JPH1085655A - Coating treatment of photosensitive resist and coating treating device therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a coating treatment method for a photosensitive resist by which firstly the photosensitive resist is surely applied on the inside walls of through-holes, secondly the photosensitive resist is thickly applied near the corners of the opening edges of the through-holes, thirdly the clogging of the through-holes is eliminated, fourthly the film thickness of the photosensitive resist is made uniform and fifthly these operations are simply and easily embodied excellently in terms of costs and a coating treating device therefor. SOLUTION: This coating treatment method and coating treating device 9 for the photosensitive resist A lower the printed circuit board martial 5 hung and held in a vertical state B by a holding mechanism 11 and immerse this material by a lifting mechanism into the liquid tank 6 of the photosensitive resist A and pulling up the material after applying vibration thereon in an excitation section 14, then turning the material upside down in the vertical state B. Further, the printed circuit board martial 5 is held in a horizontal state C, is turned inside out and is dried in a drying section 15. The respective stages are executed while the printed circuit board martial is transported by a transporting mechanism 12 rotating around a slide shaft 24.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method and an apparatus for coating a photosensitive resist. That is,
A method and application for applying a photosensitive resist, which is used in a manufacturing process of a printed wiring board, and applies a liquid photosensitive resist to the front and back surfaces of the printed wiring board material and the inner wall of the through hole thereof, and performs a post-treatment. The present invention relates to a processing device.

[0002]

2. Description of the Related Art First, the technical background will be described. FIG.
FIG. 1 is an explanatory plan view of a printed wiring board. The printed wiring board 1 has recently become increasingly thinner, higher in precision and higher in density. For example, its thickness is becoming extremely thin, from about 1.0 mm to about 0.8 mm, and even about 0.4 mm.
The progress of high density, miniaturization, and high precision of the circuit 2 is also remarkable.
The printed wiring board 1 is, for example, cut, drilled, polished, plated, polished, coated with an etching resist, dried or glued, as a material of the printed wiring board.
Exposure, development, etching, circuit 2 applying circuit negative
It is manufactured by following steps such as etching resist stripping of a portion. Further, as a post-processing step which forms a part of such a manufacturing process, in order to form a protective film for the formed circuit 2 part, application and drying or soldering of a solder resist, exposure, development, mounting of components such as through holes and the like. Each step such as removal of a part of the solder resist is performed.

[0003] In the manufacturing process of such a printed wiring board 1, a process of applying, drying or bonding an etching resist for forming the circuit 2 or a solder resist after the formation of the circuit 2 is conventionally performed as follows. I was First,
In general, a so-called dry method is generally used, in which a dry film-shaped photosensitive resist as an etching resist or a solder resist is adhered to the outer surface of a printed wiring board material by pressing with a roll. And
The case where such a dry method, that is, a dry film-shaped photosensitive resist is used as an etching resist, is as follows. That is, in this case, as a conduction path on the front and back of the printed wiring board 1, in order to protect hundreds or thousands of extremely small through holes or pores formed on the printed wiring board material, for example, In order to protect the copper plating etc. applied to the inner wall of the through hole from damage and corrosion from the developing solution and etching solution, each through hole is filled with a chemical resistant ink in advance and dried and hardened to achieve a smooth finish. From the state, a photosensitive resist in the form of a dry film was pasted. Also, a so-called tenting method for protecting the through-hole has been performed by merely attaching a dry film photosensitive resist while leaving the through-hole hollow without using such a hole filling ink.

However, in such a dry method, in the former method of filling the ink for protection of through holes, only the additional step of filling the ink is required.
It is troublesome and requires facilities, so that the cost is high, and furthermore, the dust of the ink for filling the holes is apt to adhere to the printed wiring board material, which causes disconnection of the circuit 2 formed later and defective short circuit. There was a drawback. Also, in a system that relies solely on a dry film photosensitive resist that can be protected by through-hole protection, it is fundamental to ensure that all of the thousands of through-holes are securely protected only by mounting the photosensitive resist. In addition, with the recent development of through holes into landless holes, the thin dry film-shaped photosensitive resist that has been adhered is torn near the through holes in subsequent steps,
It was also pointed out that the throughholes were easily damaged and the throughholes were often not protected. FIG. 10 (4) is a plan view of a main part of a conventional printed wiring board 1 with lands 3, and FIG. 10 (3) is a plan view of a recent landless type printed wiring board 1. It is a top view of a part. In other words, in the conventional circuit 2, the lands 3 are formed so as to surround the through holes 4. However, recently, such lands 3 that spread are often not formed. Accordingly, the dry film-shaped photosensitive resist adhered on the through hole 4 is not protected in shape by the land 3 and is torn, peeled or broken near the corner of the opening edge of the through hole 4 during development or etching. It was easy to be damaged.

On the other hand, the case where such a dry method, that is, a dry film-shaped photosensitive resist is used as a solder resist is as follows. In other words, in this case, it is becoming difficult to cover the extremely narrow gap between the circuits 2 by masking in view of the circuit 2 in which the density, the miniaturization, and the precision have been remarkably advanced as described above. The disadvantage was pointed out. It has recently become difficult to use a film-shaped photosensitive resist as a solder resist for protecting the circuit 2.

[0006] As described above, in the conventional dry method, when used as an etching resist, there is a problem in that the through hole is difficult to protect, the cost is high, and defects are likely to occur. There was a difficulty, and when it was used as a solder resist, it was becoming difficult to fulfill the function itself as a protective film of the circuit 2. Further, in this dry method, a photosensitive resist in the form of a dry film is extremely expensive, and from this point of view, a great difficulty has been pointed out in terms of cost.

Secondly, there is a so-called wet method,
Recently developed and used. In the wet method, a liquid photosensitive resist is applied instead of sticking a dry film-shaped photosensitive resist as in the above-described dry method. That is, a liquid photosensitive resist is applied to a printed wiring board material as an etching resist or a solder resist and dried to form a coating film.

FIG. 12 shows an example of such a wet system. (1) FIG. 12 is an explanatory side view of the immersion, (2) FIG. 12 is an explanatory side view after the pulling up, and (3) FIG. FIG. In the conventional wet method, that is, when the liquid photosensitive resist A is applied to the printed wiring board material 5 as, for example, an etching resist, first, as shown in FIG. After immersion in the liquid tank 6 of the photosensitive resist A of FIG.
(3) As shown in the figure, the photosensitive resist A applied to the printed wiring board material 5 was pulled up from the liquid tank 6 and dried to form a coating film. FIG. 10 (2) is a front sectional view of a main part of such a printed wiring board material 5, in which the front surface 7 and the back surface 8 of the printed wiring board material 5 and the inner wall of the through hole 4 between them are exposed to light. The resist A is applied, dried, and formed into a film. In addition, when the liquid photosensitive resist A is applied to the printed wiring board material 5 as, for example, a solder resist, a spray nozzle is often used. That is, conventionally, the liquid photosensitive resist A is sprayed and applied to the printed wiring board material 5 for a solder resist using a spray nozzle, and dried to form a coating film.

[0009]

The following problems have been pointed out in such a conventional example.
First, when applying the liquid photosensitive resist A to the printed wiring board material 5, the photosensitive resist A is often applied to the inner wall of the through hole 4 without being covered. In other words, simply immersing or spraying in the liquid tank 6 of the photosensitive resist A will result in a large number of through holes 4
As shown in FIG. 10 (2), the inside of the through-hole 4 in which the hole diameter is increasing to a very small diameter of about 0.1 mm to 0.2 mm recently, as shown in FIG.
Was often applied to the inner wall of the hole and not formed into a coating film. Therefore, in the subsequent exposure, development, etching, and the like, the copper plating or the like previously applied to the inner wall of the through hole 4 serving as the conductive path was easily broken or corroded by, for example, a developing solution or an etching corrosive solution. Therefore, it has been pointed out that defects are apt to occur and a problem arises in the manufacturing cost, and that this cannot cope with the above-mentioned high density, miniaturization and high precision of the circuit 2.

