CN107922587B - 固化性组合物及使用其的光学元件 - Google Patents

固化性组合物及使用其的光学元件 Download PDF

Info

Publication number
CN107922587B
CN107922587B CN201680046156.0A CN201680046156A CN107922587B CN 107922587 B CN107922587 B CN 107922587B CN 201680046156 A CN201680046156 A CN 201680046156A CN 107922587 B CN107922587 B CN 107922587B
Authority
CN
China
Prior art keywords
component
curable composition
compounds
group
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201680046156.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN107922587A (zh
Inventor
藤川武
石田恭平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daicel Corp
Original Assignee
Daicel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Corp filed Critical Daicel Corp
Publication of CN107922587A publication Critical patent/CN107922587A/zh
Application granted granted Critical
Publication of CN107922587B publication Critical patent/CN107922587B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/20—Carboxylic acid amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C08K5/134—Phenols containing ester groups
    • C08K5/1345—Carboxylic esters of phenolcarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515—Three-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C08K5/3475—Five-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37—Thiols
    • C08K5/375—Thiols containing six-membered aromatic rings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN201680046156.0A 2015-08-07 2016-07-14 固化性组合物及使用其的光学元件 Active CN107922587B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015156988A JP6204420B2 (ja) 2015-08-07 2015-08-07 硬化性組成物、及びそれを用いた光学素子
JP2015-156988 2015-08-07
PCT/JP2016/070803 WO2017026225A1 (ja) 2015-08-07 2016-07-14 硬化性組成物、及びそれを用いた光学素子

Publications (2)

Publication Number Publication Date
CN107922587A CN107922587A (zh) 2018-04-17
CN107922587B true CN107922587B (zh) 2020-12-25

Family

ID=57983137

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680046156.0A Active CN107922587B (zh) 2015-08-07 2016-07-14 固化性组合物及使用其的光学元件

Country Status (7)

Country Link
US (2) US10584200B2 (https=)
EP (1) EP3333210A4 (https=)
JP (1) JP6204420B2 (https=)
KR (1) KR20180039081A (https=)
CN (1) CN107922587B (https=)
TW (1) TWI700329B (https=)
WO (1) WO2017026225A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6204420B2 (ja) 2015-08-07 2017-09-27 株式会社ダイセル 硬化性組成物、及びそれを用いた光学素子
JP6553980B2 (ja) * 2015-08-13 2019-07-31 株式会社ダイセル 硬化性組成物及びその硬化物
WO2018101196A1 (ja) * 2016-11-29 2018-06-07 富士フイルム株式会社 重合性液晶組成物、光学異方性膜、光学フィルム、偏光板、画像表示装置および有機エレクトロルミネッセンス表示装置
JP6576991B2 (ja) * 2017-08-30 2019-09-18 株式会社ダイセル 硬化性組成物、及びそれを用いた光学素子
JP7087358B2 (ja) * 2017-11-29 2022-06-21 Dic株式会社 繊維強化成形材料及びそれを用いた成形品
WO2024081298A1 (en) * 2022-10-11 2024-04-18 U.S. Silica Company Reflective granular compositions containing cristobalite

