JP3265529B2 - Manufacturing method of printed wiring board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board and a printed wiring board , and more particularly to a method for manufacturing a multilayer printed wiring board by a post connection method.

[0002]

2. Description of the Related Art The following documents disclose techniques relating to a method of manufacturing this type of post-connection type printed wiring board. Reference: S.M. Itaya et al; "High De
nity Build-UP Wiring Boa
rds Using Conventional Pr
integrated Wiring Boards Process
ss ": 1995, IEMT SYMPOSIUM
Proceedings (US), p. 96-p. 102

FIG. 7 is a process sequence diagram showing a conventional method of manufacturing a post-connection type printed wiring board by using the respective symbols of (a) to (p). In FIG. 7, (a) to (p)
Each figure shows a cross section of the wiring board. Hereinafter, a general manufacturing method for a substrate in which electrical connection between upper and lower conductor circuit layers of a conventional build-up type substrate is performed by a post (metal pillar) will be described with reference to FIGS. 7A to 4P. Will be sequentially described.

In FIG. 7A, reference numeral 701 denotes an insulator layer formed of, for example, glass epoxy or the like and serving as a main body of a substrate. A copper foil 702 for a surface layer circuit formed on the insulator layer 701 is buffed. The copper foil 70 is obtained by mechanical polishing such as by using a chemical solution such as sulfuric acid mixed with hydrogen peroxide, or a combination of both.
(2) The surface is cleaned, and the adhesion of an ultraviolet-sensitive dry film resist for copper foil etching to be pressed in a later step is improved. Note that both the insulator layer 701 and the copper foil 702 are core substrate portions (portions formed by a method of manufacturing a printed circuit board manufactured using a conventional double-sided copper-clad board or prepreg).

Next, in FIG. 7B, after the above-mentioned dry film resist (not shown) is thermocompression-bonded, exposure is performed with a circuit pattern mask (not shown) superposed thereon.
After developing with a developing solution, a portion of the copper foil 702 from which copper is removed is exposed by an etching solution such as a copper chloride solution, an iron chloride solution, and a hydrogen peroxide mixed sulfuric acid solution. Coating with (C) of FIG.
Then, unnecessary copper portions in the copper foil 702 are removed, and a surface circuit 704 is formed. Then, in FIG. 7D,
This shows a state in which the resist 703 which has become unnecessary and has become unnecessary has been removed.

In FIG. 7E, a post (metal column) for electrical connection between the circuit and the build-up circuit pattern is formed on the surface circuit 704 by electrolytic plating using a plating resist. However, in order to perform post electrolytic plating for the connection, a power supply film 705 for plating is formed on the surface circuit 704 (on both surfaces of the conductor portion and the portion where no conductor exists) by electroless plating. Next, FIG. 7F shows a state in which a post plating resist 706 is applied and formed. Note that the resist 706 has ultraviolet sensitivity, and is exposed to light and developed so that the portion of the resist to be post-plated is opened.

FIG. 7G shows a state in which the opening 708 and other portions, that is, the remaining resist 707 are formed by exposure and development of the resist 706. And FIG.
(H) shows a state in which a required post 709 is formed in the opening 708 by electrolytic plating. (I) of FIG.
This shows a state where the unnecessary remaining resist 707 has been removed. In FIG. 7 (j), the feeding film 70 which is no longer needed
5 is removed with an etching solution such as sulfuric acid containing copper chloride or hydrogen peroxide without forming an etching resist.

FIG. 7 (k) shows an example in which an insulating resin for a build-up portion is applied by printing, curtain coating, or the like.
This is a state in which the resin film 710 is formed by being cured by heat. FIG. 7 (l) shows a state where the head of the post 709 buried in the resin film 710 is exposed by a method such as buffing and the like, and the post crown 711 is formed. The buffing here has not only the purpose of exposing the post top portion 711 but also the purpose of improving the adhesion strength of the upper conductor circuit of the post to the resin. Next, a chemical solution treatment is performed in order to provide finer irregularities than the irregularities formed by the above-mentioned buffing and to improve the adhesion strength of the upper conductor circuit.

