CN107984090A - Laser marking machine and its application method - Google Patents
Laser marking machine and its application method Download PDFInfo
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- CN107984090A CN107984090A CN201711205132.8A CN201711205132A CN107984090A CN 107984090 A CN107984090 A CN 107984090A CN 201711205132 A CN201711205132 A CN 201711205132A CN 107984090 A CN107984090 A CN 107984090A
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- workpiece
- laser
- mark
- carrier platform
- material carrier
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention relates to a kind of laser marking machine, including：Feed mechanism, for by workpiece transfer to material carrier platform；First marking mechanism, including first laser device, the first laser device are set towards the side of the material carrier platform, so that the side that the first laser device is pointed to the workpiece of the material carrier platform carries out mark；Second marking mechanism, is set up in the top of the material carrier platform, including second laser, and the top surface of the second laser towards the material carrier platform is set, so that the top surface that the second laser is pointed to the workpiece of the material carrier platform carries out mark；Cutting agency, for the workpiece for completing mark to be removed by the material carrier platform.The work efficiency of above-mentioned laser marking machine is higher.
Description
Technical field
The present invention relates to laser equipment technical field, more particularly to a kind of laser marking machine and its application method.
Background technology
Existing laser marking machine usually only includes a labelling head, and mark is carried out respectively when needing the different surfaces to workpiece
When, it is necessary to carry out successively, expend time length, cause low production efficiency；In addition, when workpiece size to be processed is smaller (such as empty
Air cock) when, the dimension precision requirement of labelling head transfer process is high, increases the manufacture difficulty of laser marking machine.
The content of the invention
Based on this, it is necessary to which for existing laser marking machine workpiece different surfaces are carried out with low production efficiency, ruler during mark
The problem of very little required precision is high, there is provided a kind of laser marking machine and its application method.
A kind of laser marking machine, including：
Feed mechanism, for by workpiece transfer to material carrier platform；
First marking mechanism, including first laser device, the first laser device are set towards the side of the material carrier platform, with
The side that the first laser device is pointed to the workpiece of the material carrier platform is set to carry out mark；
Second marking mechanism, is set up in the top of the material carrier platform, including second laser, the second laser direction
The top surface of the material carrier platform is set, so that the top surface that the second laser is pointed to the workpiece of the material carrier platform carries out mark；
Cutting agency, for the workpiece for completing mark to be removed by the material carrier platform.
Above-mentioned laser marking machine, including the first marking mechanism and the second marking mechanism, the first laser of the first marking mechanism
Device towards material carrier platform side set so that the first marking mechanism be pointed to the workpiece of material carrier platform side carry out mark, second
The top surface of the second laser of marking mechanism towards material carrier platform is set so that the second marking mechanism beats the top surface of workpiece
Mark, it is above-mentioned synchronously to be carried out for the side of workpiece and the mark process of top surface, mark efficiency is substantially increased, while can
Meet the requirement that the different surfaces of reduced size workpiece are carried out with mark；In addition, feed mechanism and cutting agency realize automatically
Loading and unloading, effectively strengthen the degree of automation of above-mentioned laser marking machine, so as to improve production efficiency.
In one of the embodiments, the clamping device arranged on the material carrier platform is further included, the clamping device includes fixed
Position block, baffle and automatic telescopic component, the locating piece are arranged on the material carrier platform, and the locating piece is set with the baffle in angle
Put, the automatic telescopic component is arranged on the one end of the locating piece away from the baffle, the material carrier platform, the locating piece, institute
State baffle and the automatic telescopic component encloses and sets to form mark position, the automatic telescopic component and the baffle are described to being positioned over
The workpiece of mark position forms clamping.
In one of the embodiments, the automatic telescopic component includes base, pushing block and elastic parts, and the base connects
The locating piece is connected to, described elastic parts one end is connected to the base, and the other end is connected to the pushing block.
In one of the embodiments, the clamping device further includes the pushing mechanism arranged on the material carrier platform, described to push away
Motivation structure and the material carrier platform form material position, and the pushing mechanism is used to promote the workpiece to move to institute by the upper material position
State mark position.
In one of the embodiments, first marking mechanism further includes the first camera module and the first focusing component,
First camera module is used to absorb the mark pattern formed on the side of the workpiece；The first laser device and described
One camera module is arranged on first focusing component, to adjust the first laser device to the distance of the side of the workpiece
So that the first laser device is focused on the side of the workpiece.
In one of the embodiments, second marking mechanism further includes the second camera module and the second focusing component,
Second camera module is used to absorb the mark pattern formed on the top surface of workpiece；The second laser and described second is taken the photograph
Picture module is arranged on second focusing component, is caused with adjusting the second laser to the distance of the top surface of the workpiece
The second laser is focused on the top surface of the workpiece.
In one of the embodiments, first marking mechanism and/or second marking mechanism further include light source, use
Light filling is carried out when in first camera module or second camera module intake mark pattern.
In one of the embodiments, the feed mechanism includes stent, striker plate, first linear module, the first clamping
Component and the first Power Component, the striker plate and the first linear module are arranged on the stent, first clamp assembly
The described first linear module is slidably connected to, first Power Component is used to drive first clamp assembly along described first
Linear module movement, to shift the workpiece..
In one of the embodiments, the cutting agency include support plate, the second linear module, the second clamp assembly and
Second Power Component, the second linear module are arranged on the support plate, and second clamp assembly is slidably connected to described
Two linear modules, second Power Component are used to drive second clamp assembly to move along the described second linear module, with
The workpiece of mark is completed in transfer.
A kind of application method of the laser marking machine, comprises the following steps：
Workpiece of the feed mechanism crawl on conveyer belt, and it is transferred to material carrier platform；
The side to the workpiece and top surface carry out mark respectively for the first laser device and the second laser；
The workpiece for completing mark is transferred on the conveyer belt by the cutting agency from the material carrier platform.
Brief description of the drawings
Fig. 1 is the partial structural diagram of laser marking machine in one embodiment of the invention；
Fig. 2 is the partial structural diagram of the removal feed mechanism of laser marking machine in Fig. 1；
Fig. 3 is the structure diagram of laser marking machine in one embodiment of the invention；
Fig. 4 is the structure diagram of the feed mechanism of laser marking machine shown in Fig. 1；
Fig. 5 is the structure diagram of the clamping device of laser marking machine shown in Fig. 1；
Fig. 6 is the structure diagram of automatic telescopic component in clamping device shown in Fig. 5；
Fig. 7 is the schematic cross-sectional view of automatic telescopic component shown in Fig. 6；
Fig. 8 is the partial structural diagram of the first marking mechanism of laser marking machine shown in Fig. 1；
Fig. 9 is another partial structural diagram of the first marking mechanism of laser marking machine shown in Fig. 1；
Figure 10 is the partial structural diagram of the second marking mechanism of laser marking machine shown in Fig. 1；
Figure 11 is another partial structural diagram of the second marking mechanism of laser marking machine shown in Fig. 1；
Figure 12 is the structure diagram of the cutting agency of laser marking machine shown in Fig. 1.
Embodiment
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.In attached drawing
Give the better embodiment of the present invention.But the present invention can realize in many different forms, however it is not limited to herein
Described embodiment.On the contrary, the purpose for providing these embodiments is to make to understand more the disclosure
Add thorough and comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " interior ", " outer ", "left", "right" and
For illustrative purposes only, it is unique embodiment to be not offered as similar statement.
