JP3002883U - Printed circuit board etching equipment - Google Patents
Printed circuit board etching equipmentInfo
- Publication number
- JP3002883U JP3002883U JP1994004750U JP475094U JP3002883U JP 3002883 U JP3002883 U JP 3002883U JP 1994004750 U JP1994004750 U JP 1994004750U JP 475094 U JP475094 U JP 475094U JP 3002883 U JP3002883 U JP 3002883U
- Authority
- JP
- Japan
- Prior art keywords
- tank
- etching
- processing liquid
- printed circuit
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Abstract
(57)【要約】
【目的】プリント回路基板の製造において、水平搬送で
処理する工程のエッチング処理を基板表面はもとよりス
ルーホール内部まで確実に行う。
【構成】プリント回路基板を、エッチング処理槽１内に
水平に搬送させて、処理するものであって、前記エッチ
ング処理槽１の入口側および出口側に水洗水の水面を保
持する溢流堰兼用の対向ローラ１１を配備し、かつエッ
チング処理槽内のプリント基板の上下両面に向かって処
理液を噴射するスリットまたはノズルのあるスプレ管
３、４を上下千鳥状に対向配備したことにより、処理液
中に基板を浸漬させながら連続搬送しつつ強制的に噴射
される処理液の衝突で、スルーホール内にも処理液を送
り込み効果的にエッチング処理し、生産性を大幅に向上
できる。
(57) [Abstract] [Purpose] In the manufacture of printed circuit boards, the etching process in the horizontal transfer process is performed reliably not only on the substrate surface but also inside the through holes. [Structure] A printed circuit board is transported horizontally into an etching treatment tank 1 for treatment, and also serves as an overflow weir for holding the water surface of rinsing water on the inlet side and the outlet side of the etching treatment tank 1. By disposing the facing roller 11 of No. 1 and the spray pipes 3 and 4 having slits or nozzles for jetting the processing liquid toward the upper and lower surfaces of the printed circuit board in the etching processing tank, the processing liquid is arranged in a zigzag pattern. Due to the collision of the processing liquid that is forcibly jetted while being continuously transported while immersing the substrate therein, the processing liquid is also sent into the through holes for effective etching processing, and the productivity can be greatly improved.
Description
【０００１】[0001]
本考案は、プリント回路基板（以下単に基板と称す）の製造工程において基板 の表面の銅及びスルーホール内の内層銅箔面の酸化物や不純物を除去すると共に 、後工程のレジスト、化学銅メッキ、電気銅メッキの密着を確実にするためのエ ッチング処理装置に関するものである。 The present invention removes oxides and impurities on the copper on the surface of the printed circuit board and the copper foil on the inner layer in the through holes in the manufacturing process of a printed circuit board (hereinafter simply referred to as "board"), and resists and chemical copper plating in the subsequent process. The present invention relates to an etching processing device for ensuring the close contact of electrolytic copper plating.
【０００２】[0002]
基板の製造処理の基本工程は、水溶性有機溶剤による樹脂の活性化処理→水洗 →過マンガンカリウム水溶液等による樹脂のエッチング処理→水洗→中和処理→ 水洗→乾燥といった工程からなっている。 このような基板の処理は、各工程の処理槽間にわたってトロリコンベア等のチ ェーン式のコンベアを掛け回して、該コンベアに基板を吊り下げ、この吊り下げ られた基板に大気中で処理液を噴射する方式より、基板を各処理槽上で順次下降 させて処理槽内の処理液中に浸漬し、基板表面や小口径ホール内に処理液が十分 に接触するように処理液中で揺動させながら処理するディッピング方式が多用さ れている。 The basic steps of the substrate manufacturing process include the steps of activating the resin with a water-soluble organic solvent, washing with water, etching the resin with a potassium permanganate aqueous solution, washing with water, neutralizing treatment, washing with water, and drying. Such a substrate is processed by hanging a chain type conveyor such as a trolley conveyor between the processing tanks of each process, suspending the substrate on the conveyor, and applying the treatment liquid to the suspended substrate in the atmosphere. From the spraying method, the substrate is sequentially lowered on each processing bath, immersed in the processing liquid in the processing bath, and oscillated in the processing liquid so that the processing liquid is in sufficient contact with the substrate surface and small holes. The dipping method of processing while performing is often used.
【０００３】[0003]
しかしながら、従来の処理装置は、基板を処理液中で揺動させる処理であるた め、スルーホール内に強制的に処理液を送り込むことがむずかしく、スルーホー ル内の内層銅箔の処理残りが発生しやすく、またディッピング方式であると小口 径スルーホール内の液の通りが悪く、しかも水平搬送式のように処理基板を連続 的に流せないため生産性を高めることができず、処理槽上で基板を下降させなけ ればならず、チェーン式のコンベアが不可欠で、設備が大規模、複雑化するとい う問題もあった。 本考案は、基板のエッチング処理の従来方式の欠点を解消し、水平移動方式を 採用し、簡単な設備でプリント回路基板の表面はもとより、スルーホール内部ま でを確実に液処理し、生産性を向上させることができるプリント回路基板エッチ ング処理装置を提供することを目的とするものである。 However, since the conventional processing equipment is a process in which the substrate is swung in the processing liquid, it is difficult to forcibly feed the processing liquid into the through holes, and unprocessed inner layer copper foil in the through holes occurs. In addition, the dipping method does not allow the liquid to pass through the small-diameter through holes badly, and since the processed substrates cannot be continuously flowed as in the horizontal transfer method, the productivity cannot be improved and the solution cannot be processed on the processing tank. There was also the problem that the equipment had to be lowered and the chain type conveyor was indispensable, making the equipment large and complex. The present invention eliminates the disadvantages of the conventional method of etching the substrate, adopts the horizontal movement method, and with simple equipment, it can surely perform liquid treatment not only on the surface of the printed circuit board but also inside the through hole, thus improving productivity. It is an object of the present invention to provide a printed circuit board etching processing device capable of improving the above.
【０００４】[0004]
本考案は、プリント回路基板をエッチング槽内の処理液に浸漬させて、搬送コ ンベアで水平搬送しつつ処理し、さらに水洗槽内に水平に搬送させて水洗処理す る装置において、前記エッチング槽の入口側および出口側に処理液の液面を保持 する溢流堰兼用の対向ローラを配備し、かつエッチング槽内の前記プリント回路 基板の上下両面に向かって処理液を噴射するスリットまたはノズルのあるスプレ 管を液面下で、上下千鳥状に対向配備したものである。 The present invention is an apparatus for immersing a printed circuit board in a processing solution in an etching tank, carrying it horizontally while being carried by a carrying conveyor, and further carrying it horizontally in a washing tank to carry out the washing treatment. Opposed rollers that also serve as overflow weirs that hold the surface of the processing liquid are installed on the inlet side and the outlet side of the substrate, and the slits or nozzles that spray the processing liquid toward the upper and lower surfaces of the printed circuit board in the etching tank are installed. A spray pipe is placed below the surface of the liquid in a zigzag pattern.
【０００５】[0005]
プリント回路基板を水平に保持しつつ、搬送コンベアでエッチング槽を水平方 向に処理液中に搬送する間に、基板を挟んだ上下のスプレ管から基板両面に処理 液を噴射し、処理液が基板に直角に衝突し、小口径スルーホール内部にまで処理 液が効果的に送り込まれ、多層基板におけるスルーホール内の処理も確実に行え る。 そして、エッチング槽内の処理液の液面は、プリント回路基板を搬送する搬送 コンベアの溢流堰を兼用する対向ローラにより高さが規定され、プリント回路基 板に対し一定の高さに保持されるため、プリント回路基板を処理液中に確実に浸 漬させることができ、しかも上下部のスプレ管の噴射ノズル位置を基板搬送方向 に対して千鳥状にしてあるので、噴射液の流れがぶつかり合わずに基板前面に対 して処理液が確実に噴射され、ホールの位置が何処にあろうともホール内のエッ チング処理は確実に行われる、即ち処理液噴流はスルーホールの上方から下方へ 、また下方から上方へ交互に送り込まれ効率良好なエッチングができるし、さら に、活性化処理、洗浄処理等の各処理槽を直列に配置すれば、連続処理が容易と なり生産性が向上する。 While the printed circuit board is held horizontally, while the etching tank is being horizontally transferred into the processing solution by the transfer conveyor, the processing solution is sprayed from both upper and lower spray pipes sandwiching the substrate to both sides of the processing solution, The processing liquid collides with the substrate at a right angle, and the processing liquid is effectively sent into the inside of the small-diameter through-hole, so that the processing inside the through-hole in the multilayer board can be performed reliably. The height of the surface of the processing liquid in the etching tank is regulated by a counter roller that also serves as an overflow weir of a transfer conveyor that transfers the printed circuit board, and is maintained at a constant height with respect to the printed circuit board. Therefore, the printed circuit board can be surely immersed in the processing liquid, and the spray nozzle positions of the upper and lower spray pipes are staggered with respect to the substrate transport direction, so that the flow of the spray liquid collides. The processing liquid is surely jetted to the front surface of the substrate without matching, and the etching treatment in the hole is surely performed regardless of the position of the hole, that is, the processing liquid jet flows downward from above the through hole. In addition, it can be fed alternately from the bottom to the top for efficient etching, and if each treatment tank for activation treatment, cleaning treatment, etc. is arranged in series, continuous treatment becomes easier and productivity is improved. To.
