CN209133507U - LED component and lamp group array - Google Patents

Abstract

The utility model provides a kind of LED component and lamp group array, wherein, LED component includes: supporting structure, supporting structure includes supporting substrate and the metal framework that is arranged on supporting substrate, metal framework surrounds installation region, the upper surface of supporting substrate is formed with spaced multiple pads, and multiple pads are respectively positioned in installation region；Multiple chips, multiple chips are located at the middle part of installation region, each chip is welded on a pad, and another pad except the pad that selectively and with it is welded by conducting wire of each chip connect, so that formation series circuit and/or parallel circuit between multiple chips.The utility model solves the pad locations on the bracket of LED component in the prior art and the set-up mode between chip and pad is unreasonable, it is restricted so as to cause the circuit form between chip, the illumination effect for affecting LED component causes the problem of the luminescent properties difference of LED component.

Description

LED component and lamp group array

Technical field

The utility model relates to LED light lighting areas, in particular to a kind of LED component and lamp group array.

Background technique

Ultraviolet LED or deep ultraviolet LED, with powerful biocidal efficacies, are made extensively with it in refrigerator or family's electric lighting With.

In the related technology, inorganic encapsulated is widely used, i.e., package lens lid made of inorganic translucent material is located at use In on the bracket of carrying chip, and the two is bonded to play the role of encapsulating chip.In the prior art, the weldering on bracket Set-up mode between disk position and chip and pad is unreasonable, is limited so as to cause the circuit form between chip System, affects the illumination effect of LED component, causes the luminescent properties of LED component poor.

Utility model content

The main purpose of the utility model is to provide a kind of LED components and lamp group array, in the prior art to solve The set-up mode between pad locations and chip and pad on the bracket of LED component is unreasonable, so as to cause chip it Between circuit form be restricted, affect the illumination effect of LED component, cause the problem of the luminescent properties difference of LED component.

To achieve the goals above, one aspect according to the present utility model provides a kind of LED component, comprising: bracket Structure, supporting structure include supporting substrate and the metal framework that is arranged on supporting substrate, and metal framework surrounds installation region, are propped up The upper surface of support group plate is formed with spaced multiple pads, and multiple pads are respectively positioned in installation region；Multiple chips, it is multiple Chip is located at the middle part of installation region, and each chip is welded on a pad, and each chip by conducting wire selectively and and its Another pad connection except the pad of welding, so as to form series circuit and/or parallel circuit between multiple chips.

Further, the tie point of conducting wire and chip is located at the edge of chip, and the edge of chip is far from installation region Center edge, one end of the separate chip of conducting wire extends to the center far from installation region and connects with pad It connects.

Further, each chip passes through the company of another pad except the pad that conducting wire selectively and with it welds It connects.

Further, installation region is rounded, and multiple pads include the first weldering that the circumferential direction along installation region is arranged successively Disk, the second pad, third pad, the 4th pad and the 5th pad, wherein the first pad is located at the outer rim of installation region, and second In pad, third pad, the 4th pad and the 5th pad at least one pad some extend to the middle part of installation region, A chip is provided on two pads, third pad, the 4th pad and the 5th pad, chip and conducting wire connected to it are formed Chip circuit group passes through chip circuit group between the first pad, the second pad, third pad, the 4th pad and the 5th pad It is sequentially connected with, to form series circuit.

Further, the lower surface of supporting substrate is formed with first electrode structure and second electrode structure separately, branch Support group plate offers the conductive through hole that it is penetrated through along its thickness direction, is filled with conductor, the position of the first pad in conductive through hole With at least one conductive through hole, the first pad is electrically connected by the conductor in conductive through hole with first electrode structure, the 5th weldering There is at least one conductive through hole, the 5th pad is electrically connected by the conductor in conductive through hole with second electrode structure at the position of disk It connects.

Further, installation region is rounded, and multiple pads include that the diametrical direction along installation region is arranged successively One pad, the second pad group and third pad, the second pad group include the first sub- pad and the second sub- pad at interval, the first son Pad and the second sub- pad are respectively arranged with the first chip and the second chip in parallel, and the first chip and the second chip, which pass through, leads Line is connect with the first pad；Be provided in parallel third chip and fourth chip on third pad, third chip by conducting wire with First sub- pad connection, fourth chip are connect by conducting wire with the second sub- pad, to form two strings two and circuit.

