JPH0696796B2 - Chemical processing equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to a chemical processing apparatus. That is, for thin plate materials such as printed wiring boards,
The present invention relates to a chemical treatment apparatus which is used in the manufacturing process and the like, and which carries out electrolytic soft etching treatment, plating treatment and other chemical treatments while immersing and transporting the treatment liquid.

[0002]

2. Description of the Related Art Pretreatment of various main treatments is extremely important in the manufacturing process of thin plate materials such as printed wiring boards.
The quality often affects the quality of the main processing to be performed next. For example, in the manufacturing process of a printed wiring board, a mechanical polishing process has been conventionally performed as a pretreatment such as resist sticking. However, this mechanical polishing process involves oxidation, stains and adhering substances on the surface of the printed wiring board. Etc., and the surface of the printed wiring board is smoothed and roughened to form fine irregularities, which improves the adhesiveness of the adhesive during the resist application, which is the main process afterwards, to improve the adhesive adhesion area. It is being made to expand. Further, recently, an electrolytic soft etching process is becoming popular in place of such a mechanical polishing process. In this electrolytic soft etching treatment, the printed wiring board is immersed in a treatment liquid and subjected to a chemical treatment to remove the oxidation, dirt, adhering substances, etc. on the surface of the printed wiring board as well as the mechanical polishing treatment described above. The surface is smoothed and roughened to form fine irregularities so that the resist can be applied later.

Various other chemical treatments are carried out in the manufacturing process of thin plate materials such as printed wiring boards. Of course, a chemical treatment is also performed as a so-called main treatment, and for example, the plating treatment is performed by immersing the printed wiring board in a treatment liquid which is a plating solution to plate a predetermined portion of the printed wiring board, for example, a through hole. is there. Incidentally, such plating treatment has been conventionally performed by suspending a printed wiring board in a vertical state from above and immersing it in a treatment liquid.

[0004]

By the way, the following problems have been pointed out in such a conventional example. First, the mechanical polishing process described above is as follows. In other words, the printed wiring boards have recently become more dense, multilayered, finer, and finer circuits, and their thickness has been extremely thinned to about 0.4 mm or less, and the material is also extremely flexible. Those that do not exist are being used, and they are becoming softer and more flexible. Therefore, they must be handled with extreme caution. Therefore, when such a printed wiring board is mechanically polished by a brush polishing device and a buff polishing device, the printed wiring board is not smoothly transported, and the printed wiring board is flipped up in the rotation direction and turned over.
Damage such as bending, bending, and bending often occurs,
Further, due to the rotational frictional heat of the buff, the printed wiring board is often thermally deformed to cause defects such as warpage, which causes a problem of low yield.

Secondly, the above-mentioned electrolytic soft etching treatment is as follows. That is, since a chemical treatment device is used to carry out the chemical treatment by immersing the printed wiring board in the treatment liquid while transporting the printed wiring board, the problems such as the poor yield in the mechanical polishing treatment described above are solved, and it is extremely thin and flexible. It can deal with However, this electrolytic soft etching process causes oxidation of the surface of the printed wiring board,
If there is a lot of dirt, attachments, etc., or if they are severe, they are not removed sufficiently and remain without being removed, and surface roughening often becomes insufficient, causing poor resist attachment,
In the end, there is a problem that it becomes an obstacle to high density, multi-layer, fine and fine circuit of the printed wiring board.

Thirdly, a spray method was also adopted instead of the static bath method of immersing in the processing solution as described above, but the following problems have been pointed out with respect to the electrolytic soft etching processing of this spray method. It was That is, using this spray-type chemical treatment device, when a treatment liquid is jetted in air from a number of spray nozzles to a printed wiring board to be conveyed, even if various arrangements of spray nozzles are devised, The spray pressure inevitably causes unevenness and variation in the electrolytic soft etching process. Then, based on such unevenness / variation of the electrolytic soft etching treatment, unevenness / variation also occurs in the removal and roughening of the surface of the printed wiring board, such as oxidation, stains, attachments, etc., which causes resist sticking failure,
In the end, it was pointed out that it hinders high density, multi-layer, fine, and fine circuit of the printed wiring board.

