be obtuse angle or right angle, the angle between the first joint face 679a and the second tread 678 can be obtuse angle or right angle.
Notch 675 is opened on an end of camera case 67, that is to say, that notch 675 is located at the marginal position of top surface 670.Two
A light extraction through-hole 674 is opened on the first tread 677 and is respectively positioned on the same side of notch 675, in two light extraction through-holes 674
Heart line is vertical with the extending direction of notch 675.Two camera lens modules 68 be housed in camera case 67 and with two light extractions
Through-hole 674 corresponds to respectively, and two imaging sensors 65 are housed in camera case 67 and corresponding respectively with two camera lens modules 68,
Light outside electronic device 100 can pass through light extraction through-hole 674 and camera lens module 68 and be transmitted on imaging sensor 65.This reality
It applies in mode, imaging modules 60 can be visible image capturing head 61, and two camera lens modules 68 are visible image capturing head 61 at this time
Corresponding camera lens module.Proximity sensor 51 is arranged on the second tread 678 and outside camera case 67.In other embodiment party
In formula, imaging modules 60 can be infrared pick-up head 62, and two camera lens modules 68 are that infrared pick-up head 62 corresponds at this time
Camera lens module.In yet another embodiment, imaging modules 60 include visible image capturing head 61 and infrared pick-up head 62, at this time
One of camera lens module 68 is 62 corresponding camera lens module of infrared pick-up head, another camera lens module 68 is visible image capturing
First 61 corresponding camera lens module.
The imaging modules 60 of present embodiment offer notch 675, and proximity sensor 51 is arranged on the second tread
On 678, proximity sensor 51 is made to set compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, saves
Installation space in electronic device 100.
8 are please referred to Fig.1, in some embodiments, the notch 675 of the above embodiment is opened in the centre of top surface 670
On position, 677 incision 675 of the first tread is separated into the first sub- sub- tread 677b of tread 677a and second, the first sub- tread
The sub- tread 677b of 677a and second are located at the opposite sides of notch 675 respectively, and two light extraction through-holes 674 are opened in the first son respectively
On the sub- tread 677b of tread 677a and second, the camera lens module 68 in camera case 67 also is located at the opposite of notch 675
Both sides.At this point, notch 675 is surrounded by the second tread 678, the first joint face 679a and the second joint face 679b, the first joint face
679a tilts the first sub- top surface 677a of connection and the second tread 678 and between the first sub- top surface 677a and the second tread 678,
Second joint face 679b tilts the second sub- top surface 677b of connection and the second tread 678 and positioned at the ladder of the second sub- top surface 677b and second
Between face 678.In present embodiment, the first tread 677 is parallel with the second tread 678, the son ladders of the first joint face 679a and first
The angle of face 677a is obtuse angle, and the angle of the sub- tread 677b of the second joint face 679b and second is obtuse angle.In other embodiment
In, the angle of the sub- tread 677a of the first joint face 679a and first is right angle, the sub- tread 677b of the second joint face 679b and second
Angle be right angle.Relative to the marginal position that notch 675 is opened in top surface 670, the notch 675 of present embodiment is opened in
The centre position of top surface 670 can make the width of notch 675 wider, consequently facilitating proximity sensor 51 is arranged on the second tread
On 678.
7 and Figure 18 is please referred to Fig.1, in some embodiments, the proximity sensor 51 of the above embodiment is arranged on
On two treads 678 and positioned at the outside of camera case 67.Specifically, when notch 675 is opened in the marginal position of top surface 670,
Entire proximity sensor 51 can be located in the second tread 678 (as shown in figure 17) along perpendicular to the projection of the second tread 678；
Alternatively, part proximity sensor 51 is located at along the projection perpendicular to the second tread 678 in the second tread 678.It is that is, close
At least part of surface for being located at the second tread 678 of sensor 51.When notch 675 is opened in the centre position of top surface 670
When upper, entire proximity sensor 51 can be located at (such as Figure 18 in the second tread 678 along perpendicular to the projection of the second tread 678
It is shown).In this way, proximity sensor 51 sets compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, into
One step has saved the installation space in electronic device 100.