Further, the lower surface of supporting substrate is formed with first electrode structure and second electrode structure separately, branch Support group plate offers the conductive through hole that it is penetrated through along its thickness direction, is filled with conductor in conductive through hole, at the first pad locations With at least one conductive through hole, the first pad is electrically connected by the conductor in conductive through hole with first electrode structure, the first weldering There is at least one conductive through hole, the first pad is electrically connected by the conductor in conductive through hole with first electrode structure at the position of disk It connects；There is at least one conductive through hole, third pad passes through the conductor and the second electricity in conductive through hole at the position of third pad The electrical connection of pole structure.

Further, the lower surface of supporting substrate is formed with metallic radiating layer, first electrode structure and second electrode structure It is located at the two sides of metallic radiating layer.

Further, the upper surface of supporting substrate is formed with connection lamella by sintering process, and metal framework setting is even On contact pin layer.

Further, the upper surface of metal framework is formed with ring-shaped step structure, and LED component further includes package lens, envelope Dress lens cover is located at the cup chamber for surrounding and sealing with supporting structure at ring-shaped step structure for chip.

Further, projection of the metal framework in the upper surface of supporting substrate is located at the inside of the upper surface of supporting substrate.

Further, the peripheral surface of metal framework includes multiple outside wall surfaces being connected, the company of two neighboring outside wall surface Place is met along cambered surface transition.

Further, metal framework includes stacked multiple layer metal frame, and multiple layer metal frame passes through electroplating technology molding and phase It is fixedly connected.

Another aspect according to the present utility model, provides a kind of lamp group array, including support frame, with array on support frame Form arrangement be provided with multiple LED components, LED component is above-mentioned LED component.

Multiple pads are arranged at intervals on by optimizing the position of multiple pads using the technical solution of the utility model In installation region, while optimizing the connection relationship between multiple chips and pad, multiple chips is made neatly to constitute series circuit And/or parallel circuit, consequently facilitating controlling the luminescent properties of LED component by luminous control to multiple chips；This Outside, since the middle part that multiple chips are arranged in installation region is matched so that the light-emitting surface of multiple chips is concentrated as much as possible Together in the light-reflecting property of metal framework, the maximum emission intensity of LED component has been greatly improved, has improved shining for LED component Performance.

Detailed description of the invention

The accompanying drawings constituting a part of this application is used to provide a further understanding of the present invention, this is practical Novel illustrative embodiments and their description are not constituteed improper limits to the present invention for explaining the utility model. In the accompanying drawings:

Fig. 1 shows a kind of main view signal of the internal structure of the LED component of alternative embodiment according to the present utility model Figure；

Fig. 2 shows the LED components of the connection type for the multiple chips that can show which the embodiments of the present invention one The schematic top plan view of internal structure；

Fig. 3 shows the LED component for the connection type of multiple chips that can show which the embodiments of the present invention two The schematic top plan view of internal structure；

Fig. 4 shows a kind of bottom structure elevational schematic view of the LED component of alternative embodiment according to the present utility model.

Wherein, the above drawings include the following reference numerals:

10, supporting structure；11, supporting substrate；111, conductive through hole；12, metal framework；121, installation region；122, ring Shape step structure；123, peripheral surface；124, outside wall surface；125, metal frame；13, cup chamber；20, chip；201, the first chip； 202, the second chip；203, third chip；204, fourth chip；30, pad；301, the first pad；302, the second pad；300, Second pad group；3021, the first sub- pad；3022, the second sub- pad；303, third pad；304, the 4th pad；305, the 5th Pad；40, conducting wire；50, first electrode structure；60, second electrode structure；70, metallic radiating layer；80, lamella is connected；90, it seals Fill lens；100, chip circuit group；200, conductor.

Specific embodiment

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Be to the description only actually of at least one exemplary embodiment below it is illustrative, never as to this is practical Novel and its application or any restrictions used.Based on the embodiments of the present invention, those of ordinary skill in the art are not having Every other embodiment obtained under the premise of creative work is made, is fallen within the protection scope of the utility model.

The pad locations on bracket in order to solve LED component in the prior art and the setting between chip and pad Mode is unreasonable, is restricted so as to cause the circuit form between chip, affects the illumination effect of LED component, causes The problem of the luminescent properties difference of LED component, the utility model provide a kind of LED component and lamp group array, wherein lamp group array Including support frame, arrangement is provided with multiple LED components in an array manner on support frame, and LED component is above-mentioned and following LED Device.

Embodiment one

As shown in Figure 1, Figure 2 and Figure 4, LED component includes supporting structure 10 and multiple chips 20, and supporting structure 10 includes branch Support group plate 11 and the metal framework 12 being arranged on supporting substrate 11, metal framework 12 surround installation region 121, supporting substrate 11 Upper surface be formed with spaced multiple pads 30, multiple pads 30 are respectively positioned in installation region 121, multiple chips 20 In the middle part of installation region 121, each chip 20 is welded on a pad 30, and each chip 20 by conducting wire 40 selectively and Another pad 30 except the pad 30 welded with it is connect, so as to form series circuit and/or simultaneously between multiple chips 20 Join circuit.

By optimizing the position of multiple pads 30, it is arranged at intervals on multiple pads 30 in installation region 121, optimizes simultaneously Connection relationship between multiple chips 20 and pad 30 makes multiple chips 20 neatly constitute series circuit and/or parallel circuit, Consequently facilitating controlling the luminescent properties of LED component by luminous control to multiple chips 20；Further, since by multiple The middle part of installation region 121 is arranged in chip 20, so that the light-emitting surface of multiple chips 20 is concentrated as much as possible, is matched with gold The light-reflecting property for belonging to frame 12, has greatly improved the maximum emission intensity of LED component, has improved the luminescent properties of LED component.

As shown in Fig. 2, the tie point of conducting wire 40 and chip 20 is located at the edge of chip 20, the edge of chip 20 is separate The edge of the center of installation region 121, one end of the separate chip 20 of conducting wire 40 is to the centre bit far from installation region 121 It sets and extends and connect with pad 30.By the way that the tie point of conducting wire 40 and chip 20 is set to the edge of chip 20, and to connect Contact is away as far as possible the center of installation region 121, so that link position not only be made not influence chip 20 as far as possible It shines, so that the light-emitting surface of multiple chips 20 concentrates on the middle part of installation region 121 as far as possible, to be conducive to LED component hair The promotion of optical property.

Optionally, another except the pad 30 that each chip 20 selectively and with it is welded by least one conducting wire 40 One pad 30 connects.Preferably, each chip 20 passes through the pad 30 that at least two conducting wires 40 selectively and with it weld Except the connection of another pad 30, in this way, ought a conducting wire 40 at least two conducting wires 40 it is invalid because welding due to occurs to break When the phenomenon of road, remaining conducting wire 40 still is able to play the role of electrical connecting wire 40 and pad 30, it is ensured that chip 20 can Normal luminous improves LED component stability of photoluminescence；In addition, chip 20 is connect by multiple conducting wires 40 with pad 30, Neng Gouyou Effect ground increases the magnitude of current flowed through between the two, improves the luminous power of chip 20.

It should be noted that 40 both ends of conducting wire are electrically connected by metal welding with pad 30 and chip 20 respectively in this application It connects.

Preferably, the area of the light-emitting surface of the pad occupancy chip 20 in order to avoid conducting wire 40 on chip 20 is excessive, And the illumination effect of chip 20 is influenced, each chip 20 is connect by two conducting wires 40 with pad 30；Conducting wire 40 in the application It can allow for through the range of electric current in 0.5A with pad 30 between 1.5A.

Optionally, the chip 20 in the application is vertical chip.