Secondly, since the photosensitive resist A applied, dried, and coated on the printed wiring board material 5 is very thin, the through-hole which becomes particularly thin during subsequent exposure, development, etching, etc. In the vicinity of the corner of the opening edge of No. 4, they could not withstand these, and pinholes, tears, peeling, destruction, damage, etc. were likely to occur (see FIG. 10B). That is, a pinhole, tear, peeling, destruction, damage, and the like of the photosensitive resist A were easily generated near the corner of the opening edge of the through hole 4 by the developing solution or the etching solution (see FIG. 3) As described above with reference to the figure, the through hole 4 and the circuit 2 are becoming more and more remarkable due to the tendency to adopt a landless type.) Therefore, the vicinity of the through hole 4 is covered with the photosensitive resist A and is no longer protected from this surface. As a result, it is difficult to withstand the subsequent exposure, development, and etching as described above, and a defect is likely to occur, which causes a problem in manufacturing cost. At the same time, it was pointed out that the circuit 2 could not cope with high density, miniaturization and high precision.

Thirdly, on the contrary, the liquid photosensitive resist A applied to the printed wiring board material 5 is clogged in the through hole 4 which is a fine pore in a liquid pool state.
It was pointed out that they were dried and hardened after the fact. That is, the photosensitive resist A should be applied only to the inner wall of the through hole 4 (see FIG. 10 (2)), but the hole remains in a state where the entire hole of the through hole 4 is filled. In many cases, they adhered.
Therefore, during exposure, development, etching, heat drying, and the like performed afterward, such an adverse effect of the hole clogging caused by the photosensitive resist A occurs, for example, in the photosensitive resist A that is clogged in the through hole 4. Air that has remained in the air expands during subsequent heating and drying, causing pinholes and cracks in the photosensitive resist A applied to the surroundings, and also, for example, the adverse effect on the exposure resolution at the time of exposure is likely to occur. Finally, the photosensitive resist A was hardly peeled off (when used as a solder resist, the photosensitive resist A was not peeled off and removed from the through hole 4 as a component mounting portion). Therefore, there are many defects from this aspect, and a problem arises in terms of manufacturing cost, and there is a case where a failure occurs in the above-described high density, miniaturization, and high accuracy of the circuit 2.

Fourth, it has been pointed out that the thickness of the photosensitive resist A applied, dried and coated on the front surface 7 and the back surface 8 of the printed wiring board material 5 is not uniform. That is, the photosensitive resist A is immersed in the liquid tank 6 in the vertical state,
In the pulled-up printed wiring board material 5 or the printed wiring board material 5 sprayed with the photosensitive resist A in a vertical state, the applied photosensitive resist A flows downward by gravity, so that the dried and coated Filmed photosensitive resist A
Also, the film thickness of the lower portion was thicker than that of the upper portion, and especially in the vicinity of the lower end portion, a liquid pool was formed and adhered and remained, and the film thickness was large. Therefore, in the subsequent exposure, development, etching, and the like, such adverse effects due to the unevenness of the film thickness are likely to occur. For example, defects such as difficulty in development and adverse effects on the exposure resolution during exposure also occur. Easy to do,
From this point of view, it has been pointed out that a problem arises in terms of the manufacturing cost and that it may not be possible to cope with high density, miniaturization, and high precision of the circuit 2.

Fifth, in the conventional example in which the photosensitive resist A is sprayed and applied to the printed wiring board material 5 by a spray nozzle, the sprayed liquid photosensitive resist A is used.
It was pointed out that the material was scattered around, the waste of materials was large, and the working environment was deteriorated. Further, it was pointed out that the spraying work including the spray nozzle and the spraying work and maintenance required labor, time and cost.

The present invention has been made in view of such circumstances, and has been made to solve the above-described problems of the conventional example. A printed wiring board material coated with a photosensitive resist by immersion is vertically moved up and down. First, the photosensitive resist is surely applied to the inner wall of the through hole by reversing it and turning it upside down in a horizontal state, and further applying vibration, swinging left and right, and tilting. Secondly, a photosensitive resist is particularly thickly applied to the vicinity of the corner of the opening edge of the through hole, and thirdly, the clogging of the through hole by the photosensitive resist is eliminated. Fourth, the thickness of the photosensitive resist is made uniform between the upper part and the lower part on the front and back surfaces of the printed wiring board material. Fifth, these are easily and easily realized with excellent cost. That aims to propose a coating treatment method and coating apparatus of the photosensitive resist.

[0015]

The technical means of the present invention for achieving this object is as follows. First, claim 1
Is as follows. That is, the method for applying a photosensitive resist according to claim 1 is used in a manufacturing process of a printed wiring board, and applies a liquid photosensitive resist to the front and back surfaces of the printed wiring board material and the inner wall of the through hole. The present invention also relates to a photosensitive resist coating method for performing post-processing. First, the printed wiring board material suspended and held in a vertical state is immersed in a liquid tank of the photosensitive resist, and subsequently, an immersion step of pulling up from the liquid tank, and then pulling up from the liquid tank. The printed wiring board material coated with the photosensitive resist is held in a vertical state, and an upside-down inversion step of further inverting the printed wiring board material, and thereafter, the printed wiring board material is held in a horizontal state. And a horizontal holding front and back reversing step of reversing the front and back.

Next, claim 2 is as follows. That is, in the method for coating a photosensitive resist according to the second aspect, in the method for coating a photosensitive resist according to the first aspect, in the immersing step, vibration is applied to the printed wiring board material which is further immersed. Be characterized. Claim 3 is as follows. That is, in the method for coating a photosensitive resist according to the third aspect, the first aspect of the present invention is the first aspect.
In the method for coating a photosensitive resist described in the above, in the immersion step, by further adjusting the concentration of the photosensitive resist in the liquid tank and the pulling speed of the printed wiring board material from the liquid tank, The thickness of the photosensitive resist applied to the printed wiring board material is controlled. Claim 4 is as follows.
That is, in the method for coating a photosensitive resist according to claim 4, in the method for coating a photosensitive resist according to claim 1, the photosensitive resist is applied by being pulled up from the liquid tank instead of the upside down step. A horizontal swinging step of swinging the printed wiring board material left and right while holding the printed wiring board material in a vertical state is performed. Claim 5 is as follows. That is, in the method for coating a photosensitive resist according to the fifth aspect, in the method for coating a photosensitive resist according to the first aspect, the photosensitive resist is applied by being pulled up from the liquid tank instead of the upside down step. A tilting step of tilting the printed wiring board material from horizontal to left or right while holding the printed wiring board material in a vertical state is performed.

Further, claim 6 is as follows. That is, in the method for coating a photosensitive resist according to claim 6, in the method for coating a photosensitive resist according to claim 1, the printed wiring further held in a horizontal state in the horizontal holding front / back inversion step. Vibration is applied to the substrate material. Claim 7 is as follows. That is, in the method for coating a photosensitive resist according to claim 7, in the method for coating a photosensitive resist according to claim 1, after the horizontal holding upside down step, the printed wiring board material is placed in a vertical state or a horizontal state. A drying step of drying the applied photosensitive resist while maintaining the state is performed. Claim 8 is as follows. That is, in the method of applying a photosensitive resist according to claim 8, the printed wiring board material is suspended in a vertical state in advance in the method of applying a photosensitive resist according to claim 1 or 4 or 5 or 7. A preparatory step of holding, the immersion step and the upside down step or the right and left swinging step or the tilting step, the horizontal holding upside down inverting step, a drying step, and finally a desorption step of releasing the holding of the printed wiring board material Are carried out sequentially each time they are rotated and transported at substantially right angles, so that the preliminary step and the desorption step are performed at the same position.