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3788858B2 (ja) 1997-09-19 2006-06-21 日本化薬株式会社 レンズ用樹脂組成物及びその硬化物
US20030059618A1 (en) * 2001-03-23 2003-03-27 Hideyuke Takai Method of producing epoxy compound, epoxy resin composition and its applications, ultraviolet rays-curable can-coating composition and method of producing coated metal can
JP4124991B2 (ja) 2001-10-23 2008-07-23 Ｄｉｃ株式会社 フレネルレンズ用活性エネルギー線硬化型樹脂組成物及びフレネルレンズシート
JP2005119124A (ja) 2003-10-16 2005-05-12 Teijin Chem Ltd ポリカーボネート共重合体の射出成形法およびそれにより成形される成形品
JPWO2006100978A1 (ja) * 2005-03-18 2008-09-04 コニカミノルタエムジー株式会社 活性光線硬化型組成物、重合方法、活性光線硬化型インク、画像形成方法及びインクジェット記録装置
CN101163748B (zh) 2005-05-26 2011-04-13 陶氏康宁公司 用于模塑小的型材的方法和有机硅封装剂组合物
JP5063873B2 (ja) * 2005-07-05 2012-10-31 出光興産株式会社 光拡散性ポリカーボネート系樹脂組成物、および同樹脂組成物を用いた光拡散板
JP5064857B2 (ja) * 2007-03-29 2012-10-31 日本製紙株式会社 嵩高中質書籍用紙
US20090004579A1 (en) * 2007-06-27 2009-01-01 Dsm Ip Assets B.V. Clear and colorless three-dimensional articles made via stereolithography and method of making said articles
JP5435879B2 (ja) * 2008-02-14 2014-03-05 株式会社ダイセル ナノインプリント用硬化性樹脂組成物
JP2009197180A (ja) 2008-02-25 2009-09-03 Toray Ind Inc 耐光性エポキシ樹脂組成物およびそれを用いた繊維強化複合材料
JP5296575B2 (ja) 2009-03-06 2013-09-25 住友化学株式会社 光硬化性接着剤組成物、偏光板とその製造法、光学部材及び液晶表示装置
JP2010248408A (ja) * 2009-04-17 2010-11-04 Kaneka Corp 硬化性組成物
JP5849350B2 (ja) * 2009-12-17 2016-01-27 ディーエスエム アイピー アセッツ ビー．ブイ． 基材を用いた積層造形法
EP2422614A1 (de) * 2010-08-26 2012-02-29 Kuraray Europe GmbH Weichmacherhaltige Folien auf Basis von Polyvinylacetal mit selektiver Durchlässigkeit für UV-Strahlung
JP2012082272A (ja) * 2010-10-08 2012-04-26 Dainippon Printing Co Ltd 電子線硬化性樹脂組成物及びその硬化物
JP6047905B2 (ja) * 2012-03-29 2016-12-21 住友化学株式会社 偏光板及びそれを用いた積層光学部材
JP5953875B2 (ja) * 2012-03-29 2016-07-20 住友化学株式会社 偏光板及びそれを用いた積層光学部材
WO2014196515A1 (ja) 2013-06-03 2014-12-11 株式会社ダイセル 硬化性エポキシ樹脂組成物
FR3007153B1 (fr) 2013-06-12 2015-06-05 Montabert Roger Procede de commande d’un parametre d’alimentation d’un appareil a percussions
EP2842980B1 (en) * 2013-08-09 2021-05-05 DSM IP Assets B.V. Low-viscosity liquid radiation curable dental aligner mold resin compositions for additive manufacturing
CN105900211A (zh) * 2014-01-29 2016-08-24 株式会社大赛璐 纳米压印用光固化性组合物、以及使用了该组合物的微细图案的形成方法
WO2015199091A1 (ja) * 2014-06-27 2015-12-30 株式会社ダイセル モノマー組成物、及びそれを含む硬化性組成物
WO2015199093A1 (ja) * 2014-06-27 2015-12-30 株式会社ダイセル モノマー組成物、及びそれを含む硬化性組成物
US20170152346A1 (en) * 2014-06-27 2017-06-01 Daicel Corporation Monomer composition and curable composition containing same
EP3162822B1 (en) * 2014-06-27 2020-08-26 Daicel Corporation Monomer composition and curable composition containing same
WO2016021577A1 (ja) * 2014-08-08 2016-02-11 株式会社ダイセル 特殊形状を有するエポキシ樹脂成形物、及びそれを備えた光学装置
KR20170056617A (ko) * 2014-09-17 2017-05-23 주식회사 다이셀 경화성 조성물 및 그것을 사용한 광학 소자
JP6652495B2 (ja) * 2014-10-23 2020-02-26 株式会社ダイセル フレネルレンズ、及びそれを備えた光学装置
JP6948943B2 (ja) * 2015-05-27 2021-10-13 株式会社ダイセル 光硬化性組成物、それを用いた硬化物及び光学部品
JP6204420B2 (ja) 2015-08-07 2017-09-27 株式会社ダイセル 硬化性組成物、及びそれを用いた光学素子
JP6286396B2 (ja) * 2015-08-13 2018-02-28 株式会社ダイセル 硬化性組成物及びその硬化物
JP6553980B2 (ja) * 2015-08-13 2019-07-31 株式会社ダイセル 硬化性組成物及びその硬化物
JP2017040791A (ja) * 2015-08-20 2017-02-23 株式会社ダイセル 光学部品、及びそれを備えた光学装置
EP3377291B1 (en) * 2015-11-17 2021-11-03 Covestro (Netherlands) B.V. Improved antimony-free radiation curable compositions for additive fabrication, and applications thereof in investment casting processes
US11208585B2 (en) 2016-03-24 2021-12-28 Tetra Technologies, Inc. High density, low TCT divalent brines and uses thereof

Also Published As

Publication number Publication date
US20180230260A1 (en) 2018-08-16
US10829586B2 (en) 2020-11-10
TWI700329B (zh) 2020-08-01
JP2017036367A (ja) 2017-02-16
US10584200B2 (en) 2020-03-10
WO2017026225A1 (ja) 2017-02-16
JP6204420B2 (ja) 2017-09-27
EP3333210A1 (en) 2018-06-13
US20200115491A1 (en) 2020-04-16
KR20180039081A (ko) 2018-04-17
EP3333210A4 (en) 2019-06-26
TW201712067A (zh) 2017-04-01
CN107922587A (zh) 2018-04-17

Similar Documents

Publication Publication Date Title
JP6232160B1 (ja) レンズの製造方法、レンズおよび光学装置
CN107922587B (zh) 固化性组合物及使用其的光学元件
JP6652616B2 (ja) 特殊形状を有するエポキシ樹脂成形物、及びそれを備えた光学装置
TWI709584B (zh) 菲涅耳透鏡及其製造方法、以及具備該菲涅耳透鏡之光學裝置及其製造方法
CN106687499B (zh) 固化性组合物、以及使用其的光学元件
JP6576991B2 (ja) 硬化性組成物、及びそれを用いた光学素子

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant