JPH0513956A - Plating processing device for printed board - Google Patents
Plating processing device for printed boardInfo
- Publication number
- JPH0513956A JPH0513956A JP16556291A JP16556291A JPH0513956A JP H0513956 A JPH0513956 A JP H0513956A JP 16556291 A JP16556291 A JP 16556291A JP 16556291 A JP16556291 A JP 16556291A JP H0513956 A JPH0513956 A JP H0513956A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- substrate
- hole
- treatment liquid
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はプリント基板に関し、特
に、プリント基板のメッキ処理装置に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board, and more particularly to an apparatus for plating a printed circuit board.
【０００２】[0002]
【従来の技術】多層プリント配線板の製造に際しては、
以下のような手順が行われる。すなわち、所定の中間導
体パターンを形成した中間層を表面層とともに積層し、
スルーホールとなる孔を穿孔した後、無電解メッキによ
って該孔の内周壁を含む全面に厚さ１μｍ程度の下地導
体層と、該下地導体層上に形成したメッキレジスト層の
パターンに従って、下地導体層上に電解メッキによって
厚さ数十μｍ程度のパターン導体層及びスルーホールメ
ッキ層を形成する。さらにこの後、上記メッキレジスト
層が除去され、下地導体層を選択的にパネルエッチング
して表面層に導体パターンを形成する。2. Description of the Related Art When manufacturing a multilayer printed wiring board,
The following procedure is performed. That is, an intermediate layer having a predetermined intermediate conductor pattern is laminated together with the surface layer,
After forming a hole to be a through hole, a base conductor is formed by electroless plating on the entire surface including the inner peripheral wall of the hole to a thickness of about 1 μm and a pattern of a plating resist layer formed on the base conductor layer. A patterned conductor layer and a through-hole plating layer having a thickness of several tens of μm are formed on the layer by electrolytic plating. After that, the plating resist layer is removed, and the underlying conductor layer is selectively panel-etched to form a conductor pattern on the surface layer.
【０００３】図６は上記工程を経た多層プリント配線板
の要部断面斜視図であり、図６に示すように、中間層５
１の中間導体パターン５１ａ及び表面層５２のパターン
導体層６３がスルーホールメッキ層６４及び下地導体層
６１で接続されている。FIG. 6 is a cross-sectional perspective view of an essential part of the multilayer printed wiring board which has undergone the above steps. As shown in FIG.
The first intermediate conductor pattern 51a and the pattern conductor layer 63 of the surface layer 52 are connected by the through-hole plating layer 64 and the base conductor layer 61.
【０００４】図５は上記パターン導体層及びスルーホー
ルメッキ層を形成するための電解メッキ処理の様子を示
す概念図である。例えば硫酸銅、ピロリン酸銅溶液等の
メッキ処理液が充填された図示しないメッキ処理槽内に
対向して配置された２枚の電極板７１，７１のほぼ中間
位置に、該電極板７１，７１と平行に基板５０を、配置
する。FIG. 5 is a conceptual diagram showing a state of an electrolytic plating process for forming the patterned conductor layer and the through hole plating layer. For example, the electrode plates 71, 71 are located substantially in the middle of the two electrode plates 71, 71 arranged facing each other in a plating process tank (not shown) filled with a plating process solution such as copper sulfate or copper pyrophosphate solution. The substrate 50 is arranged in parallel with.
【０００５】このとき上記基板５０は、保持手段７３を
介して直流電源７２の陰極７２ｎに接続される一方、上
記電極板７１，７１は、直流電源７２の陽極７２ｐに接
続されて、上記基板５０及び電極板７１，７１に所定の
電圧Ｖを印加することにより、陰極７２ｎに接続した基
板５０のメッキレジスト層６２で被覆されない下地導体
層６１に所定の層厚でパターン導体層６３と、スルーホ
ールメッキ層６４を形成する。At this time, the substrate 50 is connected to the cathode 72n of the DC power source 72 via the holding means 73, while the electrode plates 71, 71 are connected to the anode 72p of the DC power source 72, and the substrate 50 is connected. By applying a predetermined voltage V to the electrode plates 71, 71, the pattern conductor layer 63 having a predetermined layer thickness and the through hole in the underlying conductor layer 61 not covered with the plating resist layer 62 of the substrate 50 connected to the cathode 72n. The plated layer 64 is formed.