Next, claim 9 is as follows. That is, the photosensitive resist coating treatment apparatus according to the ninth aspect is used in a manufacturing process of a printed wiring board, and is provided on the front and back surfaces of the printed wiring board material and the inner wall of the through hole thereof.
The present invention relates to a photosensitive resist coating processing apparatus for applying a liquid photosensitive resist and performing post-processing. And it has the following holding mechanism, transport mechanism, elevating mechanism, liquid tank, vibrating part, and the like. That is, the end of the printed wiring board material can be held, and the printed wiring board material can be rotated about a horizontal rotation axis by an attached driving source. A holding mechanism that can be positioned in an upside-down state, a left-right swing state, an inclined state, a horizontal state, a front-back inverted state in a horizontal state, and the like, and a conveyance mechanism that holds the printed wiring board material, and A transport mechanism that can be stopped at, an elevating mechanism that can elevate the holding mechanism,
The printed wiring board material arranged on the upstream side in the transport direction, suspended and held in the vertical state by the holding mechanism and lowered by the elevating mechanism, was positioned at a height level at which it can be immersed,
And a vibrating section attached to the holding mechanism and capable of applying vibration to the held printed wiring board material.

Further, claim 10 is as follows.
That is, the photosensitive resist coating processing apparatus according to claim 10 is the photosensitive resist coating processing apparatus according to claim 9, wherein the transport mechanism rotates and transports the holding mechanism on a horizontal plane. I have. And, on the printed wiring board material arranged in the transport direction downstream side and held in a vertical state or a horizontal state by the holding mechanism, the photosensitive resist applied by immersion in the liquid tank is heated. It is characterized by having a drying section for drying.

The method and apparatus for coating the photosensitive resist are as described above. Therefore, the printed wiring board material is first suspended and held in a vertical state in a preliminary step, and then dipped in a liquid tank and pulled up in a dipping step to apply a photosensitive resist. Vibration is appropriately applied to the printed wiring board material during immersion. Next, the printed wiring board material goes through a vertical inversion process (or a horizontal swing process or a tilt process), and then proceeds to a horizontal holding front / back inversion process, where appropriate vibration is applied during holding in a horizontal state, and then drying. Through the process, the holding is released in the desorption process. Preliminary process, immersion process and upside down process (horizontal swing process or tilting process)
The horizontal holding front / back reversing step, the drying step, and the desorption step may be sequentially performed every time the whole is rotated and transported at a substantially right angle. The printed wiring board material is coated with a liquid photosensitive resist on the front and back surfaces and the inner wall of the through hole by such a coating treatment method,
Post-processing is performed.

In this coating apparatus, the holding mechanism is transported by, for example, a transport mechanism that rotates and transports and stops at each step. The holding mechanism holds the printed wiring board material and has a horizontal rotating shaft. Depending on each process, the printed wiring board material can be turned into a vertical state, a vertically inverted state in a vertical state (or a horizontal swing state or an inclined state), a horizontal state, a front and back inverted state in a horizontal state, and the like. Position. Further, the holding mechanism is provided with an elevating mechanism and a vibrating section, and a photosensitive resist liquid tank is provided on the upstream side, and a drying section is appropriately provided on the downstream side.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail based on embodiments of the invention shown in the drawings. FIG. 1, FIG. 2,
FIGS. 3, 4, 5, 6, 7, 8, 9, and 10 (1) are provided for describing the embodiment of the present invention.

FIGS. 1, 2 and 3 are provided to explain the first example, FIG. 1 is a plan view, FIG. 2 is a front view before immersion, and FIG. 3 is a front view during immersion. It is. 4 and 5
Is provided for explanation of the second example, FIG. 4 is a plan view, and FIG. 5 is a front view. FIG. 6A is an explanatory front view of suspending and holding in a vertical state, and FIG. 6B is an explanatory front view during immersion. FIG. 7 (1) is a front explanatory view after pulling up, and FIG. 7 (2) is a front explanatory view in a state of swinging right and left. FIG. 8A is a front explanatory view showing suspension holding in a vertical state, FIG. 8B is a front explanatory view showing upside down, and FIG. 8C is a horizontal explanatory view. FIG. 8 (4) is an explanatory front view showing the holding in FIG. 8, and FIG. 8 (5) is an explanatory side view of the same.
The figure is a front explanatory view showing the reversal. FIG. 9 (1)
The figure is an explanatory front view during drying, and FIG. 9 (2) is an explanatory front view during detachment. FIG. 10A is a front sectional view of a main part of the printed wiring board material.

The method for coating the photosensitive resist A and the coating apparatus 9 are used in the manufacturing process of the printed wiring board 1. First, a printed wiring board 1 as a premise of the present invention will be described. The printed wiring board 1 has a wide variety of uses, such as a double-sided board for OA equipment, a multilayer board for a computer, a flexible board for a computer, and the like, and its manufacturing process is also diverse. In recent years, the printed wiring board 1 is becoming smaller, lighter, extremely thin, flexible, multi-layered, and has a higher density, finer circuit, and higher precision of the circuit 2 (see FIG. 11). The printed wiring board 1 is manufactured, for example, as follows.
That is, the printed wiring board 1 is formed by laminating, polishing, cutting, drilling for the through hole 4, polishing, plating, polishing, applying or drying or bonding an etching resist, exposing, developing, etching, Circuit 2
It is manufactured by following steps such as resist stripping of a portion.

These will be described in more detail. First, after copper foil is bonded and laminated on both sides of the insulating material by hot pressing or the like, washing and double-side polishing are performed, and then the double-sided copper foil-clad laminate obtained through such a pretreatment step The printed wiring board material 5 is cut to a short size of the work size, and then a drilling process for the through hole 4 is performed. After that, cleaning and double-side polishing are performed, and then plating is performed. Thereby, plating is also applied to the inner wall of the through hole 4 so that the circuit 2 on the front surface 7 and the circuit 2 on the back surface 8 are electrically connected. In some cases, a laminated copper foil clad laminate is used). In addition, through hole 4
As for one printed wiring board material 5 (printed wiring board 1), a large number of ultra-small ones having a diameter of hundreds or thousands are formed. After that, washing, double-side polishing, washing, and drying are performed again, and then an etching resist, that is, a photosensitive resist A serving as an alkali-resistant or acid-resistant protective film is applied and dried to form a coating film. Then, after a circuit photograph, which is a negative film of the circuit 2, is exposed to the circuit-formed surface such as the front surface 7 or the back surface 8 and exposed, the photosensitive resist A leaves the exposed and cured circuit 2 part, Unnecessary portions are dissolved and removed by spraying the developer.

Thereafter, after cleaning and drying are performed, the photosensitive resist A is cured by the etching machine, leaving the protected copper foil of the circuit 2 portion. Unnecessary copper foil dissolved and removed
It is dissolved and removed by spraying the etchant. Then, the remaining photosensitive resist A of the above-described cured circuit 2 portion is
After being dissolved and removed by spraying the stripper, the printed circuit board 1 on which the predetermined circuit 2 is formed is obtained by washing and drying. The printed wiring board 1 has dimensions of, for example, about 550 mm × 550 mm or 500 mm × 300 mm in length and width, and as shown in FIG. 11, the peripheral edge of the front surface 7 and the back surface 8 on which the central circuit 2 is formed. Part is 10mm
The width is about the same, and the slack portion 10 is a slack portion.

For the printed wiring board 1 manufactured by following these steps, a protective film of the formed circuit 2 is formed as a post-processing step as a part of the manufacturing process. That is, the photosensitive resist A, which is a solder resist, is applied to the entire circuit-formed surface such as the front surface 7 and the back surface 8 of the printed wiring board 1 on which the circuit 2 is formed, and dried to form a coating film. Thereafter, exposure and development are performed by applying a negative film, and component mounting portions such as a through hole 4 portion and a land 3 portion (see FIGS. 10 (3) and (4) in FIG. 10), that is, post-solder is performed. The exposed portion of the photosensitive resist A alone is exposed by dissolving and removing. In this manner, a protective film made of the photosensitive resist A is formed on the printed wiring board 1 and the circuit 2 is protected from the coating. Circuit 2 of 1
Is protected.

