CN107658390B - 一种显示面板和显示面板的封装方法 - Google Patents

一种显示面板和显示面板的封装方法 Download PDF

Info

Publication number
CN107658390B
CN107658390B CN201711012994.9A CN201711012994A CN107658390B CN 107658390 B CN107658390 B CN 107658390B CN 201711012994 A CN201711012994 A CN 201711012994A CN 107658390 B CN107658390 B CN 107658390B
Authority
CN
China
Prior art keywords
substrate
adhesive layer
luminous intensity
display panel
embedded photoluminescent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201711012994.9A
Other languages
English (en)
Other versions
CN107658390A (zh
Inventor
孙东领
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Hefei BOE Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Hefei BOE Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Hefei BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to CN201711012994.9A priority Critical patent/CN107658390B/zh
Publication of CN107658390A publication Critical patent/CN107658390A/zh
Priority to US15/977,365 priority patent/US20190127631A1/en
Application granted granted Critical
Publication of CN107658390B publication Critical patent/CN107658390B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
    • C09K11/025—Use of particular materials as binders, particle coatings or suspension media therefor non-luminescent particle coatings or suspension media
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/67—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing refractory metals
    • C09K11/69—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing refractory metals containing vanadium
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/74—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing arsenic, antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64—Fluorescence; Phosphorescence
    • G01N21/6428—Measuring fluorescence of fluorescent products of reactions or of fluorochrome labelled reactive substances, e.g. measuring quenching effects, using measuring "optrodes"
    • G01N21/643—Measuring fluorescence of fluorescent products of reactions or of fluorochrome labelled reactive substances, e.g. measuring quenching effects, using measuring "optrodes" non-biological material
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/70—Testing, e.g. accelerated lifetime tests
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/422—Luminescent, fluorescent, phosphorescent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0837—Bismuth
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64—Fluorescence; Phosphorescence
    • G01N21/6428—Measuring fluorescence of fluorescent products of reactions or of fluorochrome labelled reactive substances, e.g. measuring quenching effects, using measuring "optrodes"
    • G01N2021/6439—Measuring fluorescence of fluorescent products of reactions or of fluorochrome labelled reactive substances, e.g. measuring quenching effects, using measuring "optrodes" with indicators, stains, dyes, tags, labels, marks
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/04—Materials and properties dye
    • G02F2202/046—Materials and properties dye fluorescent
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/861—Repairing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Molecular Biology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

本发明提供一种显示面板和显示面板的封装方法，所述显示面板包括第一基板和第二基板，第一基板和第二基板之间设置有用于密封的粘结层，粘结层位于第一基板和第二基板的周边区域，通过在粘结层内均匀混合发光材料，利用检测装置检测粘结层内不同位置的发光材料的发光强度，粘结层内发光强度较大位置的厚度较厚，发光强度较小位置的厚度较薄，从而可以判断出粘结层不同位置的厚度的差异，相应可以判断出粘结层内是否存在断裂、空洞或厚度不均等缺陷，不但可以检测出显示面板的封装不良，相应提高显示面板的品质，还可以确定出封装不良的具体位置，以便于对封装不良的原因进行解析。

