JP2001237521A - Manufacturing method and manufacturing apparatus of circuit forming board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit forming board of low cost and high reliability wherein hole work of high quality is realized without losing high speed property of laser work in a manufacturing method of a circuit forming board which is used for small-sized electronics or the like. SOLUTION: When ultrasonic cleaning is performed with an ultrasonic vibrator 13 in order to eliminate a hard and fragile denatured part 11 and wording powder 12 which are stuck on a wall surface of a hole 10 when the penetrating hole 10 is formed by irradiating board material 1 with a laser 9, eliminating work of the denatured part 11 and the working powder 12 from the board material 1 is performed so as not to peel PET sheets 4a, 4b without vibrating the board material 1 excessively. As a result, the board material 1 having a superior hole shape can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a method for manufacturing a circuit board and an apparatus for manufacturing the same.

[0002]

2. Description of the Related Art With the recent miniaturization and high-density of electronic equipment, circuit-forming boards on which electronic components are mounted have been increasingly adopted from conventional single-sided boards to double-sided, multi-layer boards. Development of a high-density circuit formation substrate that can be integrated in a semiconductor device is underway.

In the case of high-density circuit-forming substrates, the use of a laser processing method capable of higher-speed and finer processing has been studied instead of drilling (through-hole) processing on a substrate by drilling, which has been widely used in the past. (For example, Y.
Yamanaka et al., ExcimerLaser Processing In The Mic
ro electronics Fields etc.). In addition, a circuit forming substrate has been proposed in which interlayer connection is performed by using fine hole processing by a laser and a connection means such as a conductive paste (Japanese Patent Application Laid-Open No. Hei 6-1994).
No. 268345).

In the technique of forming a fine hole and connecting layers using a conductive paste, a slight foreign matter causes a connection failure. In the present technology, hole processing is performed on a film attached to a substrate material, and the film is used as a mask for filling a fine hole with a conductive paste. Therefore, it is necessary to keep everything including the film clean.

However, both drilling and laser processing generate a large amount of processing chips, so that they may adhere to the substrate material to block connection holes. In addition, a small amount of dust in the air may block the fine holes. Therefore, although the substrate material is cleaned before filling the conductive paste, the film adhered to the substrate material is peeled off after being used as a mask for filling the conductive paste, so that the film is adhered with only a very weak strength and thus easily peeled off.

As shown in FIG. 7, the PET sheets 4a and 4b adhered to the substrate material 1 at a portion where the adhesive strength is particularly weak may come off during cleaning. If such peeling occurs around the through-hole, the conductive paste 31 for connection may bleed into the peeling portion 33 and short-circuit with the adjacent through-hole as indicated by 32.

Therefore, it is necessary to perform cleaning so as not to apply a large stress to the substrate material and not to peel off the film. Therefore, there may be a case where the substrate material is not sufficiently cleaned.

[0008]

However, as described above, the purpose of forming a hole in the substrate material 1 is to interconnect circuits formed on the front and back surfaces or the inner layer of the substrate. Thereafter, connection means such as plating and filling of a conductive paste are formed.

In a high-density circuit board, the size of the hole and the connecting means is very small, so that even a fine foreign matter has a significant effect on the reliability of the connecting means. for that reason,
It is necessary to reliably remove foreign matter. However, in the current method, when a large stress is applied to the substrate material, the film serving as the mask is peeled off, and the function as a mask is lost, and the conductive paste bleeds into the substrate material, resulting in a problem that insulation reliability is deteriorated.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a low-cost and highly reliable method for manufacturing a circuit-forming substrate and a manufacturing apparatus for the same, which realizes a high-quality substrate material having fine holes.