As described above, during the manufacturing process of the printed wiring board 1, the photosensitive resist A is applied to the printed wiring board material 5 as an etching resist or a solder resist to form a coating film. As described above, the present invention is used in the manufacturing process of the printed wiring board 1, and the front and back surfaces 7 and 8 of the printed wiring board material 5 and the inner walls of the through holes 4 are formed of a liquid photosensitive material such as an etching resist or a solder resist. While applying the resist A,
The present invention relates to a coating method and a coating apparatus 9 for a photosensitive resist A, which is subjected to post-treatment and dried and formed into a coating film.

First, the coating apparatus 9 used in such a coating method will be described. As shown in the first example of FIGS. 1, 2 and 3, and the second example of FIGS. 4 and 5, the coating processing apparatus 9 includes a holding mechanism 11, a transport mechanism 12, a lifting mechanism 13, It has a vibration section 14, a liquid tank 6, a drying section 15, and the like.

These will be described in more detail. First, the holding mechanism 11 will be described. The holding mechanism 11 of the coating apparatus 9 is capable of holding the end of the printed wiring board member 5 and is rotatable about a horizontal rotating shaft 17 by an attached driving source 16. The plate member 5 can be positioned in the vertical state B, the vertical inverted state in the vertical state B, the horizontal swing state, the inclined state, the horizontal state C, the front and back inverted state in the horizontal state C, and the like.

That is, the holding mechanism 11 is capable of holding the end of the printed wiring board material 5 (the bent portion 10 shown in FIG. 11) with the grip portion 18 by pinching, hanging, etc. Drive source 16 (FIGS. 1, 2 and 3)
(Not shown in the first example), it is possible to rotate around the horizontal rotation shaft 17. The printed wiring board material 5 is shown in the right part of each drawing in the first example of FIGS. 1, 2 and 3, and is shown in the right part and the left part of each drawing in the second example of FIGS. The vertical vertical state B as shown in FIGS. 6, 7, and 8 (1) and (2), and further (1) in FIG.
7A and 7B, the upside down state in the vertical state B as shown in FIG. 7A, the left and right swing state and the inclined state shown in FIG. 7B, and the drawing in the first example of FIG. In the second example of FIG. 4, it is shown in the upper portion and the left portion, and in the upper portion of the drawing, FIG. 8 (3), FIG. 4 (4), FIG. 5 (5), and FIG. Etc., and a horizontal state C as shown in FIG.
Rotation is variable and positioning can be stopped between the upside down state and the upside down state in the horizontal state C shown in FIGS. In the first example of FIGS. 1, 2 and 3, the horizontal swing state and the inclined state shown in FIG. 7 (2) are orthogonal to the horizontal plane regardless of the illustrated rotation shaft 17. Rotating shaft (not shown)
Around the axis.

In the holding mechanism 11 of the first example shown in FIGS. 1, 2 and 3, the grip portion 18 is attached to a hanging portion 20 suspended from a horizontal horizontal shaft 19 via a horizontal rotating shaft 17. Have been. And such a horizontal axis 19, hanging part 2
Four holding mechanisms 11 each including a grip unit 18 and a grip unit 18 are provided for one coating apparatus 9. In the holding mechanism 11 of the second example shown in FIGS. 4 and 5, the grip portion 18 is attached and fixed to the distal end of a horizontal rotation shaft 17 via an interposition member 21, and the base end of the rotation shaft 17 is a motor. , An index cam and the like. The drive source 16 and the bearing 22 of the rotating shaft 17 are fixed below the disk-shaped rotary table 23. The holding mechanism 11 including the driving source 16, the rotating shaft 17, the interposed member 21, the grip 18, and the like is provided for each of the rotary table 23 and the coating apparatus 9.
The holding mechanism 11 is configured as described above.

Next, the transport mechanism 12 will be described. The transport mechanism 12 of the coating processing apparatus 9 rotatably transports the holding mechanism 11 holding the printed wiring board material 5 on a horizontal plane in the illustrated example, and can stop at each step.

That is, the transport mechanism 12 in the illustrated example includes a slide shaft 24 arranged vertically in the center in each of the first examples of FIGS. 1, 2 and 3 and the second examples of FIGS. The slide shaft 24 has a vertical groove formed on the outer periphery and a drive source 2 including a motor, an index cam, and the like.
5. In the first example, the holding mechanism 11
The base end of each horizontal shaft 19 is fixed to a bearing 26 at the center, and the bearing 26 having a vertical groove formed on the inner periphery thereof engages with a slide shaft 24 having a vertical groove formed on the outer periphery of the transport mechanism 12. Fitted outside. In the second example, a bearing 26 is fixed below the center of the rotary table 23 of the holding mechanism 11, and the bearing 26 is fitted on the slide shaft 24 of the transport mechanism 12. Therefore, in both the first and second examples, the transport mechanism 12
Of the vertical slide shaft 24 is intermittently driven by a drive source 25 at intervals of 90 ° around the axis thereof, so that the bearing 26
Each holding mechanism 1 holding the printed wiring board material 5 via
1 is rotated and conveyed on a horizontal plane, and is stopped every time it is rotated and conveyed by 90 °, that is, every time it is rotated by 1/4, so that a predetermined process is performed. It should be noted that the transport mechanism 12 is not limited to the illustrated example, but may be of a type that is transported manually without using the drive source 25, for example. The transport mechanism 12 is configured as described above.

Next, the lifting mechanism 13 will be described. The elevating mechanism 13 of the coating processing apparatus 9 includes the holding mechanism 11
And the holding mechanism 11 is held so as to be able to move up and down.

The elevating mechanism 13 in the illustrated example has a vertically arranged screw shaft 27 in each of the first examples of FIGS. 1, 2 and 3 and the second examples of FIGS. Is
Next to the slide shaft 24 of the transport mechanism 12 described above,
They are erected side by side and are connected to a drive source 28 composed of a motor, an index cam and the like. In the first example, each horizontal shaft 1 integrated by the bearing 26 of the holding mechanism 11 is used.
9, a bearing 29 having a screw threaded on its inner periphery is fixed, and this bearing 29 is attached to the screw shaft 2 of the elevating mechanism 13.
7 is externally fitted and screwed. On the other hand, in the second example, a bearing 29 is fixed near the center of the rotary table 23 of the holding mechanism 11, and the bearing 29 is externally fitted and screwed to the screw shaft 27 of the lifting mechanism 13. Therefore, in both the first and second examples, the vertical screw shaft 27 of the lifting mechanism 13 is connected to the drive source 2.
By being driven to rotate forward and backward around the axis at 8,
Each holding mechanism 11 holding the printed wiring board member 5 is raised and lowered and is held at a predetermined height position. That is, the elevating mechanism 13 is capable of moving the holding mechanism 11 and the printed wiring board material 5 to a normal height level and a lowered height level at which the printed wiring board material 5 is immersed in the liquid tank 6. I have. The lifting mechanism 13 is configured as described above.

Next, the vibration section 14 will be described. The vibrating section 14 of the coating processing apparatus 9 is attached to the holding mechanism 11 and can apply vibration to the printed wiring board material 5 held by the holding mechanism 11.

That is, in the first example shown in FIGS. 1, 2 and 3, on the horizontal axis 19 of each holding mechanism 11, that is, the hanging part 20,
The vibration unit 14 is provided on the horizontal axis 19 corresponding to the grip unit 18. The vibrating unit 14 is adapted to apply a vertical vibration or a horizontal vibration to the printed wiring board material 5 held by the grip unit 18 for a short time, for example, by the driving thereof. It is applied to the printed wiring board material 5 as a kind of impact. In addition, in the second example of FIGS. 4 and 5, the illustration of the vibrating unit 14 is omitted, but the vibrating unit 14 is attached on the intervening member 21 or the like, for example. The vibration unit 14 is configured as described above.

