CN213876316U

CN213876316U - Developing etching spraying device

Info

Publication number: CN213876316U
Application number: CN202022525874.2U
Authority: CN
Inventors: 陈德和
Original assignee: Universal PCB Equipment Co Ltd
Current assignee: Universal PCB Equipment Co Ltd
Priority date: 2020-09-24
Filing date: 2020-11-04
Publication date: 2021-08-03
Anticipated expiration: 2030-11-04
Also published as: CN112198771A; CN213876317U

Abstract

The utility model discloses a development etching spray set, include: the PCB processing device comprises two fluid spraying pipe assemblies and a swinging assembly, wherein the two fluid spraying pipe assemblies are fixed on the swinging assembly and driven to swing by the swinging assembly, and the two fluid spraying pipe assemblies are arranged on the upper side or the front side and the rear side of a PCB workpiece to be processed. This application technical scheme, whole development or etching process adopt the configuration that two fluids sprayed, produce the high velocity of flow through compressed air and liquid medicine liquid flash mixed, high hitting power, the tiny meticulous spraying of liquid drop, slot and root between the entering into the circuit, can etch or develop the circuit root, effectively promote the development of the etching factor of circuit or meticulous circuit, and when horizontal transmission mode, can inhale the sword device at last face configuration, reduce the influence of face pond effect on the face, promote circuit homogeneity and fineness, and spraying system has the function of swaing, can promote the homogeneity of circuit development and etching.

Description

Developing etching spraying device

Technical Field

The utility model relates to a PCB technical field, in particular to develop etching spray set.

Background

With the strong support of the country to the semiconductor industry, the demand of IC carrier boards (package substrates) is correspondingly increased, the line width/line distance of typical IC carrier boards is 15um/15um, for the mass production of large-row boards, an improved Semi-Additive Process (MSAP) technology is required, and in addition, with the continuous upgrade of the PCB industry technology, a similar carrier board SLP (Substrate-Like PCB) technology is already applied to the mobile phone motherboard of each mobile phone manufacturer, the manufacturing method of the similar carrier board is to adopt an MSAP Process based on the HDI technology, and the line width and line distance can reach 25-30um to the thinnest. These carrier plates and similar carrier plates adopting the MSAP technology have a thin copper thickness, but the circuit is extremely fine, and the conventional single fluid spray development and etching method cannot meet the requirements of circuit precision and yield, and has the following defects:

the existing single-fluid spraying mode has the disadvantages that the diameter of sprayed liquid medicine particles is large, the hitting force is small, the development or etching of fine circuits is not facilitated, the burrs of the circuits are large, and the etching factor is low. And when the horizontal conveying is carried, the upper plate surface has a pool effect, the fineness degree of the line is influenced, and the line is uneven.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a development etching spray set aims at doing benefit to meticulous circuit development or etching, promotes the homogeneity of circuit development and etching, satisfies the yield requirement.

In order to achieve the above object, the utility model provides a development etching spray set, include: the PCB processing device comprises two fluid spraying pipe assemblies and a swinging assembly, wherein the two fluid spraying pipe assemblies are fixed on the swinging assembly and driven to swing by the swinging assembly, and the two fluid spraying pipe assemblies are arranged on the upper side or the front side and the rear side of a PCB workpiece to be processed.

Optionally, the rocking assembly comprises: rocking frame and swing actuating mechanism, two fluid nozzle subassembly are fixed on the rocking frame, swing actuating mechanism includes: the device comprises a swing motor, an eccentric wheel, a swing shaft and a pull rod, wherein the pull rod is connected with a swing frame, the swing shaft is in driving connection with the swing motor, the eccentric wheel is fixed on the swing shaft and is in driving connection with the pull rod, and the swing frame is driven by the pull rod so as to drive the two-fluid spray pipe assembly to swing.

Optionally, the two-fluid spout assembly comprises: a plurality of two fluid spray pipes, every two fluid spray pipe connect air inlet pipeline and liquid inlet pipeline, wherein:

the intake pipe includes: the air inlet main pipe, the air inlet connecting pipe and the air inlet hose are sequentially connected, and the air inlet hose is connected with the two-fluid spray pipe;

the feed liquor pipeline includes: the feed liquor that connects gradually is responsible for, feed liquor connecting pipe, feed liquor hose, the feed liquor hose connection two fluid spray pipes.

Optionally, a plurality of two-fluid nozzles are arranged on the two-fluid nozzle, and fine spray generated by gas and liquid mixed in the two-fluid nozzle is emitted from the two-fluid nozzles.

Optionally, the two-fluid nozzle is arranged horizontally, and a knife suction device is configured on the upper plate surface of the PCB workpiece to be processed.

Optionally, the two-fluid nozzle is set in a plumb-standing posture or inclined at a preset angle.

Optionally, the swing direction or swing angle of the two-fluid nozzle pipe is set in a preset direction or angle according to different conveying modes of the PCB workpiece to be processed.

Optionally, the two fluid nozzle assemblies are symmetrically arranged on the upper side, the lower side or the front side and the rear side of the PCB workpiece to be processed.

Optionally, the developing etching spraying device further includes: and the workpiece carrier disc is arranged between the two fluid spray pipe assemblies and is used for fixing the PCB workpiece to be processed.

The embodiment of the utility model provides a development etching spray set, include: the PCB processing device comprises two fluid spraying pipe assemblies and a swinging assembly, wherein the two fluid spraying pipe assemblies are fixed on the swinging assembly and driven to swing by the swinging assembly, and the two fluid spraying pipe assemblies are arranged on the upper side or the front side and the rear side of a PCB workpiece to be processed. This application technical scheme, whole development or etching process adopt the configuration that two fluids sprayed, produce the high velocity of flow through compressed air and liquid medicine liquid flash mixed, high hitting power, the tiny meticulous spraying of liquid drop, slot and root between the entering into the circuit, can etch or develop the circuit root, effectively promote the development of the etching factor of circuit or meticulous circuit, and when horizontal transmission mode, can inhale the sword device at last face configuration, reduce the influence of face pond effect on the face, promote circuit homogeneity and fineness, and spraying system has the function of swaing, can promote the homogeneity of circuit development and etching.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a front view of a developing etching spraying device provided in an embodiment of the present invention;

fig. 2 is a side view of the developing etching spraying device provided in the embodiment of the present invention.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				10	Two-fluid spray pipe	11	Swinging frame
20	Tool sucking device	30	Swing motor
				31	Eccentric wheel	32	Swing shaft
33	Pull rod	40	Air inlet main pipe
				41	Air inlet connecting pipe	42	Air inlet hose
50	Main pipe of liquid inlet	51	Liquid inlet connecting pipe
				52	Liquid inlet hose	70	Two-fluid nozzle
60	Workpiece

The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

Specifically, please refer to fig. 1-2, fig. 1 is a front view of a conductive device of a spring-plate hanger according to an embodiment of the present invention; fig. 2 is a top view of the elastic sheet type hanger conductive device provided by the embodiment of the present invention.

As shown in fig. 1-2, the utility model provides a developing etching spray device, including: the PCB processing device comprises a two-fluid spray pipe assembly and a swinging assembly, wherein the two-fluid spray pipe assembly is fixed on the swinging assembly and driven to swing by the swinging assembly, and the two-fluid spray pipe assembly is arranged on the upper side or the front side and the rear side of a PCB workpiece 60 to be processed.

The utility model discloses an above-mentioned structure, the spraying of whole two fluid etching (development) processes all is the flash mixed through compressed air and liquid medicine to produce the fine spraying that high velocity of flow, high hitting power, liquid drop are small, develop or etch the fine line way of panel.

Wherein, as an embodiment, the swing assembly comprises: rocking frame 11 and swing actuating mechanism, two fluid nozzle subassembly is fixed on rocking frame 11, swing actuating mechanism includes: the device comprises a swing motor 30, an eccentric wheel 31, a swing shaft 32 and a pull rod 33, wherein the pull rod 33 is connected with the swing frame 11, the swing shaft 32 is in driving connection with the swing motor 30, the eccentric wheel 31 is fixed on the swing shaft 32 and is in driving connection with the pull rod 33, and the swing frame 11 is driven by the pull rod 33 so as to drive the two-fluid spray pipe assembly to swing.

Wherein, as an embodiment, the two-fluid nozzle assembly comprises: a plurality of two fluid spray pipes 10, every two fluid spray pipe 10 connects air inlet pipeline and liquid inlet pipeline, wherein:

the intake pipe includes: the air inlet main pipe 40, the air inlet connecting pipe 41 and the air inlet hose 42 are sequentially connected, and the air inlet hose 42 is connected with the two fluid spray pipes 10;

the feed liquor pipeline includes: the liquid inlet main pipe 50, the liquid inlet connecting pipe 51 and the liquid inlet hose 51 are connected in sequence, and the liquid inlet hose 51 is connected with the two-fluid spray pipe 10.

Further, as an embodiment, a plurality of two-fluid nozzles 70 are provided on the two-fluid nozzle 10, and a fine spray generated by the gas and liquid mixed in the two-fluid nozzle 10 is emitted from the two-fluid nozzles 70.

As an embodiment, the two-fluid nozzle 10 may be disposed horizontally, and the upper plate surface of the PCB workpiece 60 to be processed is configured with a knife sucking device 20.

The whole spray tray is of a swing structure, and when the spray tray is horizontally conveyed, the liquid medicine after the board surface reaction can be sucked by arranging the suction knife device 20, so that the board surface water pool effect is prevented; the whole process uses the fine spray with high flow speed, high hitting force and tiny liquid drops generated by two fluids to achieve the capability of developing or etching fine lines.

In another embodiment, the two fluid nozzles 10 may be disposed in a plumb standing posture or inclined at a predetermined angle.

As an embodiment, the swing direction or swing angle of the two fluid nozzle 10 is set in a preset direction or angle according to different conveying manners of the PCB workpiece 60 to be processed, so that the two fluid nozzle 10 can swing in the preset direction or angle according to different conveying manners of the PCB workpiece 60 to be processed.

Wherein, as an embodiment, the two fluid nozzle assemblies are symmetrically arranged on the upper, lower, front and rear sides of the PCB workpiece 60 to be processed.

Further, as an embodiment, the developing etching spray device may further include: and the workpiece 60 is a carrier disc, and the workpiece 60 carrier disc is arranged between the two fluid nozzle assemblies on two sides and used for fixing the PCB workpiece 60 to be processed.

The utility model discloses development etching spray set's structural principle as follows:

two fluid nozzles 10 are arranged on the upper side, the lower side or the front side and the rear side of the workpiece 60, the two fluid nozzles 10 are fixed on the swing frame 11, and swing at a specific frequency and amplitude is realized by a swing system comprising a swing motor 30, an eccentric wheel 31, a swing shaft 32 and a pull rod 33. Each two-fluid nozzle 10 connects an inlet line and an inlet line. The air inlet pipeline system is an air inlet main pipe 40, an air inlet connecting pipe 41 and an air inlet hose 42, and the liquid inlet pipeline system is a liquid inlet main pipe 50, a liquid inlet connecting pipe 51 and a liquid inlet hose 51. The gas and liquid supplied through the two lines are rapidly mixed in the two-fluid nozzle 10 to produce a fine spray of fine droplets at a high flow rate and high impact force, and projected from the two-fluid nozzle 70.

The utility model discloses development etching spray set has following advantage:

a. the whole developing or etching process adopts a two-fluid spraying configuration (a carrier plate and a similar carrier plate adopting an MSAP process have a thin copper plate surface, generally 3-9um and a limit of 18um), generates fine spray with high flow rate, high impact force and tiny liquid drops through gas-liquid rapid mixing, enters a line slot and a line root, can etch or develop the line root, and effectively improves the etching factor of the line or the development of the fine line.

b. The upper plate surface is provided with a knife sucking device 20 which can suck the old liquid medicine after the reaction of the upper plate surface, prevent the effect of a plate surface pool and can keep the fresh liquid medicine to enter the slot and the root between the lines all the time.

c. The two-fluid spray pipe 10 swings with specific amplitude and frequency to ensure that the water type can equally cover the plate surface.

The utility model discloses develop etching spray set's whole development or the process of etching, all be the configuration that adopts two fluids to spray to the state that carries out the truing to the fine rule way to the end in order to reach high standard requirement.

