CN107849688B - 背板、溅射靶及它们的制造方法 - Google Patents

背板、溅射靶及它们的制造方法 Download PDF

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Publication number
CN107849688B
CN107849688B CN201680040289.7A CN201680040289A CN107849688B CN 107849688 B CN107849688 B CN 107849688B CN 201680040289 A CN201680040289 A CN 201680040289A CN 107849688 B CN107849688 B CN 107849688B
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cover member
thickness
plate
back plate
joined
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Chinese (zh)
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CN107849688A (zh
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西冈宏司
佐藤尚也
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Sumitomo Chemical Co Ltd
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Sumitomo Chemical Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • H01J37/3414Targets

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
CN201680040289.7A 2015-07-10 2016-06-29 背板、溅射靶及它们的制造方法 Active CN107849688B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015138918 2015-07-10
JP2015-138918 2015-07-10
PCT/JP2016/069346 WO2017010293A1 (ja) 2015-07-10 2016-06-29 バッキングプレート、スパッタリングターゲットおよびそれらの製造方法

Publications (2)

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CN107849688A CN107849688A (zh) 2018-03-27
CN107849688B true CN107849688B (zh) 2020-05-19

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CN201680040289.7A Active CN107849688B (zh) 2015-07-10 2016-06-29 背板、溅射靶及它们的制造方法

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JP (3) JP6151870B2 (ja)
KR (1) KR102116923B1 (ja)
CN (1) CN107849688B (ja)
TW (1) TWI669405B (ja)
WO (1) WO2017010293A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107849688B (zh) * 2015-07-10 2020-05-19 住友化学株式会社 背板、溅射靶及它们的制造方法
TWI687534B (zh) * 2018-09-07 2020-03-11 住華科技股份有限公司 背板、使用其之濺射靶材及其使用方法
CN112805402A (zh) * 2018-11-21 2021-05-14 住友化学株式会社 背板、溅射靶及它们的制造方法
JP6677853B1 (ja) * 2019-02-07 2020-04-08 住友化学株式会社 スパッタリングターゲット、ターゲット材とバッキングプレートを接合する方法およびスパッタリングターゲットの製造方法
JP6801911B2 (ja) * 2020-09-07 2020-12-16 京浜ラムテック株式会社 バッキングプレートおよびその製造方法
CN112222553A (zh) * 2020-09-27 2021-01-15 宁波江丰电子材料股份有限公司 一种钼靶焊接方法
CN112323026A (zh) * 2020-10-29 2021-02-05 珠海和泽科技有限公司 靶材背板及其制作方法
US20220310371A1 (en) 2021-03-26 2022-09-29 Sumitomo Chemical Company, Limited Sputtering target, method of bonding target material and backing plate, and method of manufacturing sputtering target
DE202021106391U1 (de) * 2021-11-23 2021-11-29 Pilatus Flugzeugwerke Ag Luftfahrzeugkomponente und Luftfahrzeug

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3818084B2 (ja) * 2000-12-22 2006-09-06 日立電線株式会社 冷却板とその製造方法及びスパッタリングターゲットとその製造方法
JP2006150454A (ja) * 2000-12-22 2006-06-15 Hitachi Cable Ltd 冷却板とその製造方法及びスパッタリングターゲットとその製造方法
JP4852897B2 (ja) 2005-06-07 2012-01-11 日立電線株式会社 冷却板
JP5401921B2 (ja) * 2008-10-30 2014-01-29 日本軽金属株式会社 伝熱板の製造方法
JP2010284693A (ja) * 2009-06-12 2010-12-24 Mitsubishi Heavy Ind Ltd 冷却板およびその製造方法
JP5541629B2 (ja) 2010-12-16 2014-07-09 株式会社アルバック バッキングプレート及びその製造方法
CN201999986U (zh) * 2011-01-21 2011-10-05 许舒华 具冷却流道的背板结构
CN107849688B (zh) * 2015-07-10 2020-05-19 住友化学株式会社 背板、溅射靶及它们的制造方法

Also Published As

Publication number Publication date
JP2017193779A (ja) 2017-10-26
JP2018095971A (ja) 2018-06-21
KR20180042214A (ko) 2018-04-25
CN107849688A (zh) 2018-03-27
TW201708582A (zh) 2017-03-01
JP6286088B2 (ja) 2018-02-28
WO2017010293A1 (ja) 2017-01-19
KR102116923B1 (ko) 2020-05-29
TWI669405B (zh) 2019-08-21
JP6151870B2 (ja) 2017-06-21
JPWO2017010293A1 (ja) 2017-07-13

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