In FIG. 7 (m), an upper layer circuit pattern copper film 712 is further formed on the top of the post 711 of the post 709 and the flat surface of the resin film 710. The formation of the circuit pattern copper film 712 is performed by using both electroless copper plating and electrolytic copper plating to secure a required thickness. In (n) of FIG.
This shows a state where an etching resist 713 for forming a circuit by etching the circuit pattern copper film is formed. As the etching resist 713, an ultraviolet-ray exposing resist is used, and the etching resist 713 is exposed and developed.
To form

FIG. 7 (o) shows a state in which an unnecessary portion of the circuit pattern copper film 712 is dissolved and removed using a chemical solution for dissolving copper to form a circuit 714. Finally, FIG.
(P) shows a state where the unnecessary etching resist 713 is removed. Through the above-described steps, formation of the insulator layer of the build-up portion, the post portion, and the post upper conductor layer is completed.

In the case of a substrate configuration in which the number of build-up layers is two or more, the above-described steps may be repeated, and a power supply film is formed on the upper circuit pattern by electroless plating. After performing post-plating, applying an insulating layer resin, polishing and roughening a chemical solution, a circuit pattern of a further upper layer is formed.

[0012]

However, in the above-mentioned conventional method for manufacturing a post-connection type printed wiring board, a power supply film for post plating formed by electroplating is formed by electroless plating. There must be. This electroless plating process has many problems such as a large number of steps of chemical solution treatment such as pretreatment and plating, and the management of the chemical solution is not easy and the cost is high.

Further, after forming the post, it is necessary to remove the unnecessary power supply film of the electroless copper plating. Since this step is performed without an etching resist, only the unnecessary electroless copper plating film is removed. In addition, necessary parts such as posts and wiring are often melted and damaged.

In addition, since a tin-palladium alloy layer formed by electroless plating and a pretreatment thereof is included between the post and the conductor circuit below the post, the shear (shear) strength of the post is significantly reduced. When formed by screen printing or the like, the post is knocked down by a squeegee. The post itself comes off by polishing for exposing the top of the post. The post comes off due to an impact or the like during handling in the manufacturing process such as the transfer of a substrate. And other problems have occurred.

In order to prevent these problems, it is possible to improve the post shear strength to some extent by changing the conditions of the electroless plating and the pretreatment conditions of the electroless plating. It is possible to make the electroless plating suitable for copper and the pretreatment conditions suitable for it.However, when this is performed, on a resin other than copper, the adhesion strength of the plating film is reduced, There was a problem that production became impossible.

Another cause of a decrease in post-shear strength is the problem of footing of the dry film resist wall at the post plating opening formed after exposure and development of the dry film photoresist used for post plating. . The problem of the tailing always arises from the relationship between the properties of the dry film and the material used for the substrate. In the class of the post diameter of the high-density substrate which is the target product of the present invention, the post shear strength of the tailing is The impact on the decline was significant, and some countermeasures were strongly desired.

[0017]

A print distribution according to the present invention is provided.
The method of manufacturing a wire plate includes a method in which a lower conductor layer and an upper
A method of making electrical connection between conductive layers, wherein
Forming a lower conductive layer, and a power supply film for plating on the lower conductive layer
Forming a resist and forming a resist on the power supply film
Process and openings for forming posts are formed in resist.
And removing the power supply film exposed from the opening.
The lower conductor layer in the opening by electrolytic plating
Forming a post connected to the substrate and removing the resist
After that, the insulating layer on the substrate including the lower conductor layer and the post
Forming an insulating layer and polishing the insulating layer to form a post from the insulating layer.
And exposing the post and the post on the exposed post
Forming an electrically conductive upper conductor layer.
Things.

The production of the printed wiring board according to the present invention
In the fabrication method, the contact area between the post and the lower conductor layer is increased.
To remove the power supply membrane,
Part of the partial conductor layer is also removed.

In the above-mentioned manufacturing method, the dissolution of the film
Removal is performed by immersion in a chemical solution, a method of immersing in a chemical solution and using vibration by ultrasonic treatment, a method of immersing in a chemical solution and performing a process while applying shock and vibration from the outside, a substrate processing surface Vertical to the surface of the chemical solution, and repeated immersion and lifting in the chemical solution, processing the substrate processing surface parallel to the surface of the chemical solution, and repeatedly immersing and lifting in the chemical solution, processing of the liquid surface and the substrate processing surface A method in which immersion and lifting in a chemical solution are repeated while each extension line is in contact with an angle, a method in which processing is performed while rotating or moving a processing substrate during immersion in a chemical solution, a transporter
While moving the substrate by the structure, a chemical solution is applied to the substrate processing surface.
Any of the methods of spraying and processing may be used.

