CN108173991A - Electronic device - Google Patents
Electronic device Download PDFInfo
- Publication number
- CN108173991A CN108173991A CN201711437284.0A CN201711437284A CN108173991A CN 108173991 A CN108173991 A CN 108173991A CN 201711437284 A CN201711437284 A CN 201711437284A CN 108173991 A CN108173991 A CN 108173991A
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- China
- Prior art keywords
- infrared
- close
- light
- casing
- electronic device
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M2250/00—Details of telephonic subscriber devices
- H04M2250/12—Details of telephonic subscriber devices including a sensor for measuring a physical value, e.g. temperature or motion
Abstract
The invention discloses a kind of electronic devices.Electronic device includes casing, output module and receiving module.Output module is arranged in casing.It exports module and includes encapsulating housing, structured light projector and close to infrared lamp.Encapsulating housing includes package substrate, and for structured light projector with being encapsulated in encapsulating housing and being carried on package substrate close to infrared lamp, structured light projector can emit infrared light with different power from close to infrared lamp outside encapsulating housing.Receiving module is arranged on package substrate and outside encapsulating housing, and receiving module includes proximity sensor and/or optical flame detector.The integrated level for exporting module is higher, and small volume, packaging efficiency is higher, and receiving module is arranged on package substrate, it may not be necessary to set additional fixed structure fixed reception module again, save the installation space in electronic device.
Description
Technical field
The present invention relates to consumer electronics technical fields, more specifically, are related to a kind of electronic device.
Background technology
As the function that mobile phone is supported is more and more rich and varied, mobile phone needs the type and quantity of function element set
It is more and more, in order to realize the functions such as the facial 3D feature recognitions of distance detection, environment light detection and user, need to set in electronics
The function elements such as standby middle configuration proximity sensor, ambient light sensor, infrared pick-up head, structured light projector, and for cloth
Numerous function elements is put, the excessive space of mobile phone can be occupied.
Invention content
Embodiment of the present invention provides a kind of electronic device.
The electronic device of embodiment of the present invention includes：
Casing；
Module is exported, the output module is arranged in the casing, and the output module includes encapsulating housing, structure light
The projector and close to infrared lamp, the encapsulating housing include package substrate, the structured light projector with it is described close to infrared lamp
Be encapsulated in the encapsulating housing and carry on the package substrate, the structured light projector with it is described close to infrared lamp energy
It is enough that infrared light is emitted outside the encapsulating housing with different power；With
Setting is on the package substrate and the receiving module outside the encapsulating housing, the receiving module include connecing
Nearly sensor and/or optical flame detector.
In some embodiments, the output module further includes chip, and the structured light projector is with described close to red
Outer lamp is formed on a piece of chip.
In some embodiments, the encapsulating housing further includes package wall and encapsulation top, and the package wall is certainly
The package substrate extends and is connected at the top of the encapsulation between the package substrate, and structure is formed at the top of the encapsulation
Light window and close to window, the structure light window is corresponding with the structured light projector, it is described close to window with it is described close
Infrared lamp corresponds to.
In some embodiments, the output module is further included close to lamp lens, described to be arranged on institute close to lamp lens
State in encapsulating housing and with it is described corresponding close to infrared lamp.
In some embodiments, the output module further includes metal shutter, and the metal shutter is located at described
In encapsulating housing and positioned at the structured light projector and described close between infrared lamp.
In some embodiments, grounding pin, structure light pin are formed with and close to lamp pin on the output module,
When the grounding pin and the structure light pin are enabled, the structured light projector emits infrared light；The grounding lead
Foot and it is described close to lamp pin be enabled when, it is described close to infrared lamp emit infrared light.
In some embodiments, the electronic device further includes the cover board of light transmission, and the casing offers casing and approaches
Through-hole and casing structure light through-hole, it is described corresponding close to through-hole with the casing close to infrared lamp, the structured light projector with
The casing structure light through-hole corresponds to, and the cover board setting is on the housing.
In some embodiments, the electronic device further includes the cover board of light transmission, and the casing offers casing and approaches
Through-hole and casing structure light through-hole, it is described corresponding close to through-hole with the casing close to infrared lamp, the structured light projector with
The casing structure light through-hole corresponds to, and the cover board is set on the housing, the surface that the cover board is combined with the casing
It is formed with and only transmits the infrared through ink of infrared light, the infrared ink that penetrates blocks the casing close to through-hole and the machine
At least one of shell structure light through-hole.
In some embodiments, the electronic device further include infrared pick-up head, visible image capturing head, receiver and
Infrared light compensating lamp, the output module, the infrared pick-up head, the visible image capturing head, the receiver and described red
The center of outer light compensating lamp is located on same line segment, is followed successively by from one end of the line segment to the other end：
The output module, the infrared light compensating lamp, the receiver, the infrared pick-up head, the visible ray are taken the photograph
As head；Or
The output module, the visible image capturing head, the receiver, the infrared pick-up head, the infrared benefit
Light lamp；Or
The infrared pick-up head, the infrared light compensating lamp, the receiver, the visible image capturing head, the output
Module；Or
The infrared pick-up head, the visible image capturing head, the receiver, the output module, the infrared benefit
Light lamp.
In some embodiments, the electronic device further include infrared pick-up head, visible image capturing head, receiver,
Infrared light compensating lamp and the cover board of light transmission, on the housing, the casing offers casing sound outlet hole, described for the cover board setting
Cover board offers cover board sound outlet hole, and the receiver is corresponding with the position of the cover board sound outlet hole and the casing sound outlet hole, institute
The center for stating output module, the infrared pick-up head, the visible image capturing head and the infrared light compensating lamp is located at same line
Duan Shang, the receiver is between the line segment and the top of the casing.