Description

一种显示面板和显示面板的封装方法
技术领域
本发明涉及显示技术领域，特别涉及一种显示面板和显示面板的封装方法。
背景技术
目前主流的显示面板包括：OLED(Organic Light-Emitting Diode,有机发光二极管)显示面板和LCD(Liquid Crystal Display，液晶显示)显示面板，OLED显示面板和LCD显示面板均要避免水汽和氧气进入显示面板，尤其是OLED显示面板，对水汽和氧气极为敏感，渗透进OLED显示面板内部的水汽和氧气是影响其使用寿命的主要因素，因此，对显示面板的封装工艺提出了更高的要求。
现有Frit(玻璃粉)封装技术由于具有隔绝水氧能力好、工艺简单等优点，备受制造厂商的青睐，但是，在利用激光对玻璃粉进行烧结之后，显示面板出现的玻璃粉内断裂、空洞或厚度不均等缺陷难以被检测。
发明内容
本发明针对现有技术中存在的上述不足，提供一种显示面板和显示面板的封装方法，用以至少部分解决现有显示面板的封装不良难以被检测的问题。
为实现上述目的，本发明提供一种显示面板，包括第一基板和第二基板，所述第一基板和所述第二基板之间设置有用于密封的粘结层，所述粘结层位于所述第一基板和所述第二基板的周边区域，所述粘结层内均匀混合有发光材料，以使检测装置检测所述粘结层内不同位置的发光材料的发光强度。
优选的，所述发光材料为光致发光粉。
优选的，所述光致发光粉包括红外光光致发光粉、紫外光光致发光粉或可见光光致发光粉。
优选的，所述粘结层的材料为玻璃粉。
优选的，所述光致发光粉的激发峰的波长为250-400nm。
优选的，所述光致发光粉的发射峰的波长为900-1100nm。
本发明还提供一种显示面板的封装方法，所述方法包括：
将粘结层材料与发光材料均匀混合；
将混合有所述发光材料的粘结层材料形成在第一基板或第二基板的周边区域；
将第二基板与所述第一基板对盒，并通过所述混合有所述发光材料的粘结层材料将所述第一基板和所述第二基板密封，以形成粘结层；
利用检测装置检测所述粘结层不同位置的发光强度。
优选的，所述粘结层材料为玻璃粉，所述发光材料为光致发光粉；
所述通过所述混合有发光材料的粘结层材料将所述第一基板和所述第二基板密封的步骤具体包括：
利用激光将所述玻璃粉熔化，以将所述第一基板和所述第二基板粘结，并利用所述激光激发所述光致发光粉，以使所述光致发光粉发光。
优选的，所述利用检测装置检测所述粘结层不同位置的发光强度之后，所述方法还包括：
比较所述粘结层不同位置的发光强度，若其中至少一个位置的发光强度与其他位置的发光强度不同，则利用激光将所述发光强度不同的位置处的玻璃粉熔化，以调整所述位置的发光材料的发光强度。
优选的，所述光致发光粉包括红外光光致发光粉、紫外光光致发光粉或可见光光致发光粉。
本发明具有以下有益效果：
本发明提供一种显示面板和显示面板的封装方法，所述显示面板包括第一基板和第二基板，第一基板和第二基板之间设置有用于密封的粘结层，粘结层位于第一基板和第二基板的周边区域，通过在粘结层内均匀混合发光材料，利用检测装置检测粘结层内不同位置的发光材料的发光强度，粘结层内发光强度较大位置的厚度较厚，发光强度较小位置的厚度较薄，从而可以判断出粘结层不同位置的厚度的差异，相应可以判断出粘结层内是否存在断裂、空洞或厚度不均等缺陷，不但可以检测出显示面板的封装不良，相应提高显示面板的品质，还可以确定出封装不良的具体位置，以便于对封装不良的原因进行解析。
附图说明
图1为本实施例提供的显示面板的结构示意图；
图2为本实施例提供的显示面板的制备方法的流程图。
图例说明：
1、第一基板 2、第二基板 3、粘结层 4、发光材料
具体实施方式
为使本领域的技术人员更好地理解本发明的技术方案，下面结合附图对本发明提供的一种显示面板和显示面板的封装方法进行详细描述。
本发明实施例提供一种显示面板，如图1所示，所述显示面板包括第一基板1和第二基板2，第一基板1和第二基板2之间设置有粘结层3，粘结层3位于第一基板1和第二基板2的周边区域，用于密封第一基板1和第二基板2，粘结层3内均匀混合有发光材料4，发光材料4能够发光，以使检测装置检测粘结层3内不同位置的发光材料4的发光强度。
