CN107474973A - 一种电路板水基清洗剂的制备方法 - Google Patents

一种电路板水基清洗剂的制备方法 Download PDF

Info

Publication number
CN107474973A
CN107474973A CN201710694509.4A CN201710694509A CN107474973A CN 107474973 A CN107474973 A CN 107474973A CN 201710694509 A CN201710694509 A CN 201710694509A CN 107474973 A CN107474973 A CN 107474973A
Authority
CN
China
Prior art keywords
parts
circuit board
cleaning agent
preparation
aqueous cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201710694509.4A
Other languages
English (en)
Inventor
潘明华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201710694509.4A priority Critical patent/CN107474973A/zh
Publication of CN107474973A publication Critical patent/CN107474973A/zh
Withdrawn legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/66Non-ionic compounds
    • C11D1/83Mixtures of non-ionic with anionic compounds
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16Organic compounds
    • C11D3/18Hydrocarbons
    • C11D3/188Terpenes
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16Organic compounds
    • C11D3/20Organic compounds containing oxygen
    • C11D3/2003Alcohols; Phenols
    • C11D3/2006Monohydric alcohols
    • C11D3/201Monohydric alcohols linear
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16Organic compounds
    • C11D3/20Organic compounds containing oxygen
    • C11D3/2003Alcohols; Phenols
    • C11D3/2006Monohydric alcohols
    • C11D3/2017Monohydric alcohols branched
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16Organic compounds
    • C11D3/20Organic compounds containing oxygen
    • C11D3/2093Esters; Carbonates
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16Organic compounds
    • C11D3/26Organic compounds containing nitrogen
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16Organic compounds
    • C11D3/26Organic compounds containing nitrogen
    • C11D3/28Heterocyclic compounds containing nitrogen in the ring
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16Organic compounds
    • C11D3/26Organic compounds containing nitrogen
    • C11D3/30Amines; Substituted amines ; Quaternized amines
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16Organic compounds
    • C11D3/36Organic compounds containing phosphorus
    • C11D3/361Phosphonates, phosphinates or phosphonites
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/008Polymeric surface-active agents
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/02Anionic compounds
    • C11D1/04Carboxylic acids or salts thereof
    • C11D1/06Ether- or thioether carboxylic acids
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/02Anionic compounds
    • C11D1/34Derivatives of acids of phosphorus
    • C11D1/345Phosphates or phosphites
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/66Non-ionic compounds
    • C11D1/72Ethers of polyoxyalkylene glycols
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/66Non-ionic compounds
    • C11D1/74Carboxylates or sulfonates esters of polyoxyalkylene glycols

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Detergent Compositions (AREA)

Abstract

本发明提供了一种电路板水基清洗剂的制备方法。制备方法如下:(1)按重量份称取原料;(2)在反应釜中加入苯并三氮唑、壬基酚聚氧乙烯醚、D‑柠檬烯、乙酸丁酯、乙醇胺、十二烷基醇聚氧乙烯醚羧酸钠、乙醇,混合搅拌5‑20min;(3)继续加入异丙醇、单硬脂酸聚氧乙烯酯、硝基乙烷、月桂醇醚磷酸酯钾,充分搅拌均匀15‑25min;(4)最后加入羟基乙叉二膦酸四钠和去离子水,超声波振荡20‑35min,静置过滤,即可。本发明的电路板水基清洗剂对人体、环境副作用物更小,清洗效率高,适用于SMT电路板印刷残留锡膏及红胶残留,尤其是有胶痕残留的电子元器件及助焊剂污染物残留的印刷电路板的清洗应用。

Description

一种电路板水基清洗剂的制备方法
技术领域
本发明涉及清洗剂,具体涉及一种电路板水基清洗剂的制备方法。
背景技术
近十几年来,我国印制电路板(Printed Circuit Board,简称PCB)制造行业发展迅速,总产值、总产量双双位居世界第一。由于电子产品日新月异,价格战改变了供应链的结构,中国兼具产业分布、成本和市场优势,已经成为全球最重要的印制电路板生产基地。随着电子行业的高速发展,在讲究集成化、智能化、简约化的今天,电路板上的电子元器件愈来愈多,电路板体积越来越小,在电路板的SMT印刷电路板制作过程中,不可避免会在元器件引脚上残留有锡膏或红胶,如果不加清洗可能会导致后期出现短路的风险,影响电路板的正常运行。因此一般需要在线路板元器件焊接工序完成后用清洗剂对电路板整体进行清洗工序。由于线路板上残留的锡膏或红胶成分复杂,含有树脂、增粘剂、触变剂登各种不溶于水的成分,早期相当部分工艺采用氟氯烃类溶剂(CFC—113三氟三氯乙烷)作为清洗剂,该种类型清洗剂化学稳定性好,相容性佳表面张力和粘度小,渗透力强、蒸发速度快,用它清洗过的制件可自行干燥,不需揩擦或烘干处理,因而被广泛用于电子工业精密清洗领域。后来随着人们认识到CFC—113对臭氧层的破坏性。国际社会制定了多部国际公约淘汰破坏大气层的有害物质。因此目前广泛采用的无卤素清洗剂作为氟氯烃清洗剂的替代品受到人们的关注。无卤素清洗剂主要由醇类、酮类、醚类、酯类、烷烃类等低闪点、低沸点溶剂组成,该类清洗剂具有成本低、干燥速度快等优点,但同时也存在清洗性能不如氟氯烃,对坏境及人员健康破坏性强、挥发性大,闪点低易爆等缺点。
发明内容
要解决的技术问题:本发明的目的是提供一种电路板水基清洗剂的制备方法,该清洗剂安全性更好,干燥速率快,对焊药及油污有优异的溶解性能,尤其是有残留胶痕的电子元件和助焊剂残留物污染的印刷电路板更为适用。
技术方案:一种电路板水基清洗剂的制备方法,包括以下步骤:
(1)按重量份称取以下成分:苯并三氮唑5-10份、乙酸丁酯12-18份、乙醇胺1.2-3份、异丙醇3-5份、硝基乙烷0.5-2份、十二烷基醇聚氧乙烯醚羧酸钠0.5-1.8份、壬基酚聚氧乙烯醚3-5份、单硬脂酸聚氧乙烯酯1.5-2.5份、D-柠檬烯0.5-3份、月桂醇醚磷酸酯钾0.3-1.5份、乙醇20-30份、羟基乙叉二膦酸四钠1.2-2份、去离子水40-60份;
(2)在反应釜中加入苯并三氮唑、壬基酚聚氧乙烯醚、D-柠檬烯、乙酸丁酯、乙醇胺、十二烷基醇聚氧乙烯醚羧酸钠、乙醇,混合搅拌5-20min;
(3)继续加入异丙醇、单硬脂酸聚氧乙烯酯、硝基乙烷、月桂醇醚磷酸酯钾,充分搅拌均匀15-25min;
(4)最后加入羟基乙叉二膦酸四钠和去离子水,超声波振荡20-35min,静置过滤,即可。
进一步的,所述的一种电路板水基清洗剂的制备方法,所述步骤(1)中按重量份称取以下成分:苯并三氮唑6-8份、乙酸丁酯 14-16份、乙醇胺1.5-2.5份、异丙醇3-4份、硝基乙烷0.8-1.2份、十二烷基醇聚氧乙烯醚羧酸钠1-1.5份、壬基酚聚氧乙烯醚4-5份、单硬脂酸聚氧乙烯酯1.8-2.2份、D-柠檬烯1-2份、月桂醇醚磷酸酯钾0.5-1.2份、乙醇23-28份、羟基乙叉二膦酸四钠1.5-1.8份、去离子水45-55份。
进一步的,所述的一种电路板水基清洗剂的制备方法,所述步骤(2)中搅拌时间为10-15min。
进一步的,所述的一种电路板水基清洗剂的制备方法,所述步骤(3)中搅拌时间为20min。
进一步的,所述的一种电路板水基清洗剂的制备方法,所述步骤(4)中振荡时间为25-32min。
进一步的,所述的一种电路板水基清洗剂的制备方法,所述的清洗剂可用于精密电路板的清洗。
有益效果:本发明中的清洗剂既发挥溶液的溶解特性又体现了水的无闪点、安全性好的优点,配合超声波或喷淋设备,能够有效地应用于电路印刷版上残留锡膏、贴片胶的清洗,对电子工业产品表面油污、灰尘的去除也具有良好的效果,并且本发明制得的产品还具有配方合理,原料简单易的、成本低廉且相对环保的优点。
具体实施方式
实施例1
一种电路板水基清洗剂的制备方法,包括以下步骤:(1)按重量份称取以下成分:苯并三氮唑10份、乙酸丁酯18份、乙醇胺1.2份、异丙醇3份、硝基乙烷0.5份、十二烷基醇聚氧乙烯醚羧酸钠0.5份、壬基酚聚氧乙烯醚3份、单硬脂酸聚氧乙烯酯2.5份、D-柠檬烯3份、月桂醇醚磷酸酯钾1.5份、乙醇30份、羟基乙叉二膦酸四钠1.2份、去离子水40份;(2)在反应釜中加入苯并三氮唑、壬基酚聚氧乙烯醚、D-柠檬烯、乙酸丁酯、乙醇胺、十二烷基醇聚氧乙烯醚羧酸钠、乙醇,混合搅拌20min;(3)继续加入异丙醇、单硬脂酸聚氧乙烯酯、硝基乙烷、月桂醇醚磷酸酯钾,充分搅拌均匀15min;(4)最后加入羟基乙叉二膦酸四钠和去离子水,超声波振荡20min,静置过滤,即可。
实施例2
一种电路板水基清洗剂的制备方法,包括以下步骤:(1)按重量份称取以下成分:苯并三氮唑6份、乙酸丁酯 16份、乙醇胺2.5份、异丙醇4份、硝基乙烷1.2份、十二烷基醇聚氧乙烯醚羧酸钠1份、壬基酚聚氧乙烯醚5份、单硬脂酸聚氧乙烯酯1.8份、D-柠檬烯1份、月桂醇醚磷酸酯钾0.5份、乙醇28份、羟基乙叉二膦酸四钠1.5份、去离子水45份;(2)在反应釜中加入苯并三氮唑、壬基酚聚氧乙烯醚、D-柠檬烯、乙酸丁酯、乙醇胺、十二烷基醇聚氧乙烯醚羧酸钠、乙醇,混合搅拌10min;(3)继续加入异丙醇、单硬脂酸聚氧乙烯酯、硝基乙烷、月桂醇醚磷酸酯钾,充分搅拌均匀20min;(4)最后加入羟基乙叉二膦酸四钠和去离子水,超声波振荡32min,静置过滤,即可。
实施例3
一种电路板水基清洗剂的制备方法,包括以下步骤:(1)按重量份称取以下成分:苯并三氮唑8份、乙酸丁酯 14份、乙醇胺1.5份、异丙醇3份、硝基乙烷0.8份、十二烷基醇聚氧乙烯醚羧酸钠1.5份、壬基酚聚氧乙烯醚4份、单硬脂酸聚氧乙烯酯2.2份、D-柠檬烯2份、月桂醇醚磷酸酯钾1.2份、乙醇23份、羟基乙叉二膦酸四钠1.5份去离子水55份;(2)在反应釜中加入苯并三氮唑、壬基酚聚氧乙烯醚、D-柠檬烯、乙酸丁酯、乙醇胺、十二烷基醇聚氧乙烯醚羧酸钠、乙醇,混合搅拌15min;(3)继续加入异丙醇、单硬脂酸聚氧乙烯酯、硝基乙烷、月桂醇醚磷酸酯钾,充分搅拌均匀20min;(4)最后加入羟基乙叉二膦酸四钠和去离子水,超声波振荡25min,静置过滤,即可。
实施例4
一种电路板水基清洗剂的制备方法,包括以下步骤:(1)按重量份称取以下成分:苯并三氮唑7份、乙酸丁酯 15份、乙醇胺2份、异丙醇3.4份、硝基乙烷1份、十二烷基醇聚氧乙烯醚羧酸钠1.3份、壬基酚聚氧乙烯醚4.7份、单硬脂酸聚氧乙烯酯2份、D-柠檬烯1.8份、月桂醇醚磷酸酯钾0.9份、乙醇25份、羟基乙叉二膦酸四钠1.6份、去离子水50份;(2)在反应釜中加入苯并三氮唑、壬基酚聚氧乙烯醚、D-柠檬烯、乙酸丁酯、乙醇胺、十二烷基醇聚氧乙烯醚羧酸钠、乙醇,混合搅拌12min;(3)继续加入异丙醇、单硬脂酸聚氧乙烯酯、硝基乙烷、月桂醇醚磷酸酯钾,充分搅拌均匀20min;(4)最后加入羟基乙叉二膦酸四钠和去离子水,超声波振荡28min,静置过滤,即可。
实施例5
一种电路板水基清洗剂的制备方法,包括以下步骤:(1)按重量份称取以下成分:苯并三氮唑5份、乙酸丁酯12份、乙醇胺3份、异丙醇5份、硝基乙烷 2份、十二烷基醇聚氧乙烯醚羧酸钠1.8份、壬基酚聚氧乙烯醚5份、单硬脂酸聚氧乙烯酯1.5份、D-柠檬烯0.5份、月桂醇醚磷酸酯钾0.3份、乙醇20份、羟基乙叉二膦酸四钠2份、去离子水60份;(2)在反应釜中加入苯并三氮唑、壬基酚聚氧乙烯醚、D-柠檬烯、乙酸丁酯、乙醇胺、十二烷基醇聚氧乙烯醚羧酸钠、乙醇,混合搅拌5min;(3)继续加入异丙醇、单硬脂酸聚氧乙烯酯、硝基乙烷、月桂醇醚磷酸酯钾,充分搅拌均匀25min;(4)最后加入羟基乙叉二膦酸四钠和去离子水,超声波振荡35min,静置过滤,即可。
对比例1
一种电路板水基清洗剂的制备方法,包括以下步骤:(1)按重量份称取以下成分:苯并三氮唑5份、乙酸丁酯12份、异丙醇5份、硝基乙烷 2份、十二烷基醇聚氧乙烯醚羧酸钠1.8份、壬基酚聚氧乙烯醚5份、单硬脂酸聚氧乙烯酯1.5份、D-柠檬烯0.5份、月桂醇醚磷酸酯钾0.3份、乙醇20份、去离子水60份;(2)在反应釜中加入苯并三氮唑、壬基酚聚氧乙烯醚、D-柠檬烯、乙酸丁酯、十二烷基醇聚氧乙烯醚羧酸钠、乙醇,混合搅拌5min;(3)继续加入异丙醇、单硬脂酸聚氧乙烯酯、硝基乙烷、月桂醇醚磷酸酯钾,充分搅拌均匀25min;(4)最后加入去离子水,超声波振荡35min,静置过滤,即可。
对比例2
一种电路板水基清洗剂的制备方法,包括以下步骤:(1)按重量份称取以下成分:苯并三氮唑10份、乙酸丁酯18份、乙醇胺1.2份、异丙醇3份、硝基乙烷0.5份、壬基酚聚氧乙烯醚3份、单硬脂酸聚氧乙烯酯2.5份、月桂醇醚磷酸酯钾1.5份、乙醇30份、去离子水40份;(2)在反应釜中加入苯并三氮唑、壬基酚聚氧乙烯醚、、乙酸丁酯、乙醇胺、乙醇,混合搅拌20min;(3)继续加入异丙醇、单硬脂酸聚氧乙烯酯、硝基乙烷、月桂醇醚磷酸酯钾,充分搅拌均匀15min;(4)最后加入羟基乙叉二膦酸四钠和去离子水,超声波振荡20min,静置过滤,即可。
本发明材料的各项性能指标见下表,我们可以看到本电路板水基清洗剂对电路板表面污染物的清洗效果较好,符合国家标准,避免使用可破坏大气层臭氧物质的卤素元素,具有绿色环保的特点。
表1 电路板水基清洗剂的各项性能指标

