CN107613649A

CN107613649A - A kind of new PCB and processing technology and process line

Info

Publication number: CN107613649A
Application number: CN201710804254.2A
Authority: CN
Inventors: 曹憬; 廖国祯
Original assignee: HUANXU ELECTRONICS CO Ltd
Current assignee: HUANXU ELECTRONICS CO Ltd; Universal Scientific Industrial Co Ltd
Priority date: 2017-09-08
Filing date: 2017-09-08
Publication date: 2018-01-19
Anticipated expiration: 2037-09-08
Also published as: CN107613649B

Abstract

The invention discloses a kind of new PCB and processing technology and process line, new PCB includes：PCB main bodys, the same side surface of PCB main bodys are provided with the first predeterminated position and the second predeterminated position；First predetermined position is used to set mat surface；Second predetermined position is used to set electronic component.Invention increases the roughness of PCB main bodys so that during follow-up plastic packaging so that the contact area on plastic-sealed body and PCB surface becomes big, and then improves tightness, stability and sealing that plastic-sealed body is connected with PCB, ensure that the quality of plastic packaging.So as to ensure that the quality of hardware (drop test of product, insulating properties of electronic component etc.) for the electronic product for being provided with the PCB of the present invention and software quality (stability of electronic component signal, intensity etc.).

Description

A kind of new PCB and processing technology and process line

Technical field

The present invention relates to communication technique field, espespecially a kind of new PCB and processing technology and process line.

Background technology

In practical application, for ruggedized electronicses component and PCB connection, prevent extraneous dust etc. from entering electronic component It is interior, avoid electronic component leak electricity and each electronic component between interference etc., it is necessary to carry out plastic packaging to electronic component, and Plastic packaging needs the distance between electronic component to meet certain spacing, to meet connecing for the PCB between plastic-sealed body and electronic component Contacting surface is accumulated, and then ensures that electronic component has stable close annexation with PCB, so as to ensure the product of product Can, the stability and intensity of such as crash resistance, signal.

At present, the electronic product in communication field is more and more integrated and microminiaturization, along with electronic product is functional Integrate, the typesetting spacing of the internal component of electronic product certainly will be less and less, this trend and electronics member device in practical application Spacing between part needs to contradict, and therefore, how to solve the spacing between electronic component and diminishes increasingly and electronics in practical application The contradiction of spacing demand between component, it is those skilled in the art's urgent need to solve the problem.

Therefore, the application is directed to providing a kind of new PCB and processing technology and process line.

The content of the invention

It is an object of the invention to provide a kind of new PCB and processing technology and process line, the thick of PCB main bodys is increased Rugosity so that during follow-up plastic packaging so that the contact area on plastic-sealed body and PCB surface becomes big, and then improves plastic packaging Tightness, stability and the sealing that body is connected with PCB, ensure that the quality of plastic packaging.

Technical scheme provided by the invention is as follows：

A kind of new PCB, including：

PCB main bodys, the same side surface of the PCB main bodys are provided with the first predeterminated position and the second predeterminated position；

First predetermined position is used to set mat surface；

Second predetermined position is used to set electronic component.

In the technical program, pass through the first predetermined position for being used to set the surface of electronic component in PCB main bodys Mat surface is set, so as to increase the roughness of PCB main bodys so that during follow-up plastic packaging, plastic-sealed body is able to mat surface Contact, due to the presence of mat surface so that the contact area on plastic-sealed body and PCB surface becomes big, and then improve plastic-sealed body with Tightness, stability and the sealing of PCB connections, it ensure that quality the progress that only need to be to existing PCB of the invention of plastic packaging somewhat Change, and need not change existing PCB overall structure (as do not have to installation position of the electronic component on PCB is entered Row modification), certainly, PCB construction of the invention is also suitable PCB (i.e. electronic component installation position generations on PCB of new design Change), and the position and both position relationships of mat surface and electronic component on PCB can be according to actual product needs It is designed, produce, processes.

It is further preferred that the PCB main bodys include the sub- PCB main bodys of several interconnections；The two neighboring son Cutting Road is provided between PCB main bodys；The same side surface of each sub- PCB main body be equipped with first predeterminated position and Second predeterminated position；A part for the mat surface is located at the Cutting Road, and another part of the mat surface is located at At the sub- PCB main bodys；And/or the PCB main bodys include the sub- PCB main bodys of several interconnections；Each described son The same side surface of PCB main bodys is equipped with first predeterminated position and second predeterminated position；The two neighboring sub- PCB Cutting Road is provided between main body；The mat surface is set away from the Cutting Road.

In the technical program, creative make use of the more sub- PCB main bodys each other by Cutting Road connection to be formed one (in the production process i.e. after plastic packaging, the plurality of sub- PCB main bodys can be cut separates and is formed list to whole PCB architectural feature Individual PCB), due to the presence of Cutting Road so that there is certain processing gap between two neighboring sub- PCB, facilitate mat surface The walking and processing action of processing unit (plant).Certainly, except mat surface is individually arranged on to Cutting Road and PCB intersection with Outside, mat surface can also be provided separately within PCB surface, mat surface can also be arranged on simultaneously Cutting Road and PCB intersection and PCB surface.Set-up mode variation, can be selected according to practical situations.

It is further preferred that the surface of the PCB main bodys is interval with the blind hole that several are used to house plastic-sealed body；It is provided with The surface of the PCB main bodys of the blind hole forms the mat surface.

In the technical program, the formation of mat surface is realized by several (i.e. at least one) blind holes, due in plastic packaging mistake Cheng Zhong, plastic-sealed body can be flowed into blind hole so that blind hole is filled by plastic-sealed body, and the inwall of blind hole and bottom surface can connect with plastic-sealed body Connection is touched, after plastic-sealed body cools down, because the inwall of blind hole increases plastic-sealed body and PCB contact area, and then enhances modeling Compactness, fastness and the sealing of Feng Tiyu PCB connections, ensure that plastic packaging quality.And the processing cost of blind hole is low, Yi Shi It is existing, it is workable and easy to operate.Than prior art, increased contact area is mainly the surface area of the inwall of blind hole, Therefore, in practical application, the shape of blind hole preferably has larger inner surface structure.