This gives a kind of structure type of optional multiple pads 30 and distribution mode and multiple chips 20 Layout type and electric connection mode, as shown in Fig. 2, installation region 121 is rounded, multiple pads 30 include along installation region The first pad 301, the second pad 302, third pad 303, the 4th pad 304 and the 5th pad that 121 circumferential direction is arranged successively 305, wherein the first pad 301 is located at the outer rim of installation region 121, the second pad 302, third pad 303, the 4th pad 304 Some extends to the middle part of installation region 121, the second pad 302, third weldering at least one pad in the 5th pad 305 A chip 20,40 shape of chip 20 and conducting wire connected to it are provided on disk 303, the 4th pad 304 and the 5th pad 305 At chip circuit group 100, the first pad 301, the second pad 302, third pad 303, the 4th pad 304 and the 5th pad 305 Between be sequentially connected with by chip circuit group 100, to form series circuit.This circuit structure, which ensures, flows through each chip 20 electric current is identical, so that the luminous intensity for advantageously allowing each chip 20 is identical, improves the luminescent properties of LED component.

As shown in figure 4, the lower surface of supporting substrate 11 is formed with first electrode structure 50 and second electrode knot separately Structure 60, supporting substrate 11 offer the conductive through hole 111 for penetrating through it along its thickness direction, are filled with conductor in conductive through hole 111 200, the position of the first pad 301 has at least one conductive through hole 111, and the first pad 301 passes through leading in conductive through hole 111 Body 200 is electrically connected with first electrode structure 50, has at least one conductive through hole 111, the 5th weldering at the position of the 5th pad 305 Disk 305 is electrically connected by the conductor 200 in conductive through hole 111 with second electrode structure 60.In this way, by by first electrode structure 50 and second electrode structure 60 be connected respectively with the anode and cathode of power supply, just can ensure stable luminous of LED component.The One electrode structure 50 and second electrode structure 60 are electrode, and the setting of conductor 200 can be played between pad 30 and electrode Stablize the effect being electrically connected.

Optionally, the first pad 301 is electrically connected by the conductor 200 in multiple conductive through holes 111 with first electrode structure 50 It connects；5th pad 305 is electrically connected by the conductor 200 in multiple conductive through holes 111 with second electrode structure 60.In this way, being promoted Reliability of electrical connection between pad 30 and electrode, avoids when open circuit occurs for the conductor 200 in unique conductive through hole 111 When, it is breaking between pad 30 and electrode.

In the present embodiment, the first pad 301 passes through the conductor 200 and first electrode structure in two conductive through holes 111 50 electrical connections；5th pad 305 is electrically connected by the conductor 200 in two conductive through holes 111 with second electrode structure 60.

Optionally, conductor 200 is the copper being filled in conductive through hole 111 in such a way that heat chemistry is electroplated.

As shown in figure 4, the lower surface of supporting substrate 11 is formed with metallic radiating layer 70, first electrode structure 50 and the second electricity Pole structure 60 is located at the two sides of metallic radiating layer 70.The setting of metallic radiating layer 70 can effectively dissipate the work of chip 20 When the heat that generates, it is ensured that LED component works steadily in the long term；It should be noted that metallic radiating layer 70 and first electrode knot Structure 50 and second electrode structure 60 do not contact, avoid that short circuit phenomenon occurs.

In order to promote the heat dissipation performance of LED component, optionally, the area of metallic radiating layer 70 is greater than first electrode structure 50 or metallic radiating layer 70 area be greater than second electrode structure 60.

As depicted in figs. 1 and 2, the upper surface of supporting substrate 11 is formed with connection lamella 80, metal frame by sintering process The setting of frame 12 is on connection lamella 80.In this way, convenient for promoting the stable connection type of metal framework 12 and supporting substrate 11.

Optionally, supporting substrate 11 is made of ceramic, and connection lamella 80 is to be mounted on supporting substrate 11 using sintering process Upper surface copper sheet frame, metal framework 12 formed by the stacked plating of multi-layer annular copper sheet.

Optionally, the outer surface for connecting lamella 80 is electroplate with gold or silver to form protective layer.

As shown in Figure 1, the upper surface of metal framework 12 is formed with ring-shaped step structure 122, LED component further includes that encapsulation is saturating Mirror 90, the lid of package lens 90 are located at ring-shaped step structure 122 to surround and be sealed for chip 20 with supporting structure 10 Cup chamber 13.Ring-shaped step structure 122 plays the position-limiting action to package lens 90, it is ensured that 90 pairs of cup chambers 13 of package lens Sealing reliability.

Optionally, the surface of package lens 90 is curved surface, and package lens 90 are Nian Jie with ring-shaped step structure 122 or weld It connects.

Optionally, in order to make metal framework 12 from being damaged by cutting, metal framework 12 is in the upper surface of supporting substrate 11 Projection be located at supporting substrate 11 upper surface inside.

As depicted in figs. 1 and 2, the peripheral surface 123 of metal framework 12 includes multiple outside wall surfaces 124 being connected, adjacent The junction of two outside wall surfaces 124 is along cambered surface transition.In this way, being conducive to the processing and manufacturing of metal framework 12.

As shown in Figure 1, metal framework 12 includes stacked multiple layer metal frame 125, multiple layer metal frame 125 passes through electroplating technology It forms and is mutually fixedly connected.In this way, being convenient for the processing and manufacturing of metal framework 12.

Embodiment two

This gives the structure type of another optional multiple pads 30 and distribution mode and multiple chips 20 layout type and electric connection mode, as shown in figure 3, difference from the first embodiment is that installation region 121 is rounded, Multiple pads 30 include the first pad 301, the second pad group 300 and that the diametrical direction along installation region 121 is arranged successively Three pads 303, the second pad group 300 include the first sub- pad 3021 and the second sub- pad 3022 at interval, the first sub- pad 3021 and second sub- pad 3022 be respectively arranged in parallel the first chip 201 and the second chip 202, the first chip 201 and the Two chips 202 are connect by conducting wire 40 with the first pad 301；203 He of third chip in parallel is provided on third pad 303 Fourth chip 204, third chip 203 connects by conducting wire 40 with the first sub- pad 3021, fourth chip 204 pass through conducting wire 40 and Second sub- pad 3022 connects, to form two strings two and circuit.In this way, the first chip 201 and third chip 203 are connected, it can Individually control, the second chip 202 and the series connection of fourth chip 204 also can in parallel with the first chip 201 and third chip 203 It is individually controlled, under the premise of ensuring the good luminescence property of LED component, improves the handling of LED component.

As shown in Figure 3 and Figure 4, the lower surface of supporting substrate 11 is formed with first electrode structure 50 separately and the second electricity Pole structure 60, supporting substrate 11 offer the conductive through hole 111 for penetrating through it along its thickness direction, are filled in conductive through hole 111 Conductor 200, has at least one conductive through hole 111 at 301 position of the first pad, and the first pad 301 passes through in conductive through hole 111 Conductor 200 be electrically connected with first electrode structure 50, there is at least one conductive through hole 111 at the position of the first pad 301, the One pad 301 is electrically connected by the conductor 200 in conductive through hole 111 with first electrode structure 50；At the position of third pad 303 With at least one conductive through hole 111, third pad 303 passes through the conductor 200 and second electrode structure 60 in conductive through hole 111 Electrical connection.In this way, by the way that first electrode structure 50 and second electrode structure 60 are connected with the anode and cathode of power supply respectively, Just can ensure that LED component is stable to shine.First electrode structure 50 and second electrode structure 60 are electrode, and conductor 200 Setting can play the role of between pad 30 and electrode stablize electric connection.

It should be noted that term used herein above is merely to describe specific embodiment, and be not intended to restricted root According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singular Also it is intended to include plural form, additionally, it should be understood that, when in the present specification using term "comprising" and/or " packet Include " when, indicate existing characteristics, step, operation, device, component and/or their combination.

Unless specifically stated otherwise, positioned opposite, the digital table of the component and step that otherwise illustrate in these embodiments Up to the unlimited the scope of the utility model processed of formula and numerical value.Simultaneously, it should be appreciated that for ease of description, each shown in attached drawing The size of a part is not to draw according to actual proportionate relationship.For skill known to person of ordinary skill in the relevant Art, method and apparatus may be not discussed in detail, but in the appropriate case, and the technology, method and apparatus should be considered as awarding Weigh part of specification.In shown here and discussion all examples, any occurrence should be construed as merely example Property, not as limitation.Therefore, the other examples of exemplary embodiment can have different values.It should also be noted that similar Label and letter similar terms are indicated in following attached drawing, therefore, once be defined in a certain Xiang Yi attached drawing, then with In attached drawing afterwards do not need that it is further discussed.