[0011]

In order to solve the above-mentioned problems, a method of manufacturing a circuit-forming substrate according to the present invention comprises a step of attaching a film-like material to one or both sides of a substrate for a substrate to form a substrate material with a film. Including a hole forming step of performing a penetrating or non-perforating hole processing on a substrate material composed of a plurality of materials, and forming a through or non-through hole formed in the hole forming step on the surface of the circuit forming substrate. Forming a connection means for interconnecting a circuit to be formed or a circuit to be formed therein, wherein the hole forming step forms a through or non-through hole by irradiating the substrate material with a laser. The altered portion formed on the surface of the substrate material and the penetrating or non-penetrating hole-shaped inner wall by the step or the substrate material after being released from the substrate material during or after the step At least one or both of the re-attached powdery or massive alteration material is selectively removed from the substrate material without peeling off the film adhered from the substrate material, and a desired through or non-through hole shape and a clean substrate To get the material.

According to this method, high-quality hole processing can be realized without losing the high speed of laser processing, and a low-cost and highly reliable circuit board can be provided.

[0013]

DETAILED DESCRIPTION OF THE INVENTION The invention as set forth in claim 1 of the present invention comprises a step of attaching a film-like material to one or both sides of a substrate for a substrate to form a substrate material with a film; Irradiate a laser, a hole forming step of forming a penetrating or non-through hole, at least one or both of the altered part or altered substance formed on the inner wall of the penetrating or non-through hole, an ultrasonic vibrator in a water tank. A step of selectively removing the substrate by ultrasonic cleaning in a water tank filled with a cleaning liquid, and a blow step of removing foreign matter or water droplets attached to the substrate material with a film by spraying a gas. In the manufacturing method, a flow is generated in the cleaning liquid between the ultrasonic vibrator and the substrate material with a film, and a water flow is applied to the substrate material. It is a method of manufacturing a circuit forming substrate, characterized in that it spreads a sound field of vibration, suppresses damage to a substrate for a film-attached substrate, and removes a powdery or massive alteration substance without peeling the film. At least one or both are selectively removed by the substrate material to obtain a desired penetrating or non-penetrating hole shape, and have an effect of cleaning the surface of the substrate material.

According to a second aspect of the present invention, there is provided an attaching step of attaching a film-like material to one or both sides of a substrate for a substrate to form a substrate material with a film, and irradiating the substrate material with a film with a laser. A hole forming step of forming a penetrating or non-through hole, and at least one or both of the deteriorated portion and the deteriorated substance formed on the inner wall of the penetrating or non-through hole, provided with an ultrasonic vibrator in a water tank and filled with a cleaning liquid. A step of selectively removing by ultrasonic cleaning in a water bath, and a method of manufacturing a circuit-forming substrate, comprising a blow step of removing foreign matter or water droplets attached to the substrate material with a film by spraying a gas, Vibration is controlled by disposing a plate material between the ultrasonic vibrator and the substrate material with a film. A method of manufacturing a path-forming substrate, in which at least one or both of a powdery or massive alteration substance without peeling the film from the substrate for a film-equipped substrate by controlling the energy of the vibration and suppressing the sound field of the vibration. Is selectively removed by the substrate material to obtain a desired penetrating or non-penetrating hole shape, and has an effect of cleaning the surface of the substrate material.

According to a third aspect of the present invention, there is provided an attaching step of attaching a film-like material to one or both sides of a substrate for a substrate to form a substrate material with a film, and irradiating the substrate material with a film with a laser. A hole forming step of forming a penetrating or non-through hole, and at least one or both of the deteriorated portion and the deteriorated substance formed on the inner wall of the penetrating or non-through hole, provided with an ultrasonic vibrator in a water tank and filled with a cleaning liquid. A step of selectively removing by ultrasonic cleaning in a water bath, and a method of manufacturing a circuit-forming substrate, comprising a blow step of removing foreign matter or water droplets attached to the substrate material with a film by spraying a gas, The substrate material with the film is sandwiched by a plate material or subjected to ultrasonic cleaning with the plate material adhered to one side of the substrate material. This is a method of manufacturing a circuit-formed substrate, characterized in that the substrate material is sandwiched between plate materials to suppress resonance of the substrate material, whereby the substrate material and the film material are separated from a portion having a weak adhesive strength. By removing at least one or both of the powdery or massive alteration substances by the substrate material without peeling the film from the substrate for a film-attached substrate by preventing the desired through or non-through hole shape. And has the effect of further cleaning the surface of the substrate material.