9 are please referred to Fig.1, the second tread 678 of the above embodiment offers loophole 676, and proximity sensor 51 is located at
It is in camera case 67 and corresponding with loophole 676.Light outside electronic device 100 can pass through loophole 676 and be transmitted to
On proximity sensor 51.The proximity sensor 51 of present embodiment is arranged in camera case 67, makes proximity sensor 51 and phase
The structure of casing body 67 is more stablized and convenient for proximity sensor 51 and imaging modules 60 is installed on casing 20.
Figure 20 is please referred to, in some embodiments, the second tread 678 of the above embodiment offers loophole 676,
Proximity sensor 51 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, image sensing
Device 65 is arranged on substrate 66, and proximity sensor 51 may be also secured on substrate 66 and be housed in camera case 67.Specifically
Ground is provided with FPC on substrate 66, and one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can
It is connect with the mainboard 110 with electronic device 100.In other embodiments, proximity sensor 51 can also be connect with FPC.
The proximity sensor 51 of present embodiment is arranged in camera case 67, makes proximity sensor 51 and camera case 67
Structure more stablize and convenient for proximity sensor 51 and imaging modules 60 are installed on casing 20；Meanwhile imaging modules 60
Proximity sensor 51 is simultaneously arranged on substrate 66 by setting substrate 66, and proximity sensor 51 is enable to be firmly mounted to camera shell
In body 67.
Also referring to Fig. 1, Figure 21 and Figure 22, in some embodiments, the electronic device 100 of the above embodiment is also
Including the mainboard 110 being mounted in casing 20.Mainboard 110 is formed with installation gap 110a.Imaging modules 60 are mounted on casing 20
It is interior and corresponding with installation gap 110a.Proximity sensor 51 is incorporated on mainboard 110, and is stretched into from the edge of installation gap 110a
Installation gap 110a.Along along the depth direction (Z-direction in such as Figure 21) of installation gap 110a, proximity sensor 51 and imaging mould
Group 60 partly overlaps.
Specifically, mainboard 110 can be printed wiring board, and printed wiring board can be hardboard, soft board or Rigid Flex.
Electronic component, such as output module 10, proximity sensor 51, optical flame detector 52, imaging modules 60, receiver 70, structure light are thrown
80 grade of emitter can be connect with mainboard 110, and electronic component can be directly installed on mainboard 110 or install
It is connect in the other structures of electronic device 100, then by circuit with mainboard 110.Installation gap 110a is formed in mainboard 110
On, installation gap 110a can run through mainboard 110.Imaging modules 60 are in casing 20 and corresponding with installation gap 110a,
Can be that imaging modules 60 wear installation gap 110a；Can also be that the incidence holes of imaging modules 60 (in some embodiments, enters
Unthreaded hole is corresponded to above-mentioned light extraction through-hole 674) it is aligned with installation gap 110a, but do not penetrate installation gap 110a.
Proximity sensor 51 is incorporated on mainboard 110, and specifically, the pin of proximity sensor 51 can be welded on mainboard
On 110 pad, so that proximity sensor 51 is fixedly connected with mainboard 110.Proximity sensor 51 is from the side of installation gap 110a
Edge stretches into installation gap 110a, has saved the installation site on mainboard 110.Along depth direction (such as Figure 22 of installation gap 110a
In Z-direction) on, proximity sensor 51 partly overlaps with imaging modules 60, and proximity sensor 51 can be mutual with imaging modules 60
It is in contact, proximity sensor 51 can also be interval with imaging modules 60.Proximity sensor 51 is set with imaging modules 60
Compacter, the horizontal space that the two occupies jointly is smaller (perpendicular to the direction of Z-direction), has saved inside electronic device 100
Space.
Certainly, imaging modules 60 can be imaging modules 60 and its deformation of any of the above-described embodiment, no longer superfluous herein
It states.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means with reference to the embodiment
Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the present invention.
In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, description
Particular features, structures, materials, or characteristics can be in any one or more embodiments or example with suitable side
Formula combines.