Please refer to Fig.1 and Fig. 2, laser marking machine 100 include feed mechanism 10, clamping device 20, the first marking mechanism 30,
Second marking mechanism 40 and cutting agency 50, the side of first laser device 31 towards the material carrier platform 90 of the first marking mechanism 30 are set
Put so that the first marking mechanism 30 carries out the side of workpiece mark, and the second laser 41 of the second marking mechanism 40 is towards load
Expect that the side of platform 90 is set so that the second marking mechanism 40 carries out the top surface of workpiece mark, the above-mentioned side for workpiece with
The mark process of top surface can be carried out synchronously, substantially increase mark efficiency, while disclosure satisfy that to reduced size workpiece not
The requirement of mark is carried out with surface；In addition, feed mechanism 10 and cutting agency 50 realize automatic loading/unloading, effectively strengthen above-mentioned
The degree of automation of laser marking machine 100, so as to improve production efficiency.
Referring to Fig. 3, laser marking machine 100 further includes cabinet 60, shell 70 and conveyer belt 80, cabinet 60 and shell 70 enclose
If forming cavity, feed mechanism 10, clamping device 20, the first marking mechanism 30, the second marking mechanism 40 and cutting agency 50 hold
It is contained in cavity；Conveyer belt 80 wears shell 70 and sets, for workpiece to be processed to be delivered in cavity, for feed mechanism 10
The workpiece transfer for completing mark to conveyer belt 80, cavity is conveyed out by conveyer belt 80 by pickup, cutting agency 40.
Referring to Fig. 5, clamping device 20 includes locating piece 22, baffle 23 and automatic telescopic component 24, locating piece 22 is arranged on
Material carrier platform 90, locating piece 22 are set with baffle 23 in angle, and automatic telescopic component 24 is arranged on one of locating piece 22 away from baffle 23
End, material carrier platform 90, locating piece 22, baffle 23 and automatic telescopic component 24, which enclose, to be set to form mark position a, automatic telescopic component 24 and gear
Plate 23 forms clamping to the workpiece for being positioned over mark position a.Clamping device 20 further includes the pushing mechanism 25 arranged on material carrier platform 90, pushes away
Motivation structure 25 and material carrier platform 90 form upper material position b, and pushing mechanism 25 is used to promote workpiece to move to mark position a by upper material position b.Folder
Holding mechanism 20 includes mark position a and upper material position b, and for the workpiece positioned at mark position a in mark, feed mechanism 10 will be next to be processed
The supreme material position b of workpiece transfer, realize the close linking of different processes, effectively improve the production efficiency of laser marking machine 100；From
The setting of dynamic telescopic component 24 is so that the size adjustable of mark position a, can be suitable for different size and the workpiece of model, enhance
The applicability of clamping device 20, can be processed the workpiece of different size and model easy to laser marking machine 100.
It should be understood that when workpiece is yielding light material, after pushing mechanism 25 shifts workpiece onto position, continue to
Workpiece is held in, clamping position effect is formed to workpiece jointly with automatic telescopic component 24, locating piece 22 and baffle 23.When workpiece matter
Measure larger or when being on-deformable rigid, pushing mechanism 25 bounces back after shifting workpiece onto position.Further, pushing mechanism
25 setting improves the degree of automation of the clamping device 20, operating personnel workpiece need to be only positioned over upper material position b without
Other operations are carried out, improve production efficiency.
Fig. 6 and Fig. 7 are referred to, automatic telescopic component 24 includes base 241, pushing block 242 and elastic parts 243, base 241
Locating piece 22 is connected to, 243 one end of elastic parts is connected to base 241, and the other end is connected to pushing block 242.It should be understood that push away
Block 242 forms clamping action to workpiece jointly towards baffle 23, pushing block 242 and baffle 23, since pushing block 242 passes through elastic parts
243 are connected to base 241, and under the telescopic action of elastic parts 243, pushing block 242 and the spacing of baffle 23 are adjustable so that clamping
Mechanism 20 is suitable for gripping for the workpiece of different size, while pushing block 242 produces pressure to workpiece, prevents workpiece from moving
It is dynamic.
Fig. 8 and Fig. 9 are referred to, the first marking mechanism 30 includes first laser device 31, the first camera module 32 and first is adjusted
Burnt component 33, first laser device 31 are set towards the side of material carrier platform 90, and the laser directive that first laser device 31 is launched is located at
The side surface of workpiece of mark position a is to carry out mark, it is possible to understand that, formed with gap c between baffle 23 and material carrier platform 90, for
The laser light of one laser 31 transmitting.First camera module 32 is used to absorb the mark pattern formed in side surface of workpiece, and will
Mark pattern is transmitted to analysis system, and analysis system analyzes clarity, position and the integrality of mark pattern, to judge mark figure
Whether case is qualified；31 and first camera module 32 of first laser device is arranged on the first focusing component 33,33 band of the first focusing component
The 31 opposite piece movement of dynamic first laser device, make it that first laser device 31 is poly- to adjust first laser device 31 to the distance of side
Jiao is in side surface of workpiece, to reach optimal mark effect.In one embodiment, the first marking mechanism 30 further includes light source 34, with
Increase the local light intensity of workpiece, illuminate mark pattern, the first camera module 32 of auxiliary is taken pictures.It should be understood that work as
When the surface of mark workpiece is metal material, first laser device 31 is infrared laser；When the surface for treating mark workpiece is modeling
When expecting material, first laser device 31 is ultraviolet laser, the laser of different wave length is selected according to unlike material, to ensure mark
Effect so that mark pattern is fine beautiful and clear lasting.
First focusing component 33 includes fixed seat 331, pinboard 332 and handwheel 333, and 331 level of fixed seat is fixed on machine
On cabinet 60, pinboard 332 is slidably connected in fixed seat 331, and 31 and first camera module 32 of first laser device is arranged on pinboard
On 332, rotate handwheel 333 and enable to screw 331b transmission pinboards 332 to be transported along before and after the guide rail 331a in fixed seat 331
It is dynamic, so that the position of 31 opposite piece of first laser device is adjusted, so that first laser device 31 focuses on side surface of workpiece.Specifically
, fixed seat 331 is equipped with two guide rail 331a, and pinboard 332 offers and the matched sliding slots of guide rail 331a, the first focusing component
33 further include the screw 331b arranged on fixed seat 331, and screw 331b one end is connected to pinboard 332, and the other end is connected to handwheel
333, rotate handwheel 333 and enable to screw 331b to drive pinboard 332 to be moved forward and backward along the guide rail 331a in fixed seat 331,
So as to adjust the position of 31 opposite piece of first laser device, so that first laser device 31 focuses on the side of workpiece, to ensure
Mark effect.
0 and Figure 11 are please referred to Fig.1, the second marking mechanism 40 includes second laser 41, the second camera module 43 and second
Focusing component 42, the top surface of second laser 41 towards material carrier platform 90 are set, the laser directive position that second laser 41 is launched
Mark is carried out in the top surface of the workpiece of mark position a, the second camera module 43 is used to absorb the mark formed on the top surface of workpiece
Pattern, and mark pattern is transmitted to analysis system, analysis system analyzes clarity, position and the integrality of mark pattern, with
Judge whether mark pattern is qualified；41 and second camera module 43 of second laser is arranged on the second focusing component 42, and second adjusts
Burnt component 42 drives the movement of 41 opposite piece of second laser, causes second to the distance of top surface to adjust second laser 41
Laser 41 is focused on the top surface of workpiece, to reach optimal mark effect.In one embodiment, the second marking mechanism 40 is gone back
Including light source (not shown), to increase the local light intensity of workpiece, mark pattern is illuminated, the second camera module 43 of auxiliary carries out
Take pictures.It should be understood that when when the surface of mark workpiece is metal material, second laser 41 is infrared laser；When treating
When the surface of mark workpiece is plastic material, second laser 41 is ultraviolet laser, and different wave length is selected according to unlike material
Laser, to ensure mark effect so that mark pattern it is fine beautiful and it is clear persistently.