In addition, the developing etching spraying device of the utility model is also applicable to different process manufacturing flows in the PCB field (the copper is advantageous as long as the copper is thin, when the copper is thick, only two fluids are adopted for spraying, and no fluid is sprayed in the front, so that the economic benefit is poor); the two-fluid nozzle 10 is not limited to be installed horizontally, but may be installed in a plumb-standing posture or inclined at a certain angle. The work 60 is not limited to being conveyed in the horizontal direction, and may be conveyed in a vertical direction of a plumb. And the two-fluid nozzle 10 may be oscillated in a particular direction or angle depending on the manner in which the workpiece 60 is transported.

Compared with the prior art, the embodiment of the utility model provides a develop etching spray set provides, include: the PCB processing device comprises a two-fluid spray pipe assembly and a swinging assembly, wherein the two-fluid spray pipe assembly is fixed on the swinging assembly and driven to swing by the swinging assembly, and the two-fluid spray pipe assembly is arranged on the upper side or the front side and the rear side of a PCB workpiece 60 to be processed. This application technical scheme, whole development or etching process adopt the configuration that two fluids sprayed, produce the high velocity of flow through compressed air and liquid medicine liquid flash mixed, high hitting power, the tiny meticulous spraying of liquid drop, slot and root between the entering into the circuit, can etch or develop the circuit root, effectively promote the development of the etching factor of circuit or meticulous circuit, and when horizontal transmission mode, can inhale sword device 20 at last face configuration, reduce the influence of face pond effect on going up, promote circuit homogeneity and fineness, and spraying system has the function of swaying, can promote the homogeneity of circuit development and etching.

The above only is the preferred embodiment of the present invention, not so limiting the patent scope of the present invention, all under the concept of the present invention, the equivalent structure transformation made by the contents of the specification and the drawings is utilized, or the direct/indirect application is included in other related technical fields in the patent protection scope of the present invention.

Claims

1. A developing etching spray device is characterized by comprising: the PCB board processing device comprises a two-fluid spray pipe assembly and a swinging assembly, wherein the two-fluid spray pipe assembly comprises a plurality of two-fluid spray pipes, the two-fluid spray pipe assembly is fixed on the swinging assembly and driven to swing by the swinging assembly, the two-fluid spray pipe assembly is arranged on the upper side, the lower side, the front side and the rear side of a PCB board workpiece to be processed, and the swinging direction or the swinging angle of the two-fluid spray pipe is set according to different conveying modes of the PCB board workpiece to be processed in a preset direction or angle mode.

2. The developing etching spray device of claim 1, wherein the wobble assembly comprises: rocking frame and swing actuating mechanism, two fluid nozzle subassembly are fixed on the rocking frame, swing actuating mechanism includes: the device comprises a swing motor, an eccentric wheel, a swing shaft and a pull rod, wherein the pull rod is connected with a swing frame, the swing shaft is in driving connection with the swing motor, the eccentric wheel is fixed on the swing shaft and is in driving connection with the pull rod, and the swing frame is driven by the pull rod so as to drive the two-fluid spray pipe assembly to swing.

3. The developing etching spraying device according to claim 1, wherein each of the two-fluid nozzles is connected to an air inlet pipeline and a liquid inlet pipeline, and wherein:

4. The developing etching spraying device according to claim 3, wherein the two-fluid nozzle is provided with a plurality of two-fluid nozzles, and fine spray generated by gas-liquid mixed in the two-fluid nozzle is emitted from the two-fluid nozzles.

5. The developing etching spraying device according to claim 3, wherein the two fluid nozzles are horizontally arranged, and a knife sucking device is arranged on the upper plate surface of the PCB workpiece to be processed.

6. The developing etching spray device according to claim 3, wherein the two fluid nozzles are arranged in a plumb standing posture or inclined at a predetermined angle.

7. The developing etching spraying device of claim 1, wherein the two fluid spraying pipe assemblies are symmetrically arranged at the upper, lower, front and rear sides of the PCB workpiece to be processed.

8. The developing etching spray device according to claim 1, further comprising: and the workpiece carrier disc is arranged between the two fluid spray pipe assemblies and is used for fixing the PCB workpiece to be processed.