In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one feature.In the description of the present invention, " multiple " are meant that at least two, such as two,
Three, unless otherwise specifically defined.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, changes, replacing and modification, the scope of the present invention are limited by claim and its equivalent.
Claims (14)
1. a kind of electronic device, which is characterized in that including：
Casing；
Module is exported, on the housing, the output module includes encapsulating housing, infrared light filling for the output module installation
Lamp and close to infrared lamp, the encapsulating housing includes package substrate, and the infrared light compensating lamp is encapsulated in described close to infrared lamp
In the encapsulating housing and carry on the package substrate, the infrared light compensating lamp with it is described can be with difference close to infrared lamp
Power emit infrared light outside the encapsulating housing；
Mainboard, the mainboard are mounted in the casing and are formed with installation gap；
Imaging modules, the imaging modules are mounted in the casing and corresponding with the installation gap；
Proximity sensor, the proximity sensor are incorporated on the mainboard, and are stretched into from the edge of the installation gap described
Installation gap, along the depth direction of the installation gap, the proximity sensor partly overlaps with the imaging modules；
Display screen, on the housing, the display screen is formed with light transmission entity area and including that can show for the display screen setting
Show the front of picture and the back side opposite with the front；And
Optical flame detector, the optical flame detector are arranged on the side where the back side of the display screen, the optical flame detector with it is described
Light entity area corresponds to, and the optical flame detector is used to receive the light being incident on the optical flame detector and the target light for exporting the light
By force.
2. electronic device according to claim 1, which is characterized in that the output module further includes chip, described infrared
Light compensating lamp is formed on one chip with described close to infrared lamp.
3. electronic device according to claim 2, which is characterized in that the encapsulating housing further includes package wall and encapsulation
Top, the package wall extend from the package substrate and are connected at the top of the encapsulation between the package substrate, institute
It states encapsulation top and is formed with light filling window and close to window, the light filling window is corresponding with the infrared light compensating lamp, described close
Window with it is described corresponding close to infrared lamp.
4. electronic device according to claim 2, which is characterized in that the output module further includes light-supplementing lamp lens, institute
Light-supplementing lamp lens are stated to be arranged in the encapsulating housing and corresponding with the infrared light compensating lamp；And/or
The output module is further included close to lamp lens, described to be arranged in the encapsulating housing close to lamp lens and connect with described
Near-infrared lamp corresponds to.
5. electronic device according to claim 2, which is characterized in that the output module, which further includes, is arranged on the encapsulation
Light-supplementing lamp lens in housing and close to lamp lens, the light-supplementing lamp lens are corresponding with the infrared light compensating lamp, described close to lamp
With described corresponding close to infrared lamp, the light-supplementing lamp lens are located at close to lamp lens on same transparent base lens with described.
6. electronic device according to claim 2, which is characterized in that the output module further includes metal shutter, institute
Metal shutter is stated to be located in the encapsulating housing and positioned at the infrared light compensating lamp and described close between infrared lamp.
7. electronic device according to claim 1, which is characterized in that the output module is further included to be made of translucent material
Optics sealing cover, the optics sealing cover formed on the package substrate and in the encapsulating housing, the optics sealing cover
Wrap the infrared light compensating lamp and described close to infrared lamp.
8. electronic device according to claim 7, which is characterized in that the output module further includes out light clapboard, described
Go out light clapboard to be formed in the optics sealing cover and positioned at the infrared light compensating lamp and described close between infrared lamp.
9. electronic device according to any one of claims 1 to 8, which is characterized in that be formed with and connect on the output module
Ground pin, light compensating lamp pin and close to lamp pin, the grounding pin and the light compensating lamp pin be enabled when, the infrared benefit
Light lamp emits infrared light；The grounding pin and it is described close to lamp pin be enabled when, it is described close to infrared lamp emit it is infrared
Light.