Furthermore, chemical solution Oite used to dissolve away the above-mentioned film, ferric chloride and hydrochloric acid, cupric chloride and hydrochloric acid, hydrogen peroxide and sulfuric acid, of the ammonium chloride with aqueous ammonia and ammonium persulfate A solution containing any of them may be used.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION

[First Embodiment] FIGS. 1A and 1B show a first embodiment of a method for manufacturing a post connection type printed wiring board according to the present invention.
It is a process sequence figure shown by each figure attached | subjected sequentially to (k). In FIG. 1, each of the drawings (a) to (k) shows a cross section of the wiring board. Hereinafter, a general manufacturing method for a substrate in which electrical connection between upper and lower conductor circuit layers of a build-up type substrate according to a first embodiment of the present invention is performed by a post (metal column) will be described with reference to FIGS. (K) will be sequentially described. Note that, for simplification of the description, in the present embodiment, a case where the build-up layer is one layer will be described.

In FIG. 1A, an insulator layer 101 is an insulator layer portion immediately below a lower circuit layer provided with a post, and a portion of a lower circuit 102 such as a copper film is formed thereon. Here, in the present embodiment, the build-up layer is 1
Since it is a layer, the description is for a case where a post is provided on a surface circuit of a core (a layer produced by conventional press working), and therefore, the insulator layer 101 is not a build-up layer.

FIG. 1B shows a state where a power supply film 103 required for electrolytic copper plating for forming a post is formed on the insulator layer 101 and the lower circuit 102. If the power supply film is not formed, the lower layer circuit 102 is electrically isolated, a current does not flow at the time of electrolytic copper plating, and a portion where a post cannot be formed occurs only at that portion. The formation of the power supply film 103 is an important step. Next, in FIG. 1C, a dry film photoresist 104 serving as a plating resist at the time of post plating is laminated (deposited) on the power supply film 103.

FIG. 1D shows a state in which an opening 105 to be subjected to post plating is formed by the exposure and development steps. Reference numeral 106 denotes a skirt formed after exposure and development of the dry film photoresist 104.

Further, as shown in FIG. 1E, the power supply film 10 existing at the bottom of the opening 105 for forming the post plating is formed.
3 is immersed in a chemical solution for dissolving copper and dissolved and removed. 107
Indicates the bottom of the opening 105, but not only the electroless copper plating film of the power supply film 103 but also the copper film itself of the lower circuit 102 thereunder is slightly dissolved and removed. Is effective. Also, the bottom 107
By further dissolving and removing the cross section of the connection interface with the post (described later) so that the cross section is not a horizontal straight line but an arc, the strength can be further improved.

The chemical used here does not violate the dry film resist 104 and has a capability of dissolving copper, for example, an aqueous solution composed of cupric chloride and hydrochloric acid, and a solution composed of ferric chloride and hydrochloric acid. An aqueous solution, an aqueous solution comprising hydrogen peroxide and sulfuric acid, a sulfuric acid solution of chromium oxide (CrO ₃ ), and the like are used, but are not limited thereto. And the method of dissolving and removing is not limited to simple immersion as described above, but by applying ultrasonic waves and vibration at the time of immersion,
A method for facilitating entry and exit of the chemical solution into the opening 105 may be used together. Although the details will be described in the second and subsequent embodiments, the immersion and pulling are repeated, or the substrate is rotated or moved in the liquid to move the opening of the chemical liquid. It is also effective to use a method that promotes entry and exit. Further, as a method other than the immersion, a method of spraying in a shower shape by a spray or the like may be used.

