CN107709618A - Decoction renewal nozzle and Etaching device for the etching of metallic conductor - Google Patents
Decoction renewal nozzle and Etaching device for the etching of metallic conductor Download PDFInfo
- Publication number
- CN107709618A CN107709618A CN201580081108.0A CN201580081108A CN107709618A CN 107709618 A CN107709618 A CN 107709618A CN 201580081108 A CN201580081108 A CN 201580081108A CN 107709618 A CN107709618 A CN 107709618A
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- China
- Prior art keywords
- decoction
- nozzle
- etching
- metallic conductor
- renewal
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3063—Electrolytic etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
Abstract
The present invention provides the decoction renewal nozzle and Etaching device of a kind of etching for metallic conductor.In order in the state of optimal environment is maintained promote the etching of metallic conductor the renewal of the decoction of the etching for metallic conductor, thus, it is possible to obtain the metallic conductor of high-quality.Therefore, use the decoction renewal nozzle formed as follows：The discharge nozzle and suction nozzle of decoction are configured in the etching liquid cell of filling decoction, the discharge of decoction, suction are carried out simultaneously to impregnate the state of said nozzle in decoction, and uniform stress is put on into decoction, thus the renewal of decoction is promoted, the decoction renewal nozzle is characterised by, the object of etching is metallic conductor, and the single or multiple opening portion that the nozzle used in the discharge of decoction and suction is set by the length identical length throughout the metallic conductor substrate with being configured with metallic conductor is formed.
Description
Technical field
The present invention relates to a kind of decoction renewal nozzle of etching for metallic conductor and Etaching device.
Background technology
Metallic conductor is arranged on processing substrate and is etched by chemical treatment, now, in order to which etchant is lost
Liquid (or only decoction) supply used in quarter is generally implemented to use the method sprayed to metallic conductor.Example
Such as, there is following invention disclosed in Japanese Unexamined Patent Publication 2003-243811：By for blowing out liquid to the surface of the upside of printed circuit board (PCB)
The spray nozzle device of the processing medium of body is arranged at the top of conveyor surface, and configures aspirator in spraying treatment device, suction
Device is pumped in the processing medium blown out in spray injection from the surface of the upside of printed circuit board (PCB).Thus, foregoing invention is not required to
Want cleaning treatment medium.
On the other hand, the decoction used in etching is spued to nozzle during processing substrate, considers from many situations, make
With smaller nozzle for Etaching device.It is intended to using small nozzle more to 1 processing substrate use
Individual small nozzle, this necessarily causes the homogenization problem of the etching solution discharge condition in multiple nozzles.If it is being arranged at processing base
The inside of the metallic conductor of plate produces the inequality of etching, and this also affects product specification, therefore small nozzle is applied in combination.
But when combining multiple small nozzles, realize the homogenization inside metallic conductor along with difficulty, it is necessary to pair of essence
Plan.In recent years, the high density at metallic conductor width and metallic conductor interval, High precision gradually develop, and prediction is more using combining
The reply of the spray injection method of individual small nozzle reaches boundary.
There is the photoresist removal device of Japanese Unexamined Patent Publication 2002-251794 in conventional art, it, which has, utilizes from more
The displacement of displacement cleaning fluid or remove medicine and glass raw sheet is kept tool rotation and is got rid of displacement cleaning that individual spray nozzle sprays
The purpose of liquid, but this is also one using small nozzle.It is also, photic as removing in Japanese Unexamined Patent Publication 2003-91885
The mechanism of resist layer, possesses liquid discharge nozzle, the liquid discharge nozzle makes glass substrate rotation while carrying out ultrasound
On the basis of ripple vibration, photoresist removal decoction is added dropwise in glass baseplate surface, the nozzle for this is also small-sized spray
Mouth.In addition, used in the Japanese Unexamined Patent Publication 2003-243811 and small nozzle.Therefore, any of the above inventions
It is difficult to avoid that and combines the adjoint difficulty of multiple small nozzles.
Conventional art document
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2003-243811
Patent document 2：Japanese Unexamined Patent Publication 2002-251794
Patent document 3：Japanese Unexamined Patent Publication 2003-91885
The content of the invention
The invention technical task to be solved
The present invention be in view of above-mentioned actual conditions and complete, its problem is to maintain the state of optimal environment
Under carry out to be arranged at processing substrate (hereinafter referred to as " metallic conductor substrate ".) metallic conductor etching and promote be used for gold
Belong to the renewal of the decoction of the etching of conductor, thus, it is possible to obtain the metallic conductor of high-quality.Also, other problems of the present invention exist
In providing a kind of following device, it applies will spue to being arranged at metallic conductor substrate simultaneously for the decoction used in etching
The overall stress (pressure) of metallic conductor, and above-mentioned etching decoction is aspirated in the decoction, thus, it is possible to high accuracy
Carry out the etching to metallic conductor.
For solving the means of technical task
In order to solve above-mentioned problem, the present invention in the state of optimal environment is maintained in order to carry out the erosion to metallic conductor
Carve and promote the renewal of the decoction of the etching for metallic conductor, thus, it is possible to obtain the metallic conductor of high-quality.Therefore, take
Following mechanism, i.e. use the decoction renewal nozzle formed as follows：Telling for decoction is configured in the etching liquid cell of filling decoction
Go out to use nozzle and suction nozzle, the discharge of decoction, suction are carried out simultaneously to impregnate the state of said nozzle in decoction, and will
Uniform stress puts on decoction, thus promotes the renewal of decoction, wherein, the object of etching is metallic conductor, the discharge of decoction
And the nozzle used in suction is set by the length identical length throughout the metallic conductor substrate with being configured with metallic conductor
The single or multiple opening portion put is formed.The present invention relates to a kind of etching of metallic conductor, used decoction is mainly used for
The etching solution of etching process is etchant.Also, cleaning fluid, especially clean cleaning fluid of the bottom rich in concaveconvex shape etc.
As the object handled as the decoction used in the present invention.
In decoction renewal nozzle for the etching of metallic conductor, discharge side nozzle is by with the narrow of single opening portion
Slit shape is formed, and suction side nozzle is made up of shape of slit or by being opened to obtain desired suction capactity along slit
Multiple opening portions of mouth are formed, and this structure is preferable for the present invention.
Also, the present invention includes a kind of Etaching device, it uses the medicine of the etching for metallic conductor described in technical scheme 1
Liquid renewal nozzle, the Etaching device have following structure：Decoction renewal nozzle used in spuing and aspirating is with them
Configured up and down towards the mode of metallic conductor substrate across metallic conductor substrate and respective opening portion, handle the etching of etching solution
Liquid bath is made up of the upper slot of etching metallic conductor and the lower channel of storage etching solution, and upper slot and lower channel pass through from top
The return pipe arrangement connection of groove, decoction renewal nozzle is provided with the end of above-mentioned pipe arrangement.
Invention effect
The decoction renewal of etching for metallic conductor involved in the present invention is formed and acted as described above with nozzle
With the renewal of promotion decoction in the etching of the metallic conductor to being arranged at metallic conductor substrate, height can be obtained by thus playing
The effect of the metallic conductor of quality.Also, in accordance with the invention it is possible to provide following Etaching device, it is with to metallic conductor substrate
The overall decoction that spues simultaneously, and the mode for aspirating above-mentioned decoction works, therefore metallic conductor is contacted with gas, because
This, will not be by the stress of gas-liquid interface and under the effect in uniform fluid stress, in the absence of by gas-liquid
Body interface stress, being capable of pinpoint accuracy thus, it is possible to be updated by efficient suction nozzle to carry out the decoction of depth direction
Ground carries out the etching to metallic conductor.
Brief description of the drawings
Fig. 1 is one of the decoction renewal nozzle for representing the etching for metallic conductor involved in the present invention with etching
The cross sectional illustration figure of relation between the progress of reaction.
Fig. 2 is equally the cross sectional illustration figure for representing to react the state further carried out.
Fig. 3 is the nozzle of the invention in the slit-shaped openings portion for the length for representing to possess more than the length with metallic conductor substrate
The top view of one.
Fig. 4 is the cross sectional illustration figure of one of the Etaching device for representing the etching for metallic conductor involved in the present invention.
The vertical view that Fig. 5 is two kinds of decoction renewal nozzles A, B representing the etching for metallic conductor involved in the present invention is said
Bright figure.
Fig. 6 is the explanation figure of etching (eching) factor in the etching for represent metallic conductor involved in the present invention.
Embodiment
Hereinafter, the present invention is described in more detail in the embodiment of refer to the attached drawing.
The decoction renewal of etching for metallic conductor involved in the present invention is by the use of nozzle to the process object as etching
Metallic conductor substrate point-blank while equably spued from vertical direction and aspiration medicinal liquid.Therefore, decoction renewal nozzle phase
There is between perpendiculars more than length N length M for the metallic conductor substrate conveyed by conveyer belt (with reference to figure 3).Here, to this
The involved decoction renewal of invention is specifically described with nozzle.In Fig. 1,11 represent the nozzle of the present invention, and 12 represent etching solution
Liquid level, 13 represent the resist that is formed by photosensitive material image, and 14 represent the opening portion that is opened up thereon, and 15 represent metals
Conductor, 16 represent base material.Nozzle 11 has slit-shaped openings portion as described later.
Start etching when, as shown in figure 1, for the width K of opening portion 14, depth J1 is shallower, using from
The discharge stress of nozzle 11 can obtain the sufficient effect needed for the etching solution in outlet opening portion, it can thus be assumed that in fact not
The obstacle of etching solution discharge be present.Discharge stress be actually used using nozzle internal pressure as parameter, enter but following region
In value, i.e. as the parameter factor, Reynolds number：Re=ρ v2/ (μ v/L) Fa Sheng Gan Wataru region and ρ=fluid density (kg/
m3), the viscosity (kg/ (ms)) of relative velocity m/s, μ=fluid of v=flowings, L=characteristic lengths (flow of fluid
Distance：M) it is set to the region of positive parameter.
If in contrast, be etched reaction, as shown in Fig. 2 the depth of opening portion 14 increases to J2, then etching solution is from spray
Mouth 11 reaches the distance increase of open bottom, therefore with the increased tendencies of resistance R for the discharge direction being subject to from etching solution.Resistance
By R=J/K, (J is depth J1 or J2 to power R.) represent.Therefore, with being reacted and resistance R increases, therefore in opening portion 14
The renewal efficiency that decoction (being in this case etching solution) occurs for inside declines and the situation of the etching characteristic of vertical direction decline.
Therefore,, should if making the stress of suction in the opening portion 14 for being opened in resist 13 from nozzle 11 in Fig. 2
Power works along J2 directions, it may thus be appreciated that the contact distance (length) with the above-mentioned opening portion 14 corresponding with nozzle 11 is set to
L, and be multiplied by exposure level section M (horizontal range) × K (width) product, i.e. the decoction suitable with L × M × K volume obtains
Renewal.By the renewal of decoction, if in the liquid of identical systems, the cumulative volume that can will be equivalent to be aspirated by nozzle 11
The decoction of amount is supplied within the same time to such as bottom of liquid bath, thus, promotes decoction renewal, especially by the erosion of vertical direction
Carve characteristic and maintain optimum state.
The present invention nozzle 11 by as above method improve because of etching process and caused by undesirable condition, therefore, such as Fig. 3 institutes
Show possess more than the length N with metallic conductor substrate 22 to integrally spue decoction simultaneously to metallic conductor substrate 22
Length M slit-shaped openings portion 21.Fig. 3 represent be provided with it is multiple by etching and the product 23 formed with metallic conductor distribution
Metallic conductor substrate 22, it is blank (remaining white) between adjacent product 23, the metallic conductor 15 is formed at the surface of product 23.
" product " refers to the article as obtained from the present invention has carried out the result of etching process, does not imply that final commodity.Also,
Each figure is merely representative of concept, is less likely in reality.
If here, can be to the overall decoction that spues of metallic conductor substrate 22 simultaneously, even if not having metallic conductor substrate
22 more than length N length, such as also can form spray by linking multiple slit-shaped openings portions shorter than above-mentioned length
Mouth.That is, nozzle is divided into some, makes these together while the decoction that spues, also fall into this in feasible region.But
When combining multiple nozzles, vortex is produced in the boundary member of multiple liquid streams, is all inevitably influenceed no matter it influences size
To metallic conductor substrate 22.It is therefore contemplated that obtain larger advantage except forcing the situation for haveing no alternative but combine multiple nozzles, or with this
Beyond situation, it is less to combine interests caused by multiple nozzles.Although there is such case, 1 slit-shaped openings portion is not only,
Also be divided into it is multiple, disclosure satisfy that the present invention important document, this point can be clear and definite from described above.
Fig. 4 is (above-mentioned Fig. 1, Fig. 2 and Fig. 3 can be considered as into Fig. 4 using the skeleton diagram of the immersion-type Etaching device of the present invention
A part).In the figure, the one side of metallic conductor substrate 22 is moved by conveyer belt 24, while being lost in etching liquid cell 25
The discharge effect of liquid is carved, and by swabbing action.26 be the injector (ejector) of decoction, and 27 be discharge loop, and 28 be to take out
Road is sucked back, there is the valve that can adjust flow respectively.Also, discharge loop 27, aspiration circuit 28 pipe end have spue and
Nozzle 27a, 27b, 28a, 28b are used in decoction renewal used in suction, and they are with across metallic conductor substrate 22 and respective
Opening portion configures up and down towards the mode of metallic conductor substrate 22.
Also, in order that suction fluid turns into uniform stress, the etching liquid cell 25 for handling etching solution is led by etching metal
The upper slot 25A of body and the lower channel 25B of storage etching solution are formed.Upper slot 25A and lower channel 25B is connected by returning to pipe arrangement 29
Connect, be housed in without decoction during etching in lower channel 25B, pass through reflux circuit (27,28) using pump P1, P2 when being etched
It is back in upper slot, implements the renewal of decoction.Shown in dotted lines in Figure 4 is bottom when decoction to be loaded on to upper slot 25A
Groove 25B liquid level.
As shown in figure 5, shape of slit nozzle 31 is used in discharge side nozzle 27a, 27b.On the slit opening portion width,
Pipe internal ratio internal diameter is that the supervisor portion of 40~50mm size dwindles into taper, and reaches end end with 50~150mm distance and spue
Portion.The experimental result for the scope that the size of the opening portion is preferably set to 0.5~3mm is obtained.With reference to figure 1, large diameter portion is
Supervisor portion, front end are the tube portion of taper between them to hold last spitting unit.Under the same conditions, another suction side nozzle
28a, 28b similarly preferred 0.5~3mm scope, also can by be processed into the suction plate 32 that width is 0.6~8mm seal it is narrow
Opening portion is stitched, and 0.5~3mm of φ toroidal hole 33 is outputed in the suction plate 32, so as to form suction section nozzle.In addition,
Aspirating side nozzle also has supervisor portion same as described above, the last spitting unit in end, the tube portion of taper.
The etch target being provided with the present invention i.e. substrate of metallic conductor 15 generally has for thin film transistor (TFT) (TFT)
Ultra-clear glasses substrate, for touch panel backboard glass (also using ultra-clear glasses.), printing distributing board etc..It is but of the invention
The various glass materials or resin material system substrate that can also apply to beyond above-mentioned glass material.
Metallic conductor 15 is provided with the metallic conductor substrate 22 being made up of various materials as described above.As to gold
The etchant for belonging to conductor 15 is medicament, usually using organic acids such as inorganic acid, acetic acid, the oxalic acid such as hydrochloric acid, sulfuric acid, nitric acid, fluoric acid
Oxidisability metallic solution such as iron chloride, copper chloride etc..It is the composition of the aqueous solution, and recorded in Fig. 1, Fig. 2 with symbol 13
Resist 13 is typically hydrophobicity epithelium, therefore in the case of the spraying etching sprayed in gas, foregoing resistance R is by R=J/K
(J is depth J1 or J2) represents, becomes big plus the water-sprinkling stress Fa Sheng Gan Wataru at resist interface.But according to the present invention, make
Decoction sprays in decoction or aspirates and it is worked, thus gas interface stress will not Fa Sheng Gan Wataru, above-mentioned Resistance Value
It can be suppressed to smaller.
The present invention provides a kind of nozzle equipped with the discharge and suction that are used for decoction in the etching of metallic conductor 15
Etaching device.As described above, nozzle is in order to from being that the transmission tape feeding direction of metallic conductor 15 is relative to etching process object
Vertical direction linearly while equably spues and aspiration medicinal liquid, possesses with the transmission relative to metallic conductor substrate 22
Tape feeding direction is the slit-shaped openings portion of the length more than length in vertical direction, and in order to promote above-mentioned decoction to update,
Possesses the pump orifice of aspiration medicinal liquid in a liquid.The reason is that discharge, suction by carrying out decoction simultaneously, can be avoided
As the Xiang Hu Gan Wataru caused by the flowing of multiple decoctions；When only spued and without suction when, the wall in opening portion 14
Produce vortex and the smooth outflow of decoction can not be realized, but by being aspirated, the opening along described Fig. 1, Fig. 2 could be realized
The flowing of the rectification of the length direction in portion 14, so as to obtain to by etching and the fine recessed of the opening portion side that is formed
The convex effect for carrying out shaping.
In above-mentioned, it is stated that the chi of discharge side nozzle 27a, 27b of uniform discharge ability opening portion can be obtained
The very little scope in 0.5~3mm, similarly, the opening portion that can obtain suction side nozzle 28a, 28b of uniform suction capactity are wide
Degree is 0.5~3mm under the described conditions.Also, by being processed into the suction plate sealing suction side nozzle that width is 0.6~8mm
In the mode in 28a, 28b slit opening portion, as the aperture for the toroidal outputed in the suction plate, preferably φ 0.5~
3mm, this is also as described above.The reason for as above-mentioned numerical value is taken, following situation can be enumerated：Metallic conductor etching requires fine
Highdensity process technology, and require the etching technique in the presence of the small resist of the bonding area of fine rule.It is now required
Accuracy to size is micron level, and nozzle is required to tackle low pressure and the performance of uniform stress.In order to tackle the requirement,
Need to set opening portion size, the aperture of suction side of above-mentioned exhaust end, lost because relative to the big glass of bonding area
The millimeter rank at quarter is very small, it is desirable to the etching technique of height.
In the present invention, the conveyer belt 24 of the movement of metallic conductor substrate 22 is set and sets decoction to spue in decoction is etched and is used
Nozzle and decoction suction nozzle, therefore as far as possible the gas of decoction can be avoided to contact.That is, nitrogen in air, oxygen, two can be avoided
Carbonoxide can avoid etchant composition from decomposing, aoxidize, reduce because of the composition in air etchant Gan Wataru.
In the case of spray pattern, the oxidation of composition in air and etchant composition, reduction reaction are carried out at any time, in etchant
When the stable management aspect of composition, fine conductor etch, the variation of its constituent sometimes can produce negative to metallic conductor 15
Face acts on, but according to the present invention, by using nozzle in a liquid and connecting upper slot 25A and lower channel by return pipe arrangement 29
25B, this negative factor are substantially eliminated.
In the Etaching device of metallic conductor involved in the present invention, in etchant, from relative to conveyer belt conveying direction
Linearly while equably spued for vertical direction and aspiration medicinal liquid, therefore the mobile phase of etchant is for metallic conductor base
The transmission tape feeding direction of plate 22 is parallel, and is equably controlled.Also, it is being taking out for 0.6~8mm by being processed into width
In the mode in suction disc sealing suction side nozzle 28a, 28b slit opening portion, as the toroidal outputed in the suction plate
Aperture, be set to 0.5~3mm of φ, be achieved on depth direction J effectively and relative to transmission tape feeding direction be vertical
Direction on uniform decoction renewal, thus allow for the retrofit of the stabilization inside metallic conductor substrate 22.
＜ Etaching devices and method ＞
In the present invention, in order to implement the etching of metallic conductor, the Etaching device shown in Fig. 4 is used.Specifically, it is following to form：
In the etching liquid cell 25 of filling decoction, by the discharge of decoction with nozzle 27a, 27b and suction nozzle 28a, 28b with across gold
Belong to conductor substrate 22 and respective opening portion configures up and down towards the mode of metallic conductor substrate 22.Therefore, impregnated in decoction
Discharge, the suction of decoction are carried out in the state of said nozzle 27a, 27b, 28a, 28b, at the same used said nozzle 27a,
27b, 28a, 28b discharge, suction, and uniform stress is put on into decoction, thus promote the renewal of decoction.
Metallic conductor substrate 22 is in etching liquid cell 25 while being moved by conveyer belt 24 while being spued by etching solution
Act on and by swabbing action.Also, the explanation with reference to the former nozzle of figure 4 is entirely embodiment.Also, Etaching device
Certainly keep the state and form cleaning device.
＜ embodiments ＞
Hereinafter, embodiment is recorded the present invention is described in more detail.
9 μm of electrolytic copper foil is used in metallic conductor 15.
For the electrolytic copper foil, will unify at interval：4.0th, 4.5,5.0,5.5,6.5,7.0,7.5,8.0,8.5,9.0 (unit：
μm), resist width：20.0 μm of copper conductor as metallic conductor 15,
In CuCl2·2H2O 35.0wt%, 35.0% hydrochloric acid 8%, proportion 1.31 (25 DEG C, concentration of hydrochloric acid 36.7g/l, copper concentration
In copper chloride aqueous hydrochloric acid solution 170g/l), etching (each device bar of Resist patterns has been carried out under 30 DEG C of temperature conditionss
Part is as shown in table 1.).
Table 1
| Discharge nozzle exit pressure | Suction nozzle negative pressure | Minimum etchable conductor separation |
| 0.15MPa | 0.01MPa | 4.0 |
| 0.15MPa | 0 | 5.0 |
As shown in table 1, in accordance with the invention it is possible to obtain 0.002MPa discharge pressure and swabbing pressure, thus at least may be used
Etched conductors interval can realize 4.0 μm.
Then, the comparative example as spray-on process, using IKEUCHI 040Full-cone nozzles, irradiation distance 100mm,
Etched under conditions of 30 DEG C of temperature, spraying internal pressure 0.15MPa, show the result in table 2.
Table 2
| Discharge nozzle exit pressure | Irradiation distance | Minimum etchable conductor separation |
| 0.15MPa | 100mm | 6.5 |
As shown in table 2, confirm in the case of based on spray-on process, only obtain 0.15MPa discharge pressure, as a result,
Minimum etchable conductor separation rests on 6.5 μm.
Then, in the comparison with spray-on process is investigated, to return carve (identical with etching back) and etching factor (with
Etching factor are identical) investigated.First, as shown in fig. 6, resist conductor width is set into w, finishing top
When conductor width is set to t, returns and carve by m ≈ (w-t)/2 expressions.Numerical value is smaller, and it is better to return quarter m.
Also, etching factor Fa is represented by Fa=h/l (wherein, l=(n-t)/2), numerical value is more big better.
As noted previously, as 9 μm of electrolytic copper foil is used in metallic conductor 15, therefore h=9, because resist width is
20 μm, therefore w=20.Infusion process involved in the present invention and the finishing top conductor width t of the irradiation of comparative example and under
Width n average value is held as shown in table 3, table 4.