Fourthly, the following problems have been pointed out regarding the conventional electrolytic soft etching treatment. That is, since the printed wiring board is made of a short material cut into a certain size, it is not possible to immerse it in the treatment liquid or spray the treatment liquid from the spray nozzle while continuously conveying it in the chemical treatment device. Conventionally, it was generally considered difficult. In other words, when dipping an endless strip, it is easy to carry out dipping, spraying, etc. for electrolytic soft etching while continuously transporting it, but this is difficult for a cut printed wiring board. The work efficiency was poor because they were individually viewed and individually dipped and sprayed.

Fifthly, the chemical treatment is not limited to the electrolytic soft etching treatment as described above, and the chemical treatment is not sufficient for general chemical treatment apparatuses that perform chemical treatment by dipping a printed wiring board or other thin plate material in the treatment liquid. In addition, it was pointed out that unevenness and variations were also pointed out, and it was not easy to carry out chemical treatment while continuously transferring.

Sixth, in addition to these, the following problems have been pointed out regarding the above-mentioned plating treatment. That is, this plating treatment, which is an example of a chemical treatment, has conventionally been performed by sequentially suspending a printed wiring board in a vertical state from above and immersing the printed wiring board in a treatment liquid. In other various manufacturing processes, various processes are performed while the printed wiring board is transported in a horizontal state, that is, horizontally. In this way, in the printed wiring board manufacturing process, only the chemical processing equipment that performs the plating processing is in the vertical state, and the other equipment is in the horizontal orientation, so it is difficult to connect and link the equipment. This is a hindrance to the automatic production line of each manufacturing process.

Seventh, the following problems have been pointed out regarding the above-mentioned plating treatment. That is, since the printed wiring board is vertically suspended from the top and immersed in the treatment liquid, the chemical treatment apparatus for performing the plating treatment needs to have an open upper surface and cannot be hermetically sealed. Therefore, gas, odor, etc. generated from the plating solution, which is a processing solution, flows out to the outside, polluting the inside of the factory and corroding and deteriorating machines and products, and worsening the working environment and adversely affecting the health of workers. There was an occasion.

In view of the above situation, the present invention has been made as a result of earnest research efforts by the inventor in order to solve the problems of the above-mentioned conventional examples. A thin plate material such as a printed wiring board in a liquid is sent by sandwiching one edge of it with upper and lower conveying roller groups, and horizontally supporting the processing liquid by ejecting it from a number of lower ejection holes. As a result, with regard to thin plate materials such as printed wiring boards, firstly, bending, warping, sagging, etc. can be prevented, and smooth and reliable horizontal transportation can be performed. Secondly, electrolytic soft etching treatment and other chemical treatments are sufficient. And surely, thirdly, evenly, without unevenness and variation, fourth
In addition to the above, in addition to this, the plating treatment according to claim 3 can be further connected / interlocked with another device, and sixthly, the upper surface of the device can be connected. It is an object of the present invention to propose a chemical treatment device capable of closing / sealing.

[0012]

The technical means of the present invention for achieving this object are as follows. First, claim 1
About: That is, this chemical processing device
The present invention relates to a device for carrying out a chemical treatment by immersing a thin plate material in a horizontal direction and immersing it in a treatment liquid. Then, a group of upper and lower conveying rollers that sandwich and feed one side edge of the thin plate material in the treatment liquid, and a large number of ejection holes that support the thin liquid material from below by ejecting the treatment liquid toward the thin plate material. And.

The second aspect of the present invention is as follows. This chemical treatment apparatus is used in a manufacturing process of a printed wiring board, and relates to an apparatus for carrying out the electrolytic soft etching treatment by horizontally conveying the printed wiring board and immersing it in a treatment liquid.
Then, a liquid bath of the treatment liquid in which the printed wiring board is dipped, upper and lower conveying roller groups which are disposed in the treatment liquid of the liquid bath and which feed by sandwiching one side edge of the printed wiring board, and the liquid. A drive mechanism arranged outside the tank to rotate and drive the conveying roller group, and arranged in the treatment liquid of the liquid tank and substantially entirely opposed to the lower surface of the printed wiring board, which is conveyed, A large number of ejection holes for ejecting the treatment liquid toward the printed wiring board and supporting it from the lower side, and a plurality of ejection holes which are arranged horizontally in the treatment liquid in the liquid tank and are opposed to the upper surface of the printed wiring board to be conveyed. A level control bar to which the printed wiring board is appropriately pressed from the lower side by the processing liquid sprayed from the holes,
It has a minus electrode horizontally arranged on the side of the treatment liquid of the liquid tank, and a plus electrode arranged on the side of the transport rollers and the printed wiring board side.