【０００６】またこの電解メッキでは、上記スルーホー
ルメッキ層をむらなく形成するために、上記基板５０
を、電圧Ｖの印加中もしくはその前後の期間にわたっ
て、電極板７１，７１の間で所定の速度、幅を以て、揺
動させることにより孔５３内にトラップされている気泡
等を除去するとともに、孔５３内に所定の金属イオン濃
度のメッキ処理液を供給するようにしている。In this electrolytic plating, in order to form the through hole plating layer evenly, the substrate 50 is formed.
Is oscillated at a predetermined speed and width between the electrode plates 71, 71 during the application of the voltage V or before and after the application of the voltage V to remove air bubbles and the like trapped in the holes 53. A plating treatment liquid having a predetermined metal ion concentration is supplied into 53.
【０００７】[0007]
【発明が解決しようとする課題】近年の電子機器の高速
度化、多機能化、小型化する傾向にあって、該電子機器
に搭載するプリント配線板は一層の多層化、高密度化が
求められているところから、プリント基板の板厚を大き
くするとともに、上記スルーホールとなる孔の孔径を小
さくした、高アスペクト比（例えば板厚：孔径＝８：
０．３５程度）のプリント配線板が需要が高まってい
る。In recent years, there has been a tendency for electronic devices to operate at higher speeds, to have more functions, and to be smaller, so that printed wiring boards mounted on the electronic devices are required to have more layers and higher density. Therefore, a high aspect ratio (for example, plate thickness: hole diameter = 8:
Demand for printed wiring boards (about 0.35) is increasing.
【０００８】ところが、プリント配線板のメッキ処理工
程においては、上記図５に示すようなメッキ処理液中で
のプリント基板の揺動を行っても、スルーホール用の孔
５３内に付着した気泡が抜け切らなかったり、孔５３の
メッキ処理液の交換が行われないで、孔５３内のメッキ
処理液の金属イオン濃度が不足することがある。この結
果、図６に示すような層厚が不足するメッキくわれや欠
損部９０をもつスルーホールメッキ層６４′が形成され
てしまうこととなり、導体抵抗が過度に大きくなった
り、スルーホール断線等の原因となる。この傾向は特に
高アスペクト比のプリント配線板で一層顕著であり、製
品の歩留りを向上させる上でのネックとなっていた。However, in the process of plating the printed wiring board, even if the printed circuit board is swung in the plating solution as shown in FIG. 5, bubbles adhering to the through-holes 53 remain. There is a case where the metal ion concentration of the plating treatment liquid in the hole 53 is insufficient due to the fact that the plating treatment liquid is not completely removed or the plating treatment liquid in the hole 53 is not replaced. As a result, as shown in FIG. 6, a through hole plating layer 64 'having a plating nick or a defective portion 90 having an insufficient layer thickness is formed, and the conductor resistance becomes excessively large, or the through hole is disconnected. Cause of. This tendency is more remarkable especially in a printed wiring board having a high aspect ratio, which has been a bottleneck in improving the yield of products.
【０００９】本発明は上記従来の事情に鑑みて提案され
たものであって、スルーホールメッキ層のメッキくわれ
やスルーホール断線を防止して、歩留りを向上させるこ
とを目的とするものである。The present invention has been proposed in view of the above conventional circumstances, and it is an object of the present invention to prevent plating nicks in the through-hole plating layer and disconnection of the through-holes to improve the yield. .
