CN106957748A - 一种pcb电路板水性清洗剂及其制备与应用 - Google Patents
一种pcb电路板水性清洗剂及其制备与应用 Download PDFInfo
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- ZZVUWRFHKOJYTH-UHFFFAOYSA-N diphenhydramine Chemical compound C=1C=CC=CC=1C(OCCN(C)C)C1=CC=CC=C1 ZZVUWRFHKOJYTH-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/88—Ampholytes; Electroneutral compounds
- C11D1/94—Mixtures with anionic, cationic or non-ionic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2068—Ethers
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/28—Heterocyclic compounds containing nitrogen in the ring
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/30—Amines; Substituted amines ; Quaternized amines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/02—Anionic compounds
- C11D1/04—Carboxylic acids or salts thereof
- C11D1/10—Amino carboxylic acids; Imino carboxylic acids; Fatty acid condensates thereof
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- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
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- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/02—Anionic compounds
- C11D1/12—Sulfonic acids or sulfuric acid esters; Salts thereof
- C11D1/14—Sulfonic acids or sulfuric acid esters; Salts thereof derived from aliphatic hydrocarbons or mono-alcohols
- C11D1/146—Sulfuric acid esters
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- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
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- C11D1/72—Ethers of polyoxyalkylene glycols
- C11D1/721—End blocked ethers
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- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
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- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/88—Ampholytes; Electroneutral compounds
- C11D1/92—Sulfobetaines ; Sulfitobetaines
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- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
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Abstract