The invention described in claim 4 has the effect that the flow velocity, amount and direction of the water flow can be freely controlled by using a pump as a means for generating a flow in the cleaning liquid.

According to a fifth aspect of the present invention, the discharge port of the discharge device for generating a flow of the cleaning liquid has a slit shape, so that a water flow is generated over the entire effective width of the vibrator without giving an impact to the object to be cleaned. It has an action that can be performed.

According to the sixth aspect of the present invention, the water pressure can be easily increased by forming the discharge port of the discharge device for generating a flow in the cleaning liquid into a shower, so that even if the vibrator is connected in multiple units, the pressure can be increased. It has the function of giving a water flow to the entire length with the discharge device of the stand.

The seventh aspect of the present invention has an effect of effectively generating a water flow at a necessary portion by installing a discharge device for generating a flow at one or more locations.

The invention described in claim 8 has the effect of making it possible to arbitrarily control the energy of the ultrasonic oscillator by stacking a plurality of plates by setting the plate placed between the ultrasonic oscillator and the substrate material to be a flat plate. .

According to the ninth aspect of the present invention, the plate provided between the ultrasonic vibrator and the substrate material is made of a corrugated plate, so that the ultrasonic vibration energy can be diffused over a wide range.

According to a tenth aspect of the present invention, the effect of cavitation can be reduced by providing at least one hole having a diameter equal to or less than a quarter wavelength of a standing wave in a plate provided between the ultrasonic vibrator and the substrate material. It has the effect of suppressing and effectively obtaining a shock wave.

According to the eleventh aspect of the present invention, the effect of erosion by ultrasonic waves can be reduced and the life of the apparatus can be extended by using metal as the material of the plate provided between the ultrasonic vibrator and the substrate material. Has a function that can be.

According to the twelfth aspect of the present invention, the sound pressure can be easily controlled by using a plurality of thin plates provided between the ultrasonic vibrator and the substrate material.

According to the thirteenth aspect of the present invention, the material of the plate sandwiching the substrate material is an air layer or a plate having air bubbles therein, thereby having an effect of suppressing the resonance of the substrate material.

According to the present invention, the substrate material is wetted before the substrate material is sandwiched between the plates, so that the substrate material and the plate are more strongly adhered by linking, so that resonance is further suppressed. The cleaning liquid that has entered has the function of cleaning the inside of the hole.

According to the fifteenth aspect, the sound pressure is 9.5.
When an ultrasonic vibrator having 5 × 10 ¹⁰ μPa or more is used,
When a plate material is provided between the substrate material and the ultrasonic vibrator to suppress the sound pressure, it has an effect that the conditions for obtaining a good hole shape can be easily adjusted.

According to the present invention, the sound pressure can be set to 4.78 × 10 ¹⁰ μPa or more and 9.55 by installing a plate.
By setting the pressure to 10 ¹⁰ μPa or less, there is an effect that a good hole shape can be obtained without peeling the film material from the substrate material.

According to a seventeenth aspect of the present invention, there is provided an attaching step of attaching a film-like material to one or both sides of a substrate for a substrate to form a substrate material with a film, and irradiating the substrate material with a film with a laser beam to penetrate the substrate material. A hole forming step of forming a non-through hole, a step of washing in a liquid in a water tank, a foreign matter or a water droplet attached to the film-attached substrate material, or a blowing step of removing the gas-blasted substrate material or the film-attached substrate material. In a method of manufacturing a circuit-forming substrate, comprising a mechanical cleaning step of removing adhering foreign matter with a rotating brush or the like, wherein the substrate material with a film is heated in at least one of the cleaning step, the blowing step, and the mechanical cleaning step. Of a circuit forming substrate characterized by heating using a substrate Are those that law has the effect of peeling can be prevented in the film from the film-coated substrate material during the process by having heating means for heating the film with a substrate material.