具体的，粘结层3不同位置的发光强度与发光材料4的数量成正比，即粘结层3发光强度弱的位置发光材料4的数量较少，粘结层3发光强度强的位置发光材料4的数量较多；发光材料4的数量与粘结层3的厚度成正比，即发光材料4的数量较多的位置粘结层3的厚度较厚，发光材料4的数量较少的位置粘结层3的厚度较薄。因此，通过检测装置检测粘结层3内不同位置的发光材料4的发光强度的差异，并比较不同位置的发光强度的大小差异，以判断出粘结层3不同位置的厚度的差异。
本发明实施例提供的显示面板，通过在粘结层3内均匀混合发光材料4，在显示面板封装之后，可以利用检测装置检测粘结层3内不同位置的发光材料4的发光强度，粘结层3内发光强度较大位置的厚度较厚，发光强度较小位置的厚度较薄，从而可以判断出粘结层3不同位置的厚度的差异，相应可以判断出粘结层3内是否存在断裂、空洞或厚度不均等缺陷，不但可以检测出显示面板的封装不良，相应提高显示面板的品质，还可以确定出封装不良的具体位置，以便于对封装不良的原因进行解析。
优选的，发光材料4为光致发光材料。光致发光材料是指能够在一定的波长的光的激发下，发射出一定波长的光的材料，光致发光材料可以包括掺杂不同的稀土离子的发光材料，上述光致发光材料的发光强度较高、发光时间较长，便于检测装置检测粘结层3内不同位置的发光强度。
根据光致发光材料受激发后所发出的光的波长进行划分，光致发光材料可以包括红外光光致发光材料、紫外光光致发光材料或可见光光致发光材料。当光致发光材料为红外光光致发光材料时，检测装置可以检测粘结层3内不同位置发出的红外光的强度，当光致发光材料为紫外光光致发光材料时，检测装置可以检测粘结层3内不同位置发出的紫外光的强度，当光致发光材料为可见光光致发光材料时，检测装置可以检测粘结层3内不同位置发出的可见光的强度。
显示面板可以通过UV胶(紫外固化胶)封装，也可以通过Frit(玻璃粉)封装，由于Frit封装相比于UV胶封装，工艺简单且隔绝水氧能力强，因此，本发明实施例以显示面板通过玻璃粉封装为例进行说明，相应粘结层3的材料为玻璃粉。
需要说明的是，显示面板通过UV胶封装也是可行的，当显示面板通过UV胶封装时，粘结层3的材料为紫外固化胶。
当通过玻璃粉对显示面板封装时，激光将玻璃粉熔化，以将第一基板1和第二基板2粘结密封。优选的，光致发光材料的激发峰的波长为250-400nm，这样，光致发光材料的激发光的波长与激光的波长相比配，即在激光将玻璃粉熔化的过程中，激光可以激发光致发光材料，以使发光致发光材料发光，从而不用额外对光致发光材料进行激发，相应简化了封装工艺。
优选的，光致发光材料的发射峰的波长为900-1100nm。也就是说，光致发光材料为红外光光致发光材料，即光致发光材料在激发后发出红外光，检测装置对红外光的检测精度较高，能够更佳准确的检测粘结层3内不同位置的发光强度。具体的，红外光光致发光材料可以包括Bi3+和Yb3+共掺杂的GdVO4材料。
本发明实施例还提供一种显示面板的封装方法，结合图1和图2所示，所述方法包括：
步骤11，将粘结层材料与发光材料4均匀混合。
具体的，可以利用物理的方法，例如机械搅拌或超声波分散的方法，将发光材料4均匀的分散在粘结层材料中。
需要说明的是，本发明实施例以显示面板通过Frit(玻璃粉)封装方法进行封装为例进行说明，相应粘结层材料为玻璃粉。
当粘结层材料为玻璃粉时，所述将粘结层材料与发光材料4均匀混合的步骤，具体包括：
通过固相法将发光材料4制成粉末状，将成粉末状的发光材料4与粘结层材料均匀混合。通过上述步骤可以使粘结层材料与发光材料4混合更均匀。
优选的，发光材料4为光致发光材料，光致发光材料的发光强度较高高、发光时间较长。
步骤12，将混合有发光材料4的粘结层材料形成在第一基板1或第二基板2的周边区域。
具体的，可以通过涂布工艺将混合有发光材料4的粘结层材料涂布在第一基板1或第二基板2的周边区域，也可以通过丝网印刷工艺将混合有发光材料4的粘结层材料印刷在第一基板1或第二基板2的周边区域。
步骤13，将第二基板2与第一基板1对盒，并通过混合有发光材料4的粘结层材料将第一基板1和第二基板2密封，以形成粘结层3。