Second focusing component 42 includes main body 421, mounting bar 422 and runner 423, and main body 421 is arranged on cabinet 60 vertically,
Mounting bar 422 is slidably connected to main body 421, and 41 and second camera assembly 42 of second laser is fixed on mounting bar 422, rotates
Runner 423 so that mounting bar 422 moves up and down with respect to main body 421, drives the movement of 41 opposite piece of second laser, so that
Second laser 41 focuses on the top surface of workpiece.In one embodiment, runner 423 is marked with code table, for recording second laser
The height value of device 41, convenient adjustment.
Referring to Fig. 4, feed mechanism 10 includes stent 11, striker plate 12, first linear module 13, the first clamp assembly 14
And first Power Component 15, stent 11 are fixed on cabinet 60, striker plate 12 and first linear module 13 are arranged on stent 11, first
Clamp assembly 14 is slidably connected to the first linear module 13, and the first Power Component 15 is used to drive the first clamp assembly 14 along first
Linear module 13 moves, to shift workpiece.First clamp assembly 14 is by picking up workpiece to be processed, the first power on conveyer belt 80
Component 15 drives the first clamp assembly 14 to be moved along the first linear module 13, by workpiece transfer to clamping device 20.Implement one
In example, the first Power Component 15 is electric cylinders, and electric cylinders can realize the laterally quick mobile of the first clamp assembly 14, while can essence
The really running position of the first clamp assembly 14 of control, realizes the accurate linking of feed mechanism 10 and clamping device 20, improves laser
The production efficiency of marking machine 100.
In one embodiment, the first clamp assembly 14 includes fixture 141, cylinder 142 and sensor (not shown), cylinder
142 are used to control fixture 141 to clamp or unclamp workpiece, and sensor 34 is used for the working status for judging cylinder 142, and feeds back to control
System processed, accurate instruction is sent easy to control system to cylinder 142.
2 are please referred to Fig.1, cutting agency 50 includes support plate 51, the second linear module 52, the second clamp assembly 53 and second
Power Component 54, support plate 51 are fixed on cabinet 60, and the second linear module 52 is arranged on support plate 51, and the second clamp assembly 53 is slided
Dynamic to be connected to the second linear module 52, the second Power Component 54 is used to drive the second clamp assembly 53 to transport along the second linear module 52
It is dynamic, the workpiece of mark is completed with transfer.Second clamp assembly 53 is completed the work of mark by the mark position a pickups of clamping device 20
Part, the second Power Component 54 drive the second clamp assembly 53 to be moved along the second linear module 52, will complete the workpiece transfer of mark
To conveyer belt, the degree of automation of laser marking machine 100 is improved.In one embodiment, the second Power Component 54 is electric cylinders, electricity
Cylinder can realize the vertical quick mobile of the second clamp assembly 53, while can accurately control the running position of the second clamp assembly 53
Put.
A kind of application method of laser marking machine 100, comprises the following steps：
Workpiece of the crawl of feed mechanism 10 on conveyer belt 80, and it is transferred to material carrier platform 90；
The side to workpiece and top surface carry out mark respectively for first laser device 31 and second laser 41；
The workpiece for completing mark is transferred on conveyer belt 80 by cutting agency 50 from material carrier platform.
Further, the mark pattern on the first camera module 32 intake side, the second camera module 43 are absorbed on top surface
Mark pattern, and the mark pattern on side and top surface is transmitted to analysis system, analysis system air exercise marks on a map case carry out it is clear
Clear degree, position and integrity analysis, and the workpiece for completing mark is divided into non-defective unit or substandard products, cutting agency 50 shifts non-defective unit
To conveyer belt 80, and carry out the processing of subsequent processing；And substandard products are collected.Taken the photograph by the first camera module 32 and second
As module 43 carries out credit rating classification to the workpiece after mark, it is ensured that the quality of mark product, while can realize substandard products
Effective recycling and recycle.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses the several embodiments of the present invention, its description is more specific and detailed, but simultaneously
Cannot therefore it be construed as limiting the scope of the patent.It should be pointed out that come for those of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
- A kind of 1. laser marking machine, it is characterised in that including：Feed mechanism, for by workpiece transfer to material carrier platform；First marking mechanism, including first laser device, the first laser device is set towards the side of the material carrier platform, so that institute The side for stating the workpiece that first laser device is pointed to the material carrier platform carries out mark；Second marking mechanism, is set up in the top of the material carrier platform, including second laser, the second laser is described in The top surface of material carrier platform is set, so that the top surface that the second laser is pointed to the workpiece of the material carrier platform carries out mark；Cutting agency, for the workpiece for completing mark to be removed by the material carrier platform.