It is further preferred that the cross sectional shape of the blind hole is ellipse, circular or kidney-shaped；And/or the depth of the blind hole Spend half of the size no more than the thickness of the PCB main bodys；And/or the quantity at least two of the blind hole；Adjacent two The distance value of the central point of the individual blind hole is not less than twice along the size sum of its centerline direction；And/or the blind hole The distance value of central point and the electronic component adjacent thereto is not less than 150 μm.

In the technical program, according to practical application needs, the cross sectional shape of blind hole can diversified facilities (can be ellipse Shape, circle, kidney-shaped, triangle, polygon etc.), and influence in order to avoid the setting because of blind hole PCB structural strength, machinery Intensity, the depth of blind hole are preferably lower than or equal to the half of whole PCB thickness, and in order to avoid the setting because of blind hole causes electricity Sub- component causes that PCB's is bad during PCB is fixedly arranged on, because the welding fluid of electronic component flows into blind hole, therefore, The distance at the edge of the central point of blind hole and electronic component adjacent thereto is not less than 150 μm.So as to meet electronic component The demand of self structure intensity and mechanical strength, welding (SMT or pin welding) demand, plastic packaging and with the processing after plastic packaging The performance requirement of process (such as cutting, sputter).

Present invention also offers a kind of new PCB processing technology, including step：

S100, fixed PCB main bodys, mat surface, the PCB main bodys are processed in the first predetermined position of the PCB main bodys Same side surface be provided with the first predeterminated position and the second predeterminated position；Second predetermined position is used to set electronics member device Part.

In the technical program, progress changing somewhat that only need to be to existing PCB, and need not change existing PCB's Overall structure (as not having to be modified during change is existing to installation position of the electronic component on PCB), it is certainly, of the invention PCB structure is also suitable the PCB (i.e. electronic component installation position on PCB changes) of new design, and mat surface and electricity Position and both position relationship of the sub- component on PCB can need to be designed according to actual product, produce, process Deng.And the setting of mat surface can be automated by automation equipment, the processing of intelligent and mass, and then realize this The automating of PCB, intelligent, mass production, the performance of the production efficiency of the present invention, product quality and product is ensure that, With good practicality, applicability, market prospects and the market competitiveness, meet increasingly integrated electronic product, microminiaturization and The market of function integration.It is worthy of note that also can by be positioned manually easily realize mat surface processing unit (plant) positioning, but This method is less efficient, is preferably applied to the less PCB of output.

Mat surface is set by the first predetermined position for being used to set the surface of electronic component in PCB main bodys, from And increase the roughness of PCB main bodys so that during follow-up plastic packaging, plastic-sealed body is contacted with mat surface, due to coarse The presence in face so that the contact area on plastic-sealed body and PCB surface becomes big, and then improves the fastening that plastic-sealed body is connected with PCB Property and stability, so as to which the spacing efficiently solved between electronic component diminishes between electronic component in practical application increasingly The problem of spacing demand so that electronic product is while meeting that its increasingly integrated, microminiaturization and function are integrated, it is ensured that Its properties of product, be such as connected with electronic component and PCB related product crash resistance, the stability of product signal and intensity, Service life of electronic product etc..So that microminiaturization, integrated and function modoularization electronic product are meeting user To its small volume, in light weight, signal stabilization and the good demand of intensity, the city of the electronic product using this product is substantially increased Field potentiality and competitiveness.

It is further preferred that the PCB main bodys include the sub- PCB main bodys of several interconnections；Each described sub- PCB The same side surface of main body is equipped with first predeterminated position and second predeterminated position；The two neighboring sub- PCB master Cutting Road is provided between body；The same side surface of each sub- PCB main body is equipped with first predeterminated position and described Second predeterminated position；A part for the mat surface is located at the Cutting Road, and another part of the mat surface is positioned at described At sub- PCB main bodys；And/or the PCB main bodys include the sub- PCB main bodys of several interconnections；Each described sub- PCB master The same side surface of body is equipped with first predeterminated position and second predeterminated position；The two neighboring sub- PCB main bodys Between be provided with Cutting Road；The mat surface is set away from the Cutting Road.

It is further preferred that step S100 includes step：

S121, the processing unit (plant) for processing blind hole move to first predetermined position；

S122, the processing unit (plant) processing blind hole so that the surface of the PCB main bodys provided with the blind hole forms described Mat surface.

It is further preferred that the cross sectional shape of the blind hole is ellipse, circular or kidney-shaped；And/or the depth of the blind hole Spend the thickness that size is not more than the PCB main bodys；And/or the quantity at least two of the blind hole；It is two neighboring described The distance value of the central point of blind hole is not less than twice along the size sum of its centerline direction；And/or the central point of the blind hole It is not less than 150 μm with the distance value of the electronic component.

It is further preferred that the PCB main bodys include the sub- PCB main bodys of several interconnections；Each described sub- PCB The same side surface of main body is equipped with first predeterminated position and second predeterminated position；The two neighboring sub- PCB master Cutting Road is provided between body；A part of hole wall of the blind hole is located at the Cutting Road, another part hole wall of the blind hole At the sub- PCB main bodys；Or, the PCB main bodys include the sub- PCB main bodys of several interconnections；Each described son The same side surface of PCB main bodys is equipped with first predeterminated position and second predeterminated position；Two sub- PCB main bodys Between be provided with Cutting Road；The blind hole at least two, including Part I blind hole and Part II blind hole；Described first is default Position includes the first sub- predeterminated position and the second sub- predeterminated position, and the first sub- predeterminated position is used to set the Part I Blind hole, the second sub- predeterminated position are used to set the Part II blind hole；A part of hole wall of the Part I blind hole At the Cutting Road, another part hole wall of the Part I blind hole is located at the sub- PCB main bodys；Described second Blind hole is divided to be located at the described second sub- predetermined position.