具体的，混合有发光材料4的粘结层材料将第一基板1和第二基板2粘结密封之后，形成粘结层3。
当粘结层材料为玻璃粉时，所述通过混合有发光材料4的粘结层材料将第一基板1和第二基板2密封的步骤，具体包括：
利用激光将玻璃粉熔化，以将第一基板1和第二基板2粘结，并利用激光激发光致发光材料，以使光致发光材料发光。
具体的，激光可以对玻璃粉进行加热，以将玻璃粉熔化，熔融状态下的玻璃粉可以将第一基板1和第二基板2粘结，玻璃粉固化之后，以形成粘结层3。激光可以激发光致发光材料，以使光致发光材料发光，从而不用额外对光致发光材料进行激发，相应简化了封装工艺。
需要说明的是，发光材料的熔点大于玻璃粉的熔点，在激光将玻璃粉熔化的过程中，发光材料不会熔化，相应不会影响熔融状态下的玻璃粉对第一基板1和第二基板2的粘结效果。
步骤14，利用检测装置检测粘结层3不同位置的发光强度。
具体的，粘结层3不同位置的发光强度与发光材料4的数量成正比，即粘结层3发光强度弱的位置发光材料4的数量较少，粘结层3发光强度强的位置发光材料4的数量较多；发光材料4的数量与粘结层3的厚度成正比，即发光材料4的数量较多的位置粘结层3的厚度较厚，发光材料4的数量较少的位置粘结层3的厚度较薄。因此，通过检测装置检测粘结层3内不同位置的发光材料4的发光强度的差异，可以判断出粘结层3不同位置的厚度的差异。
本发明实施例提供的显示面板的封装方法，首先将粘结层材料与发光材料4均匀混合，然后将混合有发光材料4的粘结层材料形成在第一基板1的周边区域，再将第二基板2与第一基板1对盒，并通过混合有发光材料4的粘结层材料将第一基板1和第二基板2密封，以形成粘结层3，最后利用检测装置检测粘结层3不同位置的发光强度，从而可以根据检测装置检测粘结层3不同位置的发光强度判断出粘结层3不同位置的厚度的差异，相应可以通过粘结层3不同位置的厚度的差异，判断出粘结层3内是否存在断裂、空洞或厚度不均等缺陷，不但可以检测出显示面板的封装不良，相应提高显示面板的品质，还可以确定出封装不良的具体位置，以便于对封装不良的原因进行解析。
进一步的，所述利用检测装置检测粘结层3不同位置的发光强度之后，所述方法还包括：
步骤15，比较粘结层3不同位置的发光强度，若其中至少一个位置的发光强度与其他位置的发光强度不同，则利用激光将发光强度不同的位置处的玻璃粉熔化，以调整所述位置的发光材料4的发光强度。
具体的，检测装置检测粘结层3不同位置的发光强度，并比较粘结层3不同位置的发光强度的差异，若其中至少一个位置的发光强度与其他位置的发光强度差异较大时，说明所述发光强度差异较大的位置处存在断裂、空洞或厚度不均等缺陷，则利用激光将所述发光强度差异较大的位置处的玻璃粉熔化，熔融状态的玻璃粉具有一定的流动性，以修复玻璃粉内的断裂、空洞或厚度不均等缺陷，使粘结层3不同位置的发光强度的差异较小。通过上述方法可以对显示面板的封装不良进行修复，从而可以提高显示面板的良率。
需要说明的是，所述至少一个位置的发光强度与其他位置的发光强度不同，是指至少一个位置的发光强度与其他位置的发光强度的差异较大，若发光强度的差异大于预设阈值时，则说明差异较大，若发光强度的差异小于或等于预设阈值时，则说明差异较小，其中，所述预设阈值需要根据粘结层3的厚度的实际工艺波动进行确定。
还需要说明的是，光致发光材料可以包括红外光光致发光材料、紫外光光致发光材料或可见光光致发光材料。具体的，红外光光致发光材料在激发后可以发出红外光，紫外光光致发光材料在激发后可以发出紫外光，可见光光致发光材料在激发后可以发出可见光。优选的，光致发光材料为红外光光致发光材料，检测装置对红外光的检测精度较高，能够更佳准确的检测粘结层3内不同位置的发光强度。
可以理解的是，以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式，然而本发明并不局限于此。对于本领域内的普通技术人员而言，在不脱离本发明的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本发明的保护范围。