Claims (6)

1.一种电路板水基清洗剂的制备方法,其特征在于,包括以下步骤:
(1)按重量份称取以下成分:苯并三氮唑5-10份、乙酸丁酯12-18份、乙醇胺1.2-3份、异丙醇3-5份、硝基乙烷0.5-2份、十二烷基醇聚氧乙烯醚羧酸钠0.5-1.8份、壬基酚聚氧乙烯醚3-5份、单硬脂酸聚氧乙烯酯1.5-2.5份、D-柠檬烯0.5-3份、月桂醇醚磷酸酯钾0.3-1.5份、乙醇20-30份、羟基乙叉二膦酸四钠1.2-2份、去离子水40-60份;
(2)在反应釜中加入苯并三氮唑、壬基酚聚氧乙烯醚、D-柠檬烯、乙酸丁酯、乙醇胺、十二烷基醇聚氧乙烯醚羧酸钠、乙醇,混合搅拌5-20min;
(3)继续加入异丙醇、单硬脂酸聚氧乙烯酯、硝基乙烷、月桂醇醚磷酸酯钾,充分搅拌均匀15-25min;
(4)最后加入羟基乙叉二膦酸四钠和去离子水,超声波振荡20-35min,静置过滤,即可。
2.根据权利要求1所述的一种电路板水基清洗剂的制备方法,其特征在于:所述步骤(1)中按重量份称取以下成分:苯并三氮唑6-8份、乙酸丁酯 14-16份、乙醇胺1.5-2.5份、异丙醇3-4份、硝基乙烷0.8-1.2份、十二烷基醇聚氧乙烯醚羧酸钠1-1.5份、壬基酚聚氧乙烯醚4-5份、单硬脂酸聚氧乙烯酯1.8-2.2份、D-柠檬烯1-2份、月桂醇醚磷酸酯钾0.5-1.2份、乙醇23-28份、羟基乙叉二膦酸四钠1.5-1.8份、去离子水45-55份。
3.根据权利要求1所述的一种电路板水基清洗剂的制备方法,其特征在于:所述步骤(2)中搅拌时间为10-15min。
4.根据权利要求1所述的一种电路板水基清洗剂的制备方法,其特征在于:所述步骤(3)中搅拌时间为20min。
5.根据权利要求1所述的一种电路板水基清洗剂的制备方法,其特征在于:所述步骤(4)中振荡时间为25-32min。
6.根据权利要求1-5所述的一种电路板水基清洗剂的制备方法,其特征在于:所述的清洗剂可用于精密电路板的清洗。
CN201710694509.4A 2017-08-15 2017-08-15 一种电路板水基清洗剂的制备方法 Withdrawn CN107474973A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710694509.4A CN107474973A (zh) 2017-08-15 2017-08-15 一种电路板水基清洗剂的制备方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710694509.4A CN107474973A (zh) 2017-08-15 2017-08-15 一种电路板水基清洗剂的制备方法

