CN107910426A - A kind of magnetic fluorescence powder composite material and its flat coating method - Google Patents
A kind of magnetic fluorescence powder composite material and its flat coating method Download PDFInfo
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- CN107910426A CN107910426A CN201711124125.5A CN201711124125A CN107910426A CN 107910426 A CN107910426 A CN 107910426A CN 201711124125 A CN201711124125 A CN 201711124125A CN 107910426 A CN107910426 A CN 107910426A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
Abstract
The invention belongs to field of photoelectric technology, and in particular to a kind of magnetic fluorescence powder composite material and its flat coating method, include the following steps：Magnetic fluorescence powder composite material is prepared, and it is uniformly mixed with packaging plastic by a certain percentage；Flip LED chips are fixed on package substrate, form the circuit of connection；By the magnetic fluorescence arogel mixture of step 1. gained coated on chip；Using the effect of external magnetic field, the fluorescent powder grain with different luminosities is concentrated in the diverse location height of silica gel, is cured after its distribution is stablized；Peripheral optical components are installed.Fluorescent powder is set to be located at the diverse location of packaging plastic highly using magnetic fields; long-range coating processes can be achieved; Protection glue of the packaging plastic of bottom directly as LED chip; chip and phosphor powder layer are separated at the same time, avoided because the heat of chip is directly conducted to the problems such as phosphor powder layer causes its accelerated ageing, reliability to reduce.
Description
Technical field：
The invention belongs to field of photoelectric technology, and in particular to a kind of magnetic fluorescence powder composite material and its flat coating method.
Background technology：
Light emitting diode（Light emitting diode）It is a kind of electroluminescent device, its core is partly led by p-type
Body and N-type semiconductor are formed, and can directly convert electrical energy into luminous energy, have environmental protection, cost is low, luminosity is high, service life
The series of advantages such as long, is known as the green illumination energy of 21 century.
The large power white light LED of mainstream is by blue-light LED chip at present（GaN）One layer of yellow fluorescent powder of upper covering
（YAG or TAG）It is made, some light excitated fluorescent powder layer that chip is sent produces yellow light, and another part blue light is mixed with yellow light
After white light is presented.LED obtained by which becomes both domestic and external one big research because its light efficiency is high, price is low, high reliability
Hot spot.
Traditional fluorescent powder coating method is die coating method.This coating processes use fine needle class instrument by fluorescent powder
Glue is coated in chip surface, is sent into curing apparatus and is heating and curing after its flowing forming, ideally forms similar spherical crown
The coating of shape.But the phosphor powder layer center prepared by this method is to the structural non-homogeneous of edge so that LED glow colors
Spatially uniform is poor, and since phosphor's density is more than silica gel material, be easy to cause particle deposited phenomenon, cause light rear
Come to being scattered back, i.e., light energy is absorbed by chip and substrate, and light extraction efficiency reduces.Simultaneously because only layer of fluorescent powder film, hair
The spectrum of light is more dull, causes the adjustment difficulty to optical parameters such as the colour temperatures of lamps and lanterns larger.Further, since fluorescent powder and core
Piece directly contacts so that chip is in enclosed environment, and caused heat is difficult to distribute in time when it shines, and causes LED
Junction temperature raises, and chip temperature is conducted to phosphor powder layer, and fluorescent powder can be caused to accelerate aging, and luminous efficiency and reliability reduce.
The final luminous efficiency and reliability for influencing lamps and lanterns.
To improve the quality and reliability of light source, long-range paint-on technique and multilayered fluorescent powder structure was directed initially into recent years
In the encapsulation technology of LED chip.Long-range paint-on technique uses design of the phosphor powder layer away from chip, so as to improve heat dissipation performance；
And multilayered fluorescent powder structure is utilized, the phosphor powder layer with different emission spectrum can be prepared on chip, so that abundant LED light
The spatial distribution of tool, to achieve the purpose that to change lamps and lanterns optical parameter.But there is also problems with the same time：（1）Away from coating skill
Art uses the method that individually forms a film of phosphor powder layer, and the phosphor powder layer after film forming is combined with the encapsulated sticker of chip, packaging plastic
It is difficult to ensure that obscission easily occurs in the later stage with the degree of adhesion of phosphor powder layer；（2）Using the side such as spraying, spin coating or deposition
Formula prepares phosphor powder layer, though the deposited phenomenon of fluorescent powder grain can obtain a degree of improvement, curing is completed at it
Before, still there is partial particulate precipitation, can not realize being uniformly distributed for particle；（3）The preparation of multilayered fluorescent powder structure at present, is usually adopted
With the mode being coated with layer by layer, i.e., first complete the coating of layer of fluorescent powder, cure, followed by second layer fluorescent powder is prepared, class successively
Film forming period length is pushed away ..., is unfavorable for integrated production.
