CN110797449A - LED package and packaging method thereof - Google Patents
LED package and packaging method thereof Download PDFInfo
- Publication number
- CN110797449A CN110797449A CN201911072094.2A CN201911072094A CN110797449A CN 110797449 A CN110797449 A CN 110797449A CN 201911072094 A CN201911072094 A CN 201911072094A CN 110797449 A CN110797449 A CN 110797449A
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- Prior art keywords
- fluorescent powder
- led chip
- magnetic
- powder particles
- light emitting
- Prior art date
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Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 title claims description 15
- 239000000843 powder Substances 0.000 claims abstract description 75
- 239000002245 particle Substances 0.000 claims abstract description 54
- 238000004804 winding Methods 0.000 claims abstract description 43
- 239000003292 glue Substances 0.000 claims abstract description 29
- 238000005538 encapsulation Methods 0.000 claims abstract description 5
- 239000000696 magnetic material Substances 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 2
- 238000001459 lithography Methods 0.000 claims 2
- 238000004062 sedimentation Methods 0.000 abstract description 15
- 239000010410 layer Substances 0.000 description 25
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 13
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000005119 centrifugation Methods 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229910000428 cobalt oxide Inorganic materials 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The utility model provides a LED package, includes the LED chip, the LED chip includes more than one light emitting area, it has fluorescence glue film, its characterized in that to cover on the light emitting area: the LED light source is characterized in that a transparent winding is arranged on the light emitting surface of the LED chip, the fluorescent glue layer comprises a packaging glue layer and a fluorescent powder layer, and the fluorescent powder layer is composed of magnetic fluorescent powder particles. (1) Forming a transparent winding on the light emitting surface of the LED chip; (2) covering a fluorescent glue layer on the light emitting surface of the LED chip, wherein the fluorescent glue layer comprises a packaging glue layer and magnetic fluorescent powder particles; (3) electrifying the transparent winding, enabling the transparent winding to flow current to generate a magnetic field, and enabling the magnetic field to generate attraction force on the magnetic fluorescent powder particles; (4) the magnetic fluorescent powder particles are converged on the surface of the light-emitting surface under the action of the attraction force to form a fluorescent powder layer; (5) and (5) completing encapsulation after the fluorescent glue layer is cured. The invention can accelerate the sedimentation of the fluorescent powder, and the fluorescent powder after sedimentation is uniformly distributed.
Description
Technical Field
The invention relates to the field of LEDs, in particular to an LED package and a packaging method thereof.
Background
The prior art LED package structure generally includes an LED chip and a phosphor layer encapsulating the LED chip. In order to improve the light emitting characteristics of the LED chip, the phosphor particles in the phosphor gel need to be settled to form a phosphor layer close to the light emitting surface, and the two methods for settling the phosphor particles in the prior art are mainly as follows:
1. natural sedimentation, sedimentation by self gravity, the method has high requirements on the viscosity of the silica gel, the viscosity is too low, the production is difficult to control, and the sedimentation time of the powder with too high viscosity is too long.
2. Centrifugal sedimentation, sedimentation is performed by centrifugal force, but an LED light source with a large-sized light emitting surface is difficult to realize. Because the relative directions of the centrifugal forces applied to different positions of the large luminous surface are inconsistent during the rotating centrifugation, the fluorescent powder is unevenly distributed after the centrifugation, and the product is unqualified.
In order to solve the technical problems, the applicant previously applied for a powder-precipitating magnetic light source and a process thereof, wherein the publication number is CN 109659298A, the powder-precipitating magnetic light source comprises a substrate, a functional area is arranged on the substrate, a plurality of LED chips are arranged on the functional area, and a cofferdam is arranged at the periphery of the functional area to enclose the LED chips; the cofferdam is internally provided with packaging adhesive, the packaging adhesive is internally provided with a plurality of magnetic fluorescent powder, the magnetic fluorescent powder comprises fluorescent powder particles, a magnetic material body and a wrapping layer, the magnetic fluorescent powder is added into the packaging adhesive, and then the sedimentation rate of the magnetic fluorescent powder can be accelerated and the sedimentation quality of the magnetic fluorescent powder can be improved through a magnet. Although the method can also realize the rapid sedimentation of the fluorescent powder, the magnetic fluorescent powder particles are distributed in the cofferdam, and when the magnetic fluorescent powder particles are sedimented by the magnet, the magnetic fluorescent powder particles cannot be sedimented on the luminous surface of the LED chip accurately, so that the problem of uneven distribution of the fluorescent powder can also occur, particularly on the side luminous surface of the LED chip.
Disclosure of Invention
The invention aims to provide an LED package and a packaging method thereof, which can accelerate the sedimentation of fluorescent powder and ensure that the sedimentated fluorescent powder is uniformly distributed.