【０００６】[0006]
【実 施 例】 本考案の一実施例を図面を参照しながら説明すれば、図１において、エッチン グ処理槽１の一つと洗浄槽２０とを組み合わせた例であって、外槽１1 と処理液 を保持する内槽１2 とからなるエッチング処理槽１の入口側から出口側にわたっ ては、基板（図示せず）を水平に保持しつつ水平方向に搬送する搬送コンベア２ が配備され、該内槽１2 の搬送コンベア２の基板搬送路の上下には、基板の両面 に直角に処理液を噴射するためのノズルまたはスリットを多数設けた上部スプレ 管３と下部スプレ管４とが液面下に配設されている。これらの上部スプレ管３と 下部スプレ管４のノズルの位置は、搬送コンベア２の搬送方向に対して千鳥状と し、搬送中の基板前面に対して処理液が確実に当たるように噴射されるようにす る。[Embodiment] An embodiment of the present invention will be described with reference to the drawings. In FIG. 1, one of the etching treatment tanks 1 and a cleaning tank 20 are combined, and an outer tank 1 1 is over the outlet side from the inlet side of the etching tank 1 consisting of the inner tub 1 2 for holding the processing solution, transport conveyor 2 is deployed to transport in the horizontal direction while holding the substrate (not shown) horizontally , above and below the inner tub 1 second substrate transport path of the conveyor 2, and the upper spray pipe 3 is provided a number of nozzles or slits for injecting a right angle to the treatment liquid on both surfaces of the substrate and the lower spray pipe 4 It is arranged below the liquid surface. The positions of the nozzles of the upper spray pipe 3 and the lower spray pipe 4 are staggered in the transport direction of the transport conveyor 2 so that the processing liquid is sprayed so as to surely hit the front surface of the substrate being transported. To
【０００７】 搬送コンベア２は、例えば図２に示すが如く、回転制御用インバータ５を備え た駆動モータ６により、チェーン７を介して回転される駆動シャフト８と歯車伝 動されて回転する回転軸９に所定間隔をおいて固定された複数のホイール１０を 備えたもので、また図１のように、搬送コンベア２のある内槽１2 の入口側およ び出口側には溢流堰を兼用する対向ローラ１１を設け、内槽１2 内の処理液の液 面を上部スプレ管３及び下部スプレ管４より上方に保持している。 なお、搬送コンベア２、あるいは搬送コンベア２と上部スプレ管３を液面下に するように、内槽１2 の液面はポンプの送液量を調整することで保持してある。 また、外槽１1 は処理液貯槽１２に連通され、内槽１2 の底部も処理液貯槽１ ２に遮断可能に連通されており、該処理液貯槽１２にスプレポンプ１３を備えた 配管１４で前記上部スプレ管３および下部スプレ管４が接続され処理液噴射でき るようにしてある。As shown in FIG. 2, for example, the conveyer conveyor 2 has a drive shaft 6 rotated by a drive motor 6 having a rotation control inverter 5 and a rotary shaft rotated by gear transmission with a drive shaft 8. 9 but having a plurality of wheels 10 fixed at a predetermined interval, and as in Figure 1, the inlet-side and the overflow weir to the outlet side of the inner tub 1 2 with a conveyor 2 a counter roller 11 which also serves provided, holds the liquid level of the processing liquid of the inner tank 1 in 2 upward from the upper spray bar 3 and a lower spray pipe 4. Note that, as the conveyor 2 or the conveyor 2 and the upper spray pipe 3, under the liquid surface, the liquid surface of the inner tank 1. 2 are held by adjusting the feed rate of the pump. The outer tub 1 1 is communicated with the processing liquid tank 12, the bottom of the inner tank 1 2 is also passed through interruptible in communication with the processing solution tank 1 2, into the processing liquid reservoir 12 by a pipe 14 with Supureponpu 13 The upper spray pipe 3 and the lower spray pipe 4 are connected so that the processing liquid can be injected.
