CN107848307A - 打印头插入件 - Google Patents

打印头插入件 Download PDF

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CN107848307A
CN107848307A CN201580081146.6A CN201580081146A CN107848307A CN 107848307 A CN107848307 A CN 107848307A CN 201580081146 A CN201580081146 A CN 201580081146A CN 107848307 A CN107848307 A CN 107848307A
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insert
emc
printhead die
printhead
electrical connection
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CN107848307B (zh
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迈克尔·W·昆比
德威·亚历山大·穆雷
陈简华
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Hewlett Packard Development Co LP
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14088—Structure of heating means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1637—Manufacturing processes molding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)

Abstract

在示例性实施方案中，提供具有插入件的装置。所述装置可以包括环氧模塑化合物(EMC)。打印头模具和驱动集成电路(IC)可以嵌入在所述EMC中。插入件也可以嵌入在所述EMC中。所述打印头模具、所述驱动IC和所述插入件可以在所述EMC内引线接合。

Description

打印头插入件
背景技术
喷墨打印机使用以期望的图案将不同颜色的油墨喷射到介质上的打印头。不同颜色的打印头模具在模具的每端配有独立的电互连件。目前使用的打印头的配置具有外部耦接到模塑打印头的集成电路。
附图说明
图1是具有本公开的插入件的示例性模塑打印头的框图；
图2是用于制造具有插入件的模塑打印头的示例性方法的流程图；
图3是用于制造具有插入件的模塑打印头的方法的示例性示意图；以及
图4A和4B是用于制造具有插入件的模塑打印头的方法的更详细的示例性示意图。
具体实施方式
本公开广泛地公开具有插入件的模塑打印头。如上面讨论的，目前使用的模塑打印头的配置将ASIC或驱动集成电路(IC)外部耦接到模塑打印头。然而，这可能在打印头模具的末端处使用焊盘或互连件。由于定位焊盘或互连件的挑战，可能需要额外的硅来形成打印头模具。这可能导致与硅增加的消耗量相关联的额外的成本。另外，由于耦接打印头模具外部的ASIC或驱动IC的突出的引线接合，打印头模具的表面可能是不平坦的。
本公开的示例使用插入件来允许将ASIC或驱动IC引线接合到模塑打印头内部的打印头模具。结果是，可以去掉用于将焊盘或互连件连接到ASIC或驱动IC的额外的硅。另外，通过封装引线接合，打印头可以具有平坦或平面的表面。
图1图示说明具有插入件110的示例性模塑打印头100的框图。图1图示说明示例性模塑打印头100的横截面图。
在一个示例中，模塑打印头100包括打印头模具102、驱动集成电路(IC)112和插入件110。打印头模具102、驱动IC 112和插入件110可以由环氧模塑化合物(EMC)118封装。示例性EMC可以包括比如来自 Chemical的CEL400ZHF40WG的化合物。
在一个示例中，打印头模具102可以是热流体喷射模具(例如，打印头模具102可以用于各种各样不同类型的二维和三维打印机)。驱动IC 112可以是用于控制打印头模具102的每一个供墨孔122的致动器(未示出)的半导体微芯片或处理器。在一个实施方案中，驱动IC 112可以是专用集成电路(ASIC)，其被定制成控制模塑打印头100的打印头模具102。如上所述，驱动IC 112会预先被外部连接到打印头模具102。
在一个实施方案中，插入件110允许驱动IC 112连接到模塑打印头100内的打印头模具102，并在施加EMC 118之前连接。插入件110可以是模塑打印头100内的结构，其提供从一个“z”平面到另一个“z”平面的电连接。换言之，插入件110可以允许从模塑打印头100内到模塑打印头100的前侧120的电连接。
插入件110可以允许驱动IC 112位于模塑打印头100内，而不是外部连接到打印头模具102。例如，驱动IC 112可以通过连接焊盘104和106的电连接114来连接到打印头模具102。驱动IC 112还可以通过将焊盘108连接到插入件110的电连接116来连接到插入件110。在一个示例中，电连接114和116可以是引线接合。然后，打印头模具102、驱动IC 112和插入件110可以被EMC 118封装。
另外，通过将驱动IC 112连接到EMC 118内的打印头模具102，消除了先前用来为用于外部连接的焊盘和互连件提供区域的额外的硅的使用。而且，通过去除驱动IC112和打印头模具102之间的外部电连接，在模塑打印头100上创建平坦或平面的表面。例如，前表面120可以是相对平坦的。
在一个示例中，插入件110可以由各种各样不同的材料制造，比如金属、导体、半导体(例如，硅、陶瓷、玻璃等)、填充银导电颗粒或碳导电颗粒的塑料或环氧材料，其填充贯通材料122的通孔。可以使用的不同导体或半导体和材料122的示例可以包括具有硅通孔(TSV)的硅(Si)、具有玻璃通孔(TGV)的玻璃、具有模塑通孔(TMV)的模塑部件、具有填充有该材料的通孔的印刷电路板(PCB)等。
图2图示说明用于制造具有插入件110的模塑打印头100的示例性方法200的流程图。方法200可以在制造厂内通过各种各样不同的工具(例如，模具工具、光刻工具、蚀刻工具、抛光工具等)实施。图3图示说明用于制造具有插入件110的模塑打印头100的方法300的示例性示意图。应该注意的是，可以结合图2的框来参考图3。
在框202处，方法200开始。在框204处，方法200提供载体。载体可以是印刷电路板(例如，FR4PCB)。载体为待形成的模塑打印头100提供基础结构。
在框206处，方法200在载体上施加热释放带。热释放带可以是允许电子组件附着和通过加热该热释放带而去除的任何类型的材料。热释放带可以用来从模塑打印头去除结构化的载体。可以使用的热释放带的示例可以是来自Nitto 的产品编号3195V。
在框208处，方法200将打印头模具、驱动IC和插入件附接在热释放带上。图3图示说明在框302处，附接到热释放带322和载体320的打印头模具102、驱动IC 112和插入件110的图。应该注意的是，虽然在图3的框302中仅图示说明了单个打印头模具102、单个驱动IC112和单个插入件110，但是可以将任何数量的打印头模具102、驱动IC 112和插入件110附接到热释放带322。另外，尽管示出一个驱动IC 112连接到一个打印头模具102，但是应该注意的是，驱动IC 112可以连接到多个不同的打印头模具102。
图3图示说明由顶帽150保护的打印头模具102。顶帽150可以保护供墨孔122以防在制造模塑打印头100期间堵塞或收集碎片。顶帽150可以是环氧类的化学放大负性光刻胶材料。供墨孔122也可以被填充保护。
回来参考图2，在框210处，方法200用环氧模塑化合物封装打印头模具、设备IC和插入件。在一个示例中，可以使用压缩模具工具来施加EMC。在一个示例中，压缩模具工具可以来自可以在140摄氏度(℃)下施加EMC 118大约5分钟。图3在框304处图示说明封装打印头模具102、驱动IC112和插入件110的EMC 118。
回来参考图2，在框212处，方法200去除载体和热释放带。图3在框306中图示说明在去除热释放带322和载体320之后的模塑打印头100。另外，可以施加图案化步骤和蚀刻步骤以将EMC 118开槽于打印头模具102上。图案化步骤和蚀刻步骤去除顶帽150和供墨孔122中的任何材料以打开供墨孔122。在框214处，方法200结束。
图4A和图4B图示说明用于制造具有插入件的模塑打印头的方法400的另一个示例性示意图。在图4A中在框402处开始，可以预先准备具有插入件452的PCB 456和具有插入件454的PCB 458。可以将ASIC 450接合到PCB 458。如上所述，ASIC 450可以控制用于打印头模具102的供墨孔的致动器(未示出)。
在框404处，具有插入件452的PCB 456、具有插入件454的PCB 458以及ASIC 450可以被附接到热释放带322。虽然图4中图示说明将单个ASIC 450、两个PCB 456和458以及两个插入件452和454附接到热释放带322，但是应该注意的是，可以将任何数量的ASIC、PCB和插入件附接到热释放带322。可以将热释放带322施加到载体320。另外，可以将打印头模具102附接到热释放带322。
打印头模具102可以是热流体喷射打印头模具。虽然在图4中仅图示说明单个打印头模具102，应该注意的是，可以将任何数量的打印头模具102附接到热释放带322。类似于图3中的打印头模具102，打印头模具102可以具有顶帽150，其在制造模塑打印头期间保护供墨孔以防堵塞或收集碎片。顶帽150可以是环氧类化学放大负性光刻胶材料。供墨孔也可以被填充保护。
在框406处，打印头模具102可以通过至少一个电连接460连接到插入件452，并通过至少一个电连接462连接到插入件454。例如，电连接460可以将插入件452连接到打印头模具102的焊盘464。电连接462可以将插入件454连接到打印头模具102的焊盘466。在一个实施方案中，电连接460和462可以通过导电金属(例如铜线)引线接合。
继续参考图4B，在框408处，可以封装打印头模具102、具有插入件452的PCB456和具有插入件454的PCB 458以及ASIC 450。在一个实施方案中，可以使用EMC118来将组件封装在热释放带322上。在一个示例中，压缩模具工具可以来自可以在140摄氏度(℃)下施加EMC 118大约5分钟。
在框410处，可以去除热释放带322和载体320。例如，可以加热热释放带322以将其从模塑打印头去除。
在框412处，可以形成覆盖打印头模具102中的供墨孔的EMC 118中的区域上的槽，并且可以去除打印头模具102上的保护顶帽150。在一个示例中，可以通过切入式锯切或激光烧蚀工艺形成槽。例如，可以使用激光烧蚀来图案化覆盖供墨孔的EMC118中的区域，以去除EMC 118的期望部分。随后可以向暴露的顶帽150施加蚀刻步骤以去除顶帽150。框412中图示说明的其余组件图示说明了具有插入件的完成的模塑打印头。
模塑打印头可以在模塑打印头的前侧120上具有平坦表面。另外，插入件452和454允许模塑打印头容易地连接到其他组件或附接到电路板。换句话说，插入件452和454将至少一个电连接从EMC 118内传递到EMC的前侧(例如，前侧120)。另外，通过将ASIC 450封装在EMC 118内，模塑打印头可以具有更小的占用空间。
将理解的是，上面公开的变量和其他特征和功能或其替代方案可以被组合成许多其他不同的系统或应用。各种目前未预见或未预料到的替代方案、其中的修改、变化或改进随后可以由本领域技术人员做出，该替代方案、其中的修改、变化或改进也意图囊括在权利要求书中。