In order to solve the technical problems, the technical scheme of the invention is as follows: the utility model provides a LED package, includes the LED chip, the LED chip includes more than one light emitting area, the light emitting area coats and is stamped the fluorescence glue film, be equipped with transparent wire winding on the light emitting area of LED chip, the fluorescence glue film includes encapsulation glue film and phosphor layer, the phosphor layer comprises magnetic phosphor powder granule. The transparent winding is directly arranged on the light emitting surface of the LED chip, the light emitting of the LED chip cannot be influenced due to the transparency of the transparent winding, in addition, a magnetic field can be generated after the transparent winding is electrified, the magnetic field can attract the magnetic fluorescent powder particles, the sedimentation of the magnetic fluorescent powder particles is accelerated, the magnetic fluorescent powder particles can be intensively sedimentated on the light emitting surface due to the concentration of the magnetic field on the light emitting surface of the LED chip, and the distribution of the sedimentated magnetic fluorescent powder particles can be more uniform.
As a refinement, the transparent winding is formed by photolithography on a transparent layer of the LED chip.
As an improvement, the transparent winding is distributed on the whole luminous surface.
As an improvement, the magnetic fluorescent powder particles comprise fluorescent powder particles and magnetic materials, and the fluorescent powder particles and the magnetic materials are combined through silica gel or resin.
As an improvement, two ends of the transparent winding are respectively connected with two electrodes of the LED chip.
The packaging method comprises the following steps:
(1) forming a transparent winding on the light emitting surface of the LED chip;
(2) covering a fluorescent glue layer on the light emitting surface of the LED chip, wherein the fluorescent glue layer comprises a packaging glue layer and magnetic fluorescent powder particles;
(3) electrifying the transparent winding, enabling the transparent winding to flow current to generate a magnetic field, and enabling the magnetic field to generate attraction force on the magnetic fluorescent powder particles;
(4) the magnetic fluorescent powder particles are converged on the surface of the light-emitting surface under the action of the attraction force to form a fluorescent powder layer;
(5) and (5) completing encapsulation after the fluorescent glue layer is cured.
Compared with the prior art, the invention has the following beneficial effects:
the invention can be used for packaging a single LED chip; the transparent winding is directly arranged on the light emitting surface of the LED chip, the light emitting of the LED chip cannot be influenced due to the transparency of the transparent winding, in addition, a magnetic field can be generated after the transparent winding is electrified, the magnetic field can attract the magnetic fluorescent powder particles, the sedimentation of the magnetic fluorescent powder particles is accelerated, the magnetic fluorescent powder particles can be intensively sedimentated on the light emitting surface due to the concentration of the magnetic field on the light emitting surface of the LED chip, and the distribution of the sedimentated magnetic fluorescent powder particles can be more uniform.
Drawings
FIG. 1 is a schematic view of a light emitting surface of an LED chip.
Fig. 2 is a cross-sectional view of a single-sided light emitting LED package.
Fig. 3 is a cross-sectional view of a single-sided light emitting LED package.
FIG. 4 is a packaging flow chart of the present invention.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
An LED package comprises a flip-chip LED chip 1, two electrodes 13 are arranged at the bottom of the LED chip 1, the LED chip 1 comprises more than one luminous surface 11, a single-surface luminous LED chip 1 with a top surface generally, and a five-surface luminous LED chip 1. As shown in fig. 2, the light emitting surface 11 is covered with a phosphor layer 3, the phosphor layer 3 includes a packaging adhesive layer 31 and a phosphor layer 32 formed on the light emitting surface 11 by sedimentation, and the phosphor layer 32 is composed of magnetic phosphor particles; the magnetic fluorescent powder particles comprise fluorescent powder particles and a magnetic material, the fluorescent powder particles and the magnetic material are combined through silica gel or resin, and the magnetic material is iron, cobalt, nickel or iron oxide powder. As shown in fig. 1, a transparent winding 2 is arranged on a light emitting surface 11 of the LED chip 1, the transparent winding 2 is formed by photoetching on a transparent layer of the LED chip 1, the transparent winding 2 is a horizontal coil, the winding of the transparent winding can be distributed over the whole light emitting surface 11, and when the transparent winding 2 is electrified, a magnetic field can be generated on the light emitting surface 11; the two ends of the transparent winding 2 are respectively connected with the two electrodes 13 of the LED chip 1, the LED chip 1 can supply power to the transparent winding 2 after being electrified, and an extra power supply circuit of the transparent winding 2 is omitted.
As shown in fig. 4, the packaging method of the present invention includes the following steps:
(1) forming a transparent winding 2 on a transparent layer of a light emitting surface 11 of the LED chip 1 by photoetching;
(2) covering a fluorescent glue layer 3 on the luminous surface 11 of the LED chip 1;
(3) the transparent winding 2 is electrified to generate a magnetic field while the LED chip 1 is lightened through the electrode 13 of the LED chip 1, and the magnetic field generates attraction force on the magnetic fluorescent powder particles;
(4) the magnetic fluorescent powder particles are converged on the surface of the luminous surface 11 under the action of the attraction force to form a fluorescent powder layer;
(5) and (5) completing encapsulation after the fluorescent glue layer is cured.
In the step (2), the fluorescent adhesive layer may be formed by molding or dispensing. As shown in fig. 2, the fluorescent glue layer can be directly molded or formed by dispensing on the light emitting surface 11, and this way is suitable for single-sided light emission or five-sided light emission; as shown in fig. 3, in addition, the LED chip 1 may also be placed in a bowl cup, a fluorescent glue layer is filled in the bowl cup, the fluorescent glue layer wraps the whole LED chip 1, and the magnetic fluorescent powder particles around are adsorbed to the light emitting surface 11 by the attraction of the transparent winding 2.
The manufacturing method of the magnetic fluorescent powder particles comprises the following steps: (1) mixing fluorescent powder particles and a magnetic material through packaging glue and curing to form a mixture; (2) the mixture is ground to form magnetic fluorescent powder particles, the magnetic fluorescent powder particles contain fluorescent powder particles with larger particles, so that light can be excited, and the magnetic fluorescent powder particles also contain metal powder particles, so that the magnetic fluorescent powder particles have magnetism.
The invention can be directed to the packaging of a single LED chip 1; according to the invention, the transparent winding 2 is directly arranged on the light emitting surface 11 of the LED chip 1, the transparent winding 2 is transparent, so that the light emitting of the LED chip 1 is not influenced, in addition, the transparent winding 2 generates a magnetic field after being electrified, the magnetic field can attract the magnetic fluorescent powder particles, so that the sedimentation of the magnetic fluorescent powder particles is accelerated, the magnetic field is concentrated on the light emitting surface 11 of the LED chip 1, so that the magnetic fluorescent powder particles are concentrated and sedimentated on the light emitting surface 11, and the distribution of the sedimentated magnetic fluorescent powder particles is more uniform. Because the two ends of the transparent winding 2 are connected with the two electrodes 13 of the chip, namely, the chip can generate a magnetic field when being electrified, and the magnetic field can provide suction force for the fluorescent powder layer, so that the fluorescent powder layer can not fall off.
Claims (10)
1. The utility model provides a LED package, includes the LED chip, the LED chip includes more than one light emitting area, it has fluorescence glue film, its characterized in that to cover on the light emitting area: the LED light source is characterized in that a transparent winding is arranged on the light emitting surface of the LED chip, the fluorescent glue layer comprises a packaging glue layer and a fluorescent powder layer, and the fluorescent powder layer is composed of magnetic fluorescent powder particles.
2. The LED package of claim 1, wherein: the transparent winding is formed by lithography on a transparent layer of the LED chip.
3. The LED package of claim 1, wherein: the transparent winding is distributed on the whole luminous surface.
4. The LED package of claim 1, wherein: the magnetic fluorescent powder particles comprise fluorescent powder particles and magnetic materials, and the fluorescent powder particles and the magnetic materials are combined through silica gel or resin.
5. The LED package of claim 1, wherein: and two ends of the transparent winding are respectively connected with two electrodes of the LED chip.
6. An LED packaging method is characterized by comprising the following steps:
(1) forming a transparent winding on the light emitting surface of the LED chip;
(2) covering a fluorescent glue layer on the light emitting surface of the LED chip, wherein the fluorescent glue layer comprises a packaging glue layer and magnetic fluorescent powder particles;
(3) electrifying the transparent winding, enabling the transparent winding to flow current to generate a magnetic field, and enabling the magnetic field to generate attraction force on the magnetic fluorescent powder particles;
(4) the magnetic fluorescent powder particles are converged on the surface of the light-emitting surface under the action of the attraction force to form a fluorescent powder layer;
(5) and (5) completing encapsulation after the fluorescent glue layer is cured.
7. The method of claim 6, wherein: the transparent winding is formed by lithography on a transparent layer of the LED chip.
8. The method of claim 6, wherein: the manufacturing method of the magnetic fluorescent powder particles comprises the following steps:
(1) mixing fluorescent powder particles and a magnetic material through packaging glue and curing to form a mixture;
(2) and grinding the mixture to form the magnetic fluorescent powder particles.
9. The method of claim 6, wherein: two ends of the transparent winding are respectively connected with two electrodes of the LED chip, and the transparent winding is electrified to generate a magnetic field when the LED chip is lightened by the electrodes of the LED chip.
10. The method of claim 6, wherein: and (3) forming the fluorescent glue layer in the step (2) through molding or dispensing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911072094.2A CN110797449A (en) | 2019-11-05 | 2019-11-05 | LED package and packaging method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911072094.2A CN110797449A (en) | 2019-11-05 | 2019-11-05 | LED package and packaging method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110797449A true CN110797449A (en) | 2020-02-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911072094.2A Pending CN110797449A (en) | 2019-11-05 | 2019-11-05 | LED package and packaging method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN110797449A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112268231A (en) * | 2020-10-24 | 2021-01-26 | 中山火炬职业技术学院 | High-reliability COB light source module with variable beam angle |
| CN113418837A (en) * | 2021-06-10 | 2021-09-21 | 厦门多彩光电子科技有限公司 | Method for evaluating quality of ultraviolet LED packaging adhesive |
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Application publication date: 20200214 |