In the description of the present invention, it should be understood that the noun of locality such as " front, rear, top, and bottom, left and right ", " laterally, Vertically, vertically, it is horizontal " and " pushing up, bottom " etc. indicated by orientation or positional relationship be normally based on orientation or position shown in the drawings Relationship is set, is merely for convenience of describing the present invention and simplifying the description, in the absence of explanation to the contrary, these nouns of locality Do not indicate that and imply that signified device or element must have a particular orientation or be constructed and operated in a specific orientation, because This should not be understood as the limitation to scope of protection of the utility model；The noun of locality " inside and outside " refers to the wheel relative to each component itself Wide is inside and outside.

For ease of description, spatially relative term can be used herein, as " ... on ", " ... top ", " ... upper surface ", " above " etc., for describing such as a device shown in the figure or feature and other devices or spy The spatial relation of sign.It should be understood that spatially relative term is intended to comprising the orientation in addition to device described in figure Except different direction in use or operation.For example, being described as if the device in attached drawing is squeezed " in other devices It will be positioned as " under other devices or construction after part or construction top " or the device of " on other devices or construction " Side " or " under other devices or construction ".Thus, exemplary term " ... top " may include " ... top " and " in ... lower section " two kinds of orientation.The device can also be positioned with other different modes and (is rotated by 90 ° or in other orientation), and And respective explanations are made to the opposite description in space used herein above.

It should be noted that term used herein above is merely to describe specific embodiment, and be not intended to restricted root According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singular Also it is intended to include plural form, additionally, it should be understood that, when in the present specification using term "comprising" and/or " packet Include " when, indicate existing characteristics, step, work, device, component and/or their combination.

It should be noted that the description and claims of this application and term " first " in above-mentioned attached drawing, " Two " etc. be to be used to distinguish similar objects, without being used to describe a particular order or precedence order.It should be understood that using in this way Data be interchangeable under appropriate circumstances, so that presently filed embodiment described herein can be in addition to illustrating herein Or the sequence other than those of description is implemented.

The above descriptions are merely preferred embodiments of the present invention, is not intended to limit the utility model, for this For the technical staff in field, various modifications and changes may be made to the present invention.It is all in the spirit and principles of the utility model Within, any modification, equivalent replacement, improvement and so on should be included within the scope of protection of this utility model.

Claims (14)

1. a kind of LED component characterized by comprising

Supporting structure (10), the supporting structure (10) include supporting substrate (11) and are arranged on the supporting substrate (11) Metal framework (12), the metal framework (12) surround installation region (121), and the upper surface of the supporting substrate (11) is formed with Spaced multiple pads (30), the multiple pad (30) are respectively positioned in the installation region (121)；

Multiple chips (20), the multiple chip (20) are located at the middle part of the installation region (121), each chip (20) weldering It connects on a pad (30), and each chip (20) passes through the weldering that conducting wire (40) selectively and with it are welded Another described pad (30) connection except disk (30) so that formed between the multiple chip (20) series circuit and/or Parallel circuit.

2. LED component according to claim 1, which is characterized in that the connection of the conducting wire (40) and the chip (20) Point is located at the edge of the chip (20), and the edge of the chip (20) is the centre bit far from the installation region (121) The edge set, the conducting wire (40) far from the chip (20) one end to far from the installation region (121) centre bit It sets and extends and connect with the pad (30).

3. LED component according to claim 1 or 2, which is characterized in that each chip (20) passes through at least one institute Another described pad (30) except the pad (30) that conducting wire (40) selectively and with it welds is stated to connect.

4. LED component according to claim 1, which is characterized in that the installation region (121) is rounded, the multiple Pad (30) includes the first pad (301), the second pad (302), that the circumferential direction along the installation region (121) is arranged successively Three pads (303), the 4th pad (304) and the 5th pad (305), wherein first pad (301) is located at the installing zone The outer rim in domain (121), second pad (302), the third pad (303), the 4th pad (304) and the described 5th In pad (305) at least one pad some extend to the middle part of the installation region (121), second pad (302), an institute is provided on the third pad (303), the 4th pad (304) and the 5th pad (305) It states chip (20), the chip (20) and the conducting wire connected to it (40) form chip circuit group (100), first weldering Disk (301), second pad (302), the third pad (303), the 4th pad (304) and the 5th pad (305) it is sequentially connected with by the chip circuit group (100) between, to form series circuit.