Table 3 (infusion process)
| n1 | 16.30 | t1 | 8.83 |
| n2 | 16.26 | t2 | 8.62 |
| n3 | 16.10 | t3 | 8.65 |
| n：Infusion process average value | 16.22 | t：Infusion process average value | 8.70 |
Table 4 (irradiation)
| n1 | 16.68 | t1 | 7.26 |
| n2 | 16.71 | t2 | 7.30 |
| n3 | 16.68 | t3 | 7.25 |
| n：Irradiation average value | 16.69 | t：Irradiation average value | 7.27 |
Average value t, n of table 3, table 4 are substituted into above-mentioned mathematical expression, etching factor is calculated, returns and carve.Show the result in table
5th, table 6.During metering, 9 μm of blank positions have been measured in used metallic conductor 15 in the above-described embodiments (using decoction, examination
It is same as the previously described embodiments to test condition.).
Table 5 (infusion process)
| Discharge nozzle exit pressure | Suction nozzle negative pressure | Etching factor | Return and carve |
| 0.15MPa | 0.01MPa | 2.39 | 5.65 |
Table 6 (irradiation)
| Discharge nozzle exit pressure | Irradiation distance | Etching factor | Return and carve |
| 0.15MPa | 100mm | 1.91 | 6.37 |
Such as it can be seen from the comparison of above-mentioned table 5 and 6, pass through the decoction of the etching for metallic conductor involved in the present invention
Renewal nozzle and Etaching device, relative to the situation based on irradiation, etching factor increase by 25% is obtained, time quarter equally subtracts
Few 11% result.Therefore, according to the present invention, the renewal of decoction is promoted, thus, it is possible to obtain the metallic conductor with high-quality
15 product 23.
Symbol description
11- nozzles, 12- liquid levels, 13- resists, 14- opening portions, 15- metallic conductors, 16- base materials, 17- metal evaporations
Film, 20- nozzles, the example in 21- slit-shaped openings portion, 22- metallic conductor substrates, 23- products, 24- conveyer belts, 25- etching solutions
Groove, 26- injectors, 27- discharge side lines, 28- suction side lines, 29- return pipe arrangements, 31- suction plates, the hole of 32- toroidals,
P1- exhaust end pumps, P2- suction side pumps.
Claims (3)
1. a kind of decoction renewal nozzle of etching for metallic conductor, its following composition：In the etching liquid cell of filling decoction
The discharge nozzle and suction nozzle of middle configuration decoction, decoction is carried out simultaneously to impregnate the state of said nozzle in decoction
Spue, suction, and uniform stress is put on into decoction, thus promote the renewal of decoction, the spy of the decoction renewal nozzle
Sign is,
The object of etching is metallic conductor, and the nozzle used in the discharge of decoction and suction is by throughout with being configured with metallic conductor
Metallic conductor substrate length identical length and the single or multiple opening portion that sets is formed.
A kind of 2. decoction renewal nozzle of etching for metallic conductor, it is characterised in that
Decoction discharge is made up of with nozzle the shape of slit with single opening portion,
Decoction suction be made up of with nozzle shape of slit or by order to obtain desired suction capactity and along slit opening
Multiple opening portions form.