Next, the liquid tank 6 will be described. The liquid tank 6 of the coating processing device 9 is disposed on the upstream side in the transport direction, is suspended and held in the vertical state B by the holding mechanism 11, and the printed wiring board material 5 lowered by the elevating mechanism 13 is It is located at a height level at which it can be immersed, and contains a photosensitive resist A. That is, in both the first examples of FIGS. 1, 2 and 3 and the second examples of FIGS. 4 and 5, the liquid tank 6 is disposed below the coating apparatus 9 and contains the photosensitive resist A. The printed wiring board material 5 can be immersed from the open upper surface. The liquid tank 6 is configured as described above.

Next, the drying section 15 will be described. The drying unit 15 of the coating processing apparatus 9 is disposed on the downstream side in the transport direction, and the printed wiring board material 5 held in the vertical state B or the horizontal state C by the holding mechanism 11 is immersed in the liquid tank 6. The applied photosensitive resist A is dried by heating.

First, in the first example shown in FIGS. 1, 2 and 3, while holding the entire printed wiring board material 5 held in the horizontal state C by the holding mechanism 11, there is a slight gap therebetween. A drying unit 15 is disposed above and below the drying unit 15, and the drying unit 15 blows, for example, heated air or hot air introduced from an air pipe 30 to the entire surface of the printed wiring board material 5. On the other hand, in the second example of FIGS. 4 and 5, the printed circuit board material 5 suspended and held in the vertical state B by the holding mechanism 11 is sandwiched between the front and rear portions with a slight gap. The drying unit 15 is disposed, and the drying unit 15 is made of, for example, a hot plate. The drying unit 15 is configured as described above.

In the first example shown in FIGS. 1, 2 and 3, reference numeral 31 denotes a chamber, in which the coating apparatus 9 described above is disposed. In the drawing, reference numeral 32 attached to the chamber 31 denotes an operation box,
Reference numeral 3 denotes a bearing for the slide shaft 24 and the screw shaft 27, and R denotes a rotation hole of the screw shaft 27. In the drawing, reference numeral 34 denotes a suction mechanism, which functions to supplementally hold the free end side of the printed wiring board material 5 held in the drying section 15 in the horizontal state C by the grip section 18 of the holding mechanism 11. . In addition, in the second example shown in FIGS. 4 and 5, the configuration of the drive source 25 and other components are the same as those described above with reference to the first example shown in FIGS. 1, 2 and 3, and the illustration and description thereof are omitted. The coating processing apparatus 9 according to the first and second examples according to the present invention includes:
Such a holding mechanism 11, a transport mechanism 12, and a lifting mechanism 1
3, a vibration unit 14, a liquid tank 6, a drying unit 15, and the like.

Next, the coating method of the present invention will be described. This coating processing method is performed using, for example, such a coating processing apparatus 9 and, as shown in FIGS.
By following a preliminary step as a step, a dipping step as a step, a vertical inversion step (or a horizontal swinging step or a tilting step) as a step, a horizontal holding front / back inversion step as a step, a drying step as a step, and a desorption step as a step, the printed wiring base is formed. A liquid photosensitive resist A as an etching resist or a solder resist is applied to the front and back surfaces 7 and 8 of the plate material 5 and the inner wall of the through hole 4 and post-processed, followed by drying and coating.

By the way, in the illustrated example, a step preliminary step, a step dipping step and an upside down step (lateral swinging or tilting step), a horizontal holding upside down step, a step drying step, and a step The detachment process is sequentially performed each time the holding mechanism 11 is rotated and transported at a substantially right angle by the transport mechanism 12, so that the preliminary step of the step and the detachment step of the step are performed at the same position. Has become. Note that the present invention is not limited to such an endless circular rotary transfer type, and it is a matter of course that the present invention can be implemented in a linear transfer type or a substantially U-shaped type. That is, the above-described steps of,,,, and may be performed while being transported linearly or entirely in a substantially U-shape. The desorption process of the step and the step is performed in different positions separated upstream and downstream.

Hereinafter, each of these steps and processes will be described in more detail. First, a preliminary step will be described. In this preliminary step, the printed wiring board member 5 is suspended and held in the vertical state B. In other words, the printed wiring board material 5 delivered from the previous process is suspended and held in the vertical state B by the grip portion 18 of the holding mechanism 11 in this preliminary process (FIGS. 1, 4, and 6). (See FIG. 1 (1)).

Next, the immersion step will be described. In this immersion step, the printed wiring board material 5 suspended and held in the vertical state B is immersed in the liquid tank 6 of the photosensitive resist A and pulled up from the post-liquid tank 6. That is, the vertical state B is applied to the holding mechanism 11 in the preliminary process of the above-described steps.
The printed wiring board material 5 suspended and held by the above is transported 90 ° counterclockwise in the illustrated example by the transport mechanism 12, and then, in the immersion step of this step, is lowered by the lifting mechanism 13 and afterwards. It is raised. As a result, the printed wiring board material 5 is dipped in the liquid bath 6 of the photosensitive resist A and then pulled up, and the photosensitive resist A is applied to the front and back surfaces 7 and 8 and the inner wall of the through hole 4 (FIG. 1, (2), (3), (4), (5), (6) of FIG. 6, and (1) of FIG. 7).

In the immersion step of this step, vibration is further applied to the printed wiring board material 5 during immersion. That is, when the vibration unit 14 is driven,
Vibration as a kind of impact is applied to the printed wiring board material 5 immersed in the liquid tank 6 of the photosensitive resist A,
This vibration may be generated by disposing a vibrator of an ultrasonic oscillator in the liquid tank 6 without using the vibrator 14 as in the illustrated example. Further, in the immersion step of this step, the concentration of the photosensitive resist A in the liquid tank 6 and the speed of pulling up the printed wiring board material 5 from the liquid tank 6 are further adjusted to apply the photosensitive resist A to the printed wiring board material 5. The thickness of the applied photosensitive resist A can be freely controlled. The concentration of the photosensitive resist A in the liquid tank 6 is automatically controlled (evaporated amount is replenished), and the reduced amount applied to the printed wiring board material 5 is automatically replenished. Is done.

Next, the upside down process of the steps will be described. In the upside down step of this step, the printed wiring board material 5 pulled up from the liquid tank 6 and coated with the photosensitive resist A is held in the vertical state B and further turned upside down. That is, in the immersion step in the above-described step, the printed wiring board material 5 on which the photosensitive resist A is applied is pulled up from the liquid tank 6 and constantly raised to the height level by the elevating mechanism 13, and the transport mechanism 12 is stopped. In this position, that is, in the same position, the holding mechanism 11 is rotated up and down by 180 ° around the rotation shaft 17, and the vertical state B in which the grip section 18 is located lower than the vertical state B in which the grip section 18 is located upper. The state B is turned upside down in the state B (see FIGS. 8A and 8B). Such upside-down is normally performed once, but may be performed a plurality of times.

As such a step, instead of the above-described upside down step, the printed wiring board material 5 pulled up from the liquid tank 6 and coated with the photosensitive resist A is held in the vertical state B and A shaking or right and left shaking process may be performed (see FIG. 7 (2)). Furthermore,
Instead of such a vertical inversion process or a horizontal swing process, the liquid tank 6
A tilting step of tilting the printed wiring board material 5 coated with the photosensitive resist A pulled up from the horizontal to the right or left while holding it in the vertical state B may be performed ((FIG. 7 ( 2) Refer to the figure as a stopped state). When such a left-right swinging process or a tilting process is performed as a step, a rotating shaft (not shown) orthogonal to the illustrated rotating shaft 17 on a horizontal plane and a driving mechanism for the rotating shaft 17 are additionally provided. It is also possible to carry out these manually without using a driving mechanism.

Next, the horizontal holding front / back reversing process of the step will be described. In the horizontal holding front / back reversing step, the printed wiring board material 5 is thereafter held in the horizontal state C and the front / back is further reversed.