The embodiment of the prior art：Phosphor powder layer is separately coated with Protection glue, and the later stage easily comes off；Multilayered fluorescent powder
Coating is using the method for spin coating layer by layer, and time-consuming, and phosphor powder layer still occurs that partial particulate sinks before completing to cure
The phenomenon in shallow lake；Traditional white light LEDs are made by covering one layer of yellow fluorescent powder on blue-light LED chip, the portion that chip is sent
Light splitter excitated fluorescent powder layer produces yellow light, mix generation white light with the blueness that chip is sent, but due to there are energy loss, this
Kind white light LEDs entirety light efficiency is not high.
The content of the invention：
For the disadvantages described above of the prior art, the present invention provides a kind of magnetic fluorescence powder composite material and its flat coating side
Method, its object is to：Phosphor powder layer is prepared using magnetic fluorescent dual-function compound, fluorescence is effectively improved with reference to external magnetic field
The distributing homogeneity of powder particles, solves the problems, such as phosphor powder layer and packaging plastic delamination, optimizes the work of multilayered fluorescent powder flat coating
Skill, shortens fabrication cycle.
In order to achieve the above object, the present invention provides a kind of improved method of fluorescent powder plane coating, include the following steps：
A kind of flat coating method of magnetic fluorescence powder composite material, includes the following steps：
1. preparing magnetic fluorescence powder composite material, and it is uniformly mixed with packaging plastic by a certain percentage；
2. flip LED chips are fixed on package substrate, the circuit of connection is formed；
3. by the magnetic fluorescence arogel mixture of step 1. gained coated on chip；
4. using the effect of external magnetic field, the diverse location that the fluorescent powder grain with different luminosities is concentrated on to silica gel is high
On degree, cured after its distribution is stablized；
5. peripheral optical components are installed.
Further, 1. the packaging plastic is epoxies colloid or silica type colloid to step, can directly and magnetic fluorescence
Powder composite material mixes；Or add powdery filling material and obtain the colloid of refractive index improvement, then it is compound with magnetic fluorescence powder
Material mixes；The powder filler is vitreosil, the one or more in fluorite, glass microballoon.
Further, 2. the LED chip is blue-light LED chip, red LED chip, yellow light LED chip, green light to step
One or more in LED chip, purple LED chip；Can be single led chip, or the combination of one group of LED chip.
Further, 2. the substrate, its material can be aluminium, copper, alloy, carborundum, aluminium nitride, asphalt mixtures modified by epoxy resin to step
Fat.
Further, 3. the coating method can be spin coating, spraying, deposition, printing to step.
Further, 4. the external magnetic field can be horse-hof shape, spherical, annulus to have effigurate magnet to step
Shape, it is plane in one or more；Can be single magnet, or the combination of one group of magnet.
Further, step 3. gained magnetic fluorescence arogel, step 4. gained external magnetic field under the action of, will have not
It is synchronous to carry out heat cure after its distribution is stablized with the diverse location in the magnetic fluorescence granular absorption to colloid of magnetism size,
Realize the fluorescent powder storied placement of different luminosities.
Further, 6. the peripheral optical components are lens that outer surface is free form surface to step, for controlling light
With the requirement for realizing Uniform Illumination；Its inner surface can be rectangular-shaped, hemispherical or cylindric；The material of the lens is poly- carbonic acid
It is one or more in ester, silica gel or glass.
A kind of magnetic fluorescence powder composite material, using ferroso-ferric oxide as magnetic core, silica is couplant, rare earth doped
Inorganic fluorescent material be shell magnetic fluorescent dual-function compound；The magnetic core particle diameter is 50 ~ 200nm；The coupling
Agent has good biocompatibility, can reduce quenching effect of the ferroso-ferric oxide to fluorescent powder, and thickness is 10 ~ 20nm；
Further, the fluorescent material is one in red fluorescence powder, green emitting phosphor, yellow fluorescent powder, blue light fluorescent powder
Kind is a variety of, and thickness is 20 ~ 40nm；
Further, the magnetic fluorescence powder composite material, the rare earth doped inorganic fluorescent material of different luminosities should
The magnetic core of different-grain diameter size is coated, to obtain with magnetic magnetic fluorescent dual-function compound of different sizes；
Further, the magnetic core of the different-grain diameter size is modified by adding surface in the preparation process of ferroso-ferric oxide
Agent obtains；The surface modifier is hydrochloric acid, hydrogen peroxide, iron chloride or oleic acid.
