CN107921582B - 用于形成导电迹线的方法和设备 - Google Patents

用于形成导电迹线的方法和设备 Download PDF

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Publication number
CN107921582B
CN107921582B CN201680047793.XA CN201680047793A CN107921582B CN 107921582 B CN107921582 B CN 107921582B CN 201680047793 A CN201680047793 A CN 201680047793A CN 107921582 B CN107921582 B CN 107921582B
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China
Prior art keywords
laser beam
substrate
path
cross
energy distribution
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CN201680047793.XA
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English (en)
Chinese (zh)
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CN107921582A (zh
Inventor
A·N·布伦顿
西蒙·约翰·亨里
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Yingshuo Laser Technology Zhuhai Co ltd
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Vanguard Laser Co Ltd
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Publication of CN107921582A publication Critical patent/CN107921582A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/34—Laser welding for purposes other than joining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0732—Shaping the laser spot into a rectangular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)
  • Electrodes Of Semiconductors (AREA)
CN201680047793.XA 2015-08-18 2016-08-03 用于形成导电迹线的方法和设备 Active CN107921582B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1514655.8 2015-08-18
GB1514655.8A GB2541412B (en) 2015-08-18 2015-08-18 Method and Apparatus for Forming a Conductive Track
PCT/GB2016/052387 WO2017029472A1 (en) 2015-08-18 2016-08-03 Method and apparatus for forming a conductive track

Publications (2)

Publication Number Publication Date
CN107921582A CN107921582A (zh) 2018-04-17
CN107921582B true CN107921582B (zh) 2020-02-07

Family

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CN201680047793.XA Active CN107921582B (zh) 2015-08-18 2016-08-03 用于形成导电迹线的方法和设备

Country Status (8)

Country Link
US (1) US10882136B2 (https=)
EP (1) EP3337636B1 (https=)
JP (1) JP7079727B2 (https=)
KR (1) KR102563985B1 (https=)
CN (1) CN107921582B (https=)
GB (1) GB2541412B (https=)
TW (1) TWI694881B (https=)
WO (1) WO2017029472A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6955932B2 (ja) * 2017-08-25 2021-10-27 株式会社ディスコ レーザービームプロファイラユニット及びレーザー加工装置
EP3624571A1 (en) * 2018-09-14 2020-03-18 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO A process for the manufacturing of printed conductive tracks on an object and 3d printed electronics
CN115361785B (zh) * 2022-08-23 2025-03-21 广东工业大学 一种精细线路的制备方法及系统
GB2629349A (en) * 2023-04-24 2024-10-30 M Solv Ltd Apparatus and method for directing laser radiation onto a target, laser drilling apparatus and method
CN118016737B (zh) * 2024-01-24 2025-05-30 天合光能股份有限公司 太阳能电池及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2220502A (en) * 1988-07-09 1990-01-10 Exitech Ltd Excimer laser beam homogenizer system
JPH04307727A (ja) * 1991-04-04 1992-10-29 Seiko Epson Corp 薄膜トランジスタの製造方法及び製造装置
EP1055479A2 (en) * 1999-05-24 2000-11-29 Sel Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus
US6168968B1 (en) * 1997-02-27 2001-01-02 Sharp Kabushiki Kaisha Method of fabricating integrated thin film solar cells

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US6331692B1 (en) 1996-10-12 2001-12-18 Volker Krause Diode laser, laser optics, device for laser treatment of a workpiece, process for a laser treatment of workpiece
US6750423B2 (en) * 2001-10-25 2004-06-15 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation method, laser irradiation apparatus, and method of manufacturing a semiconductor device
TWI221102B (en) * 2002-08-30 2004-09-21 Sumitomo Heavy Industries Laser material processing method and processing device
JP4536601B2 (ja) * 2004-06-14 2010-09-01 株式会社半導体エネルギー研究所 半導体装置の作製方法
US20060003262A1 (en) * 2004-06-30 2006-01-05 Eastman Kodak Company Forming electrical conductors on a substrate
JP2006038999A (ja) * 2004-07-23 2006-02-09 Sumitomo Electric Ind Ltd レーザ照射を用いた導電性回路形成方法と導電性回路
WO2006011671A1 (en) * 2004-07-30 2006-02-02 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus and laser irradiation method
US7722422B2 (en) 2007-05-21 2010-05-25 Global Oled Technology Llc Device and method for improved power distribution for a transparent electrode
JP4601679B2 (ja) * 2008-02-21 2010-12-22 三洋電機株式会社 太陽電池モジュール
DE102008019636A1 (de) * 2008-04-18 2009-10-22 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Bauteil mit Schweißnaht und Verfahren zur Herstellung einer Schweißnaht
JP2010145562A (ja) 2008-12-17 2010-07-01 Panasonic Corp パターン形成方法
KR20100080120A (ko) * 2008-12-31 2010-07-08 한국생산기술연구원 인쇄회로 소결방법
GB0900036D0 (en) 2009-01-03 2009-02-11 M Solv Ltd Method and apparatus for forming grooves with complex shape in the surface of apolymer
GB2474665B (en) * 2009-10-22 2011-10-12 M Solv Ltd Method and apparatus for dividing thin film device into separate cells
JP2011194413A (ja) 2010-03-17 2011-10-06 Sony Corp 表面超微細凹凸構造を有する成形品の製造方法
JP2011249357A (ja) * 2010-05-21 2011-12-08 Panasonic Electric Works Co Ltd 回路基板および回路基板の製造方法
KR101114256B1 (ko) * 2010-07-14 2012-03-05 한국과학기술원 패턴 제조 방법
KR101247619B1 (ko) * 2011-08-29 2013-04-01 한국과학기술원 금속 나노입자 극미세 레이저 소결 장치 및 방법
WO2016075822A1 (ja) 2014-11-14 2016-05-19 富士機械製造株式会社 配線基板作製方法および配線基板作製装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2220502A (en) * 1988-07-09 1990-01-10 Exitech Ltd Excimer laser beam homogenizer system
JPH04307727A (ja) * 1991-04-04 1992-10-29 Seiko Epson Corp 薄膜トランジスタの製造方法及び製造装置
US6168968B1 (en) * 1997-02-27 2001-01-02 Sharp Kabushiki Kaisha Method of fabricating integrated thin film solar cells
EP1055479A2 (en) * 1999-05-24 2000-11-29 Sel Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus

Also Published As

Publication number Publication date
CN107921582A (zh) 2018-04-17
GB2541412A (en) 2017-02-22
TW201718151A (zh) 2017-06-01
TWI694881B (zh) 2020-06-01
GB2541412B (en) 2018-08-01
KR20180040594A (ko) 2018-04-20
JP2018525838A (ja) 2018-09-06
GB201514655D0 (en) 2015-09-30
US20180236601A1 (en) 2018-08-23
EP3337636B1 (en) 2023-06-07
WO2017029472A1 (en) 2017-02-23
KR102563985B1 (ko) 2023-08-04
JP7079727B2 (ja) 2022-06-02
US10882136B2 (en) 2021-01-05
EP3337636A1 (en) 2018-06-27

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Address after: Room 103-160, 1st Floor, Building 1, No. 18 Futian Road, Xiangzhou District, Zhuhai City, Guangdong Province (centralized office area)

Patentee after: Yingshuo Laser Technology (Zhuhai) Co.,Ltd.

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Patentee before: M-SOLV LTD.

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