FIG. 1F shows a state in which the post 108 is formed in the opening 105 by electrolytic copper plating. FIG. 1G shows a state where the unnecessary dry film photoresist 104 is removed.
Further, FIG. 1H shows an unnecessary power supply film 103.
2 shows a state in which the electroless copper plating film of FIG. Since the dissolution and removal here are performed without using a mask, it is preferable to use a solution having a low dissolution rate, such as a solution composed of aqueous hydrogen peroxide and sulfuric acid.

Further, as shown in FIG.
This shows a state in which the resin constituting the insulating layer 109 between the upper and lower conductor circuit layers 08 is applied and cured by an appropriate method such as printing or a curtain coating method. (J) of FIG.
The figure shows a state in which the flat post crown 110 is exposed by mechanical polishing such as buff polishing for removing the umbrella-shaped portion above the post 108 embedded in the resin.
FIG. 1K shows a state in which the upper post conductor circuit 111 is formed. This method employs a method in which plating is performed on the entire surface of the insulating resin including the post crown 110 by electroless plating and electrolytic plating, and then only the necessary portions are dissolved and removed by using an etching resist or the like. Is preferred. Thus, the formation of the substrate in the case where the number of the build-up layers is one is completed.

Thereafter, if necessary, a solder resist,
Apply solder etc. In the case of forming a multi-layer substrate having three or more layers, the multi-layer substrate is formed by repeating the processing from FIG. FIG. 2 is a diagram showing a comparison of the shear intensities of posts by the conventional method and the method according to the present invention in a diagram.

As described above, according to the first embodiment,
The copper film made of electroless copper plating for power supply of the electrolytic plating of the post provided on the copper film and the post provided on the copper film of the portion to be plated with the post is plated by electroplating using the post as a plating resist. Before the formation, in the state where the opening for post plating is formed in the plating resist, the electroless copper plating is completely dissolved and removed with a chemical solution, and also a part of the copper film for the lower conductor circuit is dissolved and removed together. Since the post plating is performed, the adhesion between the copper film for the lower conductor circuit and the post is strengthened.

As a result, as shown in FIG. 2, it was shown that the post formed by this method had about five times the strength of the conventional post. In addition to the steps and the transportation between the steps as well as the mechanical polishing such as the screen printing or the buff where a strong force is applied to the post, the effect that the peeling and dropping of the post does not occur at all is exhibited. In addition, the yield of the substrate has been dramatically improved, and it has been shown that this is a substrate manufacturing method that greatly contributes to the reduction of the quality and cost of the substrate.

In addition, since the shear strength of the post has been improved by this manufacturing method, most of the steps have been put into an automatic line, although one by one was manually manufactured so as to handle a broken article. In this aspect, the excellent effect that greatly contributes to the reduction of the man-hour was also exhibited.

[Second Embodiment] FIG. 3 is a partial process explanatory view showing a second embodiment of the method for manufacturing a post connection type printed wiring board according to the present invention. In FIG. 3, a method for immersing a chemical solution in the steps (d) to (e) of FIG. 1 of the first embodiment will be described for simplification of the description.

FIG. 3A shows an electroless copper plating film (FIG. 1).
In the chemical immersion for dissolving and removing the power supply film 103), the processing substrate 301 to be processed is immersed in the chemical 302 filled in the chemical tank 303. And
FIG. 3B shows the substrate 304 in a state in which the chemical liquid that has entered the opening (105 in FIG. 1) is once pulled out of the liquid in order to exit the opening. By repeating such a procedure as necessary, a fresh chemical solution always enters the opening, and the dissolution and removal can be performed efficiently. The immersion time, the time for raising, and the like are appropriately adjusted depending on the state of dissolution. This may be performed by an automatic machine.

Although FIG. 3 shows the case where the substrate is perpendicular to the liquid surface, the substrate may be inclined (depending on the level of the liquid surface) depending on the viscosity of the chemical solution and the degree of bubbles generated during dissolution and removal. The state where the line and the extension line of the board touch at an angle,
It is also effective to immerse the substrate in a state where one corner of the substrate enters the liquid first).

As described above, according to the second embodiment,
The same effects as those described in the description of the effects of the first embodiment can be obtained. However, in the case of the present embodiment, an effect that is difficult to obtain with the effect of the first embodiment may be reliably achieved as described below in some cases.