Further, the magnetic fluorescent dual-function compound of the different magnetic sizes can also coat one by couplant
A or two or three or different number of magnetic core obtain.
Further, the red fluorescence powder is using sulfide systems, Nitride systems or tungsten/molybdic acid salt system as main body
Fluorescent material；The green emitting phosphor is based on thiogallate salt system, nitrogen oxides system or silicate systems
Fluorescent material；The blue colour fluorescent powder is based on YAG, TAG, nitrogen oxides system, halogen-phosphate system or silicate systems
The fluorescent material of body.
Further, the magnetic fluorescent dual-function compound can pass through sol-gel process, the hot method of micro emulsion, coprecipitation
Or prepared by solvent-thermal method mode.
The present invention provides a kind of improved method of fluorescent powder plane coating, has the following advantages：
1st, a variety of fluorescent powders with different luminosities of LED light source excitation send the light of different wave length, and spatial distribution is wider；
2nd, using having magnetic fluorescence composite material, realized using the effect of external magnetic field and be uniformly distributed, no with species fluorescent powder
With the controllable effect of species fluorescent powder storied placement, the disposable preparation for completing multilayered fluorescent powder, improves production efficiency, solves at the same time
The problem of certainly fluorescent powder precipitates；
3rd, the preparation of magnetic magnetic fluorescence powder of different sizes is realized by the method for surface modification or cladding varying number magnetic core；
4th, fluorescent powder is made to be located at the diverse location height of packaging plastic, it can be achieved that long-range coating processes using magnetic fields, bottom
Chip and phosphor powder layer while are separated, avoided because the heat of chip is direct directly as the Protection glue of LED chip by packaging plastic
The problem of conduction to phosphor powder layer causes its accelerated ageing, reliability to reduce.
5th, using the cooperation of magnetic fluorescence powder and external magnetic field, Protection glue and the system of phosphor powder layer are realized by primary coating
It is standby, therefore the adhesiveness between phosphor powder layer and Protection glue is more preferably superior, the later stage is not easily to fall off；Utilize magnetic fluorescence powder and outer magnetic
The cooperation of field, by varying the magnetic size of different fluorescent powders, realizes the disposable coating of multilayered fluorescent powder, improves and photosensitiveness
Energy.
Brief description of the drawings
Attached drawing 1 is one structure diagram of the embodiment of the present invention.
Attached drawing 2 is two structure diagram of the embodiment of the present invention.
Attached drawing 3 is two structure diagram of the embodiment of the present invention.
Attached drawing 4 is three structure diagram of the embodiment of the present invention.
Attached drawing 5 is three structure diagram of the embodiment of the present invention.
Attached drawing 6 is four structure diagram of the embodiment of the present invention.
Attached drawing 7 is five structure diagram of the embodiment of the present invention.
Attached drawing 8 is five structure diagram of the embodiment of the present invention.
Attached drawing 9 is five structure diagram of the embodiment of the present invention.
Embodiment
The preferred embodiment of the present invention will be described in detail below.
Embodiment 1：As shown in Figure 1, the present invention provides a kind of improved method of fluorescent powder plane coating, altogether comprising 5 portions
Point.Substrate 1 is used to support the encapsulating structure of whole LED；Flip LED chips 2 are fixed on by way of die bond or eutectic welding
On substrate 1；A variety of different types of magnetic fluorescent dual-function compounds 4 are mixed with packaging plastic 3；Magnet 5 provides external magnetic field will not
The diverse location in packaging plastic 3 is adsorbed onto with fluorescent dual-function compound 4.
Changing of magnetism size is weighed with magnetic conductivity, and the magnetic conductivity of ferroso-ferric oxide is by particle size effect.It is magnetic
The magnetic size of core can be adjusted in the following manner.Mode 1：By hydrochloric acid, hydrogen peroxide, iron chloride or oleic acid etc. into
Row surface treatment can obtain the different ferroso-ferric oxide particle of particle size, and add couplant such as silica, prevent four oxygen
Change quenching effect of the three-iron to fluorescent powder；Mode 2：Different number of four oxidation three such as couplant cladding one, two or three
Iron particle, obtains the core with different size magnetism.
Embodiment 2：As shown in Figure 2 and Figure 3, obtained different types of fluorescent powder as shell, cladding pass-through mode 1 or 2
There are different magnetic ferroso-ferric oxides, obtain magnetic different magnetic fluorescent dual-function compound 4.
Can be added in the packaging plastic powdery filling material such as glass microballoon etc. obtain refractive index improvement colloid, then by it
Mixed with magnetic fluorescence powder composite material.What the magnetic fluorescent dual-function compound 4 of different excitation wavelengths was sent by LED chip 2
After light excitation, the light of different wave length will be produced, white light outgoing is produced through mixing；The kind of magnetic fluorescent dual-function compound 4
It class and its can be adjusted with the proportioning of packaging plastic 3 according to requirement of the lamps and lanterns to spectral power distribution, realize and colour temperature, colour developing are referred to
Effective control of the optical parameters such as number.
Embodiment 3：As shown in figure 4, using the effect of external magnetic field, different magnetic fluorescent dual-function compounds is adsorbed onto
On the diverse location for encapsulating glue-line, the storied placement of fluorescent powder is realized：Yellow fluorescent powder is located at bottom, during green emitting phosphor is located at
Interbed, red fluorescence powder are located at top layer or other arrangement modes.It is synchronous to carry out heat cure after being fixed after fluorescent powder grain position,
Realize the coating of phosphor powder layer.Using the effect of external magnetic field, the position of bottom fluorescent powder can be fixed in the middle part of encapsulation glue-line, envelope
The unstressed configuration powder distribution of glue lower part is filled, isolating for phosphor powder layer and chip is realized, effectively avoids chip temperature from causing fluorescent powder performance
Decay.Meanwhile the phosphor powder layer prepared using this kind of method, Protection glue that can be directly using the packaging plastic of bottom as chip, province
The link that Protection glue is injected in conventional coating process is gone, more due to Protection glue spraying synchronous with phosphor powder layer, is cured, after avoiding
The problem of phase comes off.Finally, as shown in figure 5, installation peripheral optical components 7, complete the encapsulation of LED chip.
Embodiment 4：As shown in fig. 6, changing the shape of magnet, the arrangement shape of phosphor powder layer can be made also to change therewith
Become, the shape of magnet is not limited to plane, curved shown in figure, or other horse-hof shapes, coniform etc., its number
It is also not necessarily limited to single, can is one group of magnet, realizes that the periodic arrangement of magnetic fluorescence particle is distributed.
Embodiment 5：As shown in Figure 7, Figure 8, adopt this method, be applicable in integration packaging multi-chip LED.Multiple chips pass through
The methods of eutectic welds is fixed on substrate, forms the circuit of connection.Using spraying process directly by magnetic fluorescence particle/packaging plastic
Composite material is coated in chip surface, and using the effect of external magnetic field, different magnetic fluorescent dual-function compounds is adsorbed onto envelope
On the diverse location for filling glue-line, the storied placement of fluorescent powder is realized, it is synchronous to carry out thermosetting after being fixed after fluorescent powder grain position
Change, complete the coating of phosphor powder layer.Peripheral optical components 7 are finally installed, complete the encapsulation of multi-chip LED, as shown in Figure 9.
Certainly, the use scope illustrated above for being only better embodiment of the present invention, the present invention not being limited with this, therefore,
It is every made in the principle of the invention it is equivalent change should be included within the scope of the present invention.
Claims (10)
- A kind of 1. flat coating method of magnetic fluorescence powder composite material, it is characterised in that include the following steps：1. preparing magnetic fluorescence powder composite material, and it is uniformly mixed with packaging plastic by a certain percentage；2. flip LED chips are fixed on package substrate, the circuit of connection is formed；3. by the magnetic fluorescence arogel mixture of step 1. gained coated on chip；4. using the effect of external magnetic field, the diverse location that the fluorescent powder grain with different luminosities is concentrated on to silica gel is high On degree, cured after its distribution is stablized；5. peripheral optical components are installed.
- 2. flat coating method according to claim 1, it is characterised in that：1. the packaging plastic is epoxies glue to step Body or silica type colloid, can directly mix with magnetic fluorescence powder composite material；Or addition powdery filling material obtains refractive index and changes Kind colloid, then it is mixed with magnetic fluorescence powder composite material；The powder filler is vitreosil, fluorite, glass are micro- One or more in pearl.
- 3. flat coating method according to claim 1, it is characterised in that：2. the LED chip is blue-ray LED core to step One or more in piece, red LED chip, yellow light LED chip, green LED chip, purple LED chip；Can be single led Chip, or the combination of one group of LED chip.
