JP3232070B2 - Etching equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an etching apparatus used for forming a circuit on a printed circuit board.

[0002]

2. Description of the Related Art FIG. 9 is a schematic view showing a conventional etching apparatus, FIG. 10 is a view showing a part of the etching apparatus shown in FIG. 9, and FIG. As shown in the figure, a transfer means 2 is provided in a container 1, and the transfer means 2 is composed of a number of rotating shafts 3, a number of transfer wheels 4 attached to each of the rotating shafts 3, and the transfer means 2 is to be etched. The board material 5 for a printed board, which is a board material, is transported. Further, the spray pipes 6 and 7 are rotatably provided in the container 1, and the spray pipes 6 and 7 are provided with a large number of spray nozzles 8 and 9, respectively. The spray pipe 6 is located above the conveying means 2. , The spray tube 7 is located below the conveying means 2,
One end of each of the spray pipes 6 and 7 is connected to an etching solution supply means (not shown), and the spray pipes 6 and 7 are each moved by about 20 ° with respect to a vertical axis about their center line.
Spray tube rotating means (not shown) that reciprocates in the range of
And an etching solution spraying means for spraying the etching solution toward the surface of the printed circuit board 5 using the spray pipes 6 and 7, the spray nozzles 8 and 9, and the like.

In this etching apparatus, a metal layer for forming a circuit, which is a layer to be etched, is formed on the surface of a plate material 5 for a printed circuit board, and an etching mask is formed on the metal layer for forming a circuit. The board material 5 for the printed circuit board on which the etching mask is formed is transported by the transporting means 2, the etching liquid is supplied from the etching liquid supply means to the spray pipes 6 and 7, and the spray pipes 6 and 7 are reciprocated by the spray pipe rotating means. When rotated, the etching liquid is sprayed from the spray nozzles 8 and 9 onto the surface of the printed circuit board 5, so that the circuit-forming metal layer on the surface of the printed circuit board 5 is selectively etched, and the printed circuit board 5 is etched. A circuit is formed on the surface of. In this case, the center of the etchant sprayed from the spray nozzles 8 and 9 and reaching the printed circuit board plate member 5 moves in the horizontal direction on the paper of FIG.

[0004]

However, in such an etching apparatus, a waste liquid of an etching solution, that is, a solution having a reduced rate of dissolving the metal layer for forming a circuit, is formed on a part of the surface of the board member 5 for a printed circuit board. And the circuit-forming metal layer on the surface of the printed circuit board plate material 5 cannot be uniformly etched.

The present invention has been made to solve the above-mentioned problem, and has as its object to provide an etching apparatus capable of uniformly etching a layer to be etched formed on a surface of a plate material to be etched.

[0006]

According to the present invention, there is provided an etching apparatus for performing etching by supplying an etching solution to a surface of a plate material to be etched. While discharging the etchant from the surface of the plate material to be etched, and supplying the etchant supply chamber and the like.
And an etchant supply with an etchant discharge chamber
An etchant supply / discharge means having a discharge body is provided. This
In the case of the above, the etching
A liquid discharge chamber is provided.

[0007]

FIG. 1 is a schematic view showing an etching apparatus according to the present invention, FIG. 2 is a sectional view taken along line AA of FIG. 1, and FIG. 3 is a partially detailed view of FIG. As shown in the figure, a transporting means 12 is provided in a container 11, and the transporting means 12 is composed of a number of rotating shafts 13 and transporting rollers 4 attached to each rotating shaft 13, and the transporting means 12 is a plate material to be etched. A certain board material 15 for a printed circuit board is transported. Further, a shaft 17 rotatably supported by the container 11 is provided in the vicinity of the conveying means 12, and a pressing roller 18 is attached to the shaft 17, and
A plurality of etching solution supply / discharge bodies 19 are attached to
Part of the end of the etching solution supply / discharge body 19 on the side of the transport means 12 is in contact with the pressing roller 18. The etching solution supply / discharge body 19 has an etching solution supply chamber 20 and an etching solution discharge chamber 21. The supply chamber 20 and the etchant discharge chamber 21 are adjacent to the etchant supply chamber 20 and the etchant discharge chamber 2 of the etchant supply and discharge body 19.
The etching liquid is supplied to the surface of the printed circuit board 15 by the pressing roller 18, the etching liquid supply / discharge body 19, and the like.
The etching liquid supply / discharge means 16 for discharging the etching liquid from the surface of the substrate is constituted. Further, an etching solution pressurizing and supplying device 22 is provided outside the container 11, and a connecting pipe 23 is connected to the etching solution pressurizing and supplying device 22.
3, a plurality of supply pipes 24 are connected, the supply pipe 24 is connected to an etchant supply chamber 20 of an etchant supply / discharge body 19, and an etchant is supplied by an etchant pressurized supply device 22, a connection pipe 23, and a supply pipe 24. An etchant supply unit that supplies an etchant to the chamber 20 is configured. Further, an etching solution suction / discharge device 25 is provided outside the container 11, and a connection pipe 26 is connected to the etching solution suction / discharge device 25.
Are connected, a plurality of discharge pipes 27 are connected to the connection pipe 26, the etching liquid discharge chamber 21 of the etching liquid supply / discharge body 19 is connected to the discharge pipe 27, the etching liquid suction / discharge device 25, the connection pipe 26, and the discharge pipe. 27 constitutes an etchant discharging means for discharging the etchant from the etchant discharge chamber 21.

In this etching apparatus, a metal layer for forming a circuit, which is a layer to be etched, is formed on the surface of a plate material 15 for a printed board, and an etching mask is formed on the metal layer for forming a circuit. The board material 15 for the printed circuit board on which the etching mask is formed is transported by the transporting means 12, and the etching liquid supply / discharge unit 1 is connected from the etching liquid pressurizing / supplying device 22 via the connection pipe 23 and the supply pipe 24.
9 to supply an etchant to the etchant supply chamber 20;
And a discharge pipe 27 by the etching liquid suction / discharge device 25;
When the etching liquid is discharged from the etching liquid discharge chamber 21 of the etching liquid supply / discharge body 19 through the connection pipe 26, the etching liquid is supplied to the surface of the printed circuit board 15 and the etching liquid is discharged from the surface of the printed circuit board 15 Is discharged, the circuit-forming metal layer on the surface of the printed circuit board 15 is selectively etched, and a circuit is formed on the surface of the printed circuit board 15. In this case, since a new etching solution can always be supplied to the surface of the printed circuit board 15, waste liquid does not accumulate on a part of the surface of the printed circuit board 15.
Part of the circuit-forming metal layer of the printed circuit board 15 is not partly etched, so that the circuit-forming metal layer on the surface of the printed circuit board 15 can be uniformly etched, and the etching rate is high. . For this reason, even if the circuit of the printed circuit board is miniaturized, a circuit having a uniform width can be formed, and a printed circuit board having uniform electric characteristics can be efficiently manufactured.

FIG. 4 is a diagram showing a part of another etching apparatus according to the present invention. As shown in the figure, a shaft 32 rotatably supported by the container 11 is provided in the vicinity of the conveying means 12, and a pressing roller 33 is attached to the shaft 32,
Are provided with a plurality of etching solution supply / discharge bodies 34,
Part of the end of the etching solution supply / discharge body 34 on the side of the transport means 12 is in contact with the pressing roller 33. The etching solution supply / discharge body 34 has an etching solution supply chamber 35 and an etching solution discharge chamber 36, An etchant discharge chamber 36 is provided on both sides of the supply chamber 35, the supply pipe 24 is connected to the etchant supply chamber 35, the discharge pipe 27 is connected to the etchant discharge chamber 36, the holding roller 33, and the etchant supply and discharge body. 34 and the like for the printed circuit board 15
An etchant supply / discharge means 31 for supplying an etchant to the surface of the substrate and discharging the etchant from the surface of the printed circuit board 15 is formed.

In this etching apparatus, a printed circuit board 15 on which a circuit forming metal layer and an etching mask are formed is transported by a transport means 12, and a connection pipe 23 and a supply pipe 24 are supplied from an etching liquid pressurizing supply apparatus 22 to the connecting pipe 23. The etching solution is supplied to the etching solution supply chamber 35 of the etching solution supply / discharge unit 31 through the etching solution suction / discharge device 25, and the etching solution discharge chamber of the etching solution supply / discharge unit 31 is connected to the etching solution supply / discharge unit 31 via the connection tube 26. When the etchant is discharged from 36, the etchant is supplied to the surface of the printed circuit board 15 and the etchant is discharged from the surface of the printed circuit board 15.
The circuit forming metal layer on the surface of the printed circuit board 15 is selectively etched to form a circuit on the surface of the printed circuit board 15. In this case, the printed circuit board plate 1
Since a new etchant can always be supplied to the surface of the printed circuit board 5, waste liquid does not accumulate on a part of the surface of the printed circuit board 15 so that the circuit-forming metal layer Part of the metal layer for circuit formation on the surface of the printed circuit board 15 can be uniformly etched without being partially etched, and the etching rate is high.

FIG. 5 is a schematic view showing another etching apparatus according to the present invention, FIG. 6 is a view showing a part of the etching apparatus shown in FIG. 5, and FIG. 7 is a sectional view taken along the line BB of FIG. As shown in the figure, an air injection nozzle 41 is provided between the etching liquid supply / discharge means 16 near the transfer means 12, and a compressed air supply device (not shown) is connected to the air injection nozzle 41 to supply compressed air. A gas injection unit that injects air toward the surface of the printed circuit board 15 using the device, the air injection nozzle 45, and the like is configured.

In this etching apparatus, air is jetted from the air jet nozzle 41 toward the surface of the printed circuit board 15 in a planar manner. Since the accumulated waste liquid can be reliably removed, the printed board 1
The circuit forming metal layer on the surface of No. 5 can be more uniformly etched.

FIG. 8 is a schematic view showing another etching apparatus according to the present invention. As shown in the figure, one end of the connection pipe 51 is connected to the lower part in the container 1, a plurality of supply pipes 24 are connected to the other end of the connection pipe 51, and the etching of the etching liquid supply / discharge body 19 is connected to the supply pipe 24. The liquid supply chamber 20 is connected,
The connection pipe 51 and the supply pipe 24 allow the etchant supply chamber 20
An etchant supply means for supplying an etchant to the apparatus is provided. Further, an etching solution suction device 52 is provided outside the container 1, a connection pipe 53 is connected to a suction port of the etching solution suction device 52, and a plurality of discharge pipes 2 are connected to the connection pipe 53.
7 is connected, one end of the discharge pipe 54 is connected to the discharge port of the etching liquid suction device 52, and the other end of the discharge pipe 54 is connected to the container 1.
The etching liquid discharge chamber 21 of the etching liquid supply / discharge body 19 is connected to the lower part of the inside, and the etching liquid is discharged from the etching liquid discharge chamber 21 by the etching liquid suction device 52, the connection pipe 53, and the discharge pipe 27. An etchant discharging means for discharging is configured.

In this etching apparatus, when the etching liquid suction device 52 is operated, the etching liquid supply chamber 2 is opened.
Since 0 becomes a negative pressure, the etching liquid accumulated at the bottom of the container 1 is supplied to the etching liquid supply chamber 20 of the etching liquid supply / discharge body 19 via the connection pipe 51 and the supply pipe 24, and the discharge pipe 27 is connected to the etching liquid supply chamber 20. The etching liquid is discharged from the etching liquid discharge chamber 21 of the etching liquid supply / discharge body 19 via the pipe 53, the etching liquid is returned into the container 1 via the discharge pipe 54, and the etching liquid is deposited on the surface of the printed circuit board plate 15. Is supplied and the etchant is discharged from the surface of the printed circuit board 15, so that the circuit-forming metal layer on the surface of the printed circuit board 15 is selectively etched, and a circuit is formed on the surface of the printed circuit board 15. Is formed.

In such an etching apparatus, since the etching solution suction device 52 is provided instead of the etching solution pressurizing supply device and the etching solution suction / discharge device, the structure is simple and the manufacturing cost is low.
Further, since there is no need to consider the relationship between the supply amount of the etching solution by the etching solution pressurizing supply device and the discharge amount of the etching solution by the etching solution suction / discharge device, the etching work of the printed circuit board plate 15 can be easily performed. it can.

In the above embodiment, the case where the plate material to be etched is the printed board member 15 has been described. However, the present invention can be applied to a case where the plate material to be etched is a semiconductor substrate, a glass substrate, or the like. it can. Further, in the above embodiment, the case where the layer to be etched is a metal layer for forming a circuit has been described, but the present invention can be applied to a case where the layer to be etched is another layer. Further, in the above-described embodiment, a device that injects air is used as the gas injection device, but a device that injects an inert gas may be used as the gas injection device.
Further, in the above-described embodiment, the air injection nozzle 41 that injects air in a plane shape is used, but an air injection nozzle that injects air in a linear shape may be used.

[0017]

In the etching apparatus according to the present invention, since a new etching solution can be constantly supplied to the surface of the plate material to be etched, waste liquid does not accumulate on a part of the surface of the plate material to be etched. Therefore, the layer to be etched on the surface of the plate material to be etched can be uniformly etched.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing an etching apparatus according to the present invention.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a detailed view showing a part of the etching apparatus shown in FIG.

FIG. 4 is a diagram showing a part of another etching apparatus according to the present invention.

FIG. 5 is a schematic view showing another etching apparatus according to the present invention.

FIG. 6 is a detailed view showing a part of the etching apparatus shown in FIG.

FIG. 7 is a sectional view taken along the line BB of FIG. 6;

FIG. 8 is a schematic view showing another etching apparatus according to the present invention.

FIG. 9 is a schematic view showing a conventional etching apparatus.

FIG. 10 is a detailed view showing a part of the etching apparatus shown in FIG. 9;

FIG. 11 is a sectional view taken along the line CC in FIG. 10;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 15 ... Plate material for printed circuit boards 16 ... Etch liquid supply / discharge means 17 ... Shaft 18 ... Holding roller 19 ... Etch liquid supply / discharge body 20 ... Etch liquid supply chamber 21 ... Etch liquid discharge chamber 31 ... Etch liquid supply / discharge means 32 ... Shaft 33 ... Pressing roller 34 ... Etching liquid supply / discharge body 35 ... Etching liquid supply chamber 36 ... Etching liquid discharge chamber

Claims (2)

(57) [Claims] An etching apparatus for performing etching by supplying an etching solution to a surface of a plate material to be etched,
The etching solution is supplied to the surface of the plate material to be etched, and the etching solution is discharged from the surface of the plate material to be etched.
An etching solution supply / discharge body with an etching solution discharge chamber
An etching liquid supply / discharge means for providing an etching liquid . 2. The etching solution supply chamber according to claim 1, wherein
2. A chucking liquid discharge chamber is provided.
On-board etching equipment.