CN112268231A - High-reliability COB light source module with variable beam angle - Google Patents
High-reliability COB light source module with variable beam angle Download PDFInfo
- Publication number
- CN112268231A CN112268231A CN202011150908.2A CN202011150908A CN112268231A CN 112268231 A CN112268231 A CN 112268231A CN 202011150908 A CN202011150908 A CN 202011150908A CN 112268231 A CN112268231 A CN 112268231A
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- light
- light source
- beam angle
- source module
- variable beam
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- 239000000758 substrate Substances 0.000 claims abstract description 29
- 230000005496 eutectics Effects 0.000 claims description 27
- 229910000679 solder Inorganic materials 0.000 claims description 16
- 239000003292 glue Substances 0.000 claims description 8
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 3
- 238000004020 luminiscence type Methods 0.000 claims 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 7
- 239000000843 powder Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 3
- 241001465382 Physalis alkekengi Species 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000004062 sedimentation Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/61—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using light guides
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/69—Details of refractors forming part of the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a high-reliability COB light source module with a variable beam angle, which comprises a substrate, wherein a light guide cup is formed on the substrate, a plurality of groups of light-emitting units are arranged on the light guide cup, the on and off of the plurality of groups of light-emitting units are mutually independent, and each light-emitting unit comprises a plurality of LED chips which are sequentially arranged on the light guide cup. Because the multiple groups of light-emitting units are respectively positioned at different positions of the substrate, the light-emitting areas formed by the light-emitting units can present different beam angles under the refraction of the lens. In the use process, different light-emitting units are switched on or off according to requirements to form different light-emitting areas, so that the light beam angle of the lamp can be adjusted. Because the optimal matching position of the light source and the optics is fixed, the light-emitting rate, the light spots and the irradiation effect of the lamp are not influenced by the change of the angle of the light beam and are all maintained in the optimal state.
Description
[ technical field ] A method for producing a semiconductor device
The application relates to the LED field especially relates to high reliability COB light source module of variable beam angle.
[ background of the invention ]
The LED has the advantages of high lighting efficiency, fast speed, low driving current, small space, firm structure, long service life, etc., and is therefore accepted by the public. COB is currently a mainstream form of packaging device. Variable beam angle COB light source module is because its light-emitting angle is adjustable, by wide application. Traditional variable beam angle COB light source module is through the lens of tensile lamps and lanterns, and the relative distance that changes lens and COB light source realizes the change of lamps and lanterns beam angle, and this structure has destroyed the best matching position of light source when adjusting the lens distance, and the light beam penetrating power descends, and the facula is inhomogeneous, and the irradiation effect is not good.
[ summary of the invention ]
The invention provides a high-reliability COB light source module with a variable beam angle, which is improved aiming at the problems that when the light-emitting angle of the existing variable beam angle COB light source module is adjusted, the optimal matching position of a light source is damaged, the penetrating power of a light beam is reduced, light spots are not uniform, and the irradiation effect is poor.
As an improvement of the above-mentioned variable beam angle high-reliability COB light source module, the light-emitting unit includes a plurality of LED chips electrically connected to the substrate, and the plurality of LED chips are spaced apart on the substrate.
As an improvement of the above-mentioned high-reliability COB light source module with a variable beam angle, an LED driver is provided on the substrate to drive the light-emitting unit to emit light.
As an improvement of the high-reliability COB light source module with the variable beam angle, a plurality of groups of lenses for packaging the light-emitting units are arranged on the substrate, and a fluorescent powder layer and a glue layer which are sequentially arranged in the direction of the substrate are arranged in the lenses.
As an improvement of the above-mentioned high-reliability COB light source module with variable beam angle, one side of the substrate opposite to the LED chip is provided with a eutectic layer for electrode bonding with the LED chip.
As an improvement of the high-reliability COB light source module with the variable beam angle, the substrate is opposite to one side of the LED chip is provided with a circuit layer, a eutectic solder cavity is formed on the circuit layer, and the eutectic solder cavity is provided with the eutectic layer.