Claims (15)

1.一种装置，包括：
环氧模塑化合物(EMC)；
嵌入在所述EMC中的打印头模具；
嵌入在所述EMC中的驱动集成电路(IC)；以及
嵌入在所述EMC中的插入件，其中，所述打印头模具、所述驱动IC和所述插入件在所述EMC内引线接合。
2.如权利要求1所述的装置，其中所述打印头模具包括热流体喷射模塑打印头。
3.如权利要求1所述的装置，其中所述插入件将来自所述EMC内的电连接传递到所述EMC的前侧。
4.如权利要求1所述的装置，其中所述插入件包括金属。
5.如权利要求1所述的装置，其中所述插入件包括填充有银颗粒或碳颗粒的塑料材料或环氧材料。
6.如权利要求1所述的装置，其中所述打印头模具包括多个不同颜色的打印头模具。
7.一种方法，包括：
提供载体；
在所述载体上施加热释放带；
在所述热释放带上附接打印头模具、驱动集成电路(IC)和插入件；
用环氧模塑化合物(EMC)封装所述打印头模具、所述驱动IC和所述插入件；以及
去除所述载体和所述热释放带。
8.如权利要求7所述的方法，进一步包括：
在所述封装之前电连接所述打印头模具、所述驱动IC和所述插入件。
9.如权利要求8所述的方法，其中所述电连接包括引线接合。
10.如权利要求7所述的方法，进一步包括：
在所述打印头模具中覆盖喷嘴的所述EMC的区域上形成槽。
11.如权利要求7所述的方法，其中所述插入件包括金属。
12.一种方法，包括：
准备插入件，其中所述插入件包括专用集成电路(ASIC)；
将所述插入件和打印头模具附接到载体上的热释放带；
通过至少一个电连接将所述打印头模具连接到所述插入件；
通过环氧模塑化合物(EMC)封装所述打印头模具、所述插入件和所述至少一个电连接；
去除所述热释放带和所述载体；
在所述打印头模具中覆盖供墨孔的所述EMC中的区域上形成槽；以及
去除所述打印头模具上的保护顶帽。
13.如权利要求12所述的方法，其中所述至少一个电连接包括引线接合。
14.如权利要求12所述的方法，其中所述插入件通过硅通孔、玻璃通孔、模具通孔或具有通孔的印刷电路板(PCB)来制备。
15.如权利要求12所述的方法，其中所述插入件将所述EMC内的所述至少一个电连接传递到所述EMC的前侧。
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