That is, after the above-described upside down process (horizontal swinging process or tilting process), the printed wiring board material 5 is further transported 90 ° counterclockwise in the illustrated example by the transport mechanism 12. Thereafter, in the horizontal holding front / back reversing process of this step, first, the rotating shaft 1 of the holding mechanism 11 is used.
7 is rotated upward by 90 °, and the state is changed from the vertical state B to the horizontal state C. After that, the front and back surfaces 7 and 8 are turned over by further turning 180 ° in the vertical direction (FIGS. 1, 4 and 8 (3), (4),
(5) Refer to the figures). In addition, such a reversal is 1
One or more times. Further, in the horizontal holding front / back reversing process of this step, vibration is further applied to the printed wiring board material 5 held in the horizontal state C. In other words, when the vibration unit 14 is driven, the printed wiring board material 5 held in the horizontal state C instead of being turned upside down is held.
On the other hand, vibration as a kind of impact is applied.

Next, the drying step will be described. In this drying step, after the horizontal holding front / back inversion step of the above-described step, a drying step of drying the applied photosensitive resist A while holding the printed wiring board material 5 in the vertical state B or the horizontal state C is performed. Is done.

That is, after the horizontal holding front / back reversing step of the above-described step, the printed wiring board material 5 is
In the example shown in FIG. 2, after the paper is further conveyed 90 ° in the left and right counterclockwise direction, in the drying process of this step, the rotating shaft 17 of the holding mechanism 11 is used to rotate the holding mechanism 11 in FIGS. (1) It is held in the horizontal state C in the first example of the drawing, and is held in the vertical state B in the second example of FIGS. Then, drying by the drying unit 15 is performed, and the photosensitive resist A applied to the printed wiring board material 5 is dried to form a coating film. Note that this drying is only about fresh drying, and a coating method in which the drying step of such a step is not performed is also possible. That is, regardless of the illustrated example, a coating apparatus 9 that does not include the drying unit 15 is also conceivable. In this case, full-scale drying is performed in a step subsequent to the coating processing step.

Next, the step desorption process will be described. In this attaching / detaching step, the holding of the printed wiring board material 5 is finally released. That is, after the drying step in the above-described step, the printed wiring board material 5 is further conveyed 90 ° counterclockwise in the illustrated example by the conveying mechanism 12 in the illustrated example, and returns to the same position as in the preliminary step in the above-described step. Then, in the attaching / detaching process of this step, the printed wiring board member 5 is detached from the grip portion 18 of the holding mechanism 11 (see FIGS. 1, 4, and 9 (2)).

The method of applying the photosensitive resist A is as follows.
The following steps are performed: a preliminary step of the step, a dipping step of the step, an upside-down step of the step (or a horizontal swinging step or a tilting step), a drying step of a horizontal holding front / back inverting step, and a drying step. Then, the printed wiring board material 5 is transferred to the next step.

The present invention is configured as described above. Then, it becomes as follows. This photosensitive resist A
In the coating processing method, the printed wiring board material 5 is first suspended and held in the vertical state B in the preliminary step of the step, and then dipped in the liquid tank 6 of the photosensitive resist A in the dipping step of the step and pulled up. The photosensitive resist A is applied to the front and back surfaces 7 and 8 and the inner wall of the through hole 4 by applying appropriate vibrations during the immersion. The photosensitive resist A applied to the printed wiring board material 5
Is controlled by adjusting the concentration in the liquid tank 6 and adjusting the pulling speed from the liquid tank 6. Next, while being held in the vertical state B, the printed wiring board material 5 is turned upside down in a step of turning upside down, swung right and left in a swinging step, or tilted left or right in a tilting step in a step. You. Then, the printed wiring board material 5 is held in the horizontal state C and the front and back surfaces 7 and 8 are further inverted in the horizontal holding front and back inversion step of the step. Then, if necessary, in the drying step, the vertical state B or the horizontal state C
The applied photosensitive resist A is dried while being held by the above, so that the holding is released in the desorption process of the step.

In addition, as shown in the illustrated example, the wafer is rotated and transported as a whole, and the preliminary step of the above-described steps, the immersion step of the steps, the upside-down or left-right swinging or tilting step of the steps, the horizontal holding front and back of the steps The reversing process, the drying process of the step, and the desorption process of the step are sequentially performed each time the rotary conveyance is performed at a substantially right angle, so that the preliminary process of the step and the desorption process of the step are performed at the same position. You may. As shown in FIG. 10 (1), the printed wiring board material 5 has the front and back surfaces 7,
A liquid photosensitive resist A is applied to the inner walls of the holes 8 and the through holes 4, and post-processing is performed.

The coating apparatus 9 used in the method for coating the photosensitive resist A is as follows. That is, for example, the holding mechanism 11 is transported by the transport mechanism 12 that rotates and stops at each step, and
The holding mechanism 11 holds the printed wiring board member 5 and is rotatable about a horizontal rotation shaft 17, so that the printed wiring board member 5 is held in the vertical state B and the vertical state B in accordance with each process. Upside down state (or left and right swing process or tilting process),
Positioning is performed in the horizontal state C, the upside down state in the horizontal state C, and the like. Further, the holding mechanism 11 is provided with a lifting mechanism 13 and a vibration unit 14.

Therefore, first, in the immersion step,
The holding mechanism 11 transported by the transport mechanism 12 is the lifting mechanism 1
The printed wiring board material 5 suspended and held in the vertical state B by being raised and lowered in 3 is immersed in the liquid tank 6 of the photosensitive resist A, and further appropriately vibrated by the vibrating section 14, Will be pulled up. Thereafter, in the upside down step, the left and right swing step, or the tilting step, the printed wiring board material 5 coated with the photosensitive resist A as described above.
When the holding mechanism 11 is appropriately rotated and stopped while being held in the vertical state B, it is turned upside down, swung right and left, or tilted left or right. Then, in the horizontal holding front / back reversing process of the step, the printed wiring board material 5 to which the photosensitive resist A has been applied as described above is appropriately rotated and stopped by the holding mechanism 11 further transferred by the transfer mechanism 12. While being held in the horizontal state C, the front and back are reversed, and further, the vibration is appropriately applied by the vibrator 14 during the holding in the horizontal state C.

In the drying step, the printed wiring board material 5 is held in the vertical state B or the horizontal state C by the rotation and stop of the holding mechanism 11 further transferred by the transfer mechanism 12 as appropriate. While being applied, the applied photosensitive resist A is dried by being heated in the drying unit 15 to form a coating film. Then, the printed wiring board material 5
After being further transported by the transport mechanism 12, it is detached from the holding mechanism 11 in the detachment step of the step. As shown in FIG. 10A, a liquid photosensitive resist A is applied to the printed wiring board material 5 on the front and back surfaces 7 and 8 and the inner wall of the through hole 4 as shown in FIG. After being applied, post-processing is performed.

Therefore, the coating method and the coating apparatus 9 for the photosensitive resist A are described in the following first and second embodiments.
The second, third, fourth and fifth are as follows.

First, in a dipping step, a vibration is applied to the printed wiring board material 5 on which the photosensitive resist A is dipped and applied by the vibrating section 14. Further, in the next step of the upside down process, the left and right swing process, the tilting process, etc., the printed wiring board material 5 is swung up and down, swung right and left, and tilted. Is done. Thus, the photosensitive resist A to be applied surely enters all of the through holes 4 of the printed wiring board material 5 having a very small diameter. Therefore, the photosensitive resist A can be reliably applied and coated on the inner wall of each through hole 4.

Second, the printed wiring board material 5 on which the photosensitive resist A has been applied is once held in the horizontal state C in the horizontal holding front / reverse inversion step of the step, and the front and back are turned over. Vibration is applied by the vibration unit 14 while being held. Therefore, the photosensitive resist A applied to each through hole 4 of the printed wiring board material 5 is gathered in the vicinity of the corner of the opening edge thereof, especially in a thick and substantially donut shape ((1) in FIG. 10). See figure). Although the applied photosensitive resist A has a very small thickness, the vicinity of the corner of the opening edge of the through hole 4, which tends to be particularly thin, is thickly reinforced.