- 2. laser marking machine according to claim 1, it is characterised in that further include the clamping machine arranged on the material carrier platform Structure, the clamping device include locating piece, baffle and automatic telescopic component, and the locating piece is arranged on the material carrier platform, described fixed Position block is set with the baffle in angle, and the automatic telescopic component is arranged on the one end of the locating piece away from the baffle, institute State material carrier platform, the locating piece, the baffle and the automatic telescopic component and enclose and set to form mark position, the automatic telescopic component Clamping is formed to the workpiece for being positioned over the mark position with the baffle.
- 3. laser marking machine according to claim 2, it is characterised in that the automatic telescopic component includes base, pushing block And elastic parts, the base are connected to the locating piece, described elastic parts one end is connected to the base, other end connection In the pushing block.
- 4. laser marking machine according to claim 2, it is characterised in that the clamping device is further included arranged on the material containing The pushing mechanism of platform, the pushing mechanism and the material carrier platform form material position, and the pushing mechanism is used to promote the workpiece The mark position is moved to by the upper material position.
- 5. laser marking machine according to claim 1, it is characterised in that first marking mechanism further includes the first shooting Module and the first focusing component, first camera module are used to absorb the mark pattern formed on the side of the workpiece；Institute State first laser device and first camera module is arranged on first focusing component, to adjust the first laser device to institute State the distance of the side of workpiece and so that the first laser device is focused on the side of the workpiece.
- 6. laser marking machine according to claim 5, it is characterised in that second marking mechanism further includes the second shooting Module and the second focusing component, second camera module are used to absorb the mark pattern formed on the top surface of workpiece；Described Dual-laser device and second camera module are arranged on second focusing component, to adjust the second laser to the work The distance of the top surface of part and cause the second laser focus on the top surface of the workpiece.
- 7. laser marking machine according to claim 6, it is characterised in that first marking mechanism and/or second mark Mechanism further includes light source, for being mended in first camera module or second camera module intake mark pattern Light.
- 8. laser marking machine according to claim 1, it is characterised in that the feed mechanism includes stent, striker plate, the One linear module, the first clamp assembly and the first Power Component, the striker plate and the first linear module are arranged on the branch Frame, first clamp assembly are slidably connected to the described first linear module, and first Power Component is used to driving described the One clamp assembly is moved along the described first linear module, to shift the workpiece.
- 9. laser marking machine according to claim 8, it is characterised in that the cutting agency includes support plate, the second line Property module, the second clamp assembly and the second Power Component, the second linear module is arranged on the support plate, and described second clamps Component slippage is connected to the described second linear module, and second Power Component is used to drive second clamp assembly described in Second linear module movement, the workpiece of mark is completed with transfer.
- It is 10. a kind of such as the application method of claim 1-9 any one of them laser marking machines, it is characterised in that including following Step：Workpiece of the feed mechanism crawl on conveyer belt, and it is transferred to material carrier platform；The side to the workpiece and top surface carry out mark respectively for the first laser device and the second laser；The workpiece for completing mark is transferred on the conveyer belt by the cutting agency from the material carrier platform.