In the technical program, creative make use of what the more sub- PCB main bodys connected each other by Cutting Road were formed (in the production process i.e. after plastic packaging, the plurality of sub- PCB main bodys can be cut to be separated and is formed one whole PCB architectural feature Single PCB), due to the presence of Cutting Road so that there is certain processing gap between two neighboring sub- PCB, facilitate blind hole Processing unit (plant) is walked and processing action.Certainly, blind hole can be provided separately within Cutting Road and PCB intersection；Blind hole can also be independent It is arranged on PCB surface；Blind hole can also be arranged on the intersection of Cutting Road and PCB and PCB surface simultaneously.Set-up mode is more Sample, those skilled in the art can be selected according to practical situations.

It is further preferred that also include step：

S010, design the PCB be used for the first predeterminated position of the mat surface is set and for placing the electricity Second predeterminated position of sub- component so that first predeterminated position is located at the periphery of second predeterminated position；Or, S020, design the first predeterminated position for being used to set the mat surface of the PCB so that first predeterminated position is located at institute State the periphery of the second predeterminated position.

In the technical program, the design of mat surface can be designed and process after PCB is made；Can also be together with PCB It is designed, and is preferably processed after the PCB is made.

It is further preferred that also include step：

S200, clean the PCB main bodys so that the impurity of the mat surface is cleaned.

In the technical program, due to during mat surface is processed in mat surface, or even in addition to mat surface Impurity, such as burr, floating dust occur on PCB surface, the presence of these impurity can influence PCB when carrying out subsequent technique, shadow The quality assurance of technique is rung, therefore, after mat surface is processed, these impurity of preferred pair are purged processing, follow-up to ensure The quality of technique (such as welding electronic component, plastic packaging).

It is further preferred that when the clean method of the PCB main bodys is wet-cleaning mode, after step S200, also Including step：

S300, dry the PCB main bodys after wet-cleaning.

In the technical program, when PCB cleaning mode is (clear such as washing or liquid containing water for wet-cleaning mode Clean mode or the cleaning mode that water can be produced) when, in order to ensure that follow-up welding, plastic packaging are normally carried out, it is necessary to wet-cleaning PCB afterwards is dried；Certainly, in order to accelerate PCB production efficiency, production production capacity and output, at PCB cleaning Manage for wet-cleaning when, processing PCB preferably is dried by drying device, certainly, also can be by way of natural air drying PCB is dried processing.

It is further preferred that also include step：

S400, the fixed electronic component is in the second predetermined position of the PCB main bodys；

S500, electronic component described in plastic packaging so that plastic-sealed body and the asperity contact.

In the technical program, after electronic component tentatively is installed in into PCB, for ruggedized electronicses component and PCB Connect, prevent extraneous dust etc. from entering in electronic component, avoid doing between electronic component electric leakage and each electronic component Disturb, plastic packaging is carried out to electronic component so that during plastic packaging, plastic-sealed body and asperity contact, during plastic packaging, when When plastic-sealed body is fluid state, plastic-sealed body will flow directly into mat surface；When plastic-sealed body is solid, because rear extended meeting is to solid The plastic-sealed body of state is heated, so that it becomes molten condition, likewise, plastic-sealed body also can be with mat surface fluidly Simultaneously cooled and solidified is contacted, so as to realize the plastic packaging to electronic component.

Present invention also offers a kind of new PCB process line, including：

Processing unit (plant), mat surface is processed for the first predetermined position in PCB main bodys to be processed；

Cleaning device, the PCB to be processed of the mat surface processing is completed for cleaning；

SMT device, the PCB to be processed of cleaning treatment is completed for electronic component to be arranged on；

Plastic packaging apparatus, SMT PCB to be processed is completed for plastic packaging so that plastic-sealed body and the asperity contact；And

Control system, it communicates with the processing unit (plant) and connected.

In the technical program, pass through the first predetermined position for being used to set the surface of electronic component in PCB main bodys Mat surface is set, so as to increase the roughness of PCB main bodys so that during follow-up plastic packaging, plastic-sealed body is able to mat surface Contact, and then tightness, stability and sealing that plastic-sealed body is connected with PCB are improved, it ensure that the quality present invention of plastic packaging Progress changing somewhat that only need to be to existing PCB, and the overall structure that need not change existing PCB is (as existing in not having to change Have and installation position of the electronic component on PCB modified), certainly, PCB of the invention structure is also suitable new design PCB (i.e. electronic component installation position on PCB changes), and position on PCB of mat surface and electronic component, with And both position relationships can need to be designed according to actual product, produce, process.

It is further preferred that when the cleaning device is wet type cleaning equipment, in addition to drying device so that it is to be processed PCB is dried after completing wet-cleaning by the drying device.

In the technical program, when PCB cleaning mode is wet type, in order to ensure that follow-up welding, plastic packaging are normally carried out, Need that the PCB after wet-cleaning is dried；In order to accelerate PCB production efficiency, production production capacity and output, work as PCB Cleaning treatment when being wet-cleaning, processing PCB preferably is dried by drying device.Certainly, also can be clear by dry type Clean mode cleans PCB, and such as hairbrush, dry ice clean.

A kind of new PCB and processing technology and process line provided by the invention, can bring following at least one to have Beneficial effect：

1st, in the present invention, set by first predetermined position on the surface for setting electronic component in PCB main bodys Mat surface is put, so as to increase the roughness of PCB main bodys so that during follow-up plastic packaging, plastic-sealed body is connect with mat surface Touch, due to the presence of mat surface so that the contact area on plastic-sealed body and PCB surface becomes big, and then improves plastic-sealed body and PCB The tightness and stability of connection, diminish increasingly and electronics in practical application so as to efficiently solve the spacing between electronic component The problem of spacing demand between component so that electronic product is meeting that its increasingly integrated, microminiaturization and function integrate same When, it is ensured that its properties of product, be such as connected with electronic component and PCB related product crash resistance, product signal it is steady Qualitative and intensity, service life of electronic product etc..So that microminiaturization, integrated and function modoularization electronic product exist Meet user to its small volume, it is in light weight, signal stabilization and intensity are good the needs of, substantially increase the electricity using this product The market potential and competitiveness of sub- product, there are good practicality, applicability and market prospects, meet electronic product and collect increasingly Cheng Hua, microminiaturization and function integration market.