In the electronic device of embodiment of the present invention, output module is by structured light projector with being integrated into one close to infrared lamp
A list package body structure has gathered transmitting infrared light with the function of infrared distance measurement and three-dimensional imaging, therefore, has exported the integrated of module
Higher, small volume is spent, output module has saved the space for the function of realizing three-dimensional imaging and infrared distance measurement.In addition, due to knot
Structure light projector and be carried on same package substrate close to infrared lamp, compared to traditional handicraft structured light projector with connecing
Near-infrared lamp, which needs to be respectively adopted in different wafer manufacture recombinants to PCB substrate, to be encapsulated, and improves packaging efficiency.Furthermore it connects
It receives module to be disposed on the substrate, it may not be necessary to set additional fixed structure fixed reception module again, save in electronic device
Installation space.Furthermore receiving module is arranged on package substrate, it may not be necessary to additional fixed structure be set to fix again and connect
Module is received, saves the installation space in electronic device.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partly will be from following
Description in become apparent or recognized by the practice of embodiments of the present invention.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change
It obtains significantly and is readily appreciated that, wherein：
Fig. 1 is the structure diagram of the electronic device of embodiment of the present invention；
Fig. 2 is the stereoscopic schematic diagram of the output module of the electronic device of embodiment of the present invention；
Fig. 3 is the schematic cross-section of the output module of the electronic device of embodiment of the present invention；
Fig. 4 is the stereoscopic schematic diagram of the output module of the electronic device of embodiment of the present invention；
Fig. 5 is the partial sectional schematic view of the electronic device of embodiment of the present invention；
Fig. 6 is the receiving module of the electronic device of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules；
Fig. 7 is the arrangement schematic diagram of the electronic component of the electronic device of embodiment of the present invention；
Fig. 8 is the schematic cross-section of the output module of another embodiment of the present invention；
Fig. 9 is the proximity sensor of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules；
Figure 10 is the structure diagram of the electronic device of another embodiment of the present invention；
Figure 11 is the partial sectional schematic view of the electronic device of another embodiment of the present invention；
Figure 12 is the partial sectional schematic view of the electronic device of a further embodiment of this invention；
Figure 13 is the output module of the electronic device of embodiment of the present invention and the stereoscopic schematic diagram of receiving module；
Figure 14 is the receiving module of another embodiment of the present invention and the stereoscopic schematic diagram of imaging modules；
Figure 15 is the receiving module of the electronic device of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules；
Figure 16 is the receiving module of the electronic device of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules；
Figure 17 is the receiving module of the electronic device of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules；
Figure 18 is the receiving module of the electronic device of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules；
Figure 19 is the receiving module of the electronic device of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules；
Figure 20 is the receiving module of the electronic device of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules；
Figure 21 is the receiving module of the electronic device of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules；With
Figure 22 is the receiving module of the electronic device of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules.
Specific embodiment
Embodiments of the present invention are described further below in conjunction with attached drawing.Same or similar label is from beginning in attached drawing
To the whole element for representing same or similar element or there is same or like function.
In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, it is only used for explaining the present invention's
Embodiment, and be not considered as limiting the invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature can be with "above" or "below" second feature
It is that the first and second features are in direct contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature right over second feature or oblique upper or be merely representative of
Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be
One feature is immediately below second feature or obliquely downward or is merely representative of fisrt feature level height less than second feature.
Referring to Fig. 1, the electronic device 100 of embodiment of the present invention includes casing 20, cover board 30 and electronic component.Electricity
Sub- component includes output module 10, receiving module 50 (such as Fig. 6), imaging modules 60 (such as Fig. 6), receiver 70 and infrared light filling
Lamp 80.Electronic device 100 can be mobile phone, tablet computer, laptop, smartwatch, Intelligent bracelet, automatic teller machine etc., this
Inventive embodiments are illustrated so that electronic device 100 is mobile phone as an example, it will be understood that the concrete form of electronic device 100 can be with
It is other, this is not restricted.
Fig. 2 and Fig. 3 are please referred to, output module 10 is single package body structure, including encapsulating housing 11, structured light projector 12
With close to infrared lamp 13.
Encapsulating housing 11 is for encapsulating structure light projector 12 simultaneously and close to infrared lamp 13, in other words, project structured light
Device 12 and close to infrared lamp 13 simultaneously be encapsulated in encapsulating housing 11.Encapsulating housing 11 includes package substrate 111, package wall
112 and at the top of encapsulation 113.Encapsulating housing 11 can be by electromagnetic interference (Electromagnetic Interference, EMI)
Shielding material is made, and output module 10 is had an impact to avoid extraneous electromagnetic interference.
Package substrate 111 is for bearing structure light projector 12 and close to infrared lamp 13.When manufacture exports module 10, knot
Structure light projector 12 and can be formed on a piece of chip 14 close to infrared lamp 13, then by structured light projector 12, close to infrared
Lamp 13 and chip 14 are set along on package substrate 111, and specifically, chip 14 can be bonded on package substrate 111.Together
When, package substrate 111 can be used for (such as the casing 20 of electronic device 100, main with other parts of electronic device 100
Plate etc.) connection, module 10 will be exported and be fixed in electronic device 100.
Package wall 112 can be set with coil structure light projector 12 and close to infrared lamp 13, and package wall 112 encapsulates certainly
Substrate 111 extends, and package wall 112 can be combined with package substrate 111, preferably, package wall 112 is with package substrate 111
It is detachably connected, in order to remove to structured light projector 12 after package wall 112 and overhauled close to infrared lamp 13.Envelope
The making material of dress side wall 112 can be the material of impermeable infrared light, to avoid structured light projector 12 or close to infrared lamp 13
The infrared light sent out passes through package wall 112.
Encapsulation top 113 is opposite with package substrate 111, and encapsulation top 113 is connect with package wall 112.Encapsulation top 113
It is formed with structure light window 1131 and close to window 1132, structure light window 1131 is corresponding with structured light projector 12, structure light
The structure light (infrared light) that the projector 12 emits is pierced by from structure light window 1131；Close to window 1132 with it is right close to infrared lamp 13
Should, the infrared light emitted close to infrared lamp 13 is pierced by from close to window 1132.Encapsulation top 113 can be with one with package wall 112
Body shapes to obtain, can also split shape to obtain.In one example, structure light window 1131 and close to window 1132 be logical
Hole, the making material at encapsulation top 113 is the material of impermeable infrared light.In another example, encapsulation top 113 is by impermeable infrared
The material co-manufactured of the material of light and saturating infrared light forms, specifically, structure light window 1131 and close to window 1132 by saturating
The material of infrared light is made, remaining position is made of the material of impermeable infrared light, further, structure light window 1131 and close
Window 1132 could be formed with lens arrangement, be sent out with the infrared light for improving from structure light window 1131 and being projected close to window 1132
Firing angle degree, such as structure light window 1131 are formed with concavees lens structure so that across structure light window 1131 divergence of beam to
Outer injection；Convex lens structures are formed with close to window 1132, so as to gather outside injection across the light close to window 1132.
Structured light projector 12 further reduces structure light and throws with that can be formed on a piece of chip 14 close to infrared lamp 13
Emitter 12 and the volume close to infrared lamp 13 after integrated, and preparation process is simpler.Structured light projector 12 can outside emitter junction
Structure light, structure light can form infrared laser speckle pattern, project structured light to target object surface, by infrared pick-up head 62
Acquisition (as shown in Figure 1) is by the modulated structured light patterns of target object, by analyzing the structured light patterns modulated
Calculate the depth image (at this point, structured light projector is used for three-dimensional imaging) for obtaining target object.In embodiments of the present invention, it ties
Structure light projector 12 includes light source 121, mirror holder 122, lens 123 and diffraction optical element (diffractive optical
elements,DOE)124.The light beam that light source 121 is sent out is expanded after lens 123 are collimated or converged by diffraction optical element 124
And emitted outward with certain beam pattern.Specifically, light source 121 can be formed on chip 14, lens 123 and diffraction optics
Element 124 can be fixed on mirror holder 122, such as is fixed on mirror holder 122 by way of gluing.It can be sent out close to infrared lamp 13
Infrared light is penetrated, infrared light passes through close to window 1132 and reaches body surface, 51 (such as Fig. 6 of proximity sensor of electronic device 100
It is shown) infrared light being reflected by the object is received with the distance of detection object to electronic device 100 (at this point, being used close to infrared lamp 13
In infrared distance measurement).