The invention according to claim 18 is characterized in that a preheating means for heating a substrate material with a film before a cleaning or blowing step or a mechanical cleaning step is provided, so that the film and the substrate are not subjected to stress in each step. It has the effect of enhancing the adhesive strength of the material.

The invention according to claim 19 has the function of heating the liquid used in the cleaning step to prevent the film from peeling from the substrate material with the film during cleaning.

According to the twentieth aspect of the present invention, by heating the gas used in the blowing step, the adhesive strength of the substrate material with a film is strengthened, and thus has the effect of preventing film peeling due to wind pressure.

According to a twenty-first aspect of the present invention, the adhesive strength between the substrate material and the film material after the attaching step has a property of being proportional to the temperature, and the temperature of the substrate material with the film heated by the heating means is reduced. When the substrate material or film-like material is subjected to a mechanical or physical stress applied to the substrate material with a film in a washing step or a blowing step below the heat-resistant temperature of the substrate material or a limit temperature which causes a change in a desired physical property value. By setting the heating temperature equal to or higher than the heating temperature at which the adhesion strength corresponding to the limit at which the part or the whole is separated from the substrate material is obtained, the material can be reliably produced without impairing the material properties.

According to a twenty-second aspect of the present invention, the base material for a substrate is a prepreg in which a reinforcing material is impregnated with a thermosetting resin to form a B-stage and the thermosetting resin contains an uncured portion. Has the effect of minimizing the effect of moisture.

According to a twenty-third aspect of the present invention, the reinforcing material is a glass fiber woven fabric or a non-woven fabric, and has an effect of reducing unevenness of the inner wall of the hole due to a difference in processing rate between the thermosetting resin and the glass fiber. .

According to a twenty-fourth aspect of the present invention, there is provided a laser processing method using an aromatic polyamide base material which is excellent in workability of a through hole by a laser by using a woven or non-woven aromatic polyamide fiber as a reinforcing material. It is possible to provide a method of manufacturing a circuit-forming substrate that can perform effective cleaning even if the thermosetting epoxy resin melted by the heat remains in the through hole as processing dust having adhesiveness.

According to the twenty-fifth aspect of the present invention, the liquid is water or purified pure water, and has the effect that the running cost of the process is low and a device for collecting the evaporated liquid is unnecessary.

According to a twenty-sixth aspect of the present invention, the liquid is an organic solvent, and has an effect of easily drying the substrate material after the removal processing.

According to a twenty-seventh aspect of the present invention, the holes formed in the substrate material are filled with a paste containing conductive particles during the step of forming the connection means, and the inner wall of the holes is processed with a shape having little unevenness. Since there is no adhesion of powder, it has an effect that the filling property of the paste into the hole is good.

The invention according to claim 28 includes plating during the step of forming the connecting means, and has good throwing power of the plating since the inner wall of the hole has a shape with little unevenness and no processing powder adheres. It has the action of:

According to a twenty-ninth aspect of the present invention, the film material to be bonded to both sides of the substrate material is formed by coating a thermosetting epoxy resin on both sides or one side of the film base material. It has the effect of obtaining appropriate adhesive strength.

According to a thirtieth aspect of the present invention, there is provided means for placing a substrate material on a plate having a surface having the same area or more as the ultrasonic vibrator and the substrate material in a water tank, and transporting the substrate material onto the ultrasonic vibrator. Having such a function has the effect of suppressing resonance of the substrate material and enabling continuous cleaning.

According to the thirty-first aspect of the present invention, the substrate material has a function of sandwiching the substrate material with a surface having the same area or more than the surface of the substrate material. .

According to a thirty-second aspect of the present invention, a circuit having high reliability is provided by having an ultrasonic oscillator and a device for generating a water flow in a water tank and having means for transporting a substrate material onto the ultrasonic oscillator. It has the function of manufacturing a substrate.

The invention according to claim 33 has the effect of reliably diffusing the sound field staying near the substrate material by flowing a water flow between the ultrasonic vibrator and the transported substrate material.

Hereinafter, an embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIG.