2nd, in the present invention, progress changing somewhat that only need to be to existing PCB, and the whole of existing PCB need not be changed Body structure (as not having to be modified during change is existing to installation position of the electronic component on PCB), certainly, PCB of the invention Structure be also suitable the PCB (i.e. electronic component installation position on PCB changes) of new design, and mat surface and electronics member Position and both position relationship of the device on PCB can need to be designed according to actual product, produce, process.3、 In the present invention, because PCB needs to set many electronic components, wherein the electronic component for needing to carry out plastic packaging can be distributed in On positions different PCB, in order to ensure the tightness as much as possible for needing the electronic component of plastic packaging to be connected with PCB and stably Property, therefore the mat surface of the present invention can set up diverse location in PCB surface separately according to being actually needed with actual conditions, and preferably around The periphery for the electronic component for needing plastic packaging is located at, and when PCB is single sided board, then mat surface need to only be located at PCB side table Face；When PCB is dual platen, then mat surface is located in PCB both side surface.

4th, in the present invention, mat surface at least provided with the PCB surface of a blind hole preferably by forming, because the hole wall of blind hole can Increase plastic-sealed body and PCB contact area, and then strengthen tightness and stability that plastic-sealed body is connected with PCB, and then ensure that The tightness and stability that electronic component is connected with PCB.And the quantity of blind hole can be configured according to actual conditions, its section Ellipse, circular or kidney-shaped are shaped as, or even can be polygonized structure, various shapes and personalization, and can be blind according to setting The PCB in hole size, shape etc. are configured, and when being strip at the PCB as set blind hole, then blind hole is preferably slotted eye Or waist row hole, and the extension direction of the big footpath direction of blind hole is identical with the extension direction of strip hole；And the depth dimensions of blind hole is not More than the half of the thickness of the PCB main bodys, so effectively avoid influenceing because of the setting of blind hole PCB structural strength and Mechanical strength, so as to effectively avoid PCB from occurring bad phenomenon during following process, (such as crackle, breakage, even fragmentation are existing As)；More excellent, in order to avoid PCB, when carrying out the welding of component, welding fluid flows into blind hole and causes the bad phenomenon of this product, Blind hole is preferably not less than 150 μm with distance value of the electronic component close to the edge of its side, and when PCB is dual platen, if The blind hole preferable space dislocation in PCB two sides is put, so, the bad phenomenon for avoiding triggering because blind hole runs through PCB is (caused by such as The harmful effect of PCB subsequent machining technologies：Phenomena such as failure or effect are bad；PCB structural strength is poor and cracked, broken Damage, even fragmentation phenomena such as).

5th, in the present invention, when PCB is made up of multiple single sub- PCB, blind hole may be provided on PCB surface, blind hole It is alternatively positioned on Cutting Road, i.e., the part hole wall of blind hole is located on Cutting Road；So, more sub- PCB complete plastic packaging together When, plastic-sealed body can flow into and fill blind hole, after plastic-sealed body cooled and solidified, although hereafter the plurality of sub- PCB is eventually cut Cut and separate to form single sub- PCB, and the plastic-sealed body in blind hole be located at that a part of plastic-sealed body of Cutting Road can be with cutting Road is cut off together, but the plastic-sealed body in the blind hole is located at sub- PCB another part plastic-sealed body and can retained, because blind hole is located at Sub- PCB another part hole wall increases plastic-sealed body and PCB contact surface, therefore, can equally strengthen plastic-sealed body and is connected with PCB Tightness and stability, and then ensure that tightness and stability that electronic component is connected with PCB；Certainly, blind hole also may be used A part is arranged on the surface of the PCB between electronic component, and another part is arranged on PCB and Cutting Road simultaneously.

Brief description of the drawings

Below by a manner of clearly understandable, preferred embodiment is described with reference to the drawings, to new PCB and processing technology and Above-mentioned characteristic, technical characteristic, advantage and its implementation of process line are further described.

Fig. 1 is a kind of new PCB of present invention example structure schematic diagram；

Fig. 2 is Fig. 1-2 B-B diagrammatic cross-sections；

Fig. 3 is the flow chart of the first embodiment of the processing technology of the present invention；

Fig. 4 is the flow chart of second of embodiment of the processing technology of the present invention；

Fig. 5 is the flow chart of the third embodiment of the processing technology of the present invention；

Fig. 6 is the flow chart of the 4th kind of embodiment of the processing technology of the present invention；

Fig. 7 is the flow chart of the 5th kind of embodiment of the processing technology of the present invention.

Drawing reference numeral explanation：

1. the first sub- PCB main bodys, 2. second sub- PCB main bodys, 3. Cutting Roads, 4. mat surfaces, 41. blind holes, 411. first Divide inwall, 412. Part II inwalls, 5. second predeterminated positions, 6. first predeterminated positions.

Embodiment

In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, control is illustrated below The embodiment of the present invention.It should be evident that drawings in the following description are only some embodiments of the present invention, for For those of ordinary skill in the art, on the premise of not paying creative work, other can also be obtained according to these accompanying drawings Accompanying drawing, and obtain other embodiments.

To make simplified form, part related to the present invention is only schematically show in each figure, their not generations Its practical structures as product of table.In addition, so that simplified form readily appreciates, there is identical structure or function in some figures Part, only symbolically depict one of those, or only marked one of those.Herein, "one" not only table Show " only this ", the situation of " more than one " can also be represented.

Embodiment one

As illustrated in fig. 1 and 2, a kind of new PCB, including：PCB main bodys (the i.e. first sub- PCB master of PCB main bodys 1 and/or the 2nd Body 2), the same side surface (not indicated in figure) of PCB main bodys is provided with the first predeterminated position 6 and the second predeterminated position 5；First is default It is used to set mat surface 4 at position 6；It is used to set electronic component (not indicating in figure) at second predeterminated position 5.The present invention is logical Cross to be used to set in the plate face outside the second predeterminated position 5 of electronic component in PCB and be provided for setting the second of mat surface 4 Predeterminated position 5, and the presence of mat surface 4 causes PCB (or PCB main bodys) during follow-up plastic packaging, in the thick of increase PCB main bodys While rugosity, the contact area (i.e. the active area of power) of plastic-sealed body and PCB main bodys is also increased, and then is increased between the two Frictional force so that tightness, stability and the sealing that plastic-sealed body is connected with PCB, ensure that the quality of plastic packaging, so as to indirectly It ensure that quality of hardware (drop test of product, the insulating properties of electronic component of the electronic product of the PCB provided with the present invention Deng) and software quality (stability of electronic component signal, intensity etc.).For existing PCB, the present invention need to only be set at it The surface for having electronic component carries out the design and processing of mat surface 4, and need not change existing PCB overall structure (as modified without change in existing to installation position of the electronic component on PCB, without changing existing each interlayers of PCB Structural modification etc.), for existing PCB, it is of the invention it is workable, be also easy to realize, and nor affect on follow-up PCB's Work flow is normally carried out.Not to mention (i.e. electronic component installation position on PCB redesigns and arranged new PCB PCB), now, the position and both position relationships of mat surface 4 and electronic component on PCB can be according to actual product need It is designed, produce, processes；Certainly, the setting of mat surface 4 can be also designed again after new PCB is machined.More Excellent, the setting of mat surface 4 can be automated by automation equipment, the processing of intelligent and mass, and then realize this The automating of PCB, intelligent, mass production, while ensure that the product of the present invention and its production efficiency of electronic product, production The performance of quality and product.It is worthy of note that the second predeterminated position 5 and the first predeterminated position 6 of the invention is independently set Put, it is not overlapping between the two.And the present invention says that the electronic component of description refers in particular to need the electronic component of plastic packaging.

Embodiment two

As illustrated in fig. 1 and 2, on the basis of embodiment one, in addition to the mat surface 4 at the first predeterminated position 6 is arranged on, Mat surface 4 is located at the periphery of the second predeterminated position 5, and during plastic packaging, plastic-sealed body can form one layer in PCB surface has one Determine the plastic packaging layer of thickness, therefore, all can pair electronics being connected with it by plastic packaging layer no matter which position mat surface 4 is arranged on Component has the annexation for strengthening the electronic component and PCB.Therefore, the periphery of the present embodiment, a kind of is the periphery of narrow sense： Refer in particular to some electronic component or need side (the i.e. PCB tables provided with mat surface 4 of the several electronic components of plastic packaging together Other electronic components are not provided between face and one or several electronic components).In actual applications, only to plastic packaging The periphery of higher some or certain some electronic components of quality requirement sets mat surface 4, and to it is some will to plastic packaging quality Ask the periphery of relatively low electronic component to be then not provided with mat surface 4, so, can specific aim it is increased to some or several needs The plastic-sealed body of the electronic component of overall plastic packaging and PCB contact area.Periphery that is another then being broad sense：Refer to some electronics Component or need the several electronic components of plastic packaging together side electronic component it is adjacent thereto other electronics member Side between device (is interval with one between the PCB surface and one or several electronic components i.e. provided with mat surface 4 More than other electronic components), such method to set up can equally strengthen the quality of plastic packaging, but specific aim it is poor and .

Embodiment three

As illustrated in fig. 1 and 2, on the basis of embodiment one or two, mat surface 4 includes some sub- mat surfaces 4, several Sub- mat surface 4 is divided into the same side surface of PCB main bodys.And PCB main bodys include the sub- PCB main bodys of several interconnections (i.e. First sub- 1 and second sub- PCB main bodys 2 of PCB main bodys)；The same side surface of each sub- PCB main body is equipped with the first predeterminated position 6 and second predeterminated position 5；Cutting Road 3 is provided between two neighboring sub- PCB main bodys；A part of position (i.e. blind hole 41 of mat surface 4 Part I inwall 411) at Cutting Road 3, another part (i.e. the Part II inwall 412 of blind hole 41) position of mat surface 4 At sub- PCB main bodys.It is worthy of note that Cutting Road 3 here refers not only to the connecting plate between two PCB, also refer on single PCB If need to carry out to cut separation the modular connecting plate by between each (at least one) electronic component (i.e. PCB's itself Plate body).

Example IV

As illustrated in fig. 1 and 2, unlike embodiment three, mat surface 4 is not only provided at Cutting Road 3 and sub- PCB main bodys Intersection, and also part mat surface 4 is located at the other positions of sub- PCB main bodys.What deserves to be explained is mat surface 4 can also be only It is provided only in PCB main bodys, and is not arranged in its intersection with Cutting Road 4.Here Cutting Road can refer to whole cuttings Road, it can also refer to the Cutting Road of part.

Embodiment five

As illustrated in fig. 1 and 2, on the basis of embodiment one, two, three or four, in addition to electronic component, it is arranged at At two predeterminated positions 5；When PCB main bodys one side sets electronic component, (PCB is that single sided board or one side set electronic component Multi-layer sheet), then 4 need of mat surface are arranged on a side surface of PCB main bodys；When the two-sided setting electronic component of PCB main bodys (i.e. PCB is the multi-layer sheet of dual platen or two-sided setting electronic component), then mat surface 4 need to be arranged on the both sides table of PCB main bodys Face, and it is located at the setting of the size, locus of the area of the mat surface 4 of both side surface, so that the mat surface 4 in both side surface The arrangement mode of sub- mat surface 4, size, spatial relation etc., can be selected according to actual conditions, planning and designing, Here just do not repeat one by one.

Embodiment six

As illustrated in fig. 1 and 2, on the basis of embodiment one, two, three, four or five, if the surface of PCB main bodys is interval with The dry blind hole 41 for being used to house plastic-sealed body；The surface of PCB main bodys provided with blind hole 41 forms mat surface 4.The section of blind hole 41 It is shaped as ellipse, circular or kidney-shaped；Half of the depth dimensions of blind hole 41 no more than the thickness of PCB main bodys；Blind hole 41 Quantity at least two；The distance value of the central point of two neighboring blind hole 41 is not less than along the size sum of its centerline direction Twice (distance value of the central point of i.e. two neighboring blind hole 41 is not less than two blind holes 41 along the size on its centerline direction Sum, such as when blind hole 41 is circle, and center line is passed through in the center of circle of circle, now the distance value of two neighboring blind hole 41, which is at least, justifies Twice of diameter；It is now two neighboring blind when blind hole 41 is ellipse, and oval major diameter is located on the center line of adjacent blind hole 41 The distance value in hole 41 be at least major diameter twice)；The edge of the central point of blind hole 41 and electronic component adjacent thereto Distance value be not less than 150 μm.Blind hole 41 in the present embodiment or through hole or not run through the groove of PCB main bodys, even It is to be raised in projection or spaced groove and projection of PCB body surfaces etc. to play enhancing plastic-sealed body and PCB main bodys The structure setting of annexation.

Embodiment seven

A kind of new PCB processing technology, including step：S100, fixed PCB main bodys, first in the PCB main bodys are pre- If processing mat surface 4 at position 6, the same side surface of the PCB main bodys is provided with the first predeterminated position 6 and the second predeterminated position 5； It is used to set electronic component at second predeterminated position 5.

In practical application, because the position of mat surface 4, size, quantity etc. are variable；And PCB can be a side surface Need the circuit board of setting electronic component；Or both side surface is required to set the circuit board of electronic component, as PCB master When the two sides of body are respectively provided with electronic component, its can at least one surface mat surface 4 is set, therefore, the in the present embodiment One predeterminated position 6 not merely refer to certain or some, and refer to the first predeterminated position 6 all in PCB main bodys.And when the One predeterminated position 6 is multiple and when being located at diverse location, then needs to carry out the processing of mat surface 4 in a predetermined order.

Embodiment eight

As shown in figure 3, a kind of new PCB processing technology, step S100 include step：

S110, the fixed PCB main bodys；

It is worthy of note that in order to ensure being smoothed out for mat surface processing, needed when reprocessing mat surface to PCB Main body is fixed, and so as to ensure that the stability of PCB main bodys in process, and then ensure that particularly automation, intelligence During energy metaplasia production, accurate setting of the mat surface processing unit (plant) to the precise positioning and mat surface of the first predeterminated position, from And it ensure that the crudy of mat surface.When PCB main bodys only have a side surface to need to set mat surface, then PCB main bodys are consolidated It is fixed only to need once, but when PCB main bodys both sides are required to set mat surface, then preferably first process on a side surface Mat surface, then reprocess the mat surface of another side surface, then during this, or be by being fixed again after overturning PCB main bodys, And the constant realization in processing unit (plant) position of mat surface, or the displacement for the processing unit (plant) for passing through mat surface, and PCB body positions are not Become and realize；Certainly, also mat surface can be processed in PCB main bodys both side surface simultaneously, so, processing the processing unit (plant) of mat surface then needs Two sets are set, and is divided into the side of the both side surface of PCB main bodys, can so accelerate the formation speed of mat surface.And this reality Apply the blind hole in example be alternatively through hole or for do not run through PCB main bodys groove, be even raised in PCB body surfaces projection, Or spaced groove and projection etc. can play enhancing plastic-sealed body and the structure setting of PCB main body annexations.

It must be noted that the working depth of blind hole, its cross sectional shape, the spacing of two neighboring blind hole and blind hole with The position relationship of electronic component can be configured according to being actually needed.Preferably, the cross sectional shape of blind hole is oval, circular Or kidney-shaped；Half of the depth dimensions of blind hole no more than the thickness of PCB main bodys；The quantity of blind hole is at least one；And work as When the quantity of blind hole is multiple (being more than or equal to two), the distance value of the central point of two neighboring blind hole is not less than along its center line (distance value of the central point of i.e. two neighboring blind hole is not less than two blind holes along its center line side for twice of the size sum in direction Upward size sum, such as when blind hole is circle, and the center of circle of circle is when passing through center line, and now the distance value of two neighboring blind hole is extremely It is less circular diameter twice；It is now two neighboring when blind hole is ellipse, and oval major diameter is located on the center line of adjacent blind hole The distance value of blind hole be at least major diameter twice)；The edge of the central point of blind hole and electronic component adjacent thereto Distance value is not less than 150 μm.

What deserves to be explained is when PCB main bodys need two-sided processing blind hole, the blind hole on two sides is preferably mutually wrong Open, and its depth is less than the 1/2 of PCB body thickness；So as to ensure that the structural strength after PCB main body processing blind holes and machinery are strong Degree, with ensure subsequent machining technology be normally carried out and the quality assurance of PCB finished products.And the processing of blind hole can pass through radium-shine dress Put and realized with Digit Control Machine Tool etc..