Further, claim 3 is as follows. That is, this chemical treatment apparatus is used in a manufacturing process of a printed wiring board, and relates to an apparatus for carrying out a plating treatment by immersing the printed wiring board in a treatment liquid while horizontally conveying it. Then, a liquid bath of the treatment liquid in which the printed wiring board is dipped, upper and lower conveying roller groups which are disposed in the treatment liquid of the liquid bath and which feed by sandwiching one side edge of the printed wiring board, and the liquid. A drive mechanism arranged outside the tank to rotate and drive the conveying roller group, and arranged in the treatment liquid of the liquid tank and substantially entirely opposed to the lower surface of the printed wiring board, which is conveyed,
A large number of ejection holes for injecting the treatment liquid toward the printed wiring board and supporting the ejection liquid from the lower side, and arranged horizontally in the treatment liquid in the liquid tank,
A level control bar, which is positioned to face the upper surface of the printed wiring board being conveyed, and on which the printed wiring board is appropriately pressed from below by the processing liquid ejected from the ejection holes, and a processing liquid side of the liquid tank. It comprises a horizontally arranged positive electrode and a negative electrode arranged on the side of the transport rollers and the printed wiring board.

[0015]

Since the present invention comprises such means, it operates as follows. In this chemical processing device, a thin plate material such as a printed wiring board is sent while being sandwiched at one end edge by a group of upper and lower conveying rollers, and as a supplement, a process of being ejected from a large number of lower ejection holes. It is pushed up by the jet of liquid and supported horizontally. Then, while being transported horizontally in this manner, it is immersed in the treatment liquid and subjected to chemical treatment. In the second and third aspects, the printed wiring board is transported while the height level is horizontally regulated by the level regulation bar by the upper and lower transportation roller groups which are rotationally driven by the drive mechanism. Then, by arranging the electrodes in a predetermined manner, the electrolytic soft etching treatment according to claim 2
In claim 3, plating treatment is performed.

Therefore, in this chemical processing apparatus, the following is performed. First, the thin plate materials such as printed wiring boards are extremely thin.
Even if it is made more flexible, it is prevented from springing up, turning over, bending, bending, bending, deforming, warping, sagging, etc., and conveys smoothly and reliably horizontally. Second,
A thin plate material such as a printed wiring board is chemically treated in a jet stream of the jetted treatment liquid. Therefore, this chemical treatment is sufficiently and reliably performed. Thirdly, a thin plate material such as a printed wiring board is immersed in a processing liquid for chemical treatment even though it is in a jet stream. Therefore, the chemical treatment is performed uniformly without unevenness or variation. Fourthly, a thin plate material such as a printed wiring board is conveyed with one end edge thereof being sandwiched by the upper and lower conveyance roller groups. Therefore, it becomes possible to carry out chemical treatment by dipping, jetting, etc. while continuously and sequentially transporting. Fifthly, in addition to these, in the chemical treatment apparatus according to the third aspect, the plating treatment is carried out while being conveyed horizontally, so that the printed wiring board can be easily connected and linked with other production apparatuses. Sixth, according to the third aspect, the upper surface of the device can be closed to seal the device. Therefore, it is possible to prevent the gas, odor, etc., generated from the processing liquid, which is the plating liquid, from flowing out.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below based on the embodiments shown in the drawings. 1 is a front sectional view of an embodiment of the present invention, and FIG. 2 is a side view thereof.

In this chemical treatment apparatus, a metal plate or non-metal thin plate material is conveyed horizontally while being immersed in a treatment liquid A consisting of a chemical such as acid or alkali or simply water for electrolytic treatment and electroless treatment. Regarding an apparatus for performing plating processing, electrolytic plating processing, and other chemical processing, the illustrated embodiment is used in a manufacturing process of a printed wiring board P, which is an example of a thin plate material, and the processing is performed while the printed wiring board P is horizontally transported. The present invention relates to an apparatus that is immersed in a liquid A to perform an electrolytic soft etching process, which is an example of a chemical process. First, the printed wiring board P will be described. The printed wiring board P is a single-sided board for consumer use, O
There are various types of double-sided substrates for A, multi-layered substrates for computers, flexible substrates for computers, and so on, and there are various types of manufacturing processes. For example, a printed wiring board P made of a double-sided board is used for material cutting, drilling, polishing / electrolytic soft etching, through-hole plating, polishing / electrolytic soft etching, resist sticking, exposure, development, etching, resist stripping,
It is manufactured by following the process of etc.