(Embodiment 1) FIGS. 1 (a) to 1 (g)
It is process sectional drawing of the manufacturing method of the multilayer circuit board of this invention.
In FIG. 1A, 1 is a 250 nm square, about 15 mm thick.
A composite material obtained by impregnating a thermosetting epoxy resin 3 (hereinafter referred to as an epoxy resin) into a nonwoven fabric composed of, for example, an aromatic polyamide fiber 2 (hereinafter referred to as an aramid fiber), which is a substrate material as an insulating base material having a thickness of 0 μm. A resin-impregnated base material consisting of The epoxy resin 3 is not completely cured and is in a so-called B-stage state including an uncured portion. The substrate material 1 is usually called a prepreg.

Reference numerals 4a and 4b denote releasable resin films each having a thickness of about 10 μm and having a thermosetting epoxy resin layer (not shown) having a thickness of about 1 μm on the bonding surface with the substrate material.
For example, polyethylene terephthalate (hereinafter referred to as a PET sheet) is used. After being used as a mask film in a subsequent process, it is peeled off and discarded, so that it is bonded only with very low strength (peel strength: 1 g / cm width).

Next, as shown in FIG. 1B, a laser 9 is irradiated on the substrate material 1 to form a through hole 10. At that time, the thermosetting epoxy resin and the aramid fiber in the substrate material 1 are sublimated by heat and scattered around. However, the thermosetting epoxy resin or aramid fiber, which could not be sublimated, remains on the hole wall surface as a hard and brittle deteriorated portion 11. Further, since the aramid fiber has higher heat resistance and a lower processing rate by laser as compared with the thermosetting epoxy resin, the aramid fiber easily remains without being sublimated and the inner wall of the hole has an uneven shape as shown in the figure. On the other hand, a part of the thermosetting epoxy resin or aramid fiber scattered around becomes a processing powder 12 and adheres to the surface of the substrate material 1 or the inside of the through hole 10.

Next, as shown in FIG. 1 (c), the substrate material 1 is brought close to the ultrasonic vibrator 13 in the ultrasonic washing tank where the water flow is generated by the submersible pump 18 while the water temperature is maintained at 60 ° C., and the water flow is applied. While the substrate material 1 is vibrated. Substrate material 1 due to sound energy radiated from ultrasonic transducer 13
Vibrates, and the deteriorated portion 11 and the processing powder 12 fall off and separate from the substrate material 1, thereby obtaining the substrate material 1 having a good hole shape as shown in FIG. 1D. When the substrate material 1 is washed while moving in water, FIG.
As shown in (h), a plurality of ultrasonic transducers 13 are arranged,
Discharge port 2 for generating a water flow for each ultrasonic transducer 13
When 6 is provided, an effect can be obtained also in continuous processing. In the removal process, the thermosetting epoxy resin in the B-stage state is used, so that the adhesive strength has the temperature characteristic shown in FIG. 2 and the adhesive strength is remarkably increased by applying heat to such an extent that the epoxy is not cured. The peel strength is improved.

Further, water is added to the substrate material 1 and the ultrasonic vibrator 13.
By flowing between them, there is an effect of eliminating stagnation of cavitation causing peeling, so that there is no damage due to vibration, and the hard and brittle deteriorated portion 11 and the processing powder 12 are selectively removed. When the number of ultrasonic vibrators is multiplied, by setting the number of discharge ports of the water flow equal to that of the ultrasonic vibrators, the effect of preventing peeling with a weak water flow can be obtained.

In addition, the process of FIG. 1 (c) is effective even if it is performed in the following two examples.

As shown in FIG. 3, when the sound pressure oscillated from the ultrasonic vibrator 13 is equal to or greater than 9.55 × 10 ¹⁰ μPa, a diffusion plate 17 is provided between the ultrasonic vibrator 13 and the substrate material 1. The sound pressure is 4.78 × 10 ¹⁰ μPa or more and 9.55 × 10
^By controlling the pressure to ¹⁰ μPa or less, the peeling of the film from the substrate material is prevented, and the hard and brittle deteriorated portion 11 and the processing powder 12 are formed.
Can be selectively removed.