As an improvement of the above-mentioned variable beam angle high reliability COB light source module, the eutectic layer is a tin alloy.
As an improvement of the above-mentioned variable beam angle high reliability COB light source module, a plurality of the light-emitting units are arranged in order from inside to outside.
As an improvement of the above-mentioned variable beam angle high reliability COB light source module, the plurality of groups of light emitting units include a first light emitting unit, a second light emitting unit and a third light emitting unit, the first light emitting unit is formed in a circular shape by a plurality of the LED chips being arranged at intervals, the second light emitting unit is formed in a first ring shape surrounding the first light emitting unit by a plurality of the LED chips being arranged at intervals, and the third light emitting unit is formed in a second ring shape surrounding the second light emitting unit by a plurality of the LED chips being arranged at intervals.
Compared with the prior art, the invention has the following advantages:
the invention provides a high-reliability COB light source module with a variable beam angle, which comprises a substrate, wherein a plurality of groups of mutually independent light-emitting units which are switched on and off are arranged on the substrate, and each light-emitting unit comprises a plurality of sequentially arranged LED chips. Because the multiple groups of light-emitting units are respectively positioned at different positions of the substrate, the light-emitting areas formed by the light-emitting units can present different beam angles under the refraction of the lens. In the use process, different light emitting units are switched on or off to form different light emitting areas, so that the light beam angle of the lamp is adjusted. In the process of adjusting the beam angle, the relative position of the light source and the lens is fixed and is always in the optimal matching position, so that the light-emitting rate, the light spots and the irradiation effect of the lamp are not influenced by the change of the beam angle and are all maintained in the optimal state.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below.
Fig. 1 is a front view of a variable beam angle COB (chip on board) light source module according to the present application;
fig. 2 is a schematic view illustrating a first light-emitting unit of the variable beam angle COB light source module of the present application;
fig. 3 is a schematic diagram illustrating a second light-emitting unit of the COB light source module with variable beam angle;
fig. 4 is a schematic view illustrating a third light-emitting unit of the variable beam angle COB light source module of the present application;
fig. 5 is a schematic view illustrating an irradiation angle and an irradiation range when different light-emitting units in the variable beam angle COB light source module are turned on;
fig. 6 is a schematic circuit diagram illustrating a light-emitting unit and an LED driver of the COB light source module with variable beam angle according to the present application;
fig. 7 is a schematic circuit diagram illustrating a light-emitting unit and an LED driver of the COB light source module with variable beam angle according to the present application;
fig. 8 is a schematic circuit diagram illustrating a light-emitting unit and an LED driver of the COB light source module with variable beam angle.
[ detailed description ] embodiments
In order to make the technical problems, technical solutions and advantageous effects solved by the present application more clear and obvious, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
The high-reliability COB light source module with a variable beam angle as shown in fig. 1-8 comprises a substrate 1, a light guide cup 100 is formed on the substrate 1, a plurality of groups of light emitting units 2 are arranged on the light guide cup 100, the light emitting units 2 are sequentially arranged or arranged at intervals on the light guide cup 100, and the light emitting units 2 are mutually independent in conduction and closing. Specifically, an LED driver 3 for driving the light emitting unit 2 to emit light is disposed on the substrate 1, and a lens 4 for encapsulating a plurality of groups of the light emitting units 2 is disposed on the substrate 1. Since the light emitting units 2 are respectively located at different positions of the substrate 1, the light emitting areas formed by the light emitting units will show different beam angles under the refraction of the lens 4. In the use process, different light-emitting units 2 are switched on or off according to requirements to form different light-emitting areas, so that the light beam angle of the lamp can be adjusted. In summary, the present invention realizes the adjustment of the beam angle by combining a plurality of sets of the light emitting units 2 to form different light emitting areas without changing the optimal matching position of the light source and the optics. Because the optimal matching position of the light source and the optics is fixed, in the process of adjusting the light beam angle, the light emitting is not influenced, the light emitting efficiency is optimal, the light spots are uniform, and the irradiation effect is good.
Specifically, the plurality of groups of light emitting units 2 include a first light emitting unit 22, a second light emitting unit 23, and a third light emitting unit 24, and the first light emitting unit 22, the second light emitting unit 23, and the third light emitting unit 24 are sequentially arranged from inside to outside in the radial direction of the substrate 1. Specifically, the light emitting unit 2 includes a plurality of LED chips 21 disposed on the light guide cup 100, and the plurality of LED chips 21 may be disposed in sequence or disposed at intervals, preferably in sequence. As can be seen from fig. 2 to 4, the first light emitting unit 22 is formed in a circular shape by arranging the plurality of LED chips 21 at intervals, the second light emitting unit 23 is formed in a first ring shape surrounding the first light emitting unit 22 by arranging the plurality of LED chips 21 at intervals, and the third light emitting unit 24 is formed in a second ring shape surrounding the second light emitting unit 23 by arranging the plurality of LED chips 21 at intervals. As can be seen from fig. 6 to 8, the first light emitting unit 22, the second light emitting unit 23, and the third light emitting unit 24 are connected in parallel to form a shunt circuit. Specifically, when S1 is closed as shown in fig. 6, the first light-emitting unit 22 is turned on to emit light, and as can be seen from fig. 5, the light-emitting region formed by it is Φ 1, and at this time, the light velocity angle is small, and the output light intensity is high; when S1 and S2 are closed as shown in fig. 7, the first light-emitting unit 22 and the second light-emitting unit 23 are turned on to emit light, and as can be seen from fig. 5, the light-emitting region formed by the light-emitting unit is Φ 2, and the light velocity angle is increased; when S1, S2, and S3 are all closed as shown in fig. 8, and the first light emitting unit 22, the second light emitting unit 23, and the third light emitting unit 24 are all turned on to emit light, as can be seen from fig. 5, the light emitting region formed by the light emitting units is Φ 3, and at this time, the light velocity angle is increased, and the output light intensity is high.
Further, a circuit layer 8 is arranged on one side, opposite to the LED chip 21, of the substrate 1, a eutectic solder cavity is formed in the circuit layer 8, a eutectic layer 7 used for being welded to an electrode of the LED chip 21 is arranged in the eutectic solder cavity, and specifically, the eutectic layer 7 is a tin alloy. In this structure, the PN electrode of the LED chip 21 is fixed on the substrate 1 through the eutectic layer 7. The structure changes the traditional packaging mode of using glue to fix the wafer and using gold wire to make electric connection. The failure risk caused by damage of the gold wires in the traditional connection is overcome, the physical strength, the extrusion resistance and the impact resistance of the LED chip 21 are improved, meanwhile, the light attenuation risk caused by high thermal resistance and poor heat conduction effect of glue in the traditional gluing is overcome, the internal thermal resistance of the light source is greatly reduced, and the service life of the light source is prolonged.
Specifically, the step of soldering the LED chip 21 on the substrate 1 is as follows: s1, coating eutectic solder in the eutectic solder cavity; s2, welding eutectic solders in two adjacent eutectic solder cavities in a vacuum environment to form the eutectic layer; s3, dotting a solder resist on the eutectic layer; and S4, welding the LED chip 21 on the eutectic layer in a vacuum environment to complete die bonding. The eutectic solder is welded in a vacuum state, so that the eutectic solder cavity is filled with the eutectic solder, air in the eutectic solder cavity is emptied, and the voidage is reduced; in a similar way, welding of the LED chip in a vacuum state is beneficial to infiltration of eutectic solder in gaps between the LED chip and the substrate 1, so that the void ratio is further reduced, and the stability of the LED chip is improved.
Further, a fluorescent powder layer 5 and a glue layer 6 which are sequentially arranged in the direction away from the substrate 1 are arranged in the lens 4. According to the invention, a sedimentation fluorescent powder process is adopted, the fluorescent powder and the glue realize regional layering, the heat of the fluorescent powder is conducted out through the substrate 1, the temperature of the glue body when the light source works is reduced, and the problem that the light attenuation of the light source is accelerated due to overhigh temperature caused by the fact that the fluorescent powder is suspended in the glue body in the traditional non-sedimentation process is solved.
It should be understood that the terms "first", "second", etc. are used herein to describe various information, but the information should not be limited to these terms, and these terms are only used to distinguish one type of information from another. For example, "first" information may also be referred to as "second" information, and similarly, "second" information may also be referred to as "first" information, without departing from the scope of the present application. Furthermore, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.
The foregoing is illustrative of one or more embodiments provided in connection with the detailed description and is not intended to limit the disclosure to the particular forms disclosed. Similar or identical methods, structures, etc. as used herein, or several technical inferences or substitutions made on the concept of the present application should be considered as the scope of the present application.
Claims (8)
1. High reliability COB light source module of variable beam angle, its characterized in that, including base plate (1), be formed with light guide cup (100) on base plate (1), be equipped with multiunit luminescence unit (2) on light guide cup (100), the multiunit conduction and the closing mutual independence of luminescence unit (2), luminescence unit (2) include a plurality of LED chip (21) that set gradually on light guide cup (100).
2. The variable beam angle high reliability COB light source module of claim 1, characterized in that, be equipped with on base plate (1) drive the luminous unit (2) luminous LED driver (3).
3. The COB light source module with variable beam angle according to claim 1, characterized in that a lens (4) for packaging multiple groups of the light-emitting units (2) is disposed on the substrate (1), and a phosphor layer (5) and a glue layer (6) are sequentially disposed in the lens (4) in a direction away from the substrate (1).
4. Variable beam angle high reliability COB light source module according to claim 2, characterized in that the side of the substrate (1) opposite to the LED chip (21) is provided with a eutectic layer (7) for electrode bonding with the LED chip (21).
5. The variable beam angle high reliability COB light source module of claim 4, characterized in that a side of the substrate (1) opposite to the LED chip (21) is provided with a circuit layer (8), the circuit layer (8) is formed with a eutectic solder cavity, and the eutectic solder cavity is provided with the eutectic layer (7).
6. The variable beam angle COB light source module with high reliability according to claim 4, characterized in that the eutectic layer (7) is a tin alloy.
7. The variable beam angle high reliability COB light source module of claim 1, characterized in that a plurality of the lighting units (2) are arranged in order from inside to outside.
8. The variable beam angle high reliability COB light source module of claim 7, wherein the plurality of sets of lighting units (2) include a first lighting unit (22), a second lighting unit (23), and a third lighting unit (24), the first lighting unit (22) is formed by a plurality of the LED chips (21) being spaced apart to form a circle, the second lighting unit (23) is formed by a plurality of the LED chips (21) being spaced apart to form a first ring surrounding the first lighting unit (22), and the third lighting unit (24) is formed by a plurality of the LED chips (21) being spaced apart to form a second ring surrounding the second lighting unit (23).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011150908.2A CN112268231A (en) | 2020-10-24 | 2020-10-24 | High-reliability COB light source module with variable beam angle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011150908.2A CN112268231A (en) | 2020-10-24 | 2020-10-24 | High-reliability COB light source module with variable beam angle |
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| Publication Number | Publication Date |
|---|---|
| CN112268231A true CN112268231A (en) | 2021-01-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011150908.2A Pending CN112268231A (en) | 2020-10-24 | 2020-10-24 | High-reliability COB light source module with variable beam angle |
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| CN111006150A (en) * | 2019-12-31 | 2020-04-14 | 北京星光影视设备科技股份有限公司 | Spotlight lamp |
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2020
- 2020-10-24 CN CN202011150908.2A patent/CN112268231A/en active Pending
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|---|---|---|---|---|
| CN102544322A (en) * | 2012-01-13 | 2012-07-04 | 深圳市兆驰节能照明有限公司 | White light LED (light emitting diode) and packaging process thereof |
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Application publication date: 20210126 |