That is, first, a double-sided copper-clad laminated material in which copper foil is laminated on both sides of an insulating material is cut into short-sized materials of a work size, and then a hole is bored for conducting on the front and back sides, and then a surface treatment After the double-side polishing or the electrolytic soft etching treatment is performed, the through-hole plating treatment using the plating solution is performed. That is, the inner wall of the through hole is plated so that the electric circuit on the front surface and the electric circuit on the rear surface are electrically connected. After that, after double-side polishing or electrolytic soft etching is again performed as the surface treatment, the resist is applied in the form of a film, and then a circuit photograph is exposed to expose the resist, after which the resist is exposed and cured. , And other parts are dissolved and removed by spraying the developing solution. Then, in the etching machine, the copper foil in the portion where the resist is hardened in this way is left, and the copper foil in the portion where the resist is dissolved and removed is dissolved and removed by jetting a corrosive liquid.
After that, the remaining hardened resist described above is dissolved and removed by spraying the stripping solution, and thus the printed wiring board P on which the electric circuit is formed is manufactured. As described above, in the manufacturing process of the printed wiring board P, the plating solution, the processing solution for the electrolytic soft etching processing, the developing solution, the corrosive solution,
A chemical treatment using various different treatment liquids such as a stripping liquid is carried out by each device. A resist is a photosensitive dry film for drawing an electric circuit,
Liquid photosensitive resist, electrodeposition resist, etc.

The illustrated embodiment relates to a chemical processing apparatus for performing electrolytic soft etching processing in the manufacturing process of such a printed wiring board P, and includes the following liquid tank 1, upper and lower conveying rollers 2 group, and driving mechanism 3 thereof. , An ejection hole 4, a level control bar 5, a minus electrode 6, a plus electrode 7 and the like.
To describe these in detail, first, the liquid tank 1 is composed of a tank of the processing liquid A which is a chemical liquid for electrolytic soft etching treatment in which the printed wiring board P is immersed, and the liquid tank 1 is closed by a lid 8. It is arranged in the processing chamber 9 of the chemical processing apparatus. In the liquid tank 1, a concentration meter for the processing liquid A, a circulation pump,
A filter, a heater for temperature control, a controller thereof, and a rectifier (not shown) for controlling the current required for electrolysis by the negative electrode 6 and the positive electrode 7, etc. are attached.

The upper and lower conveying rollers 2 are arranged in the treatment liquid A in the liquid tank 1 and sandwich one end of the printed wiring board P for feeding. That is, a group of the upper and lower transport rollers 2 is provided in a line in a vertical pair along one side in the liquid tank 1, and a gripping margin (electricity of about several tens mm) formed on the four sides of the printed wiring board P is provided. One of the parts (where the circuit is not provided) is sandwiched from above and below and is fed in the transport direction. The drive mechanism 3 that rotationally drives the group of transport rollers 2 is arranged outside the liquid tank 1. That is, the drive mechanism 3 includes a motor 10 as a drive source, a transmission unit 11 such as a belt, a worm wheel, and a transmission shaft connected to the drive shaft of the motor 10, and a large number of shafts 12 connected to the transmission unit 11 at one end thereof.
And the bearing 13 of the shaft 12 and the like. The other end of each shaft 12 extends into the liquid tank 1, and the transport roller 2 groups are connected and fixed.