Claims (7)

1.一种显示面板，包括第一基板和第二基板，所述第一基板和所述第二基板之间设置有用于密封的粘结层，所述粘结层位于所述第一基板和所述第二基板的周边区域，其特征在于，所述粘结层内均匀混合有发光材料，所述粘结层的材料为玻璃粉，以使检测装置检测所述粘结层内不同位置的发光材料的发光强度，并使得检测装置比较所述粘结层不同位置的发光强度，若其中至少一个位置的发光强度与其他位置的发光强度不同，则利用激光将所述发光强度不同的位置处的玻璃粉熔化，以调整所述位置的发光材料的发光强度。
2.根据权利要求1所述的显示面板，其特征在于，所述发光材料为光致发光材料。
3.根据权利要求2所述的显示面板，其特征在于，所述光致发光材料包括红外光光致发光材料、紫外光光致发光材料或可见光光致发光材料。
4.根据权利要求3所述的显示面板，其特征在于，所述光致发光材料的激发峰的波长为250-400nm。
5.根据权利要求3所述的显示面板，其特征在于，所述光致发光材料的发射峰的波长为900-1100nm。
6.一种显示面板的封装方法，其特征在于，所述方法包括：
将粘结层材料与发光材料均匀混合；
将混合有所述发光材料的粘结层材料形成在第一基板或第二基板的周边区域；
将第二基板与所述第一基板对盒，并通过所述混合有所述发光材料的粘结层材料将所述第一基板和所述第二基板密封，以形成粘结层；
利用检测装置检测所述粘结层不同位置的发光强度；
其中，所述粘结层材料为玻璃粉，所述发光材料为光致发光材料；
所述通过所述混合有发光材料的粘结层材料将所述第一基板和所述第二基板密封的步骤具体包括：
利用激光将所述玻璃粉熔化，以将所述第一基板和所述第二基板粘结，并利用所述激光激发所述光致发光材料，以使所述光致发光材料发光；
所述利用检测装置检测所述粘结层不同位置的发光强度之后，所述方法还包括：
比较所述粘结层不同位置的发光强度，若其中至少一个位置的发光强度与其他位置的发光强度不同，则利用激光将所述发光强度不同的位置处的玻璃粉熔化，以调整所述位置的发光材料的发光强度。
7.根据权利要求6所述的显示面板的封装方法，其特征在于，所述光致发光材料包括红外光光致发光材料、紫外光光致发光材料或可见光光致发光材料。
CN201711012994.9A 2017-10-26 2017-10-26 一种显示面板和显示面板的封装方法 Active CN107658390B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201711012994.9A CN107658390B (zh) 2017-10-26 2017-10-26 一种显示面板和显示面板的封装方法
US15/977,365 US20190127631A1 (en) 2017-10-26 2018-05-11 Display panel and encapsulating method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711012994.9A CN107658390B (zh) 2017-10-26 2017-10-26 一种显示面板和显示面板的封装方法

Publications (2)

Publication Number Publication Date
CN107658390A CN107658390A (zh) 2018-02-02
CN107658390B true CN107658390B (zh) 2019-10-22

Family

ID=61119606

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201711012994.9A Active CN107658390B (zh) 2017-10-26 2017-10-26 一种显示面板和显示面板的封装方法

Country Status (2)