本发明公开了一种PCB电路板水性清洗剂及其制备与应用，由以质量计算的如下组分制备而成：苯骈三氮唑0.5‑1份，月桂酸酰肌胺酸钠2‑4份，异构十三醇聚氧乙烯醚2‑4份，三乙二醇单丁醚5‑6.6份，异辛基硫酸钠1‑2.2份，萜烯醇3‑4.2份，单乙醇胺5‑6份，烷基羟磺基甜菜碱2‑3份，二丙二醇丁醚5‑6.8份，三丙二醇丁醚6‑7.7份，消泡剂0.5份，去离子水54‑68份，以水做清洗介质，添加表面活性剂，助剂，缓蚀剂，螯合剂等一系列以水为基的清洗剂助剂，去除水溶性剂和非极性污染物，同时清洗时不留白粉，确保被清洗的工件避免出现腐蚀现象；此外使用时简单，安全，环保，具有渗透力强，溶解力强的优点，清洗后的洗板水无腐蚀。
Description
技术领域
本发明涉及电子行业的金属加工液领域，尤其是涉及一种PCB电路板水性清洗剂及其制备与应用。
背景技术
随着社会的发展，科技也有着日新月异的变化。特别是电子行业迅猛发展，各种各样的电子产品被开发出来，丰富着人们的生活，供人们娱乐和工作，电子行业的发展离不开PCB电路板的开发，它是重要的电子部件，是电子元器件的支撑体。印制电路板从单层发展到双面板、多层板和挠性板，并不断地向高精度、高密度和高可靠性方向发展。不断缩小体积、减少成本、提高性能，使得印制电路板在未来电子产品的发展过程中，仍然保持强大的生命力。
未来印制电路板生产制造技术发展趋势是在性能上向高密度、高精度、细孔径、细导线、小间距、高可靠、多层化、高速传输、轻量、薄型方向发展。因此随着PCB电路板的发展，带动着金属加工液方面的发展。PCB电路板生产出来并不是光洁如新，需要我们进行清理，那我们就需要用相应的清洗剂进行处理。
目前市面上存在大量的PCB电路板清洗剂，但是都存在一定的问题，一方面存在对PCB电路板上的电子元件以及电路板产生腐蚀现象的问题；另一方面目前市面上存在的电路板清洗剂都是碳氢型的，这款清洗剂存在易燃，危险系数大，对人身安全有威胁、使用时气味大，对人体有一定的伤害的问题。
因此，一款针对以上问题的PCB电路板环保型的水性清洗剂值得研究。
发明内容
发明目的：为了解决现有技术中所存在的问题，本发明提出了一种不仅可以去除PCB电路板上水溶性剂和非极性污染物，同时也能确保被清洗工件未出现腐蚀现象、使用时简单，安全，环保的PCB电路板水性清洗剂及其制备与应用。
技术方案：为达以上目的，本发明采取以下技术方案：一种PCB电路板水性清洗剂，以质量计算包括如下原料组分：苯骈三氮唑0.5-1份，月桂酸酰肌胺酸钠2-4份，异构十三醇聚氧乙烯醚2-4份，三乙二醇单丁醚5-6.6份，异辛基硫酸钠1-2.2份，萜烯醇3-4.2份，单乙醇胺5-6份，烷基羟磺基甜菜碱2-3份，二丙二醇丁醚5-6.8份，三丙二醇丁醚6-7.7份，消泡剂0.5份，去离子水54-68份。
更为优选的，所述消泡剂为非硅抗泡剂。
更为优选的，本发明一种PCB电路板水洗清洗剂以质量计算包括：苯骈三氮唑0.6份，月桂酸酰肌胺酸钠2-4份，异构十三醇聚氧乙烯醚2-4份，三乙二醇单丁醚5-6.6份，异辛基硫酸钠1-2.2份，萜烯醇3-4.2份，单乙醇胺5.5份，烷基羟磺基甜菜碱2-3份，二丙二醇丁醚6份，三丙二醇丁醚6-7.7份，消泡剂0.5份，去离子水55.7-66.4份。
本发明还提出了上述一种PCB电路板水性清洗剂的制备方法，包括如下步骤：
(1)将各原料按照所需比例称量备用；
(2)首先将去离子水，单乙醇胺，烷基羟磺基甜菜碱，苯骈三氮唑混合均匀，在磁力搅拌器20-30rad/s的转速、搅拌温度为40-50℃的条件下进行搅拌，搅拌时间为1h；
(3)向上述混合物中加入月桂酸酰肌胺酸钠，异辛基硫酸钠，萜烯醇，与步骤(2)相同的搅拌条件下继续搅拌0.5h；
(4)向步骤(3)得到的混合物中继续添加异构十三醇聚氧乙烯醚，与步骤(2)相同的搅拌条件下继续搅拌0.5h；
(5)再向步骤(4)的混合物中加入三乙二醇单丁醚，二丙二醇丁醚，三丙二醇丁醚，与步骤(2)相同的搅拌条件下继续搅拌1h，最后加入消泡剂混合均匀得到所需清洗剂。
本发明还提出了上述一种PCB电路板水性清洗剂的应用，采用清洗剂与普通水以1:20或者1:10的比例进行清洗剂工作液的配制，保持工作液温度在50-60℃，采用PCB电路板竖直悬空放置且摆放方向与工作液流动方向一致，确保工作液均匀流过电路板表面，清洗完成后进行烘干处理。
有益效果：本发明提供的一种PCB电路板水性清洗剂及其制备与应用，由以质量计算的如下组分制备而成：苯骈三氮唑0.5-1份，月桂酸酰肌胺酸钠2-4份，异构十三醇聚氧乙烯醚2-4份，三乙二醇单丁醚5-6.6份，异辛基硫酸钠1-2.2份，萜烯醇3-4.2份，单乙醇胺5-6份，烷基羟磺基甜菜碱2-3份，二丙二醇丁醚5-6.8份，三丙二醇丁醚6-7.7份，消泡剂0.5份，去离子水54-68份；以水做清洗介质，添加表面活性剂，助剂，缓蚀剂，螯合剂等一系列以水为基的清洗剂助剂，去除水溶性剂和非极性污染物，同时清洗时不留白粉，确保被清洗的工件避免出现腐蚀现象；此外使用时简单，安全，环保，具有渗透力强，溶解力强的优点，清洗后的洗板水无腐蚀。
具体实施方式
实施例1：