Next, a large number of ejection holes 4 are arranged in the treatment liquid A in the liquid tank 1 and are positioned on the lower surface of the conveyed printed wiring board P with a space therebetween and are substantially opposed to each other on the printed wiring board P. The processing liquid A is sprayed and pushed up from below to support it. A large number of ejection holes 4 in the illustrated example are formed on the upper surface of the perforated plate 14 which is horizontally arranged on the lower side of the liquid tank 1, and the treatment liquid in the liquid tank 1 is provided in the hollow portion of the perforated plate 14. A is supplied by a pump (not shown).
The ejection holes 4 are not limited to those using the perforated plate 14 in the illustrated example, and for example, a large number of nozzles may be used. On the other hand, the level control bar 5 is horizontally disposed in the processing liquid A in the liquid tank 1 and is positioned to face the upper surface of the printed wiring board P that is transported, and the printed wiring board P is formed by the processing liquid A ejected from the ejection holes. Is pressed from below as appropriate. That is, the level regulation bar 5 is arranged on the upper side on the opposite side to the ejection hole 4 via the printed wiring board P, and is composed of a plurality of round bars provided along the conveyance direction of the printed wiring board P in the illustrated example. . The printed wiring board P, which is horizontally supported by the jet of the treatment liquid A, is appropriately pressed against the level regulation bar 5 from the lower side, so that the height level is always regulated horizontally.

The minus electrodes 6 are arranged horizontally on the side of the treatment liquid A in the liquid tank 1, and in the illustrated example, a large number of them are arranged horizontally above and below the printed wiring board P to be conveyed. It consists of an electrode plate. The plus electrode 7 is arranged on the side of the transport roller 2 and the printed wiring board P,
In the illustrated example, a carbon brush electrode is used and is pressed against the shaft 12 of the drive mechanism 3 by a spring 15.
In this way, the negative electrode 6 made of a carbon brush electrode is connected to the transport roller 2 group and the printed wiring board P via the drive mechanism 3.

The present invention is constructed as described above. Then it becomes as follows. In this chemical treatment apparatus for electrolytic soft etching treatment, the printed wiring board P, which is an example of a thin plate material, is fed with its one end edge sandwiched between the upper and lower conveyance rollers 2 groups, and as a supplement, It is pushed up by the jet stream of the treatment liquid A jetted from the large number of jet holes 4 on the lower side and supported horizontally. Then, the printed wiring board P is immersed in the treatment liquid A and subjected to a chemical treatment, that is, an electrolytic soft etching treatment, on both sides thereof while being conveyed horizontally in this manner. That is, the printed wiring board P is thus regulated by the upper and lower conveyance rollers 2 which are rotationally driven in the liquid tank 1 by the driving mechanism 3 and the height level is regulated horizontally by the level regulation bar 5. Be transported. The electrolytic soft etching process is performed by arranging the minus electrode 6 and the plus electrode 7 in a predetermined manner.

Then, in the chemical treatment apparatus for carrying out this electrolytic soft etching treatment, the following first, second, third and fourth are performed. First of all, since the electrolytic soft etching process, that is, the chemical process is performed instead of the mechanical polishing process such as the brush polishing and the buff polishing as in the conventional example of this kind, the printed wiring board P can be made extremely thin and flexible. Even if it advances, it is prevented from jumping up, turning over, bending, bending, bending, deforming, warping and the like. Moreover, since the printed wiring board P is transported while being supported by the jet flow of the processing liquid A from the ejection holes 4, the printed wiring board P is prevented from being bent, warped, drooped, or the like due to its own weight. Be transported horizontally. Secondly, the printed wiring board P is immersed in the treatment liquid A in the jet stream of the treatment liquid A ejected from the ejection holes 4, and the electrolytic soft etching treatment is performed. Therefore, even if the surface of the printed wiring board P is heavily oxidized or soiled or attached, the electrolytic soft etching treatment for removing the surface and roughening the surface can be performed by dipping in a still bath of this type of conventional example. In comparison, it is performed sufficiently and reliably.

Thirdly, the printed wiring board P has the ejection holes 4
Although it is in the jet stream of the treatment liquid A ejected from the above, the electrolytic soft etching treatment is performed only by being immersed in the treatment liquid A. As in the conventional example of this kind, the treatment is performed by a spray nozzle in air. The liquid A is not being jetted. Therefore, the electrolytic soft etching treatment for removing the oxidation, dirt, adhering substances, etc. on the surface of the printed wiring board P and roughening the surface is not affected by the spray pressure and the like, and there is no obstacle in the treatment liquid A. Therefore, there is no unevenness or variation, and it is performed uniformly as a whole. Furthermore, the processing liquid A
Since the printed wiring board P is also conveyed horizontally with respect to the minus electrode 6 arranged horizontally inside, the distance between the two is constant, and this aspect also prevents unevenness and variations in the electrolytic soft etching process. Fourth, the printed wiring board P is
The one side edge is sandwiched by two groups of upper and lower transport rollers,
It is transported while being held. Therefore, although the printed wiring board P is made of a short material cut into a certain size,
It is possible to carry out electrolytic soft etching treatment by dipping, jetting, etc. while sequentially and sequentially transporting them individually rather than individually as in the conventional example of this kind.