- 4. flat coating method according to claim 1, it is characterised in that：2. the substrate, its material can be step Aluminium, copper, alloy, carborundum, aluminium nitride, epoxy resin.
- 5. flat coating method according to claim 1, it is characterised in that：3. the coating method can be rotation to step Apply, spray, depositing, printing.
- 6. flat coating method according to claim 1, it is characterised in that：4. the external magnetic field is with certain to step The magnet of shape, can be horse-hof shape, it is spherical, circular, plane in one or more；Can be single magnet, or one group of magnetic The combination of iron.
- 7. flat coating method according to claim 1, it is characterised in that：Step 3. gained magnetic fluorescence arogel, Step is 4. under the action of gained external magnetic field, by with the different positions in magnetic magnetic fluorescence granular absorption to colloid of different sizes Put, it is synchronous to carry out heat cure after its distribution is stablized, realize the fluorescent powder storied placement of different luminosities.
- 8. flat coating method according to claim 1, it is characterised in that：6. the peripheral optical components are appearance to step Face is the lens of free form surface, for the requirement for controlling light He realizing Uniform Illumination；Its inner surface can be rectangular-shaped, hemispherical It is or cylindric；The material of the lens is one or more in makrolon, silica gel or glass.
- A kind of 9. magnetic fluorescence powder composite material, it is characterised in that：For magnetic fluorescence powder composite material using ferroso-ferric oxide as magnetic core, silica is couplant, and rare earth doped is inorganic glimmering Luminescent material is the magnetic fluorescent dual-function compound of shell；The magnetic core particle diameter is 50 ~ 200nm；The couplant has good Good biocompatibility, can reduce quenching effect of the ferroso-ferric oxide to fluorescent powder, thickness is 10 ~ 20nm；The fluorescent material is red fluorescence powder, the one or more in green emitting phosphor, yellow fluorescent powder, blue light fluorescent powder, Thickness is 20 ~ 40nm；The magnetic fluorescence powder composite material, the rare earth doped inorganic fluorescent material of different luminosities should coat different grains The magnetic core of footpath size, to obtain that there is the magnetic fluorescent dual-function compound of different magnetic sizes；The magnetic core of the different-grain diameter size is obtained by adding surface modifier in the preparation process of ferroso-ferric oxide；Institute It is hydrochloric acid, hydrogen peroxide, iron chloride or oleic acid to state surface modifier；The magnetic fluorescent dual-function compound of the different magnetic sizes can also coat one or two or three by couplant A or different number of magnetic core obtains.
- A kind of 10. magnetic fluorescence powder composite material according to claim 9, it is characterised in that：The red fluorescence powder is Fluorescent material using sulfide systems, Nitride systems or tungsten/molybdic acid salt system as main body；The green emitting phosphor is with thio Gallic acid salt system, nitrogen oxides system or silicate systems are the fluorescent material of main body；The blue colour fluorescent powder be with YAG, TAG, nitrogen oxides system, halogen-phosphate system or silicate systems are the fluorescent material of main body；The magnetic fluorescent dual-function compound can pass through sol-gel process, the hot method of micro emulsion, coprecipitation or solvent-thermal method mode Prepare.
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| CN110964470A (en) * | 2019-11-20 | 2020-04-07 | 东莞市银亮电子科技有限公司 | Packaging adhesive for improving UV light efficiency and process thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| DE102023104136A1 (en) | 2023-02-20 | 2024-08-22 | Ams-Osram International Gmbh | METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT, OPTOELECTRONIC COMPONENT AND PHONOLUBRICANT |
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| CN107910426B (en) | 2020-01-03 |
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Address after: 521011 factory building (1-3), plot d5-8-3, Beizhan West Road, Chaozhou Economic Development Experimental Zone, Chaozhou City, Guangdong Province Patentee after: Guangdong Jinyuan solar energy Co.,Ltd. Address before: 521011 factory building (1-3), plot d5-8-3, Beizhan West Road, Chaozhou Economic Development Experimental Zone, Chaozhou City, Guangdong Province Patentee before: GUANGDONG JINYUAN LIGHTING TECHNOLOGY Co.,Ltd. |
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Denomination of invention: A kind of magnetic phosphor composite material and plane coating method thereof Effective date of registration: 20220810 Granted publication date: 20200103 Pledgee: China Co. truction Bank Corp Chaozhou branch Pledgor: Guangdong Jinyuan solar energy Co.,Ltd. Registration number: Y2022980012264 |