Further, as shown in FIG. 4, the substrate material 1 wetted with water (having the same components as the cleaning liquid, not shown) such as a shower is sandwiched between the resonance suppressing plates 20 and subjected to ultrasonic cleaning. By making the PET sheets 4a and 4b rigid, the resonance of a portion where the bonding strength between the substrate material 1 and the PET sheets 4a and 4b is weak is suppressed, and the floating of the PET sheet from the substrate material 1 is prevented. At this time, since the cleaning liquid 19 is filled in the through hole 10 when wetted in advance, the ultrasonic waves reach and the hard and brittle altered portion 11 and the processing powder 12 are selectively removed.

Next, as shown in FIG. 1E, the conductive paste 14 is filled in the through-holes 10 by means such as printing.
Since the through hole 10 has a good shape, the conductive paste 1
4 is completely filled in the through hole 10 without any hindrance. PE which is a mask film after filling
Peel off the T sheet.

Next, as shown in FIG. 1 (f), the substrate material 1 is sandwiched between metal foils 15 and heated and pressed using a hot press device (not shown) so that the substrate material 1 is simultaneously formed and conductive. Metallic foil 15 and metallic foil 15 are electrically connected by conductive paste 14. Next, the metal foil 15 is patterned into a desired shape to obtain a double-sided circuit forming substrate having a circuit pattern 16 as shown in FIG.

In this embodiment, the double-sided circuit forming substrate has been described. However, it is needless to say that a multilayer circuit forming substrate can be obtained by repeating the steps a plurality of times.

(Embodiment 2) As shown in FIG. 5, the resonance suppressing plate 21 also serving as a transport plate is regarded as a belt conveyor.
The substrate material 1 is loaded on the lower transport plate by the loading device 22 and sequentially flows into the ultrasonic cleaning tank, whereby the substrate material 1 is automatically washed, and the substrate material is removed by the removal device 23 after cleaning. With this structure, an efficient circuit board manufacturing apparatus can be provided.

(Embodiment 3) FIG. 6 shows that the substrate material 1 can be transferred onto the ultrasonic vibrator in which the cavitation is diffused by the water flow generated by the submersible pump 18 installed in the water. PE does not work
This is an apparatus that can provide a high-quality circuit board because the hard and brittle deteriorated portion 11 and the processing powder 12 can be selectively removed while preventing peeling of the T sheet.

Although the present invention has been described with respect to filling with a conductive paste, similar results can be obtained by using plating.

[0061]

As described above, according to the method and apparatus for manufacturing a circuit-forming substrate of the present invention, a step of irradiating a laser to the substrate material to form a first or second through-hole or non-through-hole shape is provided. The altered part formed on the surface of the substrate material and the inner wall of the through hole or non-penetration hole of the first stage, or the powdery or lumpy material which is detached from the substrate material during or after the process and then reattached to the substrate material Vibrating the substrate material when removing at least one or both of the degenerated substances, the substrate material vibrates too much in the step of selectively removing the substrate material from the substrate material, and the PET sheet adhered to the substrate material peels off. The process consists of obtaining the desired through or non-penetrating hole shape so that high quality hole drilling can lose the speed of laser processing. Realized without those that can provide a method of manufacturing a highly reliable circuit forming substrate at low cost.

[Brief description of the drawings]

FIG. 1 is a process cross-sectional view of a method of manufacturing a circuit formation substrate according to a first embodiment of the present invention.

FIG. 2 is a characteristic diagram showing a relationship between adhesive strength and water temperature in the embodiment.

FIG. 3 is a schematic cross-sectional process view of a method of manufacturing a circuit board instead of FIG. 1 (c).

FIG. 4 is a schematic cross-sectional process view of a method for manufacturing a circuit board instead of FIG. 1 (c).

FIG. 5 is a schematic cross-sectional view of a circuit forming substrate manufacturing apparatus according to a second embodiment of the present invention.

FIG. 6 is a schematic cross-sectional view of a circuit forming substrate manufacturing apparatus according to a third embodiment of the present invention.

FIG. 7A is a plan view of a drilled portion in a conventional method of manufacturing a circuit-formed board, and FIG. 7B is a cross-sectional view of the drilled portion.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate material 2 Aramid fiber 3 Epoxy resin 4a, 4b PET sheet 9 Laser 10 Through hole 11 Transformed part 12 Processing powder 13 Ultrasonic vibrator 14 Conductive paste 15 Metal foil 16 Circuit pattern 17 Diffusion plate 18 Pump 19 Cleaning liquid 20 Resonance suppression Plate 21 Resonance suppression plate also serving as transport plate 22 Input device 23 Extraction device 26 Discharge port

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification code FI Theme coat ゛ (Reference) H05K 3/46 H05K 3/46 X (72) Inventor Toshiaki Takenaka 1006 Kazuma Kadoma, Kadoma, Osaka Matsushita Electric Industrial Inside (72) Inventor Shinji Nakamura 1006 Kadoma Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. (72) Inventor Akihiro Miura 1006 Kadoma Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.

Claims (33)

[Claims] 1. A laminating step of laminating a film-like material on one or both sides of a substrate for a substrate to form a substrate material with a film, and irradiating a laser to the substrate material with a film to form a through hole or a non-through hole. Forming step;
At least one or both of the degenerated portion and the degenerated substance formed on the inner wall of the through or non-through hole are selectively removed by ultrasonic cleaning in a water tank provided with an ultrasonic vibrator in a water tank and filled with a cleaning liquid. And a blow step of removing foreign matter or water droplets attached to the film-attached substrate material by spraying a gas, the method comprising the steps of: A method for producing a circuit-forming substrate, characterized in that a flow is generated in a cleaning liquid between the substrates. 2. A bonding step of bonding a film material to one or both surfaces of a substrate for a substrate to form a substrate material with a film, and irradiating the film material with a laser to form a through hole or a non-through hole. Forming step;
At least one or both of the degenerated portion and the degenerated substance formed on the inner wall of the through or non-through hole are selectively removed by ultrasonic cleaning in a water tank provided with an ultrasonic vibrator in a water tank and filled with a cleaning liquid. And a blow step of removing foreign matter or water droplets attached to the film-attached substrate material by spraying a gas, the method comprising the steps of: A method for manufacturing a circuit-formed substrate, wherein vibration is controlled by arranging a plate material between them. 3. A bonding step of bonding a film material to one or both surfaces of a substrate for a substrate to form a substrate material with a film, and irradiating a laser to the substrate material with a film to form a through hole or a non-through hole. Forming step;
At least one or both of the degenerated portion and the degenerated substance formed on the inner wall of the through or non-through hole are selectively removed by ultrasonic cleaning in a water tank provided with an ultrasonic vibrator in a water tank and filled with a cleaning liquid. And a blow step of removing foreign matter or water droplets adhering to the substrate material with a film by blowing a gas, wherein the substrate material with a film is sandwiched by a plate material or the substrate. A method for manufacturing a circuit-formed substrate, comprising performing ultrasonic cleaning while a plate material is adhered to one side of a material. 4. The cleaning liquid is generated by using a discharge device having a pump and a discharge port.
3. The method for manufacturing a circuit-formed substrate according to 1. 5. The method according to claim 4, wherein the discharge port has a slit shape. 6. The method for manufacturing a circuit-formed substrate according to claim 4, wherein a discharge device having a shower-like discharge port is used. 7. The method for manufacturing a circuit-formed substrate according to claim 5, wherein a discharge device having one or more discharge ports is used. 8. The method according to claim 2, wherein the plate material is a flat plate. 9. The method according to claim 2, wherein the plate member is a corrugated plate. 10. The method for manufacturing a circuit-formed substrate according to claim 8, wherein the plate material has at least one hole having a diameter equal to or less than １ ／ wavelength of the standing wave. 11. The method according to claim 2, wherein the plate material is a metal. 12. The method according to claim 11, wherein the plate member is composed of a plurality of thin plates. 13. The method according to claim 3, wherein the material of the plate material has an air layer or air bubbles therein. 14. The method according to claim 3, further comprising the step of wetting the substrate material before sandwiching the substrate material with the plate material.