The above is the description of the illustrated embodiment. In addition,
Although the illustrated embodiment relates to a chemical treatment apparatus for electrolytic soft etching, the treating solution A is not a solution for electrolytic soft etching treatment but a plating solution, and the plus and minus of the negative electrode 6 and the plus electrode 7 are opposite to each other. By setting to, this chemical processing apparatus is for plating processing. That is, a plating solution is used as the processing solution A, and the minus electrode 6 shown in the figure is changed to plus and the plus electrode 7 shown in the figure is changed to minus, whereby a chemical treatment apparatus for plating treatment is obtained. In addition to the first, second, third, and fourth points described above for the electrolytic soft etching treatment, the chemical treatment apparatus for plating treatment further includes the following fifth and sixth treatments. Become. That is, fifthly, in this chemical processing apparatus for plating, the plating is performed while being conveyed horizontally, that is, horizontally instead of the vertical as in the conventional example of this kind. In other various manufacturing processes, it is common that various processes are performed while being transported horizontally. Therefore, it becomes easy to connect and interlock such another device with the chemical processing device for performing the plating process. Sixth, in this chemical processing apparatus for plating, the plating is carried out while the processing solution A is conveyed horizontally instead of being vertically suspended from above in the processing solution as in the conventional example of this kind. Since the processing is performed, it is easy to close the upper surface side of the processing chamber 9 of the apparatus with the lid 8 and seal the entire apparatus. Therefore, the treatment liquid A which is the plating liquid
It is possible to prevent the gas, odor, etc. generated from the product from flowing out.

[0028]

As described above, the chemical treatment apparatus according to the first, second, and third aspects of the present invention has one side of the upper and lower conveying roller groups for the thin plate material such as the printed wiring board in the treatment liquid. The following effects are exhibited by sandwiching the edge and sending it, and by spraying the treatment liquid horizontally from a large number of ejection holes on the lower side. First, the thin plate material such as the printed wiring board is prevented from bending, warping, sagging, and the like. That is, the printed wiring board and the like are prevented from splashing, bending, deforming, warping, and drooping, and are smoothly and reliably transported horizontally without being damaged, and there are few defects and the yield is improved. In particular, in the printed wiring board, which has recently become ultra-thin and has become softer and more flexible as a material, such an effect is significant.

Second, the electrolytic soft etching process and other chemical processes are sufficiently and surely performed. That is, the surface of the printed wiring board is often oxidized, soiled and attached.
Even in severe cases, the electrolytic soft etching treatment ensures that these are removed, and the surface is sufficiently roughened to form fine irregularities, so that post-application of resist is also complete, and high-density printed wiring boards can be obtained. It is possible to easily deal with the trend toward higher resolution, multi-layering, finer processing, and finer circuits. Other,
The chemical treatment of a thin plate material such as a printed wiring board is sufficiently and surely performed, so that it has various advantages.

Thirdly, the electrolytic soft etching treatment and other chemical treatments are uniformly performed without unevenness or variation. That is, the surface of the printed wiring board is uniformly oxidized without any unevenness or variation in the removal of stains, adhering substances, etc. and the roughening of the surface. This makes it possible to sufficiently cope with higher density, multi-layer, finer, and finer circuits of printed wiring boards. In addition, the chemical treatment of a thin plate material such as a printed wiring board is uniformly performed on the whole without unevenness or variation, which has various advantages.

Fourth, such chemical treatment can be performed while continuously transporting a thin plate material such as a printed wiring board. That is, even in the case of a thin plate material such as a printed wiring board made of a short material cut into a certain size, endless belt-like material can be simultaneously conveyed and chemically treated by dipping, jetting, etc. Is improved.