一种PCB电路板水性清洗剂，以质量计算包括如下原料组分：苯骈三氮唑0.6份，月桂酸酰肌胺酸钠3份，异构十三醇聚氧乙烯醚3份，三乙二醇单丁醚5.6份，异辛基硫酸钠1.6份，萜烯醇3.5份，单乙醇胺5.5份，烷基羟磺基甜菜碱2.5份，二丙二醇丁醚6.8份，三丙二醇丁醚6份，消泡剂0.5份，去离子水61.4份。
实施例2：
一种PCB电路板水性清洗剂，以质量计算包括如下原料组分：苯骈三氮唑0.5份，月桂酸酰肌胺酸钠2份，异构十三醇聚氧乙烯醚2份，三乙二醇单丁醚5份，异辛基硫酸钠1份，萜烯醇3份，单乙醇胺5份，烷基羟磺基甜菜碱2份，二丙二醇丁醚5份，三丙二醇丁醚6份，消泡剂0.5份，去离子水68份。
实施例3：
一种PCB电路板水性清洗剂，以质量计算包括如下原料组分：苯骈三氮唑1份，月桂酸酰肌胺酸钠4份，异构十三醇聚氧乙烯醚4份，三乙二醇单丁醚6.6份，异辛基硫酸钠2.2份，萜烯醇4.2份，单乙醇胺6份，烷基羟磺基甜菜碱3份，二丙二醇丁醚7.7份，三丙二醇丁醚7.7份，消泡剂0.5份，去离子水53.1份。
实施例4：
一种PCB电路板水性清洗剂的制备方法，具体包括如下步骤：(1)将各原料按照所需比例称量备用；
(2)首先将去离子水，单乙醇胺，烷基羟磺基甜菜碱，苯骈三氮唑混合均匀，在磁力搅拌器20-30rad/s的转速、搅拌温度为40-50℃的条件下进行搅拌，搅拌时间为1h；
(3)向上述混合物中加入月桂酸酰肌胺酸钠，异辛基硫酸钠，萜烯醇，与步骤(2)相同的搅拌条件下继续搅拌0.5h；
(4)向步骤(3)得到的混合物中继续添加异构十三醇聚氧乙烯醚，与步骤(2)相同的搅拌条件下继续搅拌0.5h；
(5)再向步骤(4)的混合物中加入三乙二醇单丁醚，二丙二醇丁醚，三丙二醇丁醚，与步骤(2)相同的搅拌条件下继续搅拌1h，最后加入消泡剂混合均匀得到所需清洗剂。
实施例5：
将上述实施例4制备的PCB电路板水性清洗剂进行应用：
采用清洗剂与普通水以1:20的比例进行清洗剂工作液的配制，，保持工作液温度在50-60℃，取生产完成后的PCB板，将其竖直放在实验槽中，控制工作液温度保持在55摄氏度，然后搅拌工作液使其流动，看PCB板表面是否清理完成，清理完成后，烘干工件，观察其表面是否有残留，如果无，将其静置一段时间观察是否有生锈现象。取市场一款同类的清洗剂与该清洗剂做比较，在相同的条件下，清洗能力相差无几，但是市场上的清洗剂会出现腐蚀电子元件的情况，且市面上的清洗剂对皮肤有刺激性，使用时间过久容易引发皮肤病，而这款自我研发的清洗剂则无这种现象。，经检测其对松香，胶有很好的溶解性，而且对PCB电路板没有任何腐蚀现象。
此外，使用该款清洗剂，不会散发出任何刺鼻性的气味这样能确保人身安全，同时环保清洁，无残留，节省能源损耗。并且水基清洗剂能多次重复利用，而且水源易找廉价。
应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以作出若干改进，这些改进也应视为本发明的保护范围。
Claims (5)
1.一种PCB电路板水性清洗剂，其特征在于以质量计算包括如下原料组分：苯骈三氮唑0.5-1份，月桂酸酰肌胺酸钠2-4份，异构十三醇聚氧乙烯醚2-4份，三乙二醇单丁醚5-6.6份，异辛基硫酸钠1-2.2份，萜烯醇3-4.2份，单乙醇胺5-6份，烷基羟磺基甜菜碱2-3份，二丙二醇丁醚5-6.8份，三丙二醇丁醚6-7.7份，消泡剂0.5份，去离子水54-68份。
2.根据权利要求1所述的PCB电路板水性清洗剂，其特征在于：所述消泡剂为非硅抗泡剂。
3.根据权利要求1所述的PCB电路板水性清洗剂，其特征在于：以质量计算包括如下原料组分：苯骈三氮唑0.6份，月桂酸酰肌胺酸钠2-4份，异构十三醇聚氧乙烯醚2-4份，三乙二醇单丁醚5-6.6份，异辛基硫酸钠1-2.2份，萜烯醇3-4.2份，单乙醇胺5.5份，烷基羟磺基甜菜碱2-3份，二丙二醇丁醚6份，三丙二醇丁醚6-7.7份，消泡剂0.5份，去离子水55.7-66.4份。
4.如权利要求1所述的PCB电路板水性清洗剂的制备方法，其特征在于包括如下步骤：
(1)将各原料按照所需比例称量备用；
(2)首先将去离子水，单乙醇胺，烷基羟磺基甜菜碱，苯骈三氮唑混合均匀，在磁力搅拌器20-30rad/s的转速、搅拌温度为40-50℃的条件下进行搅拌，搅拌时间为1h；
(3)向上述混合物中加入月桂酸酰肌胺酸钠，异辛基硫酸钠，萜烯醇，与步骤(2)相同的搅拌条件下继续搅拌0.5h；
(4)向步骤(3)得到的混合物中继续添加异构十三醇聚氧乙烯醚，与步骤(2)相同的搅拌条件下继续搅拌0.5h；
(5)再向步骤(4)的混合物中加入三乙二醇单丁醚，二丙二醇丁醚，三丙二醇丁醚，与步骤(2)相同的搅拌条件下继续搅拌1h，最后加入消泡剂混合均匀得到所需清洗剂。
5.如权利要求1所述的PCB电路板水性清洗剂的应用，其特征在于：采用清洗剂与普通水以1:20或者1:10的比例进行清洗剂工作液的配制，保持工作液温度在50-60℃，采用PCB电路板竖直悬空放置且摆放方向与工作液流动方向一致，确保工作液均匀流过电路板表面，清洗完成后进行烘干处理。
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