Embodiment nine

As shown in figure 4, a kind of new PCB processing technology, including step：

S100, fixed PCB main bodys, mat surface, the PCB main bodys are processed in the first predetermined position of the PCB main bodys Same side surface be provided with the first predeterminated position and the second predeterminated position；Second predetermined position is used to set electronics member device Part；

S200, clean the PCB main bodys so that the impurity of the mat surface is cleaned；

What deserves to be explained is due to when processing mat surface, it is (bad to subsequent technique inevitably to produce impurity Material), it is therefore desirable to PCB main bodys are cleared up so that PCB main bodys carry out follow-up technique with good cleannes.As added Man-hour has partial impurities to enter the second predeterminated position for putting electronic device, due to the mode of either pin welding Fixed electronic component, or electronic component is fixed by way of surface mounting technology (SMT), it is required to by welding side Formula realizes the fixed of electronic component, the presence of impurity, can influence welding effect, causes that PCB's is bad, so as to influence PCB The stability and fastness being connected with electronic component, it is clear that this and starting point of the invention are disagreed.Certainly, if processed During mat surface, impurity is not produced, then can directly perform step S400 and S500 successively after execution of step S100, therefore, Step S200 is optional step.And the mode of cleaning PCB main bodys can be divided into dry type (brush cleaning mode, dry ice cleaning mode) With wet type (cleaning mode for washing, containing or producing water).

Embodiment ten

As shown in figure 5, unlike embodiment nine, before step S100, in addition to step：S010, described in design PCB's is used to set the first predeterminated position of the mat surface and the second default position for placing the electronic component Put so that first predeterminated position is located at the periphery of second predeterminated position.

It is worthy of note that mat surface (i.e. the first predeterminated position) of the invention at the beginning of PCB design can with for putting The second predeterminated position for putting electronic component is designed together, is easy to PCB layout so that mat surface and electronic component Position relationship is more reasonable.Certainly, for existing PCB, mat surface can be also designed after PCB is made, and and with Its adjacent second predeterminated position (i.e. electronic component) is spaced second predeterminated position or multiple second predeterminated positions are (i.e. electric Sub- component).

Embodiment 11

As shown in fig. 6, a kind of new PCB processing technology, including step：

S010, design the PCB be used for the first predeterminated position of the mat surface is set and for placing the electricity Second predeterminated position of sub- component so that first predeterminated position is located at the periphery of second predeterminated position；

S210, wash the PCB main bodys so that the impurity of the mat surface is cleaned；

S310, dry the PCB main bodys after washing；

In actual applications, if by water-washing method to clean the surface of PCB main bodys when, preferably pass through drying device To dry PCB main bodys, to shorten the process time of this technique, the production efficiency and production production capacity of this technique are improved, certainly, In practical operation, in order to save PCB production cost, the PCB main bodys after washing can be also dried by natural air drying.

Embodiment 12

As shown in fig. 7, unlike embodiment 11, step S100 includes step：

S110, the fixed PCB main bodys；

In actual applications, the processing of blind hole is carried out whether through radium-shine or CNC modes, is carried out to PCB main bodys During drilling, the contact with PCB main bodys due to ray or drill bit, while blind hole is formed, prepreg (PP) and/or Copper foil and/or welding resistance paint etc. can produce chip (i.e. impurity) while being drilled through, and the chip may be kept in blind hole, also may be used The other positions of PCB main bodys can be splashed to, therefore, cleaning are rinsed to the chip by water-washing method, so as to ensure PCB master The cleannes of body.

Embodiment 13

A kind of new PCB process lines, including：Control system, the pipeline for conveying PCB main bodys to be processed, with And for processing the processing unit (plant) of mat surface；Pipeline is located at the side of the processing unit (plant)；Control system respectively with pipeline Communicate and connect with processing unit (plant).The cooperating of pipeline and processing unit (plant) is controlled by control system, so as to realize mat surface Automate, intelligent and controllable metaplasia production, so as to greatly improve the operating efficiency of streamline；And it can be realized by control system The accurate processing and control of mat surface, so as to ensure PCB yield rate.In actual applications, due to the PCB of same electronic product Layout be standardization and sameization, therefore, the position of the mat surface on the type PCB can also realize standardization, unitize, So as to realize the pipelining of mat surface processing.And PCB processing procedure streamline can be connected before the process line of mat surface, after can Open and connect being made for PCBA.So as to not influence the realization of PCB of the present invention streamline.

Embodiment 14

On the basis of embodiment 13, in addition to cleaning device；Cleaning device is located at the side of pipeline, and along defeated The conveying direction of line sending is located at the rear of processing unit (plant) so that by sanitizer cartridge after the processing of PCB main bodys completion mat surface to be processed Put and cleaned so that the impurity of mat surface is cleaned.Cleaning device can be divided into dry cleaning device and wet type cleaning equipment, when clear When clean device is wet type cleaning equipment, preferably also include drying device；Wet type cleaning equipment is located at the side of pipeline, and edge The conveying direction for pipeline is located at the rear of wet type cleaning equipment so that PCB to be processed is dried dress after completing wet-cleaning Put and dry.

Embodiment 15

On the basis of embodiment 13 or 14, in addition to SMT device and Plastic packaging apparatus；SMT device and Plastic packaging apparatus The side of pipeline is successively set on along the conveying direction of pipeline；So that complete mat surface processing after PCB to be processed according to Secondary completion SMT and plastic packaging so that plastic-sealed body and asperity contact.Certainly, along the direction of pipeline, it may also include cutting dress Put, sputtering unit, detection means and packing device etc..

It should be noted that above-described embodiment can independent assortment as needed.Described above is only the preferred of the present invention Embodiment, it is noted that for those skilled in the art, do not departing from the premise of the principle of the invention Under, some improvements and modifications can also be made, these improvements and modifications also should be regarded as protection scope of the present invention.

