CN108133882A - 一种集成电路板的清洗方法 - Google Patents
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
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Abstract
本发明提供一种集成电路板的清洗方法,其包括如下步骤:步骤1:采用压缩空气吹除集成电路板表面粘附的灰尘;步骤2:将集成电路板浸泡于清洗液中5~8min,每间隔2min采用压缩气体在所述集成电路底部鼓泡30s;步骤3:采用纯水冲洗集成电路板,然后采用压缩空气吹去集成电路板表面的水滴;步骤4:采用烘箱将集成电路板烘干。本发明提供的清洁方法能够深入到紧密排列的电子元器件之间的缝隙之中,将渗入到印制电路板基板内部的污垢清洗除,清洗效率高,耗时短,并且对集成电路芯片没有任何的腐蚀作用,显著提升了产品的质量等级和质量稳定性,本发明技术方案操作温和,简单,适用性广,易于推广。
Description
技术领域
本发明涉及集成电路板领域。更具体地说,本发明涉及一种集成电路板的清洗方法。
背景技术
集成电路作为电子产品中的核心部件,其质量的好坏直接决定了到电子整机产品的性能和可靠性的高低。在集成电路的制备过程中,其表面粘附的颗粒、有机物、金属等污染物严重影响器件的性能。例如:
(1)颗粒性污染物--灰尘、棉绒和焊锡球等。其中,尤其是焊锡球是一种焊接缺陷,如果设备的振动使大量小焊锡球聚集到一个部位上,便可能引起电短路。
(2)非极性污染物--松香树脂、石蜡及波峰焊上使用的抗氧化油,还有操作者遗留下的化妆品或洗手剂等。非极性污染物会影响集成电路板的外观,且易导致接触不良。
(3)极性沾污物--卤化物、酸和盐等,极性沾污物易导致介质击穿、漏电、元件/电路腐蚀等现象。
随着集成电路板中单元图案的日益微型化以及集成度的日益提高,污染物对集成电路板的影响也愈加突出。但现有的集成电路板清洗技术存在清洗效果不佳或硅片在清洗过程中被腐蚀等现象,目前因清洗不佳引起的器件失效已超过集成电路制造中总损失的一半。
发明内容
本发明的一个目的是解决至少上述问题和/或缺陷,并提供至少后面将说明的优点。
本发明还有一个目的是提供一种集成电路板的清洗方法,其能够深入到紧密排列的电子元器件之间的缝隙之中,将渗入到印制电路板基板内部的污垢清洗除,清洗耗时短,且对集成电路芯片没有任何的腐蚀,清洗效果得到显著提升。
为了实现根据本发明的这些目的和其它优点,提供了一种集成电路板的清洗方法,其包括如下步骤:
步骤1:采用压缩空气吹除集成电路板表面粘附的灰尘;
步骤2:将集成电路板浸泡于清洗液中5~8min,每间隔2min采用压缩气体在所述集成电路底部鼓泡30s,以达到更优的清洗效果;
步骤3:采用纯水冲洗集成电路板,然后采用压缩空气吹去集成电路板表面的水滴;
步骤4:采用烘箱将集成电路板烘干;
其中,所述清洗液包括如下重量组份:
优选的是,其中,所述步骤1和步骤3中压缩空气的压力为0.08~0.15Mpa。
优选的是,其中,所述步骤2中清洗液的温度维持在35~40℃,清洗条件温和,减少清洗对集成电路板造成的损伤。
优选的是,其中,所述步骤4的烘干温度不高于65℃,。
优选的是,其中,所述步骤4在氮气的保护下烘干,防止集成电路在烘干步骤被氧化或损坏。
优选的是,其中,所述步骤3中纯水的电导率小于0.1us/cm,防止水中的微量元素或微生物改变集成电路的电特性或最终产品的性质。
优选的是,其中,所述步骤2中的压缩气体为压缩氮气,以提供集成电路板在清洗过程的保护作用。
所述步骤4的烘箱设置有运风结构,以提高箱体内部的温度均匀度,保证集成电路板的质量。
本发明至少包括以下有益效果:
(1)本发明的清洗剂其能够深入到紧密排列的电子元器件之间的缝隙之中,将渗入到印制电路板基板内部的污垢清洗除,清洗效率高,耗时短;
(2)本发明对集成电路芯片没有任何的腐蚀作用,显著提升了产品的质量等级和质量稳定性;
(3)本发明技术方案操作温和,简单,适用性广,易于推广。
本发明的其它优点、目标和特征将部分通过下面的说明体现,部分还将通过对本发明的研究和实践而为本领域的技术人员所理解。
具体实施方式
下面结合实施例对本发明做进一步的详细说明,以令本领域技术人员参照说明书文字能够据以实施。
应当理解,本文所使用的诸如“具有”、“包含”以及“包括”术语并不配出一个或多个其它元件或其组合的存在或添加。
<实例1>
步骤1:采用0.08Mpa的压缩空气清除集成电路板粘附的灰尘;
步骤2:将集成电路板于35℃的温度条件下浸泡于清洗液中5min,每间隔2min采用压缩氮气在所述集成电路底部鼓泡30s,其中,所述清洗液包括如下重量组份:脂肪醇聚氧乙烯醚15份;十三烷基聚氧乙烯醚羧酸钠10份;羟基丙酸甲酯8份;乙酸乙酯5份;二甲氧基乙烷3份;甲基环氧乙烷3份;香叶醇2份;松醇2份;辛甘醇1份;
步骤3:采用电导率小于0.1us/cm的纯水冲洗集成电路板,然后采用0.08Mpa的压缩空气吹去集成电路板表面的水滴;
步骤4:采用烘箱在氮气的保护下将集成电路板烘干,其中烘干温度不高于65℃,并且烘箱设置有运风结构。
将本实例1清洗后的集成电路板经显微镜放大检测,表面洁净,未见灰尘、油污、指纹等污染物,且集成电路板未见腐蚀痕迹。
<实例2>
步骤1:采用0.15Mpa的压缩空气清除集成电路板粘附的灰尘;
步骤2:将集成电路板于40℃的温度条件下浸泡于清洗液中8min,每间隔2min采用压缩氮气在所述集成电路底部鼓泡30s,其中,所述清洗液包括如下重量组份:脂肪醇聚氧乙烯醚20份;十三烷基聚氧乙烯醚羧酸钠15份;羟基丙酸甲酯10份;乙酸乙酯8份;二甲氧基乙烷7份;甲基环氧乙烷7份;香叶醇5份;松醇5份;辛甘醇3份;
步骤3:采用电导率小于0.1us/cm的纯水冲洗集成电路板,然后采用0.15Mpa的压缩空气吹去集成电路板表面的水滴;
步骤4:采用烘箱在氮气的保护下将集成电路板烘干,其中烘干温度不高于65℃,并且烘箱设置有运风结构。
将本实例2清洗后的集成电路板经显微镜放大检测,表面洁净,未见灰尘、油污、指纹等污染物,且集成电路板未见腐蚀痕迹。
<实例3>
步骤1:采用0.12Mpa的压缩空气清除集成电路板粘附的灰尘;
步骤2:将集成电路板于38℃的温度条件下浸泡于清洗液中7min,每间隔2min采用压缩氮气在所述集成电路底部鼓泡30s,其中,所述清洗液包括如下重量组份:脂肪醇聚氧乙烯醚18份;十三烷基聚氧乙烯醚羧酸钠12份;羟基丙酸甲酯9份;乙酸乙酯7份;二甲氧基乙烷5份;甲基环氧乙烷5份;香叶醇3份;松醇3份;辛甘醇2份;
步骤3:采用电导率小于0.1us/cm的纯水冲洗集成电路板,然后采用0.12Mpa的压缩空气吹去集成电路板表面的水滴;
步骤4:采用烘箱在氮气的保护下将集成电路板烘干,其中烘干温度不高于65℃,并且烘箱设置有运风结构。
将本实例3清洗后的集成电路板经显微镜放大检测,表面洁净,未见灰尘、油污、指纹等污染物,且集成电路板未见腐蚀痕迹。
<实例4>
步骤1:采用0.09Mpa的压缩空气清除集成电路板粘附的灰尘;
步骤2:将集成电路板于36℃的温度条件下浸泡于清洗液中8min,每间隔2min采用压缩氮气在所述集成电路底部鼓泡30s,其中,所述清洗液包括如下重量组份:脂肪醇聚氧乙烯醚16份;十三烷基聚氧乙烯醚羧酸钠11份;羟基丙酸甲酯9份;乙酸乙酯6份;二甲氧基乙烷4份;甲基环氧乙烷4份;香叶醇4份;松醇5份;辛甘醇3份;
步骤3:采用电导率小于0.1us/cm的纯水冲洗集成电路板,然后采用0.12Mpa的压缩空气吹去集成电路板表面的水滴;
步骤4:采用烘箱在氮气的保护下将集成电路板烘干,其中烘干温度不高于65℃,并且烘箱设置有运风结构。
将本实例4清洗后的集成电路板经显微镜放大检测,表面洁净,未见灰尘、油污、指纹等污染物,且集成电路板未见腐蚀痕迹。
<实例5>
步骤1:采用0.14Mpa的压缩空气清除集成电路板粘附的灰尘;
步骤2:将集成电路板于39℃的温度条件下浸泡于清洗液中6min,每间隔2min采用压缩氮气在所述集成电路底部鼓泡30s,其中,所述清洗液包括如下重量组份:脂肪醇聚氧乙烯醚17份;十三烷基聚氧乙烯醚羧酸钠14份;羟基丙酸甲酯10份;乙酸乙酯7份;二甲氧基乙烷6份;甲基环氧乙烷6份;香叶醇3份;松醇4份;辛甘醇3份;
步骤3:采用电导率小于0.1us/cm的纯水冲洗集成电路板,然后采用0.09Mpa的压缩空气吹去集成电路板表面的水滴;
步骤4:采用烘箱在氮气的保护下将集成电路板烘干,其中烘干温度不高于65℃,并且烘箱设置有运风结构。
将本实例5清洗后的集成电路板经显微镜放大检测,表面洁净,未见灰尘、油污、指纹等污染物,且集成电路板未见腐蚀痕迹。
可见,本发明的清洁方法能够深入到紧密排列的电子元器件之间的缝隙之中,将渗入到印制电路板基板内部的污垢清洗除,清洗效率高,耗时短,并且对集成电路芯片没有任何的腐蚀作用,显著提升了产品的质量等级和质量稳定性,本发明技术方案操作温和,简单,适用性广,易于推广。
尽管本发明的实施方案已公开如上,但其并不仅仅限于说明书和实施方式中所列运用。它完全可以被适用于各种适合本发明的领域。对于熟悉本领域的人员而言,可容易地实现另外的修改。因此在不背离权利要求及等同范围所限定的一般概念下,本发明并不限于特定的细节和这里示出与描述的实施例。
Claims (8)
1.一种集成电路板的清洗方法,其特征在于,包括如下步骤:
步骤1:采用压缩空气吹除集成电路板表面粘附的灰尘;
步骤2:将集成电路板浸泡于清洗液中5~8min,每间隔2min采用压缩气体在所述集成电路板底部鼓泡30s;
步骤3:采用纯水冲洗集成电路板,然后采用压缩空气吹去集成电路板表面的水滴;
步骤4:采用烘箱将集成电路板烘干;
其中,所述清洗液包括如下重量组份:
2.如权利要求1所述的集成电路板的清洗方法,其特征在于,所述步骤1和步骤3中压缩空气的压力均为0.08~0.15Mpa。
3.如权利要求1所述的集成电路板的清洗方法,其特征在于,所述步骤2中清洗液的温度维持在35~40℃。
4.如权利要求1所述的集成电路板的清洗方法,其特征在于,所述步骤4的烘干温度不高于65℃。
5.如权利要求1所述的集成电路板的清洗方法,其特征在于,所述步骤4在氮气的保护下烘干。
6.如权利要求1所述的集成电路板的清洗方法,其特征在于,所述步骤3中纯水的电导率小于0.1us/cm。
7.如权利要求1所述的集成电路板的清洗方法,其特征在于,所述步骤2中的压缩气体为压缩氮气。
8.如权利要求1所述的集成电路板的清洗方法,其特征在于,所述步骤4的烘箱设置有运风结构。
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