Fifthly, in addition to these, as for the chemical treatment apparatus for carrying out the plating treatment of the third aspect, by carrying out this while horizontally conveying, the following effects are further exhibited. That is, in the various other manufacturing processes of the printed wiring board before and after the plating process, it is common that the various processes are performed while being horizontally transported. It will be possible to connect and interlock with each other, opening the way to an automated line for each manufacturing process.

Sixth, the chemical treatment apparatus for carrying out the plating treatment according to the third aspect also exhibits the following effects. That is, in this chemical processing device, the plating process is performed while the printed wiring board is conveyed horizontally, so that the upper surface side of the device can be closed to hermetically seal the device. It is possible to prevent gas, odor, etc. generated from the barrel treatment liquid from flowing out. Therefore, it is possible to surely avoid contamination in the factory due to such gases and odors, corrosion / deterioration of machines / products, deterioration of working environment, adverse effects on the health of workers, and the like. As described above, the effects of the present invention can be remarkably large, such as the problems existing in this type of conventional example are eliminated.

[Brief description of drawings]

FIG. 1 is a front sectional view showing an embodiment of a chemical processing apparatus according to the present invention.

FIG. 2 is an explanatory side view of the same.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Liquid tank 2 Conveying roller 3 Driving mechanism 4 Jet hole 5 Level regulation bar 6 Minus electrode 7 Positive electrode 8 Lid 9 Processing chamber 10 Motor 11 Transmission means 12 Shaft 13 Bearing 14 Perforated plate 15 Spring A Treatment liquid P Printed wiring board (thin) Plate material)

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Internal reference number FI Technical display location C25F 7/00 C 8414-4K L 8414-4K H05K 3/06 Q 9443-4E 3/18 G 7511 -4E

Claims (3)

[Claims] 1. A device for performing a chemical treatment by immersing a thin plate material in a horizontal direction while immersing it in a treatment liquid, and a group of upper and lower conveying rollers for feeding by sandwiching one side edge of the thin plate material in the treatment liquid. And a plurality of ejection holes for ejecting and supporting the treatment liquid from the lower side toward the thin plate material in the treatment liquid. 2. An apparatus used in a manufacturing process of a printed wiring board, which carries out the electrolytic soft etching treatment by immersing the printed wiring board in a treatment liquid while horizontally conveying the printed wiring board,
A liquid tank of the processing liquid in which the printed wiring board is dipped, a group of upper and lower conveying rollers which are arranged in the processing liquid of the liquid tank and which sandwiches one side edge of the printed wiring board to feed the liquid, and the outside of the liquid tank. And a drive mechanism for rotating and driving the transport roller group, and a printed wiring board that is disposed in the processing liquid in the liquid tank and is substantially entirely opposed to the lower surface of the printed wiring board that is transported, A large number of ejection holes for ejecting the treatment liquid toward the substrate and supporting the treatment liquid from below, and a plurality of ejection holes which are arranged horizontally in the treatment liquid in the liquid tank and which are opposed to the upper surface of the printed wiring board to be conveyed. A level control bar on which the printed wiring board is appropriately pressed by the jetted processing liquid from the lower side, a negative electrode horizontally arranged on the processing liquid side of the liquid tank, the transfer roller group and the printed wiring board side A plus electrode arranged in
A chemical processing apparatus comprising: 3. An apparatus which is used in a manufacturing process of a printed wiring board, and which carries out a plating treatment by immersing the printed wiring board in a treatment liquid while horizontally conveying the printed wiring board, wherein the treatment is performed in which the printed wiring board is immersed. A liquid tank of liquid, upper and lower conveying roller groups arranged in the processing liquid of the liquid tank and sandwiching one side edge of the printed wiring board to send, and rotationally driving the conveying roller group arranged outside the liquid tank. Driving mechanism and the processing liquid in the liquid tank, which is disposed on the lower surface of the printed wiring board to be conveyed and is almost entirely opposed to the lower surface, and sprays the processing liquid toward the printed wiring board. A large number of ejection holes supported from the side, and the printed wiring board is positioned opposite to the upper surface of the printed wiring board that is horizontally arranged and conveyed in the treatment liquid of the liquid tank, and the treatment liquid ejected from the ejection holes Level regulation bar where the board is pressed from below as appropriate And a plus electrode horizontally arranged on the treatment liquid side of the liquid tank, and a minus electrode arranged on the transport roller group and the printed wiring board side.