Claims

A kind of 1. new PCB, it is characterised in that including：

PCB main bodys, the same side surface of the PCB main bodys are provided with the first predeterminated position and the second predeterminated position；

First predetermined position is used to set mat surface；

Second predetermined position is used to set electronic component.
2. new PCB according to claim 1, it is characterised in that：

The PCB main bodys include the sub- PCB main bodys of several interconnections；

Cutting Road is provided between the two neighboring sub- PCB main bodys；

The same side surface of each sub- PCB main body is equipped with first predeterminated position and second predeterminated position；

A part for the mat surface is located at the Cutting Road, and another part of the mat surface is located at the sub- PCB main bodys Place；

And/or

The PCB main bodys include the sub- PCB main bodys of several interconnections；

The same side surface of each sub- PCB main body is equipped with first predeterminated position and second predeterminated position；

Cutting Road is provided between the two neighboring sub- PCB main bodys；

The mat surface is set away from the Cutting Road.
3. new PCB according to claim 1 or 2, it is characterised in that：

The surface of the PCB main bodys is interval with several blind holes for being used to house plastic-sealed body；

The surface of PCB main bodys provided with the blind hole forms the mat surface.
4. new PCB according to claim 3, it is characterised in that：

The cross sectional shape of the blind hole is ellipse, circular or kidney-shaped；

And/or

Half of the depth dimensions of the blind hole no more than the thickness of the PCB main bodys；

And/or

The quantity at least two of the blind hole；

The distance value of the central point of the two neighboring blind hole is not less than twice along the size sum of its centerline direction；

And/or

The distance value of the central point of the blind hole and the electronic component adjacent thereto is not less than 150 μm.
A kind of 5. processing technology of new PCB suitable for described in the claims 1-4 any one, it is characterised in that bag Include step：

S100, the fixed PCB main bodys, mat surface is processed in the first predetermined position of PCB main bodys, the PCB main bodys it is same One side surface is provided with the first predeterminated position and the second predeterminated position；Second predetermined position is used to set electronic component.
6. processing technology according to claim 5, it is characterised in that：

The PCB main bodys include the sub- PCB main bodys of several interconnections；

The same side surface of each sub- PCB main body is equipped with first predeterminated position and second predeterminated position；

Cutting Road is provided between the two neighboring sub- PCB main bodys；

The same side surface of each sub- PCB main body is equipped with first predeterminated position and second predeterminated position；

A part for the mat surface is located at the Cutting Road, and another part of the mat surface is located at the sub- PCB main bodys Place；

And/or

The PCB main bodys include the sub- PCB main bodys of several interconnections；

The same side surface of each sub- PCB main body is equipped with first predeterminated position and second predeterminated position；

Cutting Road is provided between the two neighboring sub- PCB main bodys；

The mat surface is set away from the Cutting Road.
7. processing technology according to claim 5, it is characterised in that：

Step S100 includes step：

S121, the processing unit (plant) for processing blind hole move to first predetermined position；

S122, the processing unit (plant) processing blind hole so that the surface of the PCB main bodys provided with the blind hole forms described coarse Face.
8. processing technology according to claim 7, it is characterised in that：

The cross sectional shape of the blind hole is ellipse, circular or kidney-shaped；

And/or

The depth dimensions of the blind hole is not more than the thickness of the PCB main bodys；

And/or

The quantity at least two of the blind hole；

The distance value of the central point of the two neighboring blind hole is not less than twice along the size sum of its centerline direction；

And/or

The distance value of the central point of the blind hole and the electronic component adjacent thereto is not less than 150 μm.
9. processing technology according to claim 7, it is characterised in that：

The PCB main bodys include the sub- PCB main bodys of several interconnections；

The same side surface of each sub- PCB main body is equipped with first predeterminated position and second predeterminated position；

Cutting Road is provided between the two neighboring sub- PCB main bodys；

A part of hole wall of the blind hole is located at the Cutting Road, and another part hole wall of the blind hole is located at the sub- PCB At main body；

Or,

The PCB main bodys include the sub- PCB main bodys of several interconnections；

The same side surface of each sub- PCB main body is equipped with first predeterminated position and second predeterminated position；

Cutting Road is provided between two sub- PCB main bodys；

The blind hole at least two, including Part I blind hole and Part II blind hole；

First predeterminated position includes the first sub- predeterminated position and the second sub- predeterminated position, and the first sub- predeterminated position is used for The Part I blind hole is set, and the second sub- predeterminated position is used to set the Part II blind hole；

A part of hole wall of the Part I blind hole is located at the Cutting Road, another part hole of the Part I blind hole Wall is located at the sub- PCB main bodys；

The Part II blind hole is located at the described second sub- predetermined position.
10. processing technology according to claim 5, it is characterised in that also including step：

S010, that designs the PCB is used to set the first predeterminated position of the mat surface and for placing the electronics member Second predeterminated position of device so that first predeterminated position is located at the periphery of second predeterminated position；

Or,

S020, design the first predeterminated position for being used to set the mat surface of the PCB so that first predeterminated position is set In the periphery of second predeterminated position.
11. processing technology according to claim 5, it is characterised in that also including step：

S200, clean the PCB main bodys so that the impurity of the mat surface is cleaned.
12. processing technology according to claim 11, it is characterised in that：

When the clean method of the PCB main bodys is wet-cleaning mode, after step S200, in addition to step：

S300, dry the PCB main bodys after wet-cleaning.
13. according to the processing technology described in claim 5-12 any one, it is characterised in that also including step：

S400, the fixed electronic component is in the second predetermined position of the PCB main bodys；

S500, electronic component described in plastic packaging so that plastic-sealed body and the asperity contact.
14. the process line of new PCB suitable for described in the claims 1-4 any one a kind of,

It is characterised in that it includes：

Processing unit (plant), mat surface is processed for the first predetermined position in PCB main bodys to be processed；

Cleaning device, the PCB to be processed of the mat surface processing is completed for cleaning；

SMT device, the PCB to be processed of cleaning treatment is completed for electronic component to be arranged on；

Plastic packaging apparatus, SMT PCB to be processed is completed for plastic packaging so that plastic-sealed body and the asperity contact；And

Control system, it communicates with the processing unit (plant) and connected.
15. process line according to claim 14, it is characterised in that：

When the cleaning device is wet type cleaning equipment, in addition to drying device so that after PCB to be processed completes wet-cleaning Dried by the drying device.