Structured light projector 12 can emit infrared light with different power from close to infrared lamp 13 outside encapsulating housing 11
Line, specifically, with that can emit infrared light simultaneously close to infrared lamp 13, output module 10 is used for structured light projector 12 simultaneously
Three-dimensional imaging and infrared distance measurement；Can also structured light projector 12 emit light and do not emit light close to infrared lamp 13, export
Module 10 is only used for three-dimensional imaging；Can also structured light projector 12 do not emit light and emit light close to infrared lamp 13, it is defeated
Go out module 10 and be only used for infrared distance measurement.Incorporated by reference to Fig. 4, in embodiments of the present invention, export and be formed with grounding pin on module 10
15th, structure light pin 16 and close to lamp pin 17.It grounding pin 15, structure light pin 16 and can be formed in close to lamp pin 17
On package substrate 111, when grounding pin 15 and structure light pin 16 are enabled (that is, grounding pin 15 and structure light pin 16
When accessing circuit turn-on), structured light projector 12 emits infrared light；When grounding pin 15 and when being enabled close to lamp pin 17
(that is, grounding pin 15 and close to lamp pin 17 access circuit turn-on when), close to infrared lamp 13 emit infrared light；Work as grounding lead
Foot 15, structure light pin 16 and close to lamp pin 17 be enabled when (that is, grounding pin 15, structure light pin 16 and drawing close to lamp
When foot 17 accesses circuit turn-on), structured light projector 12 emits infrared light, and emits infrared light close to infrared lamp 13.
It please refers to Fig.1 and Fig. 5, casing 20 can be as the installation carrier of output module 10, in other words, output module 10 can
To be arranged in casing 20.Casing 20 can be the shell of electronic device 100, in embodiments of the present invention, may be used also in casing 20
For setting the display screen 90 of electronic device 100, since the output module 10 of embodiment of the present invention can occupy smaller body
Therefore product, for setting the volume of display screen 90 that can correspond to increase in casing 20, is accounted for the screen for improving electronic device 100
Than.Specifically, casing 20 include top 21 and bottom 22, display screen 90 and output module 10 be arranged on top 21 and bottom 22 it
Between, in the state of user's normal use electronic device 100, top 21 is located at the top of bottom 22, as shown in Figure 1, output mould
Group 10 can be arranged between display screen 90 and top 21.In other embodiments, display screen 90 can be to shield and open comprehensively
Equipped with notch, display screen 90 surrounds output module 10, and exports module 10 and expose from the notch of display screen 90.
Casing 20 is further opened with casing close to through-hole 23 and casing structure light through-hole 24.Output module 10 is arranged on casing 20
Corresponding close to through-hole 23 with casing close to infrared lamp 13 when interior, structured light projector 12 is corresponding with casing structure light through-hole 24.Its
In can be from casing close to through-hole 23 close to the corresponding light sent out close to infrared lamp 13 that refers to of through-hole 23 close to infrared lamp 13 and casing
It passes through, can emit close to infrared lamp 13 and casing close to 23 face of through-hole or close to infrared lamp 13 specifically
Light passes through casing close to through-hole 23 after light-guide device acts on.Structured light projector 12 is corresponding with casing structure light through-hole 24 same
Reason, therefore not to repeat here.In the embodiment as shown in fig.5, casing can be close to through-hole 23 and casing structure light through-hole 24
Apart from one another by, certainly, in other embodiments, casing can also mutually be connected with casing structure light through-hole 24 close to through-hole 23
Logical.
Cover board 30 can be light transmission, and the material of cover board 30 can be glass, resin, plastics of light transmission etc..Cover board 30 is set
It puts on casing 20, the inner surface 32 and the outer surface 31 opposite with inner surface 32 that cover board 30 includes with casing 20 is combined are defeated
Go out after the light that module 10 is sent out sequentially passes through inner surface 32 and outer surface 31 and be pierced by cover board 30.In embodiment as shown in Figure 5
In, cover board 30 covers casing structure light through-hole 24 and casing close to through-hole 23, is coated on the inner surface 32 of cover board 30 infrared
Ink 40 is crossed, it is infrared to have higher transmitance to infrared light through ink 40, such as 85% or more is can reach, and to visible ray
There is higher attenuation rate, such as can reach more than 70% so that user during normal use, is visually difficult to see that electronic device
By the infrared region covered through ink 40 on 100.Specifically, it is infrared to be covered on inner surface 32 not with showing through ink 40
90 corresponding region of display screen.
It is infrared to block casing close at least one of through-hole 23 and casing structure light through-hole 24 through ink 40,
That is, infrared can cover casing close to through-hole 23 and casing structure light through-hole 24 (as shown in Figure 5), user simultaneously through ink 40
It is difficult to close to through-hole 23 and casing structure light through-hole 24 see by casing the internal structure of electronic device 100, electronic device 100
Shape it is more beautiful；It is infrared to cover casing close to through-hole 23, and do not cover casing structure light through-hole 24 through ink 40；
Or the infrared ink 40 that penetrates can also cover casing structure light through-hole 24, and do not cover casing close to through-hole 23.
Referring to Fig. 6, receiving module 50 is integrated with proximity sensor 51 and optical flame detector 52, proximity sensor 51 and optical flame detector
52 are collectively formed single packaging body.The infrared light sent out close to infrared lamp 13, after being reflected by external object, by proximity sensor
51 receive, and proximity sensor 51 is judged according to the infrared light reflected received between external object and electronic device 100
Distance.Optical flame detector 52 receives the visible ray in ambient light, and detects the intensity of visible ray, using the display as control display screen 90
The foundation of brightness.Proximity sensor 51 and optical flame detector 52 are packaged into receiving module 50 jointly, between reducing when the two is individually assembled
Gap saves the installation space in electronic device 100.
It please refers to Fig.1 and Fig. 6, imaging modules 60 can be visible image capturing head 61 and one in infrared pick-up head 62
Or two.Imaging modules 60 include microscope base 63, lens barrel 64 and imaging sensor 65.Lens barrel 64 is mounted on microscope base 63, and image passes
Sensor 65 is housed in microscope base 63.Microscope base 63 includes mounting surface 631, mounting surface 631 be located at lens barrel 64 and imaging sensor 65 it
Between.In the embodiment illustrated in fig. 6, receiving module 50 is arranged on mounting surface 631, and specifically, receiving module 50 is being installed
Plane orthographic projection where face 631 is at least partly dropped on mounting surface 631, in this way, receiving module 50 is set with imaging modules 60
Put compacter, the horizontal space that the two occupies jointly is smaller.
Referring to Fig. 1, receiver 70 is for sending out acoustic signals when being encouraged by power supply, user can by by
Words device 70 is conversed.Infrared light compensating lamp 80 for emitting infrared light outward, after infrared light is reflected by external object surface, electronics
The infrared pick-up head 62 of device 100 receives the infrared light that is reflected by the object to obtain the image information of object.