That is, as in the case of the first embodiment, when the treatment is merely performed by immersion, in particular,
When the viscosity of the chemical solution used for dissolution and removal is high, such as a solution containing iron and hydrochloric acid or a solution containing cupric chloride and hydrochloric acid, and it is difficult for the solution to enter and exit the pores (openings). In some cases, the chemical solution does not enter the pores, or the chemical solution does not enter the pores, making it difficult to obtain the desired effect. And other problems occur.

The cause is that in the case of a solution containing ferric chloride and hydrochloric acid or a solution containing cupric chloride and hydrochloric acid, as the dissolution and removal of copper progress, the copper ion concentration in the chemical solution increases. If the value exceeds a certain value, the dissolution and removal reaction of copper does not proceed. Therefore, in order to always proceed with dissolution and removal at a constant rate, such as continuing to send a fresh chemical solution whose copper ion concentration does not exceed a certain value into the pores,
That is, it is necessary to promote liquid exchange. As a method of promoting the liquid exchange, the method according to the present embodiment is a very effective method.

When a large amount of bubbles are generated by the reaction gas, such as a solution containing sulfuric acid and hydrogen peroxide, the reaction gas is generated by the progress of the dissolution and removal of copper in the pores.
Since the gas stays in the pores due to the gas, finally, only the bubbles remain in the pores, and the dissolution removal reaction does not proceed. As a method for preventing this, it is very effective to take the substrate in and out as in this embodiment.

[Third Embodiment] FIG. 4 is a partial process explanatory view showing a third embodiment of the method for manufacturing a post-connection type printed wiring board according to the present invention. In FIG. 4, for simplification of the description, a method of dipping a chemical solution in the steps of FIGS. 1D to 1E of the first embodiment will be described.

FIG. 4A shows an electroless copper plating film (FIG. 1).
In the chemical immersion for dissolving and removing the feed film 103), the processing substrate 402 to be processed is immersed in the chemical 404 filled in the chemical tank 401 and rotated in the direction of the arrow 403 of the rotation direction. ing. Although the example of FIG. 4 illustrates a state in which one processing substrate is rotated, two or more arbitrary substrates may be simultaneously rotated by devising a jig or the like. In addition, it is needless to say that the rotation direction is not limited to the illustrated one, and may be any direction. Then, FIG. 4 (b) includes FIG. 4 (a)
Is shown as viewed from above. Note that, in the present embodiment, the case of the rotational movement of the substrate is described for simplicity, but the present invention is not limited to the rotation, and the same effect can be obtained by any movement or the like. Needless to say.

As described above, according to the third embodiment,
The same effects as those described in the description of the effects of the first embodiment can be obtained. However, in the case of the present embodiment, an effect that is difficult to obtain with the effect of the first embodiment may be reliably achieved as described below in some cases.

That is, as in the case of the first embodiment, when the treatment is merely performed by immersion, the second chloride
When the viscosity of the chemical solution used for dissolution and removal is high, such as a solution containing iron and hydrochloric acid or a solution containing cupric chloride and hydrochloric acid, and it is difficult for the solution to enter and exit the pores (openings). In some cases, the chemical solution does not enter the pores, or the chemical solution does not enter the pores, making it difficult to obtain the desired effect. And other problems occur.

In the case of a chemical solution in which bubbles are generated during the dissolving and removing reaction, the generated bubbles are retained in the pores, so that the pores are filled with the bubbles and the dissolution reaction is stopped. In such a case, as a method of preventing this, it is possible to avoid it as in the second embodiment. However, depending on the chemical, when the processing substrate is taken out of the chemical and exposed to the outside air, the conductor surface of the substrate may be oxidized or other reaction products that may hinder the substrate processing may occur. It is not possible with the method according to the embodiment,
The method according to the present embodiment is preferred.

In the case of this embodiment, in the case of a solution used while heating, such as a solution containing ferric chloride and hydrochloric acid or a solution containing cupric chloride and hydrochloric acid, a chemical solution tank is used. In a bath, if there is a difference in temperature in a bath where temperature variation due to heating is likely to occur, a difference will naturally occur in the dissolution removal reaction, which causes variation in dissolution and removal. To prevent this, it is necessary to make the stirring of the liquid more dense,
This embodiment is an advantageous method that has both the functions of making the liquid temperature in the chemical solution tank uniform and facilitating the flow of the liquid into and out of the pores of the processing substrate. In addition, since no equipment for stirring the liquid is required, there is an advantage that the equipment cost can be reduced accordingly.

[Fourth Embodiment] FIG. 5 is a partial process explanatory view showing a fourth embodiment of a method of manufacturing a post connection type printed wiring board according to the present invention. In FIG. 5, for simplicity of explanation, an example of the method of chemical solution treatment in the steps of FIG. 1 (d) to FIG. 1 (e) of the first embodiment, for example, dissolution without immersion The removal method will be described.

FIG. 5A shows that a chemical solution 503 is sprayed and sprayed from above by a spray nozzle 502 to dissolve and remove copper in an opening (not shown) formed in the processing substrate 501. It shows the state where it is. In this case, the processing substrate 501 is placed on the belt conveyor 505, and automation is performed by moving the processing substrate 501 at a constant speed in the direction of the substrate movement direction 504 using a transport mechanism such as a belt conveyor.
The chemical solution may be evenly applied to the entire substrate. Thus, by adjusting the amount and pressure of the chemical solution 503 ejected from the spray nozzle 502, it is also possible to control the amount of dissolution of the portion of the processing substrate 501 to be dissolved. Therefore, the pressure of the spray nozzle is directly
There is an advantage that the chemical liquid can easily enter into the pores because it is applied to the opening 1.

FIG. 5B shows the inside of an opening (not shown) formed in the processing substrate 501 moving in the moving direction 504 by spraying the chemical 503 from the lower part by spraying / blowing by the spray nozzle 506. 3 shows a state in which copper is dissolved and removed. In this case, when combining with a belt conveyor for transportation or the like, the belt is formed into a mesh shape and the chemical 503 is used.
Should easily pass through to reach the processing substrate 501. As an effect in this case, contrary to the case of FIG. 5A, the liquid tends to come out of the pores due to its own weight.

As a measure in the case where the mesh-shaped conveyor belt is not used, there is a method shown in FIG. In this drawing, an example is shown in which a transfer device is used instead of a conveyor, in which a nozzle blowing liquid from below hits the processing surface of the processing substrate 501 moving in the moving direction 504. In this case, a wheel-like body that is installed perpendicular to the movement direction 504 and moves the processing substrate 501 by friction between the wheel tread surface and the substrate surface while the wheel-like body 508 provided on the rotating shaft 507 rotates. 508
Is adopted. By doing so, the chemical solution from below can reach the processing surface of the processing substrate 501 without any trouble, and the liquid is suitable for the above-mentioned purpose. In addition, 509 indicates the rotation direction of the wheel-shaped body 508.

FIG. 6 is an explanatory diagram showing a comparison of the state of the chemical solution in the opening (pore) between the nozzle spraying method of the present embodiment and the dipping method shown in the first embodiment and the like. is there. First, FIG. 6A is a schematic diagram showing a state in which a droplet 605 of a chemical solution ejected from a spray nozzle enters the pore 606 in the case of nozzle spraying as in the present embodiment. Here, 601 is an insulator layer below the post lower conductor, 6
02 is a conductor circuit below the post, 603 is an electroless copper plating film formed for post electrolytic plating, and 604 is a post plating resist. Thus, in the case of nozzle spraying, it can be seen that the droplets 605 are almost uniformly distributed in the pores 606 and are carried in and filled, and the dissolution proceeds smoothly.

On the other hand, in the case of immersion, in the case of the chemical solution 608 having a high viscosity, the bulk solution tries to enter the pores 606 at a stretch, and as a result, as shown in FIG. Immediately after being immersed in the pores, the bubbles 607 are taken into the pores, making it difficult to come out of the pores. FIG. 6B shows a state in which the pores 606 are immersed in the chemical solution 608. In such a state, the copper portion in contact with the lower side of the air bubble 607 is hindered by the air bubble and the dissolution reaction does not proceed. Therefore, particularly in the case of using a highly viscous chemical solution, the yield of post formation is reduced. Inconvenience arises.

As described above, according to the fourth embodiment,
The same effects as those described in the description of the effects of the first embodiment can be obtained. And on top of that, using a transport mechanism such as a belt conveyor provided under the processing substrate,
Since copper is dissolved and removed by a chemical solution while moving the substrate at a constant speed, automation by a conveyor can be performed, so that there is an effect that automation can be easily performed at low cost. In this case, the dissolution and removal can be controlled by adjusting the spray pressure and the spray amount of the spray. In addition to this condition, it is also possible to control the dissolution and removal reaction time by controlling the moving speed of the conveyor. Unlike the case of immersion, it is possible to apply pressure to the liquid itself by the spray nozzle, so that there is an advantage that the liquid easily enters the pores.

That is, by spraying, a fresh chemical solution is always supplied into the pores, and it is possible to minimize the retention of the liquid in the pores. In addition, by combining the number and shape of the sprays and a mechanism for rotating and moving the sprays like a swinging fan, variations in the dissolution and removal reaction can be easily suppressed even for a large-sized substrate. . Thus, the method according to the present embodiment
In particular, when applied to a chemical solution having a high liquid viscosity, for example, a solution containing ferric chloride and hydrochloric acid having a large specific gravity, there is an effect that the method becomes a very effective method.

The method of manufacturing a post-connection type printed wiring board according to the present invention as described above is suitable if applied to the manufacture of pudding and wiring boards for information and communication equipment, particularly portable small and thin equipment.

[0055]

As described above, according to the present invention, there are the following advantages as compared with the conventional method of manufacturing a post connection type printed wiring board. Openings provided in plating resist
The power supply membrane exposed from the
Since the post is plated after removal before formation, the lower conductor
The adhesion between the layer and the post is enhanced.

As a result, it was shown that the post formed by this method had about five times the strength of the post formed by the conventional method. In addition to the steps and the transportation between the steps as well as the mechanical polishing such as the screen printing or the buff where a strong force is applied to the post, the effect that the peeling and dropping of the post does not occur at all is exhibited. In addition, the yield of the substrate has been dramatically improved, and it has been shown that this is a substrate manufacturing method that greatly contributes to the reduction of the quality and cost of the substrate.

In addition, since the shear strength of the post has been improved by this manufacturing method, most of the steps were put into an automatic line, although one by one was manually manufactured so as to handle a broken article in the past. In this aspect, the excellent effect that greatly contributes to the reduction of the man-hour was also exhibited.

[Brief description of the drawings]

FIG. 1 is a process flow chart showing a first embodiment of a method of manufacturing a post connection type printed wiring board according to the present invention.

FIG. 2 is a comparison diagram of the shear strength between a post formed by the method of the first embodiment and a post formed by a conventional method.

FIG. 3 is a process flow chart showing a second embodiment of the manufacturing method according to the present invention.

FIG. 4 is a partial process explanatory view showing a third embodiment of the manufacturing method according to the present invention.

FIG. 5 is a partial process explanatory view showing a fourth embodiment of the manufacturing method according to the present invention.

FIG. 6 is an explanatory diagram showing a comparison of the state of a chemical solution in an opening between a nozzle spraying method according to a fourth embodiment of the present invention and a dipping method shown in the first embodiment and the like.

FIG. 7 is a process flowchart showing a conventional method for manufacturing a post-connection type printed wiring board.

[Explanation of symbols]

 101, 601, 701 Insulator layer 102 Lower layer circuit 103, 705 Power supply film 104 Dry film resist 105, 708 Opening 106 Foot Bottom 107 Bottom 108, 709 Post 109 Insulating layer 110 Head top 111 Post upper conductor circuit 301, 402, 501 Processing substrate 302, 404, 503 Chemical solution 303, 401 Chemical solution tank 304 Substrate 403 Rotation direction 502, 506 Spray nozzle 504 Moving direction 505 Belt conveyor 507 Rotation axis 508 Wheel-shaped body 509 Rotation direction 602 Conductor circuit under post 603 Electroless copper plating Film 604 Plating resist 605 Droplet 606 Pores 607 Bubbles 608 Chemical solution 702 Copper foil 703, 706 Resist 704 Surface circuit 707 Residual resist 710 Resin film 711 Post top 712 Circuit board Over emissions copper film 713 etching resist 714 circuit

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Ho Ho Nakakugi 1-7-12 Toranomon, Minato-ku, Tokyo Oki Electric Industry Co., Ltd. (72) Yoshiro Takahashi 1-7-12 Toranomon, Minato-ku, Tokyo No. Oki Electric Industry Co., Ltd. (56) Reference JP-A-6-53660 (JP, A) JP-A-3-108798 (JP, A) JP-A-6-283864 (JP, A) JP-A-5 −226843 (JP, A) JP-A-5-55760 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 3/46

Claims (12)

(57) [Claims] 1. A method of manufacturing a printed wiring board for making electrical connection between a lower conductor layer and an upper conductor layer via a post, wherein the lower conductor layer is formed on a substrate and plated on the lower conductor layer. Forming a power supply film for use; forming a resist on the power supply film; forming an opening for forming the post in the resist; removing the power supply film exposed from the opening; Forming the post electrically connected to the lower conductor layer in the opening by electrolytic plating; and after removing the resist, on the substrate including the lower conductor layer and the post. Forming an insulating layer; polishing the insulating layer to expose the post from the insulating layer; and forming the upper conductor electrically connected to the post on the exposed post. Method for manufacturing a printed wiring board, characterized by a step of forming a layer. 2. The method for manufacturing a printed wiring board according to claim 1, wherein the power supply film is removed and the lower portion around the opening is formed to increase a contact area between the post and the lower conductor layer. A method for manufacturing a printed wiring board, wherein a part of a conductor layer is also removed. 3. The method for manufacturing a printed wiring board according to claim 1, wherein the step of removing the power supply film is performed by immersing the power supply film or the lower conductor layer in a chemical solution. Manufacturing method of a printed wiring board. 4. The method for manufacturing a printed wiring board according to claim 1, wherein the step of removing the power supply film includes at least the power supply film or the lower conductor in a chemical solution that dissolves the power supply film or the lower conductor layer. A method for manufacturing a printed wiring board, comprising immersing a layer and vibrating the chemical solution with ultrasonic waves. 5. The method for manufacturing a printed wiring board according to claim 1, wherein the step of removing the power supply film includes at least the power supply film or the lower conductor in a chemical solution that dissolves the power supply film or the lower conductor layer. A method for producing a printed wiring board, characterized by immersing a layer and applying shock and vibration from the outside. 6. The method for manufacturing a printed wiring board according to claim 3, wherein the substrate is arranged such that a surface of the substrate including the power supply film or the lower conductor layer is perpendicular to a liquid surface of the chemical solution. A method for manufacturing a printed wiring board, wherein the immersion in the chemical solution and the lifting are repeated. 7. The method for manufacturing a printed wiring board according to claim 3, wherein the substrate is arranged such that a surface of the substrate including the power supply film or the lower conductor layer is parallel to a liquid surface of the chemical solution. A method for manufacturing a printed wiring board, wherein the immersion in the chemical solution and the lifting are repeated. 8. The method for manufacturing a printed wiring board according to claim 3, wherein the substrate is placed such that a surface of the substrate including the power supply film or the lower conductor layer is inclined with respect to a liquid surface of the chemical solution. A method for manufacturing a printed wiring board, comprising: arranging and immersing in a chemical solution and lifting the same. 9. The method for manufacturing a printed wiring board according to claim 3, wherein the substrate is rotated or moved while being immersed in a chemical solution. 10. The method for manufacturing a printed wiring board according to claim 1, wherein the step of removing the power supply film is performed by spraying a chemical solution for dissolving the power supply film or the lower conductor layer. To manufacture printed wiring boards. 11. The method for manufacturing a printed wiring board according to claim 2, wherein the power supply film and the lower conductor layer are copper, and the chemical solution is ferric chloride and hydrochloric acid; A method for producing a printed wiring board, comprising a solution containing cupric chloride and hydrochloric acid, hydrogen peroxide and sulfuric acid, ammonium chloride, ammonia water, and ammonium persulfate. 12. The printed wiring board according to claim 1 or 2.
Of Oite the manufacturing method, the step of removing the power feeding layer is a printed wiring board and performing spraying a chemical solution to dissolve the feed layer or the lower conductor layer while moving the substrate by the transport mechanism Production method.