3. a kind of Etaching device of etching for metallic conductor, it is equipped with the metallic conductor that is used for described in claim 1
The decoction renewal nozzle of etching, the Etaching device be characterised by,
Decoction discharge nozzle and decoction suction nozzle are with them across metallic conductor substrate and respective opening portion towards gold
The mode for belonging to conductor substrate configures up and down,
The etching liquid cell for handling etching solution is made up of the upper slot of etching metallic conductor and the lower channel of storage etching solution, upper slot
Connected with lower channel by the return pipe arrangement from upper slot,
Decoction renewal nozzle is installed in the end of above-mentioned pipe arrangement.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2015/071363 WO2017017782A1 (en) | 2015-07-28 | 2015-07-28 | Nozzle for replacing chemical solution for etching metallic conductor and etching apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107709618A true CN107709618A (en) | 2018-02-16 |
| CN107709618B CN107709618B (en) | 2019-08-27 |
Family
ID=57884282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580081108.0A Active CN107709618B (en) | 2015-07-28 | 2015-07-28 | The medical fluid update nozzle and Etaching device of etching for metallic conductor |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6676637B2 (en) |
| KR (1) | KR20180019191A (en) |
| CN (1) | CN107709618B (en) |
| WO (1) | WO2017017782A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109041423A (en) * | 2018-09-21 | 2018-12-18 | 郑州云海信息技术有限公司 | A kind of pcb board and a kind of electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1264626A (en) * | 1999-02-22 | 2000-08-30 | 东京化工机株式会社 | Soup treatment appts. |
| CN1366333A (en) * | 2000-12-21 | 2002-08-28 | 株式会社东芝 | Substrate treatment equipment and substrate treatment method using said equipment |
| CN2608156Y (en) * | 2003-03-14 | 2004-03-31 | 上海新亚医用橡胶厂有限公司 | Cleaning treatment device of medical or pharmaceutical rubber stopper |
| KR20100096524A (en) * | 2009-02-24 | 2010-09-02 | 삼성테크윈 주식회사 | Wet etching apparatus and circuit board manufacturing apparatus |
| WO2014091561A1 (en) * | 2012-12-11 | 2014-06-19 | 富士技研工業株式会社 | Method for renewing chemical solution used for device for etching liquid crystal glass, nozzle for chemical solution renewal, and chemical solution for renewal |
| CN203760432U (en) * | 2013-12-20 | 2014-08-06 | 昆山国显光电有限公司 | Wet etching device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3002883U (en) * | 1994-04-08 | 1994-10-04 | 株式会社荏原電産 | Printed circuit board etching equipment |
| JPH10162728A (en) * | 1996-11-29 | 1998-06-19 | Toppan Printing Co Ltd | Manufacture of shadow mask |
| JP3232070B2 (en) * | 1999-10-20 | 2001-11-26 | 株式会社オーケープリント | Etching equipment |
| JP4076755B2 (en) * | 2001-11-02 | 2008-04-16 | アルプス電気株式会社 | Wet processing apparatus and wet processing method |
| JP2006019525A (en) * | 2004-07-01 | 2006-01-19 | Future Vision:Kk | Substrate processing device |
| JP2008294251A (en) * | 2007-05-25 | 2008-12-04 | Cmk Corp | Printed wiring board and its manufacturing method |
-
2015
- 2015-07-28 CN CN201580081108.0A patent/CN107709618B/en active Active
- 2015-07-28 JP JP2017530515A patent/JP6676637B2/en active Active
- 2015-07-28 WO PCT/JP2015/071363 patent/WO2017017782A1/en active Application Filing
- 2015-07-28 KR KR1020187001477A patent/KR20180019191A/en not_active Application Discontinuation
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1264626A (en) * | 1999-02-22 | 2000-08-30 | 东京化工机株式会社 | Soup treatment appts. |
| CN1366333A (en) * | 2000-12-21 | 2002-08-28 | 株式会社东芝 | Substrate treatment equipment and substrate treatment method using said equipment |
| CN2608156Y (en) * | 2003-03-14 | 2004-03-31 | 上海新亚医用橡胶厂有限公司 | Cleaning treatment device of medical or pharmaceutical rubber stopper |
| KR20100096524A (en) * | 2009-02-24 | 2010-09-02 | 삼성테크윈 주식회사 | Wet etching apparatus and circuit board manufacturing apparatus |
| WO2014091561A1 (en) * | 2012-12-11 | 2014-06-19 | 富士技研工業株式会社 | Method for renewing chemical solution used for device for etching liquid crystal glass, nozzle for chemical solution renewal, and chemical solution for renewal |
| CN203760432U (en) * | 2013-12-20 | 2014-08-06 | 昆山国显光电有限公司 | Wet etching device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109041423A (en) * | 2018-09-21 | 2018-12-18 | 郑州云海信息技术有限公司 | A kind of pcb board and a kind of electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20180019191A (en) | 2018-02-23 |
| JPWO2017017782A1 (en) | 2018-05-24 |
| WO2017017782A1 (en) | 2017-02-02 |
| JP6676637B2 (en) | 2020-04-08 |
| CN107709618B (en) | 2019-08-27 |
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