Third, in the horizontal holding front / back reversal step as a step, the printed wiring board material 5 coated with the photosensitive resist A is vibrated by the vibrator 14 while being held in the horizontal state C. Further, in addition to holding in the horizontal state C, the front and the back are reversed. Therefore, the photosensitive resist A which has adhered and clogged in the through holes 4 which are extremely small diameter pores in a liquid pool state is surely dropped and removed. In this way, even if the applied photosensitive resist A accumulates in the through hole 4 and is clogged or filled, except for the necessary coating and coating on the inner wall of the hole, the photosensitive resist A is removed. The other photosensitive resists A are surely removed.

Fourth, in the step of turning upside down, turning right and left, and tilting, the printed wiring board material 5 coated with the photosensitive resist A is turned upside down while being held in the vertical state B. , Can be swung right and left or tilted. Therefore, it is applied and dried afterwards,
Surface 7 of printed wiring board material 5 to be coated
The thickness of the photosensitive resist A on the rear surface 8 is made uniform between the upper portion and the lower portion. That is, when the photosensitive resist A is turned upside down, the photosensitive resist A applied to the front surface 7 and the back surface 8 and still flowing in the liquid state and easily flowing downward is made uniform by reversing the upper and lower portions. In addition, when the photosensitive resist A is shaken to the left or right or tilted, it is applied to the front surface 7 and the back surface 8 and is still liquid and easily becomes a liquid pool at the lower portion. The photosensitive resist A, which tends to have a large thickness, flows down and is drained. Thus, the surface 7 of the printed wiring board material 5 is
The film thickness of the photosensitive resist A applied to the back surface 8 and formed into a coating film is made uniform.

Fifth, such a coating method of the photosensitive resist A is performed by a simple process such as holding the printed wiring board material 5, dipping, turning upside down, turning right and left, tilting upside down, tilting upside down, vibrating, and drying. In a simple configuration that can be traced appropriately.
The photosensitive resist A coating processing apparatus 9 used in such a coating processing method also includes a predetermined holding mechanism 11, a transport mechanism 12, a lifting mechanism 13, a liquid tank 6, a vibrating unit 14, and a drying unit 1.
5 and so on.

[0067]

As described above, the method and the apparatus for coating a photosensitive resist according to the present invention invert a printed wiring board material coated with a photosensitive resist by immersion in a vertical state. In addition, the following effects are exhibited by reversing the front and back sides in a horizontal state, and further applying vibration, swinging left and right, and tilting.

First, the photosensitive resist is surely applied to the inner wall of the through hole and formed into a coating film. That is, in the method and the apparatus for coating the photosensitive resist, in particular, by vibrating the printed wiring board material on which the photosensitive resist is immersed and applied, the photosensitive resist is further turned upside down and left and right. Due to swinging, tilting, and reversing, the inside of a large number of hundreds or thousands of through holes formed in the printed wiring board material, particularly recently, the hole diameter is 0.1 mm to 0.1 mm. The photosensitive resist can surely enter the through-holes, which are the pores, of which the diameter is as small as about 2 mm.

As a result, the photosensitive resist can be surely applied and coated on the inner wall of the through hole. Therefore, as in the above-described conventional example, in the subsequent exposure, development, etching, and the like, for example, copper plating or the like previously applied to the inner wall of the through hole serving as a conductive path with a developing solution or an etching etchant is used. However, destruction and corrosion can be reliably prevented by the presence of the photosensitive resist as the protective coating. Therefore, the occurrence of defects in the manufactured printed wiring board is reduced, the manufacturing cost is excellent, and it is possible to cope with higher density, finer and higher precision of the circuit.

Secondly, a photosensitive resist is applied particularly thickly in the vicinity of the corner of the opening edge of the through hole. In other words, in this photosensitive resist coating method and coating apparatus, in particular, the printed wiring board material coated with the photosensitive resist, in addition to holding in the horizontal state, invert the front and back, further, In some cases, vibration is applied while being held in the horizontal state, and thus the applied photosensitive resist is concentrated around the corner of the opening edge of the through-hole, particularly in a thick, substantially donut-like shape.

As described above, the applied photosensitive resist is very thin, but the vicinity of the corner of the opening edge of the through hole, which is likely to be thin, is thickly reinforced. Therefore, at the time of subsequent exposure, development, etching, etc., as in the above-described conventional example, a photosensitive resist coated and formed into a film near the corner of the opening edge of the through hole with, for example, a developing solution or an etching corrosive solution. In addition, the occurrence of pinholes, tearing, peeling, destruction, damage, and the like is prevented.
In particular, this point is effective as a response to the recent tendency of the through hole and the circuit to be a landless type. Therefore, the vicinity of the through hole is also reliably covered and protected by the coated and formed photosensitive resist from this surface, and can sufficiently withstand subsequent exposure, development, etching, and the like. Destruction and corrosion of copper plating etc. on the inner wall are prevented,
Therefore, the occurrence of defects in the manufactured printed wiring board is reduced, the manufacturing cost is excellent, and it is possible to cope with higher density, finer and higher precision of the circuit.

Third, hole clogging of the through hole due to the photosensitive resist is also eliminated. That is, in the method and the apparatus for coating the photosensitive resist, in particular, by applying a vibration while holding the printed wiring board material coated with the photosensitive resist in a horizontal state,
In addition to maintaining the horizontal state, the photosensitive resist that had been attached and clogged in a liquid pool state in the through hole, which is a pore, was applied, adhered, and formed into a film on the inner wall of the through hole by adopting the reversal of the front and back sides. Except for the part, it is securely dropped and removed.

As described above, even if the photosensitive resist accumulates in the through-hole, becomes clogged, or is filled, the photosensitive resist is surely dropped except for covering the inner wall of the hole by coating. It is hurled and removed. Exposure, development, etching, etc., which are performed afterward, are also performed without any trouble. For example, unlike the above-described conventional example, there is no adverse effect on the exposure resolution at the time of exposure. In the case of the used photosensitive resist, it will eventually be completely stripped off, and in the case of the photosensitive resist used as a solder resist, it will not block the through hole as the component mounting part . Thus, from this aspect as well, the occurrence of defects in the manufactured printed wiring board is reduced, the manufacturing cost is excellent, and it is possible to cope with higher density, miniaturization, and higher precision of the circuit.

Fourth, the thickness of the photosensitive resist is made uniform between the upper and lower portions on the front and back surfaces of the printed wiring board material. That is, in the method and the apparatus for coating the photosensitive resist, the printed wiring board material coated with the photosensitive resist by immersion is vertically inverted or swung to the left or right while being held vertically. Or Therefore, the thickness of the photosensitive resist which is applied, dried and formed into a coating film is made uniform at the upper and lower portions on the front and back surfaces of the printed wiring board material. In other words, when the photo resist is turned upside down, the upper and lower portions of the photosensitive resist flowing downward are reversed. The photosensitive resist is made to flow downward and is drained, so that the thicknesses of the upper and lower photosensitive resists are made uniform, respectively. In particular, the state of liquid accumulation near the lower end, the state of remaining adhesion, and the thick film thickness are eliminated.

As described above, the thickness of the coated, dried, and coated photosensitive resist is made uniform. Therefore, in the subsequent exposure, development, etching, and the like, the adverse effects caused by the non-uniform film thickness are eliminated as in the above-described conventional example. For example, it is difficult to perform development, or the exposure resolution at the time of exposure is reduced. Will not be adversely affected. Thus, from this aspect as well, the occurrence of defects in the manufactured printed wiring board is reduced, the manufacturing cost is excellent, and it is possible to cope with higher density, miniaturization, and higher precision of the circuit.