Publications (1)

Publication Number Publication Date
CN107474973A true CN107474973A (zh) 2017-12-15

Family

ID=60600388

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710694509.4A Withdrawn CN107474973A (zh) 2017-08-15 2017-08-15 一种电路板水基清洗剂的制备方法

Country Status (1)

Country Link
CN (1) CN107474973A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108133882A (zh) * 2017-12-21 2018-06-08 苏州赛源微电子有限公司 一种集成电路板的清洗方法
CN111286420A (zh) * 2020-03-16 2020-06-16 何学苏 一种水剂型电路板清洗剂

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108133882A (zh) * 2017-12-21 2018-06-08 苏州赛源微电子有限公司 一种集成电路板的清洗方法
CN111286420A (zh) * 2020-03-16 2020-06-16 何学苏 一种水剂型电路板清洗剂

Similar Documents

Publication Publication Date Title
CN101503648B (zh) 一种smt印刷网板的水基清洗剂
CN106833993A (zh) 一种水基清洗剂及其制备方法
CN102533458B (zh) 一种导电胶脱胶剂及其制备方法
CN102816660A (zh) 一种纳米水基清洗剂及其制备方法
CN102408959B (zh) 一种电子线路板专用清洗剂及其制备方法
DE69004521T2 (de) Reinigungsmittel auf der Basis eines dibasischen Esters und eines Kohlenwasserstofflösungsmittels und Reinigungsverfahren.
CN106957748A (zh) 一种pcb电路板水性清洗剂及其制备与应用
CN109837145A (zh) 一种水性电子工业助焊剂清洗剂及其制备方法
CN107474973A (zh) 一种电路板水基清洗剂的制备方法
CN105861200B (zh) 一种水基清洗剂及其制备方法
WO2014081127A1 (ko) 포토레지스트 박리액 조성물 및 포토레지스트의 박리방법
CN109370809B (zh) 一种低泡水基清洗剂及清洗方法
CN102049634A (zh) 水溶性免清洗助焊剂
CN101265440A (zh) 一种印制线路板清洗剂
CN103122288A (zh) 一种异性导电胶去除剂及其制备方法
CN109456850B (zh) 一种弱碱性复合多功能水基清洗剂及清洗方法
DE69025594T2 (de) Nichttoxische, nichtentflammbare reiniger zum reinigen von gedruckten schaltungen
CN107574051A (zh) 无卤环保清洗剂
CN107488527A (zh) 一种液晶面板玻璃清洗剂
CN105018955B (zh) 一种印刷钢网用水基清洗剂
CN106019863A (zh) 一种高世代平板铜制程光阻剥离液
CN108085168A (zh) 一种柔性线路板专用清洗剂及其制备方法与应用
CN103555434A (zh) 一种快速电路板清洗剂及其制备方法
CN103540440A (zh) 一种弱碱性杀菌印刷电路板清洗剂及其制备方法
CN109401859A (zh) 一种松香型助焊剂用水基清洗剂及清洗方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WW01 Invention patent application withdrawn after publication

Application publication date: 20171215

WW01 Invention patent application withdrawn after publication