10. electronic device according to claim 1, which is characterized in that the electronic device further includes the cover board of light transmission, institute
It states casing and offers casing close to through-hole and casing light filling through-hole, it is described corresponding close to through-hole with the casing close to infrared lamp,
The light filling infrared lamp is corresponding with the casing light filling through-hole, and the cover board setting is on the housing.
11. electronic device according to claim 1, which is characterized in that the electronic device further includes the cover board of light transmission, institute
It states casing and offers casing close to through-hole and casing light filling through-hole, it is described corresponding close to through-hole with the casing close to infrared lamp,
The light filling infrared lamp is corresponding with the casing light filling through-hole, cover board setting on the housing, the cover board with it is described
The surface that casing combines, which is formed with, only transmits the infrared through ink of infrared light, and the infrared transmission ink blocks the casing and connects
Nearly at least one of through-hole and the casing light filling through-hole.
12. electronic device according to claim 1, which is characterized in that the light transmission entity area includes image pixel, described
Electronic device further includes processor, and the optical flame detector receives the light to export the ambient light for including the external electronic device
The initial beam intensity of strong information；The processor only includes the external electronic device for handling the initial beam intensity to obtain
The target light intensity of the environmental light intensity information.
13. electronic device as claimed in claim 12, which is characterized in that the initial beam intensity includes the environmental light intensity information
And the display intensity signal of display screen when showing image, the processor show image for obtaining the display screen in real time
When display intensity signal, and remove when handling the initial beam intensity display intensity signal to obtain the target light
By force.
14. electronic device as described in claim 1, which is characterized in that the light transmission entity area do not include image pixel and by
Multiple images pixel surrounds.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711437455.XA CN108183999A (en) | 2017-12-26 | 2017-12-26 | Electronic device |
| US16/231,266 US11449102B2 (en) | 2017-12-26 | 2018-12-21 | Electronic device |
| EP18215188.6A EP3514512B1 (en) | 2017-12-26 | 2018-12-21 | Electronic device |
| PCT/CN2018/123390 WO2019128967A1 (en) | 2017-12-26 | 2018-12-25 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711437455.XA CN108183999A (en) | 2017-12-26 | 2017-12-26 | Electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108183999A true CN108183999A (en) | 2018-06-19 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201711437455.XA Pending CN108183999A (en) | 2017-12-26 | 2017-12-26 | Electronic device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019128967A1 (en) * | 2017-12-26 | 2019-07-04 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Electronic device |
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| CN103050089A (en) * | 2011-10-12 | 2013-04-17 | 富泰华工业（深圳）有限公司 | Electronic device and method for adjusting brightness of display screen thereof |
| CN103515371A (en) * | 2012-06-27 | 2014-01-15 | 格科微电子（上海）有限公司 | Integrated optical sensor package |
| CN106550228A (en) * | 2015-09-16 | 2017-03-29 | 上海图檬信息科技有限公司 | Obtain the equipment of the depth map of three-dimensional scenic |
| CN107451542A (en) * | 2017-07-14 | 2017-12-08 | 广东欧珀移动通信有限公司 | Iris recognition modular arrangements structure and mobile terminal |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103050089A (en) * | 2011-10-12 | 2013-04-17 | 富泰华工业（深圳）有限公司 | Electronic device and method for adjusting brightness of display screen thereof |
| CN103515371A (en) * | 2012-06-27 | 2014-01-15 | 格科微电子（上海）有限公司 | Integrated optical sensor package |
| CN106550228A (en) * | 2015-09-16 | 2017-03-29 | 上海图檬信息科技有限公司 | Obtain the equipment of the depth map of three-dimensional scenic |
| CN107451542A (en) * | 2017-07-14 | 2017-12-08 | 广东欧珀移动通信有限公司 | Iris recognition modular arrangements structure and mobile terminal |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019128967A1 (en) * | 2017-12-26 | 2019-07-04 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Electronic device |
| US11449102B2 (en) | 2017-12-26 | 2022-09-20 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Electronic device |
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Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant after: OPPO Guangdong Mobile Communications Co., Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant before: Guangdong OPPO Mobile Communications Co., Ltd. |
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Application publication date: 20180619 |