In the embodiment shown in fig. 1, imaging modules 60 include visible image capturing head 61 and infrared pick-up head 62, defeated
The center for going out module 10, visible image capturing head 61, infrared pick-up head 62, receiver 70 and infrared light compensating lamp 80 is located at same line
Duan Shang.Specifically, output module 10, infrared light compensating lamp 80, receiver 70, infrared light are followed successively by from one end of line segment to the other end
Camera 62, visible image capturing head 61 (as shown in Figure 7)；Or be followed successively by from one end of line segment to the other end output module 10,
Visible image capturing head 61, receiver 70, infrared pick-up head 62, infrared light compensating lamp 80 (as shown in Figure 1)；Or one from line segment
The other end is held to be followed successively by infrared pick-up head 62, infrared light compensating lamp 80, receiver 70, visible image capturing head 61, output module
10；Or infrared pick-up head 62, visible image capturing head 61, receiver 70, output are followed successively by from one end of line segment to the other end
Module 10, infrared light compensating lamp 80.Certainly, module 10, infrared pick-up head, receiver 70, visible image capturing head 61, infrared is exported
The arrangement mode of light compensating lamp 80 is not limited to above-mentioned citing, can also there is other, such as the center of each electronic component is arranged in
Arc-shaped, center arranges the shapes such as rectangular.
Further, incorporated by reference to Fig. 6, receiving module 50 can be arranged on the mounting surface 631 of infrared pick-up head 62,
It can be arranged on the mounting surface 631 of visible image capturing head 61, certainly, receiving module 50 can not also be arranged on mounting surface 631
On, receiving module 50 can be disposed adjacent with output module 10, and proximity sensor 51 is readily received by being sent out close to infrared lamp 13
It penetrates, and the infrared light being reflected back by external object；Receiving module 50 can also be disposed adjacent with receiver 70, when user answers electricity
During words, proximity sensor 51 is readily detected the ear of user close to receiver 70.
To sum up, in the electronic device 100 of embodiment of the present invention, output module 10 by structured light projector 12 with close to red
Outer lamp 13 is integrated into a single encapsulation body mechanism, has gathered transmitting infrared light with the function of infrared distance measurement and three-dimensional imaging, therefore,
The integrated level for exporting module 10 is higher, small volume, and output module 10 has saved the function of realizing three-dimensional imaging and infrared distance measurement
Space.In addition, since structured light projector 12 close to infrared lamp 13 with being carried on same package substrate 111, compared to
The structured light projector 12 of traditional handicraft needs to be respectively adopted different wafers manufacture recombinants to PCB substrate from close to infrared lamp 13
Upper encapsulation, improves packaging efficiency.
Referring to Fig. 3, in some embodiments, output module 10 is further included close to lamp lens 19.Close to lamp lens 19
It is arranged in encapsulating housing 11 and corresponding with close to infrared lamp 13.Close to the infrared light that infrared lamp 13 emits close to lamp lens 19
Under the action of converge to close in window 1132 and project, reduce other regions for being emitted to package wall 112 and encapsulation top 113
Light quantity.
Referring to Fig. 3, in some embodiments, output module 10 further includes metal shutter 18, metal shutter 18
In encapsulating housing 11, and metal shutter 18 is located at structured light projector 12 and close between infrared lamp 13.Metal blocks
Plate 18 is located at structured light projector 12 and close between infrared lamp 13, and metal shutter 18 on the one hand can be with shielding construction light projection
Device 12 with close to the mutual electromagnetic interference of infrared lamp 13, structured light projector 12 and the luminous intensity close to infrared lamp 13 and
Sequential will not interact, and another aspect metal shutter 18 can be used for 12 place cavity of isolation structures light projector with approaching
Cavity where infrared lamp 13, light will not enter another cavity from a cavity.
Referring to Fig. 8, in some embodiments, output module 10 further includes optics sealing cover 1a.Optics sealing cover 1a is by saturating
Luminescent material is made, and optics sealing cover 1a is formed on package substrate 111 and in encapsulating housing 11.Optics sealing cover 1a, which is wrapped, to be connect
Near-infrared lamp 13.Specifically, optics sealing cover 1a can be formed by encapsulating injection molding and forming technology, and optics sealing cover 1a may be used
Bright thermosetting epoxy resin is made, and to be not easy to soften in use, optics sealing cover 1a can fix the position close to infrared lamp 13
It puts, and to be not easy to shake in encapsulating housing 11 close to infrared lamp 13.
Referring to Fig. 9, in some embodiments, proximity sensor 51 can be not integrated in receiving module with optical flame detector 52
In 50, in other words, proximity sensor 51 is separately set with optical flame detector 52.At this point, proximity sensor 51 can be arranged on microscope base 63
Mounting surface 631 on；Optical flame detector 52 can also be arranged on the mounting surface 631 of microscope base 63；Or proximity sensor 51 and light sensation
Device 52 is arranged on the mounting surface 631 of microscope base 63 simultaneously.Microscope base 63 can be the microscope base 63 of infrared pick-up head 62 or
The microscope base 63 of visible image capturing head 61.
Referring to Fig. 10, in some embodiments, casing 20 is further opened with casing sound outlet hole (not shown), and cover board 30 is also
Cover board sound outlet hole 35 is offered, receiver 70 is corresponding with the position of cover board sound outlet hole 35 and casing sound outlet hole.Export module 10, red
The center of outer light video camera head 62, visible image capturing head 61 and infrared light compensating lamp 80 is located on same line segment, and receiver 70 is located at should
Between line segment and the top 21 of casing 20.
The center of receiver 70 is not located on the line segment, and it is (output module 10, red to have saved each electronic component on cover board 30
Outer light video camera head 62, visible image capturing head 61, infrared light compensating lamp 80 etc.) occupy horizontal space.In implementation as shown in Figure 10
In example, cover board sound outlet hole 35 is opened in the marginal position of cover board 30, and casing sound outlet hole is opened up close to top 21.
1 is please referred to Fig.1, covering plate structure light through-hole 34, cover board can also be offered in some embodiments, on cover board 30
Structure light through-hole 34 is corresponding with casing structure light through-hole 24, and the infrared light that structured light projector 12 emits leads to across casing structure light
Electronic device 100 can be pierced by behind hole 24 from covering plate structure light through-hole 34.It is at this point, right close to through-hole 23 with casing on cover board 30
The position answered can set infrared transmission ink 40, and user is difficult to close to through-hole 23 see in electronic device 100 by casing
Portion close to infrared lamp 13, the shape of electronic device 100 is more beautiful.
2 are please referred to Fig.1, cover board can also be opened up in some embodiments, on cover board 30 close to through-hole 33, cover board approaches
Through-hole 33 is corresponding close to through-hole 23 with casing, and the infrared light emitted close to infrared lamp 13 passes through casing can be from close to after through-hole 23
Cover board is pierced by electronic device 100 close in through-hole 33.It at this point, can be with 24 corresponding position of casing structure light through-hole on cover board 30
Infrared transmission ink 40 is set, and user is difficult to see by casing structure light through-hole 24 structure light of the inside of electronic device 100
The projector 12, the shape of electronic device 100 are more beautiful.
3 are please referred to Fig.1, in some embodiments, receiving module 50 can be arranged on package substrate 111.Specifically,
A part for package substrate 111 is enclosed for bearing structure light projector 12 and close to infrared lamp 13 with package wall 112 in other words
Into space correspond to；Another part of package substrate 111 is protruding, and receiving module 50 can be fixed on package substrate 111
And outside encapsulating housing 11.On package substrate 111 can laying-out, circuit can be structured light projector 12 and close to infrared
The control of lamp 13 and driver circuit, in one example, circuit are the form of FPC, and FPC can connect with receiving module 50 simultaneously
It connects, control and drive signal for simultaneous transmission receiving module 50.
At this point, receiving module 50 can be integrated with proximity sensor 51 and optical flame detector 52, proximity sensor 51 and optical flame detector
52 are collectively formed single package body structure, reduce gap when the two is individually assembled；Receiving module 50 can also be only included close to biography
Sensor 51, optical flame detector 52 can separately be arranged on other positions；Receiving module 50 can also only include optical flame detector 52, close to sensing
Device 51 can separately be arranged on other positions.
4 are please referred to Fig.1, in some embodiments, imaging modules 60 further include substrate 66, and imaging sensor 65 is arranged on
On substrate 66, receiving module 50 may be also secured on substrate 66.Specifically, it is provided with FPC on substrate 66, one of substrate 66
Divide and be located in microscope base 63, another part is stretched out out of microscope base 63, and one end of FPC is located in microscope base 63 and is used to carry image sensing
Device 65, the other end can be connect with the mainboard of electronic device 100.When receiving module 50 is arranged on substrate 66, receiving module 50
It is arranged on outside microscope base 63, receiving module 50 can also be connect with FPC.
Further, the receiving module 50 for being arranged on substrate 66 includes proximity sensor 51 and optical flame detector 52, close to sensing
Single package body structure is collectively formed with optical flame detector 52 in device 51, reduces gap when the two is individually assembled, saves in electronic device 100
Installation space.In other embodiments, the receiving module 50 for being arranged on substrate 66 includes proximity sensor 51 or/and light sensation
Device 52, proximity sensor 51 and optical flame detector 52 are respectively single package body structure.That is, the receiving module 50 for being arranged on substrate 66 is single
The proximity sensor 51 of package body structure；Alternatively, the receiving module 50 for being arranged on substrate 66 is the optical flame detector of single package body structure
52；Alternatively, the receiving module 50 for being arranged on substrate 66 is the proximity sensor 51 of single package body structure and single package body structure
Optical flame detector 52.
Imaging modules 60 can be visible image capturing head 61 and one or two in infrared pick-up head 62.Specifically,
Receiving module 50 can be fixed on the substrate 66 of visible image capturing head 61；Receiving module 50 can be fixed on infrared pick-up head
On 62 substrate 66.When proximity sensor 51 and optical flame detector 52 are encapsulated for split, proximity sensor 51 can be fixed on visible
On the substrate 66 of light video camera head 61, optical flame detector 52 can be fixed on the substrate 66 of infrared pick-up head 62；Alternatively, optical flame detector 52
It can be fixed on the substrate 66 of visible image capturing head 61, proximity sensor 51 can be fixed on the substrate of infrared pick-up head 62
On 66；Alternatively, proximity sensor 51 is each attached to optical flame detector 52 on the substrate 66 of visible image capturing head 61；Alternatively, close to passing
Sensor 51 is each attached to optical flame detector 52 on the substrate 66 of infrared pick-up head 62.
Further, substrate 66 further includes stiffening plate, and stiffening plate is arranged on the side opposite with receiving module 50, to increase
The integral strength of substrate 66 so that FPC is not susceptible to around folding, while receiving module 50 (or proximity sensor 51 or optical flame detector 52)
It is not susceptible to shake when being arranged on substrate 66.In one example, receiving module 50 (or proximity sensor 51 or optical flame detector
52) it may be also secured on the lateral wall of microscope base 63, such as be fixed on the lateral wall of microscope base 63 by cohesive mode.
5 are please referred to Fig.1, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace
It is changed to lower structure：Imaging modules 60 include imaging sensor 65, camera case 67 and camera lens module 68.The top of camera case 67
Face 670 is cascaded surface, and top surface 670 includes the first sub- top surface 671, the second sub- top surface 672 and the sub- top surface 673 of third, the second son top
672 and first sub- top surface 671 of face tilts connection and forms notch 675, the sub- top surface 673 and second of third with the first sub- top surface 671
Sub- top surface 672 tilts connection, and the second sub- top surface 672 is between the first sub- top surface 671 and the sub- top surface 673 of third to connect first
Sub- top surface 671 and the sub- top surface 673 of third.Angle between second sub- 672 and first sub- top surface 671 of top surface can be obtuse angle or straight
Angle, the angle between the second sub- top surface 672 and the sub- top surface 673 of third can be obtuse angle or right angle.Notch 675 is opened in camera shell
On one end of body 67, that is to say, that notch 675 is located at the marginal position of top surface 670.The sub- top surface 673 of third offers out
Light through-hole 674, camera lens module 68 are housed in camera case 67 and corresponding with light extraction through-hole 674.Imaging sensor 65 is housed in
In camera case 67 and corresponding with camera lens module 68, the light outside electronic device 100 can pass through light extraction through-hole 674 and camera lens mould
Group 68 is simultaneously transmitted on imaging sensor 65, and imaging sensor 65 converts optical signals to electric signal.Receiving module 50 is arranged on
At first sub- top surface 671, receiving module 50 includes proximity sensor 51 and optical flame detector 52.In present embodiment, imaging modules 60
Can be visible image capturing head 61, receiving module 50 is single packaging body that proximity sensor 51 is collectively formed with optical flame detector 52.It connects
Nearly sensor 51 can be consistent with the extending direction of notch 675 (as shown in figure 15) with the center line connecting direction of optical flame detector 52；Or
Person, proximity sensor 51 can be vertical with the extending direction of notch 675 or in the two shape with the center line connecting direction of optical flame detector 52
Into angle be acute angle or obtuse angle.In other embodiments, imaging modules 60 can be infrared pick-up head 62.
The imaging modules 60 of present embodiment offer notch 675, and receiving module 50 is arranged on the first sub- top surface
On 671, receiving module 50 is made to set compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, saves
Installation space in electronic device 100；Meanwhile proximity sensor 51 and optical flame detector 52 are packaged into receiving module 50 jointly, reduce
The installation space in electronic device 100 is saved in gap when the two is individually assembled.
Please continue to refer to Figure 15, in some embodiments, the receiving module 50 of the above embodiment is arranged on the first son
On top surface 671 and positioned at the outside of camera case 67, specifically, entire receiving module 50 is along perpendicular to the first sub- top surface 671
Projection can be located in the first sub- top surface 671 (as shown in figure 15)；Alternatively, part receiving module 50 is pushed up along perpendicular to the first son
The projection in face 671 is located in the first sub- top surface 671.That is, receiving module 50 is at least part of to be located at the first sub- top surface
671 surface, in this way, receiving module 50 sets compacter with imaging modules 60, the horizontal space that the two occupies jointly compared with
It is small, further save the installation space in electronic device 100.In other embodiments, receiving module 50 is included close to biography
Sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are two individual single packaging bodies, at this point, being respectively single envelope
The proximity sensor 51 and optical flame detector 52 for filling body can also be all disposed on the first sub- top surface 671.
6 are please referred to Fig.1, in some embodiments, the receiving module 50 of the above embodiment only includes proximity sensor
51, not comprising optical flame detector 52, tied at this point, proximity sensor 51 (or receiving module 50) is respectively monomer encapsulation with optical flame detector 52
Structure, proximity sensor 51 are arranged on the first sub- top surface 671, and optical flame detector 52 is arranged on any other except the first sub- top surface 671
Position.
Please continue to refer to Figure 16, in some embodiments, the receiving module 50 of the above embodiment only includes optical flame detector
52, and not comprising proximity sensor 51, at this point, optical flame detector 52 (or receiving module 50) is respectively monomer envelope with proximity sensor 51
Assembling structure, optical flame detector 52 are arranged on the first sub- top surface 671, proximity sensor 51 be arranged on except the first sub- top surface 671 other
Any position.
7 are please referred to Fig.1, the first sub- top surface 671 of the above embodiment offers loophole 676, and receiving module 50 is located at
It is in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 only includes proximity sensor 51 without light sensation
Device 52, and optical flame detector 52 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, outside electronic device 100
The light in portion can pass through loophole 676 and be transmitted on proximity sensor 51.The receiving module 50 of present embodiment is arranged on
In camera case 67, receiving module 50 and the structure of camera case 67 is made more to stablize and be convenient for receiving module 50 and imaging mould
Group 60 is installed on casing 20.
Please continue to refer to 17, the first sub- top surface 671 of the above embodiment offers loophole 676, receiving module 50
It is in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 comprises only optical flame detector 52 without close
Sensor 51, and proximity sensor 51 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, electronics
Light outside device 100 can pass through loophole 676 and be transmitted on optical flame detector 52.The receiving module 50 of present embodiment is set
Put in camera case 67, make the structure of receiving module 50 and camera case 67 more stablize and convenient for by receiving module 50 with into
As module 60 is installed on casing 20.
8 are please referred to Fig.1, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole
676, receiving module 50 is located in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 be integrated with it is close
When sensor 51 is with optical flame detector 52, loophole 676 can be one and proximity sensor 51 and the corresponding light transmission of optical flame detector 52
Hole or two it is spaced and respectively with 52 corresponding loophole of proximity sensor 51 and optical flame detector, outside electronic device 100
On the proximity sensor 51 and optical flame detector 52 that light can pass through loophole 676 and be transmitted in receiving module 50.In other realities
It applies in mode, receiving module 50 includes proximity sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are two
Individually list packaging body, at this point, camera can also be all disposed within by being respectively the proximity sensor 51 of single packaging body and optical flame detector 52
It is in housing 67 and corresponding with loophole 676.The receiving module 50 of present embodiment is arranged in camera case 67, makes receiving module
50 more stablize with the structure of camera case 67 and convenient for receiving module 50 and imaging modules 60 are installed on casing 20.
8 are please referred to Fig.1, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole
676, receiving module 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, and image passes
Sensor 65 is arranged on substrate 66, and receiving module 50 may be also secured on substrate 66 and be housed in camera case 67.Specifically
Ground is provided with FPC on substrate 66, and one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can
It is connect with the mainboard with electronic device 100.In other embodiments, receiving module 50 can also be connect with FPC.This embodiment party
In formula, the receiving module 50 being arranged on substrate 66 includes proximity sensor 51 and optical flame detector 52, proximity sensor 51 and light sensation
Single package body structure is collectively formed in device 52, reduces gap when the two is individually assembled, and the installation saved in electronic device 100 is empty
Between.
In other embodiments, receiving module 50 only includes proximity sensor 51, and optical flame detector 52 is not integrated into reception
In module 50, that is to say, that receiving module 50 is the cell packaging configuration of proximity sensor 51, and optical flame detector 51 is also encapsulated for monomer
Structure, proximity sensor 51 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part for substrate 66
In camera case 67, when another part is stretched out out of camera case 67, optical flame detector 52 can also be fixed on substrate 66 simultaneously
Outside camera case 67.
In yet another embodiment, optical flame detector 52 is only included in receiving module 50, proximity sensor 51, which is not integrated into, to be connect
It receives in module 50, that is to say, that receiving module 50 is the cell packaging configuration of optical flame detector 52, and proximity sensor 51 is also sealed for monomer
Assembling structure, proximity sensor 51 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when one of substrate 66
Divide and be located in camera case 67, when another part is stretched out out of camera case 67, proximity sensor 51 can also be fixed on substrate
On 66 and outside camera case 67.
The receiving module 50 of present embodiment is arranged in camera case 67, makes the knot of receiving module 50 and camera case 67
Structure is more stablized and convenient for receiving module 50 and imaging modules 60 is installed on casing 20；Meanwhile imaging modules 60 set base
Receiving module 50 is simultaneously arranged on substrate 66 by plate 66, and receiving module 50 is enable to be firmly mounted in camera case 67.
9 are please referred to Fig.1, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace
It is changed to lower structure：Imaging modules 60 take the photograph module to be double, including two imaging sensors 65, camera case 67 and two camera lens moulds
Group 68.The top surface 670 of camera case 67 is cascaded surface, and top surface 670 includes the first tread 677, second less than the first tread 677
678 and first joint face 679a of tread.First joint face 679a and the second tread 678 tilt connection and with 678 shape of the second tread
Into notch 675, the first joint face 679a and the first tread 677, which tilt, to be connected, the first joint face 679a be located at the first tread 677 with
With the first tread 677 of connection and the second tread 678 between second tread 678.Between first joint face 679a and the first tread 677
Angle can be obtuse angle or right angle, the angle between the first joint face 679a and the second tread 678 can be obtuse angle or right angle.
Notch 675 is opened on an end of camera case 67, that is to say, that notch 675 is located at the marginal position of top surface 670.Two
A light extraction through-hole 674 is opened on the first tread 677 and is respectively positioned on the same side of notch 675, in two light extraction through-holes 674
Heart line is vertical with the extending direction of notch 675.Two camera lens modules 68 be housed in camera case 67 and with two light extractions
Through-hole 674 corresponds to respectively, and two imaging sensors 65 are housed in camera case 67 and corresponding respectively with two camera lens modules 68,
Light outside electronic device 100 can pass through light extraction through-hole 674 and camera lens module 68 and be transmitted on imaging sensor 65.This reality
It applies in mode, imaging modules 60 can be visible image capturing head 61, and two camera lens modules 68 are visible image capturing head 61 at this time
Corresponding camera lens module.Receiving module 50 is arranged on the second tread 678 and outside camera case 67.Receiving module 50 is connects
Single packaging body that nearly sensor 51 is collectively formed with optical flame detector 52.The center line connecting direction of proximity sensor 51 and optical flame detector 52 can
With consistent with the extending direction of notch 675；Alternatively, the center line connecting direction of proximity sensor 51 and optical flame detector 52 can be with notch
The angle that 675 extending direction vertical (as shown in figure 19) or the two are formed is acute angle or obtuse angle.In other embodiments, into
As module 60 can be infrared pick-up head 62, two camera lens modules 68 are 62 corresponding camera lens mould of infrared pick-up head at this time
Group.In yet another embodiment, imaging modules 60 include visible image capturing head 61 and infrared pick-up head 62, at this time wherein camera lens
Module 68 is 62 corresponding camera lens module of infrared pick-up head, another camera lens module 68 is 61 corresponding mirror of visible image capturing head
Head mould group.
The imaging modules 60 of present embodiment offer notch 675, and receiving module 50 is arranged on the second tread 678
On, receiving module 50 is made to set compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, has saved electronics
Installation space in device 100；Both meanwhile proximity sensor 51 and optical flame detector 52 are packaged into receiving module 50 jointly, reduce
The installation space in electronic device 100 is saved in individually gap during assembling.
Figure 20 is please referred to, in some embodiments, the notch 675 of the above embodiment is opened in the centre of top surface 670
On position, 677 incision 675 of the first tread is separated into the first sub- sub- tread 677b of tread 677a and second, the first sub- tread
The sub- tread 677b of 677a and second are located at the opposite sides of notch 675 respectively, and two light extraction through-holes 674 are opened in the first son respectively
On the sub- tread 677b of tread 677a and second, the camera lens module 68 in camera case 67 also is located at the opposite of notch 675
Both sides.At this point, notch 675 is surrounded by the second tread 678, the first joint face 679a and the second joint face 679b, the first joint face
679a tilts the first sub- top surface 677a of connection and the second tread 678 and between the first sub- top surface 677a and the second tread 678,
Second joint face 679b tilts the second sub- top surface 677b of connection and the second tread 678 and positioned at the ladder of the second sub- top surface 677b and second
Between face 678.In present embodiment, the first tread 677 is parallel with the second tread 678, the son ladders of the first joint face 679a and first
The angle of face 677a is obtuse angle, and the angle of the sub- tread 677b of the second joint face 679b and second is obtuse angle.In other embodiment
In, the angle of the sub- tread 677a of the first joint face 679a and first is right angle, the sub- tread 677b of the second joint face 679b and second
Angle be right angle.Relative to the marginal position that notch 675 is opened in top surface 670, the notch 675 of present embodiment is opened in
The centre position of top surface 670 can make the width of notch 675 wider, consequently facilitating receiving module 50 is arranged on the second tread
On 678.
9 and Figure 20 is please referred to Fig.1, in some embodiments, the receiving module 50 of the above embodiment is arranged on second
On tread 678 and positioned at the outside of camera case 67.Specifically, it is whole when notch 675 is opened in the marginal position of top surface 670
A receiving module 50 can be located in the second tread 678 along perpendicular to the projection of the second tread 678；Alternatively, part receives mould
Group 50 is located at along the projection perpendicular to the second tread 678 in the second tread 678 (as shown in figure 19).That is, receiving module
The 50 at least part of surfaces for being located at the second tread 678.It is whole when notch 675 is opened on the centre position of top surface 670
A receiving module 50 can be located in the second tread 678 (as shown in figure 20) along perpendicular to the projection of the second tread 678.Such as
This, receiving module 50 sets compacter with imaging modules 60, and the horizontal space that the two occupies jointly is smaller, further saves
Installation space in electronic device 100.In other embodiments, receiving module 50 includes proximity sensor 51 and optical flame detector
52, but proximity sensor 51 and optical flame detector 52 are two individual single packaging bodies, at this point, be respectively single packaging body close to sensing
Device 51 and optical flame detector 52 can also be all disposed on the second tread 678.
Figure 20 is please referred to, in some embodiments, the receiving module 50 of the above embodiment only includes close to sensing
Device 51, receiving module 50 does not include optical flame detector 52, at this point, proximity sensor 51 (or receiving module 50) is respectively with optical flame detector 52
Cell packaging configuration, proximity sensor 51 are arranged on the second tread 678, and optical flame detector 52 is arranged on the casing outside imaging modules 60
On 20.
Figure 20 is please referred to, in some embodiments, the receiving module 50 of the above embodiment only includes optical flame detector 52,
Receiving module 50 does not include proximity sensor 51, at this point, optical flame detector 52 (or receiving module 50) is respectively with proximity sensor 51
Cell packaging configuration, optical flame detector 52 are arranged on the second tread 678, and proximity sensor 51 is arranged on the casing outside imaging modules 60
On 20.
Figure 21 is please referred to, the second tread 678 of the above embodiment offers loophole 676, and receiving module 50 is located at phase
It is in casing body 67 and corresponding with loophole 676.Specifically, when receiving module 50 only includes proximity sensor 51 without optical flame detector
52, and optical flame detector 52 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, outside electronic device 100
Light can pass through and loophole 676 and be transmitted on proximity sensor 51.The receiving module 50 of present embodiment is arranged on phase
In casing body 67, the structure of receiving module 50 and camera case 67 is made more to stablize and be convenient for receiving module 50 and imaging modules
60 are installed on casing 20.
Please continue to refer to Figure 21, the second tread 678 of the above embodiment offers loophole 676, receiving module 50
It is in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 comprises only optical flame detector 52 without close
Sensor 51, and proximity sensor 51 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, electronics
Light outside device 100 can pass through loophole 676 and be transmitted on optical flame detector 52.The receiving module 50 of present embodiment is set
Put in camera case 67, make the structure of receiving module 50 and camera case 67 more stablize and convenient for by receiving module 50 with into
As module 60 is installed on casing 20.
Figure 22 is please referred to, in some embodiments, the second tread 678 of the above embodiment offers loophole 676,
Receiving module 50 is located in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 is integrated with close to sensing
When device 51 and optical flame detector 52, loophole 676 can be one with proximity sensor 51 and the corresponding loophole of optical flame detector 52 or
Two spaced and respectively with 52 corresponding loophole of proximity sensor 51 and optical flame detector, the light outside electronic device 100
On the proximity sensor 51 and optical flame detector 52 that loophole 676 can be passed through and be transmitted in receiving module 50.In other embodiment party
In formula, receiving module 50 includes proximity sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are independent for two
Single packaging body, at this point, camera case can also be all disposed within by being respectively the proximity sensor 51 of single packaging body and optical flame detector 52
It is in 67 and corresponding with loophole 676.The receiving module 50 of present embodiment is arranged in camera case 67, make receiving module 50 with
The structure of camera case 67 is more stablized and convenient for receiving module 50 and imaging modules 60 is installed on casing 20.