Fifth, they are simple, easy and cost-effective. That is, the coating method and the coating apparatus for the photosensitive resist appropriately follow the steps of holding the printed wiring board material, immersing, turning upside down, turning left and right, tilting, turning over, turning over, drying, and the like. ,
It has a transport mechanism, a lifting mechanism, a liquid tank, a vibrating section, a drying section, and the like. Then, the above-described first, second, third, and fourth points can be easily performed by such simple processes, devices, and facilities.
It is realized with excellent labor and equipment cost.

For example, as in the above-described conventional example,
There is no scattering of the liquid photosensitive resist to the surroundings due to spraying, no deterioration of the working environment, and no trouble, time and cost for work and maintenance. Furthermore, as compared with this type of conventional example using a photosensitive resist in the form of a dry film, the material cost of the photosensitive resist itself is greatly reduced, and the labor for using ink for filling the through-holes is also eliminated. Etc. are also unnecessary. In the method and the apparatus for coating a photosensitive resist according to the present invention, the printed wiring board and its circuit are made to have high density, fine structure, It is possible to cope with higher accuracy. In this way, all the problems in this type of conventional example are solved,
The effects exhibited by the present invention are remarkably large.

[Brief description of the drawings]

FIG. 1 is an explanatory plan view illustrating a method and an apparatus for coating a photosensitive resist according to a first embodiment of the present invention;

FIG. 2 is an explanatory front view of a first example of the embodiment of the present invention before immersion.

FIG. 3 is a front explanatory view illustrating a first example of the embodiment of the present invention during dipping.

FIG. 4 is provided for explanation of a second example of the embodiment of the present invention;
It is a plane explanatory view.

FIG. 5 is provided for explanation of a second example of the embodiment of the present invention;
It is a front explanatory view.

6 is an explanatory front view for explaining the embodiment of the present invention, wherein FIG. 6 (1) shows a suspended state in a vertical state, and FIG.

FIGS. 7A and 7B are front explanatory views for explaining the embodiment of the present invention, wherein FIG. 7A shows a state after pulling up, and FIG.

FIGS. 8A and 8B are views for explaining the embodiment of the present invention, wherein FIG. 8A is a front explanatory view showing suspension holding in a vertical state, FIG. ) Is a front explanatory view showing holding in a horizontal state, (4) is a side explanatory view showing the same,
(5) The figure is a front explanatory view showing the reverse of the front and back.

FIG. 9 is an explanatory front view for explaining the embodiment of the present invention, in which (1) shows a state during drying and (2) shows a state during detachment.

10A and 10B show a printed wiring board material, FIG. 10A is a front sectional view of a main part of the present invention, FIG. 10B is a front sectional view of a main part of a conventional example of this type, and FIG. Is a plan view of a main part of a land type, and FIG. 4D is a plan view of a main part of a landless type.

FIG. 11 is an explanatory plan view of a printed wiring board.

FIGS. 12A and 12B are views for explaining a conventional example of this kind, wherein FIG. 1A is a side view during immersion, FIG. 2B is a side view after being pulled up, and FIG. FIG.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 printed wiring board 2 circuit 3 land 4 through hole 5 printed wiring board material 6 liquid tank 7 front surface 8 back surface 9 coating treatment device 10 seeing portion 11 holding mechanism 12 transport mechanism 13 elevating mechanism 14 vibrating section 15 drying section 16 drive source 17 times Active shaft 18 Grip section 19 Horizontal axis 20 Hanging part 21 Interposition member 22 Bearing 23 Rotary table 24 Slide shaft 25 Drive source 26 Bearing 27 Screw shaft 28 Drive source 29 Bearing 30 Air pipe 31 Chamber 32 Operation box 33 Bearing 34 Suction mechanism A Photosensitive resist B Vertical state C Horizontal state R Rotation hole

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification code FI G03F 7/16 501 G03F 7/16 501 H01L 21/027 H05K 3/06 F H05K 3/06 3/42 620A 3/42 620 H01L 21/30 564C 564D

Claims (10)

[Claims] A liquid photosensitive resist is applied to the front and back surfaces of a printed wiring board material and the inner wall of a through hole thereof, which is used in a manufacturing process of a printed wiring board.
A method of coating a photosensitive resist, which performs a post-treatment. First, the printed wiring board material suspended and held in a vertical state is immersed in a liquid tank of the photosensitive resist, and the post-treatment is performed. A dipping step of pulling up from the tank, and then a vertical inversion step of holding the printed wiring board material with the photosensitive resist applied thereto pulled up from the liquid tank in a vertical state and further inverting the printed wiring board material up and down; And a horizontal holding front and back reversing step of holding the printed wiring board material in a horizontal state and further reversing the front and back thereof. 2. The photosensitive resist coating method according to claim 1, wherein, in the immersing step, vibration is further applied to the printed wiring board material during immersion. Coating method. 3. The method for coating a photosensitive resist according to claim 1, wherein in the immersion step, the concentration of the photosensitive resist in the liquid tank and the speed of pulling up the printed wiring board material from the liquid tank are further increased. Controlling the thickness of the photosensitive resist applied to the printed wiring board material by adjusting the thickness of the photosensitive resist. 4. The method for coating a photosensitive resist according to claim 1, wherein the printed wiring board material pulled up from the liquid tank and coated with the photosensitive resist is placed in a vertical position instead of the upside down step. A laterally oscillating step of oscillating horizontally while holding the photosensitive resist. 5. The method for coating a photosensitive resist according to claim 1, wherein the printed wiring board material pulled up from the liquid tank and coated with the photosensitive resist is placed in a vertical state instead of the upside down step. A process of inclining the photosensitive resist from horizontal to left or right while holding the substrate. 6. The method for coating a photosensitive resist according to claim 1, wherein, in the horizontal holding front / back reversing step, vibration is further applied to the printed wiring board material held in a horizontal state. A coating method for a photosensitive resist, which is characterized by the following. 7. The method for coating a photosensitive resist according to claim 1, wherein after the horizontal holding upside down step,
A drying step of drying the applied photosensitive resist while holding the printed wiring board material in a vertical state or a horizontal state, wherein a coating process of the photosensitive resist is performed. 8. A method for coating a photosensitive resist according to claim 1, wherein the printed wiring board material is suspended in a vertical state in advance, and
The immersion step and the upside down step or the left and right swing step or the tilting step, and the horizontal holding front and back inversion step,
The drying step and finally the desorption step for releasing the holding of the printed wiring board material are sequentially performed each time the paper is rotated and transported at a substantially right angle, so that the preliminary step and the desorption step are performed at the same position. A method for coating a photosensitive resist. 9. A liquid photosensitive resist which is used in the manufacturing process of a printed wiring board and is applied to the front and back surfaces of the printed wiring board material and the inner wall of the through hole thereof;
A photosensitive resist coating processing apparatus that performs post-processing, and can hold an end of the printed wiring board material, and can be rotated on a horizontal rotation axis by an attached driving source, A holding mechanism capable of positioning the held printed wiring board material in a vertical state, a vertically inverted state in a vertical state, a horizontal swing state, a tilted state, a horizontal state, a front-to-back inverted state in a horizontal state, and the like; A transport mechanism that transports the holding mechanism that holds the plate material and that can be stopped at each step, an elevating mechanism that can raise and lower the holding mechanism, and is disposed on the upstream side in the transport direction. The printed wiring board material suspended and held and lowered by the elevating mechanism was positioned at a height level at which it can be immersed.
A photosensitive tank, and a vibrating unit attached to the holding mechanism and capable of applying vibration to the held printed wiring board material. Coating equipment for conductive resist. 10. The photosensitive resist coating apparatus according to claim 9, wherein the transport mechanism is configured to rotate and transport the holding mechanism on a horizontal plane, and is disposed on a downstream side in the transport direction. Having a drying unit for drying the photosensitive resist applied by immersion in the liquid tank with respect to the printed wiring board material held in a vertical state or a horizontal state by the holding mechanism; An apparatus for coating a photosensitive resist.