3. The method for manufacturing a circuit-formed substrate according to 1. 15. The method according to claim 2, wherein the sound pressure emitted from the ultrasonic vibrator is 9.55 × 10 ¹⁰ μPa or more. 16. The sound pressure is increased by installing a plate material.
4. The method according to claim 2, wherein the pressure is set to 78 × 10 ¹⁰ μPa or more and 9.55 × 10 ¹⁰ μPa or less. 17. A bonding step of bonding a film-like material to one or both surfaces of a substrate for a substrate to form a substrate material with a film, and irradiating a laser to the substrate material with a film to form a through hole or a non-through hole. A forming step, a step of washing in a liquid in a water tank, a blowing step of removing foreign matter or water droplets adhered to the substrate material with a film by spraying a gas, or a rotating brush for removing foreign matter adhered to the substrate material with a film. Wherein the substrate material with a film is heated using a heating means in at least one of the cleaning step, the blowing step, and the mechanical cleaning step. A method for manufacturing a circuit forming substrate, comprising: 18. The method according to claim 1, further comprising a preheating means for heating the substrate material with the film before the cleaning step, the blowing step or the mechanical cleaning step.
8. The method for manufacturing a circuit-formed substrate according to any one of items 7. 19. The method according to claim 1, wherein the liquid used in the cleaning step is heated. 20. The method according to claim 1, wherein the gas used in the blowing step is heated. 21. The heating temperature of the heating means is not higher than the heat resistance temperature of the substrate material or the film material or a temperature at which a desired change in physical properties is reached, and a part or the whole of the film is higher than the substrate material due to mechanical or physical stress. The method according to claim 17, wherein the temperature is not lower than a temperature at which the substrate is not peeled. 22. The method for producing a circuit-formed substrate according to claim 1, wherein the substrate for a substrate is made of a prepreg which is B-staged by impregnating a reinforcing material with a thermosetting resin. 23. The method according to claim 22, wherein the reinforcing material is a glass fiber woven fabric or a nonwoven fabric. 24. The method according to claim 22, wherein the reinforcing material is an aromatic polyamide fiber woven or nonwoven fabric. 25. The method according to claim 1, wherein the liquid to be washed is water or purified pure water. 26. The method according to claim 1, wherein the liquid to be washed is an organic solvent. 27. A circuit formed on the surface of the circuit forming substrate or in a through hole or a non-through hole formed in the hole forming step after the method of manufacturing a circuit forming substrate according to claim 1. Forming a connection means for connecting circuits to each other, and filling a hole formed in the substrate material with a paste containing conductive particles during the step of forming the connection means. Manufacturing method. 28. After the method of manufacturing a circuit-forming substrate according to claim 1, the circuit formed on the surface of the circuit-forming substrate or inside the through-hole or the non-penetrating hole formed in the hole forming step. A step of forming connecting means for connecting circuits to each other, and plating is included in the step of forming the connecting means. 29. The circuit according to claim 1, wherein the film-like material to be attached to both sides of the substrate material is a film base material having both sides or one side coated with a thermosetting epoxy resin. A method for manufacturing a formed substrate. 30. A water tank having an ultrasonic transducer in the tank,
An apparatus for manufacturing a circuit-formed substrate, comprising: a transport member having an area equal to or greater than the substrate material; and means for transporting the substrate material by a predetermined distance above an ultrasonic vibrator in a water tank. 31. The apparatus for manufacturing a circuit-formed substrate according to claim 30, wherein the transport member includes a mechanism for holding the substrate material between the plate members. 32. The water tank is provided with a water flow generator.
30. The apparatus for manufacturing a circuit-formed substrate according to claim 9, 30. 33. The apparatus according to claim 32, wherein a water flow generator is provided at a position where a water flow is generated between the conveying means in the water tank and the ultrasonic vibrator.