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| CN201711205132.8A CN107984090B (en) | 2017-11-27 | 2017-11-27 | Laser marking machine and using method thereof |
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|---|---|---|---|
| CN201711205132.8A CN107984090B (en) | 2017-11-27 | 2017-11-27 | Laser marking machine and using method thereof |
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| CN107984090B CN107984090B (en) | 2020-05-19 |
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| CN108788484A (en) * | 2018-07-10 | 2018-11-13 | 青岛元启智能机器人科技有限公司 | A kind of trailing type laser method |
| CN110153564A (en) * | 2019-06-13 | 2019-08-23 | 武汉海创电子股份有限公司 | The mark pretreatment automation equipment and application method of sensor outer housing lock pin |
| CN110434476A (en) * | 2019-07-12 | 2019-11-12 | 大族激光科技产业集团股份有限公司 | Laser marking system |
| CN110842348A (en) * | 2018-07-31 | 2020-02-28 | 大族激光科技产业集团股份有限公司 | Laser beam splitting device and laser marking equipment |
| CN111055022A (en) * | 2019-12-31 | 2020-04-24 | 上海常越机械设备有限公司 | High-precision laser marking device |
| CN111070877A (en) * | 2020-01-14 | 2020-04-28 | 深圳市至臻精密股份有限公司 | Intelligent metal material surface printing machine |
| CN111375909A (en) * | 2020-03-02 | 2020-07-07 | 张家港市欧微自动化研发有限公司 | Laser marking method for connector |
| CN111843220A (en) * | 2019-04-19 | 2020-10-30 | 大族激光科技产业集团股份有限公司 | Laser marking device and control method thereof |
| CN113500542A (en) * | 2021-09-08 | 2021-10-15 | 启东市神龙工业配套有限公司 | Fixing device is used in data plate production and processing |
| CN114211125A (en) * | 2021-12-22 | 2022-03-22 | 深圳市同为数码科技股份有限公司 | Multi-surface laser marking system |
| CN117483969A (en) * | 2024-01-03 | 2024-02-02 | 济南雷圣自动化技术有限公司 | Full-automatic double-laser marking machine capable of automatically detecting milling opening |
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| CN108788484A (en) * | 2018-07-10 | 2018-11-13 | 青岛元启智能机器人科技有限公司 | A kind of trailing type laser method |
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| CN111843220A (en) * | 2019-04-19 | 2020-10-30 | 大族激光科技产业集团股份有限公司 | Laser marking device and control method thereof |
| CN110153564A (en) * | 2019-06-13 | 2019-08-23 | 武汉海创电子股份有限公司 | The mark pretreatment automation equipment and application method of sensor outer housing lock pin |
| CN110434476A (en) * | 2019-07-12 | 2019-11-12 | 大族激光科技产业集团股份有限公司 | Laser marking system |
| CN111055022B (en) * | 2019-12-31 | 2022-04-15 | 上海常越机械设备有限公司 | High-precision laser marking device |
| CN111055022A (en) * | 2019-12-31 | 2020-04-24 | 上海常越机械设备有限公司 | High-precision laser marking device |
| CN111070877A (en) * | 2020-01-14 | 2020-04-28 | 深圳市至臻精密股份有限公司 | Intelligent metal material surface printing machine |
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| CN113500542B (en) * | 2021-09-08 | 2021-11-26 | 启东市神龙工业配套有限公司 | Fixing device is used in data plate production and processing |
| CN113500542A (en) * | 2021-09-08 | 2021-10-15 | 启东市神龙工业配套有限公司 | Fixing device is used in data plate production and processing |
| CN114211125A (en) * | 2021-12-22 | 2022-03-22 | 深圳市同为数码科技股份有限公司 | Multi-surface laser marking system |
| CN117483969A (en) * | 2024-01-03 | 2024-02-02 | 济南雷圣自动化技术有限公司 | Full-automatic double-laser marking machine capable of automatically detecting milling opening |
| CN117483969B (en) * | 2024-01-03 | 2024-03-26 | 济南雷圣自动化技术有限公司 | Full-automatic double-laser marking machine capable of automatically detecting milling opening |
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