Please continue to refer to Figure 22, in some embodiments, the second tread 678 of the above embodiment offers loophole
676, receiving module 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, and image passes
Sensor 65 is arranged on substrate 66, and receiving module 50 may be also secured on substrate 66 and be housed in camera case 67.Specifically
Ground is provided with FPC on substrate 66, and one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can
It is connect with the mainboard with electronic device 100.In other embodiments, receiving module 50 can also be connect with FPC.This embodiment party
In formula, the receiving module 50 being arranged on substrate 66 includes proximity sensor 51 and optical flame detector 52, proximity sensor 51 and light sensation
Single package body structure is collectively formed in device 52, reduces gap when the two is individually assembled, and the installation saved in electronic device 100 is empty
Between.
In other embodiments, receiving module 50 only includes proximity sensor 51, and optical flame detector 52 is not integrated into reception
In module 50, that is to say, that receiving module 50 is the cell packaging configuration of proximity sensor 51, and optical flame detector 51 is also encapsulated for monomer
Structure, optical flame detector 52 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part for substrate 66 is located at
In camera case 67, when another part is stretched out out of camera case 67, optical flame detector 52 can also be fixed on substrate 66 and be located at
Outside camera case 67.
In yet another embodiment, receiving module 50 only includes optical flame detector 52, and proximity sensor 51 is not integrated into reception
In module 50, that is to say, that receiving module 50 is the cell packaging configuration of optical flame detector 52, and proximity sensor 51 is also encapsulated for monomer
Structure, optical flame detector 52 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part for substrate 66 is located at
In camera case 67, when another part is stretched out out of camera case 67, proximity sensor 51 can also be fixed on substrate 66 simultaneously
Outside camera case 67.
The receiving module 50 of present embodiment is arranged in camera case 67, makes the knot of receiving module 50 and camera case 67
Structure is more stablized and convenient for receiving module 50 and imaging modules 60 is installed on casing 20；Meanwhile imaging modules 60 set base
Receiving module 50 is simultaneously arranged on substrate 66 by plate 66, and receiving module 50 is enable to be firmly mounted in camera case 67.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means with reference to the embodiment
Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the present invention.
In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, description
Particular features, structures, materials, or characteristics can be in any one or more embodiments or example with suitable side
Formula combines.
In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one feature.In the description of the present invention, " multiple " are meant that at least two, such as two,
Three, unless otherwise specifically defined.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, changes, replacing and modification, the scope of the present invention are limited by claim and its equivalent.
Claims (10)
1. a kind of electronic device, which is characterized in that including：
Casing；
Module is exported, the output module is arranged in the casing, and the output module includes encapsulating housing, project structured light
Device and close to infrared lamp, the encapsulating housing includes package substrate, and the structured light projector is encapsulated with described close to infrared lamp
In the encapsulating housing and carry on the package substrate, the structured light projector with it is described can be with close to infrared lamp
Different power emits infrared light outside the encapsulating housing；With
Setting is on the package substrate and the receiving module outside the encapsulating housing, the receiving module are included close to biography
Sensor and/or optical flame detector.
2. electronic device according to claim 1, which is characterized in that the output module further includes chip, the structure
Light projector is formed in close to infrared lamp on a piece of chip with described.
3. electronic device according to claim 2, which is characterized in that the encapsulating housing further includes package wall and encapsulation
Top, the package wall extend from the package substrate and are connected at the top of the encapsulation between the package substrate, institute
It states encapsulation top and is formed with structure light window and close to window, the structure light window is corresponding with the structured light projector, institute
State close to window with it is described corresponding close to infrared lamp.
4. electronic device according to claim 2, which is characterized in that the output module is further included close to lamp lens, institute
State be arranged in the encapsulating housing close to lamp lens and with it is described corresponding close to infrared lamp.
5. electronic device according to claim 2, which is characterized in that the output module further includes metal shutter, institute
Metal shutter is stated to be located in the encapsulating housing and positioned at the structured light projector and described close between infrared lamp.
6. according to the electronic device described in claim 1-5 any one, which is characterized in that be formed with and connect on the output module
Ground pin, structure light pin and close to lamp pin, the grounding pin and the structure light pin be enabled when, the structure light
The projector emits infrared light；The grounding pin and it is described close to lamp pin be enabled when, it is described close to infrared lamp emit it is red
UV light.
7. electronic device according to claim 1, which is characterized in that the electronic device further includes the cover board of light transmission, institute
It states casing and offers casing close to through-hole and casing structure light through-hole, it is described close to infrared lamp and the casing close to through-hole pair
Should, the structured light projector is corresponding with the casing structure light through-hole, and the cover board setting is on the housing.
8. electronic device according to claim 1, which is characterized in that the electronic device further includes the cover board of light transmission, institute
It states casing and offers casing close to through-hole and casing structure light through-hole, it is described close to infrared lamp and the casing close to through-hole pair
Should, the structured light projector is corresponding with the casing structure light through-hole, and the cover board is set on the housing, the cover board
The surface combined with the casing, which is formed with, only transmits the infrared through ink of infrared light, and the infrared transmission ink blocks described
Casing is close at least one of through-hole and the casing structure light through-hole.
9. electronic device according to claim 1, which is characterized in that the electronic device further include infrared pick-up head,
Visible image capturing head, receiver and infrared light compensating lamp, the output module, the infrared pick-up head, the visible image capturing
Head, the receiver and the infrared light compensating lamp center be located on same line segment, from one end of the line segment to the other end according to
It is secondary to be：
The output module, the infrared light compensating lamp, the receiver, the infrared pick-up head, the visible image capturing head；
Or
The output module, the visible image capturing head, the receiver, the infrared pick-up head, the infrared light compensating lamp；
Or
The infrared pick-up head, the infrared light compensating lamp, the receiver, the visible image capturing head, the output module；
Or
The infrared pick-up head, the visible image capturing head, the receiver, the output module, the infrared light compensating lamp.
10. electronic device according to claim 1, which is characterized in that the electronic device further include infrared pick-up head,
Visible image capturing head, receiver, infrared light compensating lamp and the cover board of light transmission, the cover board are set on the housing, the casing
Casing sound outlet hole is offered, the cover board offers cover board sound outlet hole, the receiver and the cover board sound outlet hole and the machine
The position of shell sound outlet hole corresponds to, the output module, the infrared pick-up head, the visible image capturing head and the infrared benefit
The center of light lamp is located on same line segment, and the receiver is between the line segment and the top of the casing.
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| CN201711437284.0A CN108173991A (en) | 2017-12-26 | 2017-12-26 | Electronic device |
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| CN201711437284.0A CN108173991A (en) | 2017-12-26 | 2017-12-26 | Electronic device |
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| Publication Number | Publication Date |
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| CN108173991A true CN108173991A (en) | 2018-06-15 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106206915A (en) * | 2016-08-31 | 2016-12-07 | 歌尔股份有限公司 | The integrated morphology of a kind of optical chip and manufacture method thereof |
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| CN101273673A (en) * | 2005-08-30 | 2008-09-24 | 松下电器产业株式会社 | Board structure and electronic device |
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| CN106206915A (en) * | 2016-08-31 | 2016-12-07 | 歌尔股份有限公司 | The integrated morphology of a kind of optical chip and manufacture method thereof |
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