5. LED component according to claim 4, which is characterized in that the lower surface of the supporting substrate (11) is formed with phase The first electrode structure (50) and second electrode structure (60) at interval, the supporting substrate (11) offers passes through along its thickness direction Lead to its conductive through hole (111), is filled with conductor (200) in the conductive through hole (111), the position of first pad (301) Setting has at least one described conductive through hole (111), and first pad (301) passes through leading in the conductive through hole (111) Body (200) is electrically connected with the first electrode structure (50), is had described at least one at the position of the 5th pad (305) Conductive through hole (111), the 5th pad (305) pass through the conductor (200) and second electricity in the conductive through hole (111) Pole structure (60) electrical connection.

6. LED component according to claim 1, which is characterized in that the installation region (121) is rounded, the multiple Pad (30) includes the first pad (301), the second pad group that the diametrical direction along the installation region (121) is arranged successively (300) and third pad (303), the second pad group (300) include the first sub- pad (3021) and the second son weldering at interval Disk (3022), the first sub- pad (3021) and the second sub- pad (3022) are respectively arranged with the first chip in parallel (201) and the second chip (202), first chip (201) and second chip (202) by conducting wire (40) with it is described First pad (301) connection；Third chip (203) and fourth chip in parallel are provided on the third pad (303) (204), the third chip (203) is connect by conducting wire (40) with the described first sub- pad (3021), the fourth chip (204) it is connect by conducting wire (40) with the described second sub- pad (3022), to form two strings two and circuit.

7. LED component according to claim 6, which is characterized in that the lower surface of the supporting substrate (11) is formed with phase The first electrode structure (50) and second electrode structure (60) at interval, the supporting substrate (11) offers passes through along its thickness direction Lead to its conductive through hole (111), is filled with conductor (200) in the conductive through hole (111), the first pad (301) position Place has at least one described conductive through hole (111), and first pad (301) passes through leading in the conductive through hole (111) Body (200) is electrically connected with the first electrode structure (50), is had described at least one at the position of first pad (301) Conductive through hole (111), first pad (301) pass through the conductor (200) and first electricity in the conductive through hole (111) Pole structure (50) electrical connection；There is at least one described conductive through hole (111) at the position of the third pad (303), it is described Third pad (303) is electrically connected by the conductor (200) in the conductive through hole (111) with the second electrode structure (60).

8. the LED component according to claim 5 or 7, which is characterized in that the lower surface of the supporting substrate (11) is formed with Metallic radiating layer (70), the first electrode structure (50) and the second electrode structure (60) are located at the heat dissipation metal The two sides of layer (70).

9. LED component according to claim 1, which is characterized in that the upper surface of the supporting substrate (11) passes through sintering Technique is formed with connection lamella (80), and the metal framework (12) is arranged on the connection lamella (80).

10. LED component according to claim 1, which is characterized in that the upper surface of the metal framework (12) is formed with ring Shape step structure (122), the LED component further include package lens (90), and package lens (90) lid is located at the annular Step structure (122) sentences the cup chamber (13) for surrounding and sealing with the supporting structure (10) for chip (20).

11. LED component according to claim 1, which is characterized in that the metal framework (12) is in the supporting substrate (11) projection of upper surface is located at the inside of the upper surface of the supporting substrate (11).

12. LED component according to claim 1, which is characterized in that the peripheral surface (123) of the metal framework (12) Including multiple outside wall surfaces (124) being connected, the junction of the two neighboring outside wall surface (124) is along cambered surface transition.

13. LED component according to claim 1, which is characterized in that the metal framework (12) includes stacked multilayer gold Belong to frame (125), the multiple layer metal frame (125) is formed by electroplating technology and is mutually fixedly connected.

14. a kind of lamp group array, which is characterized in that including support frame, arrangement is provided in an array manner on support frame as described above Multiple LED components, the LED component are LED component described in any one of claims 1 to 13.