【００１０】[0010]
【課題を解決するための手段】上記目的を達成するため
に本発明は以下の手段を採用している。すなわち、図１
乃至３に示すように、メッキ処理液Ｓに浸漬された孔２
を備える基板１に対して、該基板１のほぼ板厚方向にメ
ッキ処理液Ｓを、噴出手段１００により噴射させる構成
としている。To achieve the above object, the present invention employs the following means. That is, FIG.
2 to 3, the holes 2 immersed in the plating solution S
The plating processing liquid S is jetted by the jetting means 100 to the substrate 1 provided with the above in substantially the thickness direction of the substrate 1.
【００１１】また、具体的には、上記基板１を上方より
懸架した状態で、メッキ処理槽１０に収容したメッキ処
理液Ｓに浸漬させるとともに、該基板１を少なくとも２
つの異なる停止位置Ａ0 ，Ａ1 ，…間で、鉛直軸回りに
間欠的に回動させる回動保持手段３と、上記停止位置Ａ
0 ，Ａ1 ，…のいずれかに停止した基板１に、メッキ処
理液Ｓを噴射する噴出手段１００n （n:停止位置に対応
する添字）を備える構成のメッキ処理装置が望ましい。Further, specifically, while the substrate 1 is suspended from above, it is immersed in the plating treatment liquid S contained in the plating treatment tank 10 and at least 2
A rotation holding means 3 for intermittently rotating around a vertical axis between three different stop positions A 0 , A 1 , ...
0, A 1, ... to the substrate 1 was stopped in any one of ejection means 100 n for injecting the plating treatment liquid S: the desired configuration of the plating apparatus having the (n subscript corresponding to a stop position).
【００１２】[0012]
【作用】上記の方法によれば、図１に示すように、上記
メッキ処理液Ｓの噴流が、基板１に穿孔された孔２内を
通過するので、該孔２内の気泡を除去するとともに、適
正な金属イオン濃度のメッキ処理液Ｓが供給される。According to the above method, as shown in FIG. 1, since the jet stream of the plating treatment liquid S passes through the holes 2 formed in the substrate 1, the air bubbles in the holes 2 are removed. A plating treatment liquid S having an appropriate metal ion concentration is supplied.
【００１３】[0013]
【実施例】以下、実施例をもとに更に詳細に説明する。
図２は本発明に係るメッキ処理装置の一実施例の概略を
示す斜視図であり、図３はその説明のための平面図であ
り、図４は本発明装置の全体概念図である。Embodiments will be described in more detail below with reference to embodiments.
2 is a perspective view showing an outline of an embodiment of the plating apparatus according to the present invention, FIG. 3 is a plan view for explaining the same, and FIG. 4 is a general conceptual view of the apparatus of the present invention.
【００１４】図２に示すように、本発明に係る一実施例
の電解メッキ処理装置は、例えば硫酸銅水溶液等のメッ
キ処理液Ｓを満たした電解メッキ処理槽１０と、該メッ
キ処理液Ｓ中で所定の間隔で互いに平行に配置されると
ともに、直流電源２０の陽極２０ｐに並列に接続された
２枚の電極板１１，１１と、該電極板１１，１１と所定
間隔を以て平行に配置されたメッキ層を均一に形成する
ための例えば表面に多数の孔が穿孔された塩化ビニル製
の遮蔽板１２，１２とを備える。As shown in FIG. 2, the electrolytic plating apparatus of one embodiment according to the present invention is an electrolytic plating tank 10 filled with a plating solution S such as an aqueous solution of copper sulfate, and the plating solution S. Are arranged in parallel with each other at a predetermined interval and are connected in parallel to the anode 20p of the DC power source 20 and two electrode plates 11, 11 are arranged in parallel with the electrode plates 11, 11 at a predetermined interval. It is provided with, for example, vinyl chloride shielding plates 12 and 12 for forming a plated layer uniformly, for example, a large number of holes are formed on the surface.
【００１５】また、基板１の回動保持手段３としては、
基板１の上端中央を把持するクランプ３１と、該クラン
プ３１を懸架するとともにクランプ３１を鉛直軸回りに
回動させる回転駆動装置３２とを備える。また、上記ク
ランプ３１は上記直流電源２０の陰極２０ｎに接続され
ている。Further, as the rotation holding means 3 for the substrate 1,
A clamp 31 that holds the center of the upper end of the substrate 1 and a rotation drive device 32 that suspends the clamp 31 and rotates the clamp 31 around a vertical axis are provided. The clamp 31 is connected to the cathode 20n of the DC power supply 20.
【００１６】さらに、上記メッキ処理槽１０は、図３に
示すように平面視において正六角形をなし、上記電極板
１１，１１に平行でなく、かつ相互に隣接する２面の周
壁１０ａ1 ，１０ａ2 には、該メッキ処理槽１０に収容
したメッキ処理液Ｓを還流させる図１あるいは図４に示
す噴出手段１００1 ，１００2 としてのポンプ１０
ｐ 1 ，１０ｐ2 に接続された複数の噴出口１０ｂ1 ，１
０ｂ2 を設けている。Further, the plating tank 10 is shown in FIG.
As shown in the plan view, it has a regular hexagonal shape and the electrode plate
Perimeters of two surfaces that are not parallel to each other and are adjacent to each other
Wall 10a1, 10a2In the plating tank 10
Refluxing the plated plating solution S shown in FIG. 1 or FIG.
Spouting means 1001, 1002As a pump 10
p 1, 10p210b connected to the1, 1
0b2Is provided.
【００１７】上記構成の電解メッキ処理装置による電解
メッキ処理を行うには、まず例えばスルーホール用の孔
２が穿孔されるとともに、図示しない下地導体層及びメ
ッキレジスト層の形成が完了した基板１の上端中央部を
回動保持手段３のクランプ３１で挟持する。該クランプ
３１の挟持によって基板１は上記直流電源２０の陰極２
０ｎに接続された状態となる。その後、メッキ処理槽１
０上方の待機位置にまで移送した後、所定の昇降手段を
稼働させて該待機位置から図２、図３の実線で示す上記
遮蔽板１２，１２の間隔であって、メッキ処理液Ｓ中の
上記電極板１１（遮蔽板１２）と該基板１が平行となる
基準停止位置Ａ0 にまで下降させることにより、メッキ
処理液Ｓに浸漬される。In order to carry out the electroplating process by the electroplating apparatus having the above-mentioned structure, first, for example, the through hole 2 is punched, and the substrate 1 on which the formation of the underlying conductor layer and the plating resist layer (not shown) is completed. The central portion of the upper end is clamped by the clamp 31 of the rotation holding means 3. By sandwiching the clamp 31, the substrate 1 is fixed to the cathode 2 of the DC power source 20.
It is in a state of being connected to 0n. After that, plating tank 1
After the transfer to the standby position above 0, the predetermined elevating means is operated so that the distance between the standby position and the shielding plates 12 shown by the solid lines in FIGS. The electrode plate 11 (shield plate 12) and the substrate 1 are lowered to a reference stop position A 0 in which they are parallel to each other, so that they are immersed in the plating treatment liquid S.
【００１８】次いで上記直流電源２０の電圧Ｖが上記陽
極２０ｐと陰極２０ｎとの間に印加されることにより、
電解メッキが開始される。このとき、本実施例では上記
電圧Ｖの印加開始より例えば５〜１０分程度の時間をお
いて、回転駆動装置３２を作動させて基板１を回動させ
る。この基板１の回動動作は図４に示すセンサ１８1 に
よって監視されており、基板１が上記基準停止位置Ａ0
から、平面視において時計回りに６０°回動した第１停
止位置Ａ1 でセンサ１８1 が作動して、コントローラ１
９にその旨の信号を伝送する。コントローラ１９は上記
信号を受けて回転駆動装置３２の作動を停止してポンプ
１０ｐ1 を作動させ、電解メッキ処理槽１０の周壁１０
ａ1 に備えられた噴出口１０ｂ1 よりメッキ処理液Ｓを
予めセットされた、例えば５〜１０分間程度噴射する。
これによって、孔２内に残留した気泡を除去するととも
に、孔２内に新しいメッキ処理液Ｓを供給する。Then, the voltage V of the DC power source 20 is applied between the anode 20p and the cathode 20n,
Electrolytic plating is started. At this time, in this embodiment, the rotation driving device 32 is operated to rotate the substrate 1 after a time of about 5 to 10 minutes from the start of the application of the voltage V. The rotation operation of the board 1 is monitored by the sensor 18 1 shown in FIG. 4, and the board 1 is moved to the reference stop position A 0.
From the above, the sensor 18 1 operates at the first stop position A 1 rotated by 60 ° clockwise in plan view, and the controller 1
A signal to that effect is transmitted to 9. In response to the above signal, the controller 19 stops the operation of the rotary drive device 32 and operates the pump 10p 1, and the peripheral wall 10 of the electrolytic plating tank 10 is operated.
a plating treatment liquid S from the spout 10b 1 provided in advance set to 1, injects example, about 5 to 10 minutes.
As a result, the bubbles remaining in the holes 2 are removed and a new plating solution S is supplied into the holes 2.
【００１９】このときのメッキ処理液Ｓの基板１への噴
出圧は該基板１のアスペクト比によっても異なるが、例
えばアスペクト比（板厚：孔径）が８：０．３５程度の
プリント基板では１５〜２０kg/cm3程度が適当であり、
上記範囲よりも小さな当接圧力であると本発明の所期の
効果は発現されず、上記範囲よりも大きな当接圧力であ
ると該噴流によって気泡が発生して、孔２内にトラップ
されるおそれがあり好ましくない。The ejection pressure of the plating solution S onto the substrate 1 at this time varies depending on the aspect ratio of the substrate 1, but is 15 for a printed circuit board having an aspect ratio (plate thickness: hole diameter) of about 8: 0.35. ~ 20kg / cm 3 is suitable,
If the contact pressure is smaller than the above range, the desired effect of the present invention is not exhibited, and if the contact pressure is larger than the above range, bubbles are generated by the jet flow and trapped in the holes 2. There is a risk that it is not preferable.
【００２０】次に上記設定時間の経過後、該コントロー
ラ１９の指令に基づき、上記ポンプ１０ｐ1 の作動を停
止させるとともに、回転駆動装置３２を再び作動して基
板１を回動させる。上記第１停止位置Ａ1 から平面視に
おいて反時計まわりに１２０°回動した第２停止位置Ａ
2 で同じく基板１の回動動作を監視するセンサ１８2 が
作動して、コントローラ１９にその旨の信号を伝送す
る。コントローラ１９は上記信号を受けて回転駆動装置
３２の作動を停止してポンプ１０ｐ2 を作動させ、電解
メッキ処理槽１０の周壁１０ａ2 に備えられた噴出口１
０ｂ2 より基板１に向けてメッキ処理液Ｓを上記設置時
間だけ噴射する。Next, after the lapse of the set time, based on a command from the controller 19, the operation of the pump 10p 1 is stopped and the rotary drive device 32 is operated again to rotate the substrate 1. The second stop position A rotated 120 ° counterclockwise from the first stop position A 1 in plan view
Similarly, at 2 , the sensor 18 2 for monitoring the rotational movement of the substrate 1 is activated, and a signal to that effect is transmitted to the controller 19. In response to the above signal, the controller 19 stops the operation of the rotary drive device 32 to operate the pump 10p 2, and the jet port 1 provided on the peripheral wall 10a 2 of the electrolytic plating tank 10
The plating solution S is jetted from 0b 2 toward the substrate 1 for the above installation time.
【００２１】さらに上記設定時間の経過後、上記ポンプ
１０ｐ1 の作動を停止させるとともに、回転駆動装置３
２が作動し、基板１は再び上記第２停止位置Ａ2 から平
面視において時計回りに１２０°回動して、第１停止位
置Ａ1 に停止して噴出口１０ｂ1 よりメッキ処理液Ｓを
噴射する。Further, after the lapse of the set time, the operation of the pump 10p 1 is stopped and the rotary drive unit 3
2 is activated, the substrate 1 is again rotated clockwise from the second stop position A 2 by 120 ° in a plan view, is stopped at the first stop position A 1 , and the plating solution S is discharged from the jet port 10b 1. To jet.
【００２２】以下、上記と同様の回動動作を繰り返し、
最後に基板１は第２停止位置Ａ2 におけるメッキ処理液
の噴射を受けた後、上記昇降駆動装置で上昇されて、電
解メッキ処理を完了する。Thereafter, the same rotating operation as described above is repeated,
Finally, the substrate 1 is sprayed with the plating solution at the second stop position A 2 and then lifted by the lifting drive device to complete the electrolytic plating process.
【００２３】上記各停止位置Ａ1 ，Ａ2 における停止時
間は電解メッキ処理の総処理時間を勘案してコントロー
ラ１９に設定すればよく、上記回動動作を複数回以上繰
り返すことが望ましい。The stop time at each of the stop positions A 1 and A 2 may be set in the controller 19 in consideration of the total processing time of the electrolytic plating process, and it is desirable to repeat the above-mentioned rotating operation a plurality of times.
【００２４】以上のように本実施例においては、メッキ
処理液Ｓに浸漬されたスルーホール用の孔２を備える基
板１に対して、噴出口１０ｂ1 （１０ｂ2 ）より噴出さ
せた該基板１のほぼ板厚方向のメッキ処理液Ｓの噴流を
形成しているので、該メッキ処理液Ｓの噴流が、基板１
に穿孔された孔２内を通過して、該孔２内にメッキ処理
液Ｓが滞留することがなく、該孔２内へ適正な金属イオ
ン濃度のメッキ処理液Ｓが供給される。As described above, in this embodiment, the substrate 1 having the through holes 2 immersed in the plating solution S is jetted from the jet port 10b 1 (10b 2 ) to the substrate 1. Since a jet of the plating treatment liquid S is formed substantially in the plate thickness direction, the jet of the plating treatment liquid S is
The plating treatment liquid S is supplied to the inside of the hole 2 without passing through the hole 2 formed in the hole 2 and staying in the hole 2.
【００２５】さらに本実施例においては、回動保持手段
３のクランプ３１によって懸架された基板１を、基準停
止位置Ａ0 、第１停止位置Ａ1 、第２停止位置Ａ2 の３
つの停止位置間で、鉛直軸回りに間欠的に回動させるの
で、基板１と電極板１１，１１との距離を時間的に同じ
とすることができ、均一なスルーホールメッキ層および
パターン導体層を形成することができる。Further, in this embodiment, the substrate 1 suspended by the clamp 31 of the rotation holding means 3 is divided into a reference stop position A 0 , a first stop position A 1 and a second stop position A 2 .
Since the rotation is intermittently made around the vertical axis between the two stop positions, the distance between the substrate 1 and the electrode plates 11, 11 can be made the same in time, and a uniform through-hole plating layer and a patterned conductor layer can be obtained. Can be formed.
【００２６】尚、上記実施例では、本発明をプリント配
線板の電解メッキ処理に適用した例を示したが、本発明
はこれに限られるものではなく、例えばスルーホールメ
ッキ層を無電解メッキによって形成する場合にも適用が
可能であることはいうまでもない。In the above embodiment, an example in which the present invention is applied to electrolytic plating treatment of a printed wiring board is shown, but the present invention is not limited to this, and for example, a through-hole plating layer is formed by electroless plating. Needless to say, it can be applied to the case of forming.
【００２７】[0027]
【発明の効果】以上のように、本発明によれば、メッキ
処理液に浸漬された孔を備えるプリント基板に対して、
該プリント基板のほぼ板厚方向にメッキ処理液を噴流さ
せることにより、上記メッキ処理液の噴流が、上記孔内
を通過するので、孔の内周壁に付着する気泡を除去する
ことができるとともに、メッキ処理液が間断なく供給さ
れるので、スルーホールメッキ層のメッキくわれや欠損
の発生を防止することができる。As described above, according to the present invention, the printed circuit board having the holes immersed in the plating solution is
By jetting the plating treatment liquid substantially in the plate thickness direction of the printed circuit board, the jet of the plating treatment liquid passes through the inside of the hole, so that it is possible to remove bubbles adhering to the inner peripheral wall of the hole. Since the plating solution is supplied without interruption, it is possible to prevent the occurrence of plating nicks and defects in the through-hole plating layer.
【００２８】さらに、本発明によれば、上記メッキ処理
液の噴射を上記プリント基板の間欠的な回動動作ととも
に行うことで、基板と電極板との距離を時間的に該基板
の全面で同じとすることができ、均一なスルーホールメ
ッキ層およびパターン導体層を形成することができる。Further, according to the present invention, by spraying the plating solution together with the intermittent rotation of the printed board, the distance between the board and the electrode plate is temporally the same over the entire surface of the board. The uniform through-hole plating layer and the patterned conductor layer can be formed.
【図１】本発明の概念図である。FIG. 1 is a conceptual diagram of the present invention.
【図２】本発明に係る一実施例の概略を示す斜視図であ
る。FIG. 2 is a perspective view showing an outline of an embodiment according to the present invention.
【図３】本発明に係る一実施例の説明のための平面図で
ある。FIG. 3 is a plan view for explaining an embodiment according to the present invention.
【図４】本発明装置の全体概念図である。FIG. 4 is an overall conceptual diagram of the device of the present invention.
【図５】従来例の概念図である。FIG. 5 is a conceptual diagram of a conventional example.
【図６】多層プリント配線板の要部断面図である。FIG. 6 is a cross-sectional view of an essential part of a multilayer printed wiring board.
１ 基板 ２ 孔 ３ 回動保持手段 １０ メッキ処理槽 Ｓ メッキ処理液 Ａ0 ，Ａ1 ，Ａ2 停止位置 １００1 ，１００2 噴出手段DESCRIPTION OF SYMBOLS 1 substrate 2 hole 3 rotation holding means 10 plating treatment tank S plating treatment liquid A 0 , A 1 , A 2 stop position 100 1 , 100 2 jetting means
Claims (2)
備える基板(1) に対して、該基板(1) のほぼ板厚方向に
メッキ処理液(S) を噴射する噴出手段(100)を備えるこ
とを特徴とするプリント基板のメッキ処理装置。1. A jet for jetting a plating treatment liquid (S) to a substrate (1) having a hole (2) immersed in the plating treatment liquid (S) substantially in the thickness direction of the substrate (1). An apparatus for plating a printed circuit board, which is provided with means (100).
で、メッキ処理槽(10)に収容したメッキ処理液(S) に浸
漬させるとともに、該基板(1) を少なくとも２つの異な
る停止位置(A0),(A1),…間で、鉛直軸回りに間欠的に回
動させる回動保持手段(3) と、上記停止位置(A0),(A1),
…のいずれかに停止した基板(1) に、メッキ処理液(S)
を噴射する噴出手段(100n )(n:停止位置に対応する添
字) を備えることを特徴とする請求項１に記載のプリン
ト基板のメッキ処理装置。2. The substrate (1) is suspended from above and immersed in a plating treatment liquid (S) contained in a plating treatment tank (10), and the substrate (1) is stopped at at least two different stop positions. Between (A 0 ), (A 1 ), ... Rotation holding means (3) for intermittently rotating about the vertical axis, and the stop positions (A 0 ), (A 1 ),
The plating solution (S) is applied to the substrate (1) stopped in any of the
The plating apparatus for a printed circuit board according to claim 1, further comprising: a jetting unit (100 n ) for jetting (n: a subscript corresponding to a stop position).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16556291A JPH0513956A (en) | 1991-07-05 | 1991-07-05 | Plating processing device for printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16556291A JPH0513956A (en) | 1991-07-05 | 1991-07-05 | Plating processing device for printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0513956A true JPH0513956A (en) | 1993-01-22 |
Family
ID=15814722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16556291A Withdrawn JPH0513956A (en) | 1991-07-05 | 1991-07-05 | Plating processing device for printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0513956A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002079548A1 (en) * | 2001-03-28 | 2002-10-10 | Fujitsu Limited | Electrolytic plating tank |
| CN102330085A (en) * | 2011-09-13 | 2012-01-25 | 南京航空航天大学 | Composite processing method and device of multilayer film by chemical plating and jet electroplating |
| JP2017145438A (en) * | 2016-02-15 | 2017-08-24 | 日本特殊陶業株式会社 | Partial plating method and manufacturing method of main body metal fitting for spark plug |
-
1991
- 1991-07-05 JP JP16556291A patent/JPH0513956A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002079548A1 (en) * | 2001-03-28 | 2002-10-10 | Fujitsu Limited | Electrolytic plating tank |
| CN102330085A (en) * | 2011-09-13 | 2012-01-25 | 南京航空航天大学 | Composite processing method and device of multilayer film by chemical plating and jet electroplating |
| JP2017145438A (en) * | 2016-02-15 | 2017-08-24 | 日本特殊陶業株式会社 | Partial plating method and manufacturing method of main body metal fitting for spark plug |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1179617A1 (en) | Apparatus for plating substrate, method for plating substrate, electrolytic processing method, and apparatus thereof | |
| EP0638669B1 (en) | Electroplating process | |
| US5879738A (en) | Method for fluid transport for the surface treatment of planar substrates | |
| JP4148477B2 (en) | Sheet used for manufacturing multilayer wiring board, and plating method and plating apparatus used for manufacturing the sheet | |
| KR970073249A (en) | MANUFACTURING LINE FOR MULTI-LAYERED PRINTED CIRCUIT BOARD | |
| WO1987007654A1 (en) | Printed circuit board fine line plating | |
| JPH0513956A (en) | Plating processing device for printed board | |
| JPH11229198A (en) | Plating apparatus for printed wiring board | |
| JP2003200090A (en) | Spray nozzle for printed circuit board and wet line facility using the nozzle | |
| JP4114456B2 (en) | Electroless plating apparatus and electroless plating method | |
| JPS61270889A (en) | Plating apparatus | |
| JP3181884B2 (en) | Chemical treatment equipment | |
| JP4410387B2 (en) | Via hole filling equipment | |
| JPH02211692A (en) | Manufacture of printed wiring board | |
| JPH0791680B2 (en) | Stirring method of electrolytic plating solution | |
| JP3243666U (en) | New equipment for cathode conductive rollers used in chip electroplating or chip cleaning machines | |
| JPH07212011A (en) | Printed circuit board washing device | |
| JPH1112785A (en) | Electroplating device | |
| JPH0696796B2 (en) | Chemical processing equipment | |
| JP2003152315A (en) | Cleaning equipment | |
| JPH1093241A (en) | Post-connection type printed wiring board and manufacturing method thereof | |
| JP2903789B2 (en) | Printed wiring board etching method and etching apparatus | |
| JP2001036217A (en) | Manufacture of wiring board and etching device | |
| JPS6277495A (en) | Plating device for printed circuit board | |
| JPS6116431B2 (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19981008 |