【０００８】 なお、前記水洗槽２０は、前工程のエッチング処理槽１の出口側にコンベア１ ５で連絡され、処理液でエッチングされた基板を入口側の対向ロール２１に受け 渡されてコンベア２２で出口側の対向ロール２１に搬送される途中で、上部スプ レ管２３と下部スプレ管２４とから噴射される水洗水で洗浄されるようになって いて、内外槽が洗浄水貯槽２５に連通され、洗浄水は洗浄ポンプ２６によって配 管２７でスプレ管２３、２４に連絡された配管系で循環流する。 前記水洗槽２０は、外槽２０1 と内槽２０2 からなり、入口側と出口側には溢 流堰を兼用する対向ローラ２１を備え、入口側から出口側にわたって基板を水平 状態で搬送する搬送コンベア２２と、該搬送コンベアの上下に水洗水噴射用の上 部スプレ管２３および下部スプレ管２４とが千鳥状に配備されている。また、前 記エッチング処理槽１は、外槽１1 と内槽１2 とが処理液貯槽１２に連通され、 該処理液貯槽１２内にはヒーター１６が配備されて処理液を加温し、加温された 処理液はスプレポンプ１３によって上部スプレ管３と下部スプレ管４に送液され るようになっている。さらに、前記処理液貯槽１２にはろ過器１７が付設され、 処理液はろ過ポンプ１８によってろ過器１７を経て循環され、処理液中の懸濁物 が除去される。The washing bath 20 is connected to the outlet side of the etching treatment bath 1 in the previous step by a conveyor 15 and the substrate etched with the treatment liquid is delivered to the opposing roll 21 on the inlet side to convey it to the conveyor 22. While being conveyed to the opposing roll 21 on the outlet side, the inside and outside tanks are communicated with the washing water storage tank 25 while being washed with washing water sprayed from the upper spray pipe 23 and the lower spray pipe 24. The cleaning water is circulated by the cleaning pump 26 through the pipe 27 connected to the spray pipes 23 and 24. The washing tank 20 is made from the outer tub 20 1 and the inner tub 20 2, the inlet side and the outlet side with a counter roller 21 which also serves as a spilled Nagareseki, transports the substrate across the outlet side from the inlet side in a horizontal state A transfer conveyor 22, and upper and lower spray pipes 23 and a lower spray pipe 24 for spraying washing water are arranged in a staggered pattern above and below the transfer conveyor. The front Symbol etching treatment tank 1, and the outer tub 1 1 and the inner tub 1 2 is communicated with the treatment liquid storage tank 12, heating the processing liquid heater 16 is deployed into the processing liquid reservoir 12, The heated treatment liquid is sent to the upper spray pipe 3 and the lower spray pipe 4 by the spray pump 13. Further, a filter 17 is attached to the treatment liquid storage tank 12, and the treatment liquid is circulated through the filter 17 by a filtration pump 18 to remove a suspension in the treatment liquid.
【０００９】 また、処理液貯槽１２に設けられた液温調節器１９は、ヒーター１６と共に、 操作盤３０に接続され、処理液が所定温度以上の液温でヒーター１６をOFFにし 、設定温度以下の液温でヒーター１６をONとする。３１は処理液貯槽１２に設け られた液面計で、スプレポンプ１３と共に操作盤３０に接続され、液面が設定レ ベル以下でヒーター１６およびスプレポンプ１３をOFFにする。Further, the liquid temperature controller 19 provided in the processing liquid storage tank 12 is connected to the operation panel 30 together with the heater 16, and the heater 16 is turned off when the processing liquid has a liquid temperature higher than a predetermined temperature, and the temperature is lower than the set temperature. The heater 16 is turned on at the liquid temperature of. A liquid level gauge 31 provided in the processing liquid storage tank 12 is connected to the operation panel 30 together with the spray pump 13 and turns off the heater 16 and the spray pump 13 when the liquid level is below a set level.
【００１０】 しかして、エッチング処理されるべき基板は、搬送コンベア２により水平に保 持されつつ水平方向に搬送され、エッチング処理槽１において、処理液貯槽１２ で所定温度に加温された処理液がスプレポンプ１３によって、上部スプレ管３と 下部スプレ管４から基板の両面に直角に噴射され、基板表面および小口径ホール 内のエッチング処理が行われる。そして、エッチング処理槽１内の処理液の液面 は対向ローラ１１により規定されるため、搬送される基板に対して処理液の液面 高さを一定に維持して基板を確実に処理液中に浸漬させることができる。 このように処理された基板は、搬送コンベア２からコンベア１５を経て、水洗 槽２０に至り、入口側の対向ロール２１から搬送コンベア２２により水平状態で 出口側の対向ロール２１へ水洗水中に搬送されるが、スプレ管２３、２４より水 洗水が基板上下に直角に噴射されて、基板全表面および小口径ホール内部にまで 水洗水を送り込んで洗浄処理を効果的に行ないうるもので、水洗後では次の工程 又は乾燥工程に搬送される。 なお、デスミア、ダイレクトプレディング等の処理の各工程を連続的に行うに は、図１のような装置を適宜直列に配置すればよく、生産能力も従来装置より大 幅に向上する。The substrate to be subjected to the etching treatment is conveyed horizontally while being held horizontally by the conveyer 2 and is heated in the etching treatment tank 1 to a predetermined temperature in the treatment liquid storage tank 12. Is sprayed by the spray pump 13 from the upper spray pipe 3 and the lower spray pipe 4 onto both surfaces of the substrate at a right angle, and the surface of the substrate and the inside of the small hole are etched. Since the surface of the processing liquid in the etching processing tank 1 is defined by the counter roller 11, the liquid surface height of the processing liquid is kept constant with respect to the transported substrate to ensure that the substrate is in the processing liquid. Can be dipped in. The substrate thus treated reaches the washing tank 20 from the conveyer conveyor 2 through the conveyer 15, and is conveyed in the washing water from the opposed roll 21 on the inlet side to the opposed roll 21 on the outlet side in a horizontal state by the conveyer conveyor 22. However, the washing water is sprayed from the spray pipes 23 and 24 at right angles to the upper and lower sides of the substrate, and the washing water can be sent to the entire surface of the substrate and the inside of the small hole to perform the washing process effectively. Then, it is transferred to the next step or the drying step. Incidentally, in order to continuously carry out the respective steps of the processing such as desmear and direct predating, the devices as shown in FIG. 1 may be appropriately arranged in series, and the production capacity is greatly improved as compared with the conventional device.
【００１１】[0011]
本考案によれば、搬送コンベアの対向ローラによりエッチング処理槽の液面高 さを保持し、搬送コンベアにより基板を処理液中に浸漬した状態で、水平に保持 しつつ水平方向に連続的に搬送しながら基板を挟んで上部のノズルから基板の上 面に、下部のノズルから処理液中で基板の下面に処理液を噴射するため、処理液 噴流はスルーホールの上方から下方へ、また下方から上方へと交互に送り込まれ るからどのようなスルーホールでも完全にエッチングされる。しかも、チェーン コンベア等の複雑なコンベアを用いることなく、スルーホール内は勿論、高多層 基板の小口径ホール内まで処理液を送り込ませ効率良好なエッチング処理も可能 となり、また板厚が厚く孔径の小さいスルーホール（高アスペクトのもの）に対 しても、連続的処理も容易となって従来装置よりも生産性が大幅に向上するもの である。 According to the present invention, the liquid level height of the etching processing tank is maintained by the opposing rollers of the transfer conveyor, and the substrate is immersed in the processing solution by the transfer conveyor while being held horizontally and continuously transferred in the horizontal direction. While the substrate is sandwiched, the processing liquid is jetted from the upper nozzle to the upper surface of the substrate and from the lower nozzle to the lower surface of the substrate in the processing liquid. Since it is fed alternately upwards, any through hole is completely etched. Moreover, without using a complicated conveyor such as a chain conveyor, it is possible to feed the processing liquid not only into the through-holes but also into the small-diameter holes of high-multilayer substrates, and it is possible to perform efficient etching processing. Even for small through-holes (high aspect ratios), continuous processing becomes easier and the productivity is greatly improved compared to conventional equipment.
【図１】図１は、本考案の実施例を示す系統説明側面図
である。FIG. 1 is a system explanatory side view showing an embodiment of the present invention.
【図２】図１のＡ−Ａ線における切断平面図である。FIG. 2 is a sectional plan view taken along line AA of FIG.
１ エッチング処理槽 １1 外槽 １2 内槽 ２ 搬送コンベア ３，４ スプレ管 ５ インバータ ６ モータ ７ チェーン ８ 駆動シャフト ９ 回転軸 １０ ホイール １１ 対向ロール １２ 処理液貯槽 １３ スプレポンプ １４ 配管 １５ コンベア １６ ヒーター １７ ろ過器 １８ ろ過ポンプ ２０ 水洗槽 ２１ 対向ロール ２２ 搬送コンベア ２３，２４ スプレ管 ２５ 洗浄水貯槽 ２６ ポンプ1 Etching tank 1 1 Outer tank 1 2 Inner tank 2 Conveyor 3,4 Spray pipe 5 Inverter 6 Motor 7 Chain 8 Drive shaft 9 Rotating shaft 10 Wheel 11 Opposing roll 12 Treatment liquid storage tank 13 Spray pump 14 Piping 15 Conveyor 16 Heater 17 Filtration device 18 Filtration pump 20 Water washing tank 21 Opposite roll 22 Transport conveyor 23,24 Spray pipe 25 Wash water storage tank 26 Pump
Claims (3)
理液に浸漬させて、搬送コンベアで水平搬送しつつ処理
し、さらに水洗槽内に水平に搬送させて水洗処理する装
置において、前記エッチング槽の入口側および出口側に
処理液の液面を保持する溢流堰兼用の対向ローラを配備
し、かつエッチング槽内の前記プリント回路基板の上下
両面に向かって処理液を噴射するスリットまたはノズル
のあるスプレ管を、液面下で上下千鳥状に対向配備した
ことを特徴とするプリント回路基板エッチング処理装
置。1. A device for immersing a printed circuit board in a treatment liquid in an etching tank, horizontally carrying it with a carrying conveyor for processing, and further carrying it horizontally in the washing tank for washing treatment. On the inlet side and the outlet side are provided opposing rollers that also serve as overflow weirs for holding the liquid level of the processing liquid, and there are slits or nozzles for ejecting the processing liquid toward the upper and lower surfaces of the printed circuit board in the etching tank. An etching apparatus for a printed circuit board, characterized in that the spray pipes are arranged in a staggered manner below and below the liquid surface.
有する内槽とからなり、該内槽中に前記プリント回路基
板を水平方向に搬送する複数の回転ホイールからなる搬
送コンベアを配備し、前記外槽を処理液貯槽に連通し、
かつ該処理液貯槽をポンプのある配管で前記スプレ管に
接続した請求項１記載のエッチング処理装置。2. The etching tank is composed of an outer tank and an inner tank containing a processing liquid, and a transport conveyor is provided in the inner tank, the conveyor being composed of a plurality of rotating wheels for horizontally transporting the printed circuit board. , Connecting the outer tank to the processing liquid storage tank,
The etching treatment apparatus according to claim 1, wherein the treatment liquid storage tank is connected to the spray pipe by a pipe having a pump.
回転軸に複数のホイールを所定間隔に配備したものを対
で上下に対設したものであって、エッチング槽の入口側
から出口側にわたり間隔を隔てて処理液中で水平位置に
備えてプリント回路基板が水平に搬送できる基板搬路を
処理液中に形成した請求項１または２記載のエッチング
処理装置。3. A transfer conveyor in the etching tank,
The rotating shaft has a plurality of wheels arranged at predetermined intervals, which are vertically arranged in pairs.The printed circuit is provided at a horizontal position in the processing liquid at intervals from the inlet side to the outlet side of the etching tank. The etching processing apparatus according to claim 1 or 2, wherein a substrate carrying path through which the substrate can be transported horizontally is formed in the processing liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1994004750U JP3002883U (en) | 1994-04-08 | 1994-04-08 | Printed circuit board etching equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1994004750U JP3002883U (en) | 1994-04-08 | 1994-04-08 | Printed circuit board etching equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP3002883U true JP3002883U (en) | 1994-10-04 |
Family
ID=43138846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1994004750U Expired - Lifetime JP3002883U (en) | 1994-04-08 | 1994-04-08 | Printed circuit board etching equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3002883U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017017782A1 (en) * | 2015-07-28 | 2017-02-02 | 株式会社トーア電子 | Nozzle for replacing chemical solution for etching metallic conductor and etching apparatus |
-
1994
- 1994-04-08 JP JP1994004750U patent/JP3002883U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017017782A1 (en) * | 2015-07-28 | 2017-02-02 | 株式会社トーア電子 | Nozzle for replacing chemical solution for etching metallic conductor and etching apparatus |
| JPWO2017017782A1 (en) * | 2015-07-28 | 2018-05-24 | 株式会社トーア電子 | Chemical solution renewal nozzle and etching apparatus used for etching metal conductors |
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