Country Link
US (1) US20190127631A1 (zh)
CN (1) CN107658390B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200064670A1 (en) * 2018-08-22 2020-02-27 Innolux Corporation Electronic device and method for manufacturing the same
CN109256464A (zh) * 2018-11-08 2019-01-22 深圳市万普拉斯科技有限公司 Oled显示装置
WO2020123539A1 (en) * 2018-12-11 2020-06-18 Flex Lighting Ii, Llc Front illumination lightguide with a diffusely reflective release liner
CN111452236B (zh) * 2020-04-16 2022-05-03 西安奕斯伟材料科技有限公司 晶棒粘接方法及晶棒粘接装置
JP7523127B2 (ja) 2020-11-19 2024-07-26 株式会社アクロエッジ 紫外線硬化層の硬化状態を評価する方法及び製品の製造方法
CN114384715B (zh) * 2021-12-29 2023-06-06 武汉天马微电子有限公司 显示面板和显示装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101098783B1 (ko) * 2009-10-21 2011-12-26 송진원 양자점을 이용한 디스플레이 장치 및 그 제조방법
TWI531094B (zh) * 2013-05-17 2016-04-21 Daxin Materials Corp And a light-emitting device for a light-emitting device
CN104793408A (zh) * 2015-05-07 2015-07-22 合肥鑫晟光电科技有限公司 显示面板及显示装置
CN104880864B (zh) * 2015-06-17 2018-11-16 合肥鑫晟光电科技有限公司 封框胶固化装置及封装方法
CN105116629A (zh) * 2015-09-16 2015-12-02 京东方科技集团股份有限公司 一种封框胶组合物、显示面板及其制备方法、显示装置
CN105304684B (zh) * 2015-11-18 2019-02-01 深圳市华星光电技术有限公司 彩色显示装置及其制作方法
KR102468361B1 (ko) * 2016-03-22 2022-11-18 삼성디스플레이 주식회사 표시 장치 및 표시장치의 제조 방법
CN106647051A (zh) * 2017-02-10 2017-05-10 京东方科技集团股份有限公司 隔垫物、其制备方法及封框胶和显示装置

Also Published As

Publication number Publication date
US20190127631A1 (en) 2019-05-02
CN107658390A (zh) 2018-02-02

Similar Documents

Publication Publication Date Title
CN107658390B (zh) 一种显示面板和显示面板的封装方法
US8883528B2 (en) Methods of producing light emitting device with phosphor wavelength conversion
CN104022234B (zh) Oled封装设备及oled面板的封装方法
CN100474646C (zh) 白光发光二极管的封装方法
US20220231201A1 (en) Devices including green-emitting phosphors
JP3172454U (ja) 発光ダイオードパッケージ構造
US9103954B2 (en) Cell for light-emitting device and light-emitting device
CN102804423A (zh) 磷光体转换ir led
CN103525398A (zh) 一种量子点复合颗粒及其制备方法、光电元件和光电设备
JP2006202962A (ja) 発光装置
CN107546301B (zh) 一种白胶、led灯珠及其的封装方法
CN108550607A (zh) 一种显示面板、显示装置及其封装检测方法
WO2013121752A1 (ja) 樹脂塗布装置および樹脂塗布方法
CN108682729A (zh) Csp led的封装方法及csp led的封装结构
CN103207476A (zh) 一种led背光液晶显示装置及其发光材料的涂覆方法
CN106450025A (zh) 蓝光补偿膜与oled显示装置
CN104518072B (zh) 发光二极管
CN104993037A (zh) 一种发光二极管及其封装结构、封装方法和显示装置
CN102969434B (zh) Led组件
CN107808923A (zh) 一种用于led的荧光薄膜结构的制备方法
CN111788280A (zh) 包括发射绿光的磷光体的器件
CN106784238A (zh) 量子点透镜型直下式led背光源的制作方法
CN101571265B (zh) 一种led显示器
CN103606614A (zh) 一种白光led用荧光板及其制备工艺
KR20140078269A (ko) 유기전계발광표시장치 및 그 제조방법

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant