CN107613649B - PCB, processing technology and processing line - Google Patents
PCB, processing technology and processing line Download PDFInfo
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- CN107613649B CN107613649B CN201710804254.2A CN201710804254A CN107613649B CN 107613649 B CN107613649 B CN 107613649B CN 201710804254 A CN201710804254 A CN 201710804254A CN 107613649 B CN107613649 B CN 107613649B
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Abstract
The invention discloses a PCB, a processing technology and a processing line, wherein the PCB comprises: the PCB comprises a PCB main body, wherein a first preset position and a second preset position are arranged on the same side surface of the PCB main body; the first preset position is used for arranging a rough surface; the second preset position is used for arranging electronic components. The invention increases the roughness of the PCB main body, so that the contact area between the plastic package body and the surface of the PCB is enlarged in the subsequent plastic package process, the tightness, the stability and the sealing property of the connection between the plastic package body and the PCB are further improved, and the quality of plastic package is ensured. Therefore, the hardware quality (drop test of products, the insulating property of electronic components and the like) and the software quality (the stability and the strength of signals of the electronic components and the like) of the electronic product provided with the PCB are ensured.
Description
Technical Field
The invention relates to the technical field of communication, in particular to a PCB (printed circuit board), a processing technology and a processing line.
Background
In practical application, in order to reinforce the connection between an electronic component and a PCB, prevent external dust and the like from entering the electronic component, avoid electric leakage of the electronic component, avoid interference among the electronic components and the like, the electronic component needs to be subjected to plastic packaging, and the plastic packaging requires that the distance between the electronic components meets a certain interval so as to meet the contact area of the PCB between a plastic packaging body and the electronic component, thereby ensuring that the electronic component and the PCB have a stable and close connection relationship, and ensuring the product performance of the product, such as falling resistance, signal stability and strength and the like.
At present, electronic products in the field of communication are increasingly integrated and miniaturized, and in addition, the integration of the functionality of the electronic products is added, the typesetting pitch of internal components of the electronic products is necessarily smaller and smaller, and the trend is contradictory to the pitch requirement among the electronic components in practical application, so how to solve the contradiction between the gradual reduction of the pitch between the electronic components and the pitch requirement among the electronic components in practical application is a difficult problem which needs to be solved urgently by technical personnel in the field.
Accordingly, the present application is directed to a PCB and a process line.
Disclosure of Invention
The PCB, the processing technology and the processing line provided by the invention have the advantages that the roughness of the PCB main body is increased, so that the contact area between the plastic package body and the surface of the PCB is increased in the subsequent plastic package process, the connection tightness, stability and sealing performance of the plastic package body and the PCB are improved, and the quality of plastic package is ensured.
The technical scheme provided by the invention is as follows:
a PCB, comprising:
the PCB comprises a PCB main body, wherein a first preset position and a second preset position are arranged on the same side surface of the PCB main body;
the first preset position is used for arranging a rough surface;
and the second preset position is used for arranging an electronic component.
In the technical scheme, the rough surface is arranged at the first preset position of the surface of the PCB main body for arranging the electronic components, so that the roughness of the PCB main body is increased, the plastic package body is contacted with the rough surface in the subsequent plastic package process, and the contact area of the plastic package body and the surface of the PCB is increased due to the existence of the rough surface, so that the connection tightness, the stability and the sealing property of the plastic package body and the PCB are improved, the quality of the plastic package is ensured Production, processing and the like.
Further preferably, the PCB body comprises a number of interconnected sub-PCB bodies; a cutting channel is arranged between every two adjacent sub PCB main bodies; the surface of the same side of each sub PCB main body is provided with the first preset position and the second preset position; a portion of the rough surface is located at the scribe line, and another portion of the rough surface is located at the sub-PCB body; and/or, the PCB body comprises a plurality of sub PCB bodies which are connected with each other; the surface of the same side of each sub PCB main body is provided with the first preset position and the second preset position; a cutting channel is arranged between every two adjacent sub PCB main bodies; the rough surface is arranged far away from the cutting path.
Among this technical scheme, creative utilization each other through the cutting street a plurality of sub PCB main parts of connecting form a whole PCB's structural feature (promptly in the production process after the plastic envelope, this a plurality of sub PCB main parts can be cut the separation and form solitary PCB), because the existence of cutting street for certain processing clearance has between two adjacent sub PCB, make things convenient for the processingequipment's of mat surface walking and processing action. Of course, in addition to separately disposing the rough surface at the interface of the dicing street and the PCB, the rough surface may be separately disposed on the surface of the PCB, and the rough surface may be disposed at the interface of the dicing street and the PCB and the surface of the PCB at the same time. The setting mode is diversified, and can be selected according to the practical application condition.
Further preferably, a plurality of blind holes for accommodating the plastic package body are arranged on the surface of the PCB main body at intervals; the surface of the PCB body provided with the blind holes forms the rough surface.
Among this technical scheme, realize the formation of mat face through a plurality of (promptly at least one) blind hole, because at the plastic envelope in-process, the plastic envelope can flow in the blind hole for the blind hole is filled by the plastic-sealed body, the inner wall and the bottom surface of blind hole all can be connected with the contact of plastic-sealed body, after the cooling of plastic-sealed body, because the inner wall of blind hole has increased the area of contact of plastic-sealed body and PCB, and then the compactness, fastness and the leakproofness that plastic-sealed body and PCB are connected have been strengthened, the plastic envelope quality has been guaranteed. And the processing cost of the blind hole is low, the blind hole is easy to realize, the operability is strong, and the operation is simple and convenient. Compared with the prior art, the increased contact area is mainly the surface area of the inner wall of the blind hole, therefore, in practical application, the shape of the blind hole preferably has a larger inner surface structure.
Further preferably, the cross section of the blind hole is oval, round or kidney-shaped; and/or the depth dimension of the blind hole is not more than half of the thickness dimension of the PCB body; and/or the number of the blind holes is at least two; the distance value of the center points of two adjacent blind holes is not less than twice of the sum of the sizes of the blind holes along the central line direction; and/or the distance value between the center point of the blind hole and the electronic component adjacent to the blind hole is not less than 150 μm.
In the technical scheme, according to the practical application requirement, the cross-sectional shape of the blind hole can be set in a diversified manner (namely, the cross-sectional shape can be oval, circular, kidney-shaped, triangular, polygonal and the like), the structural strength and the mechanical strength of the PCB are prevented from being influenced by the setting of the blind hole, the depth of the blind hole is preferably less than or equal to half of the thickness of the whole PCB, the bad condition of the PCB caused by the fact that welding liquid of the electronic component flows into the blind hole in the process of fixedly arranging the electronic component on the PCB is avoided, and therefore the distance between the central point of the blind hole and the edge of the electronic component adjacent to the blind hole is not less than 150 microns. Thereby meeting the requirements of the structural strength and the mechanical strength of the electronic component, the welding (SMT or pin welding) requirement, the plastic package and the performance requirements of the processing procedures (such as cutting, sputtering and the like) after the plastic package.
The invention also provides a PCB processing technology, which comprises the following steps:
s100, fixing a PCB main body, processing a rough surface at a first preset position of the PCB main body, wherein the same side surface of the PCB main body is provided with a first preset position and a second preset position; and the second preset position is used for arranging an electronic component.
In the technical scheme, only slight change is needed to be carried out on the existing PCB, the whole structure of the existing PCB is not needed to be changed (for example, the installation position of the electronic component on the PCB in the existing process is not needed to be changed), and of course, the structure of the PCB provided by the invention is also suitable for the PCB with a novel design (namely, the installation position of the electronic component on the PCB is changed), and the positions of the rough surface and the electronic component on the PCB and the position relation of the rough surface and the electronic component can be designed, produced, processed and the like according to the actual product requirements. The rough surface can be processed automatically, intelligently and in batch by an automatic device, so that the PCB can be produced automatically, intelligently and in batch, the production efficiency, the product quality and the product performance of the PCB are ensured, and the PCB has good practicability, applicability, market prospect and market competitiveness and conforms to the trend of increasingly integrated, miniaturized and function integrated electronic products. It is noted that the positioning of the roughening processing device may also be easily achieved by manual positioning, but the method is less efficient and preferably applied to PCBs with less throughput.
The rough surface is arranged at the first preset position of the surface of the PCB main body, which is used for arranging the electronic components, so that the roughness of the PCB main body is increased, the plastic package body is in contact with the rough surface in the subsequent plastic package process, the contact area of the surface of the plastic package body and the surface of the PCB is increased due to the existence of the rough surface, the tightness and the stability of the connection of the plastic package body and the PCB are further improved, the difficult problems that the distance between the electronic components is gradually reduced and the distance between the electronic components is required in practical application are effectively solved, the electronic products meet the requirements of the gradual integration, the miniaturization and the function integration, and meanwhile, the product performance is also ensured, for example, the product falling resistance, the stability and the strength of product signals, the service life and the like of the electronic products related to the connection of the electronic components and the PCB. Therefore, the electronic product which is miniaturized, integrated and modularized in function meets the requirements of a user on small size, light weight, stable signal and good strength, and the market potential and the competitiveness of the electronic product using the product are greatly improved.
Further preferably, the PCB body comprises a number of interconnected sub-PCB bodies; the surface of the same side of each sub PCB main body is provided with the first preset position and the second preset position; a cutting channel is arranged between every two adjacent sub PCB main bodies; the surface of the same side of each sub PCB main body is provided with the first preset position and the second preset position; a portion of the rough surface is located at the scribe line, and another portion of the rough surface is located at the sub-PCB body; and/or, the PCB body comprises a plurality of sub PCB bodies which are connected with each other; the surface of the same side of each sub PCB main body is provided with the first preset position and the second preset position; a cutting channel is arranged between every two adjacent sub PCB main bodies; the rough surface is arranged far away from the cutting path.
Among this technical scheme, creative utilization each other through the cutting street a plurality of sub PCB main parts of connecting form a whole PCB's structural feature (promptly in the production process after the plastic envelope, this a plurality of sub PCB main parts can be cut the separation and form solitary PCB), because the existence of cutting street for certain processing clearance has between two adjacent sub PCB, make things convenient for the processingequipment's of mat surface walking and processing action. Of course, in addition to separately disposing the rough surface at the interface of the dicing street and the PCB, the rough surface may be separately disposed on the surface of the PCB, and the rough surface may be disposed at the interface of the dicing street and the PCB and the surface of the PCB at the same time. The setting mode is diversified, and can be selected according to the practical application condition.
Further preferably, step S100 includes the steps of:
s121, moving a processing device for processing the blind hole to the first preset position;
and S122, processing the blind hole by the processing device, so that the rough surface is formed on the surface of the PCB main body provided with the blind hole.
Among this technical scheme, realize the formation of mat face through a plurality of (promptly at least one) blind hole, because at the plastic envelope in-process, the plastic envelope can flow in the blind hole for the blind hole is filled by the plastic-sealed body, the inner wall and the bottom surface of blind hole all can be connected with the contact of plastic-sealed body, after the cooling of plastic-sealed body, because the inner wall of blind hole has increased the area of contact of plastic-sealed body and PCB, and then the compactness, fastness and the leakproofness that plastic-sealed body and PCB are connected have been strengthened, the plastic envelope quality has been guaranteed. And the processing cost of the blind hole is low, the blind hole is easy to realize, the operability is strong, and the operation is simple and convenient. Compared with the prior art, the increased contact area is mainly the surface area of the inner wall of the blind hole, therefore, in practical application, the shape of the blind hole preferably has a larger inner surface structure.
Further preferably, the cross section of the blind hole is oval, round or kidney-shaped; and/or the depth dimension of the blind hole is not larger than the thickness dimension of the PCB body; and/or the number of the blind holes is at least two; the distance value of the center points of two adjacent blind holes is not less than twice of the sum of the sizes of the blind holes along the central line direction; and/or the distance value between the center point of the blind hole and the electronic component is not less than 150 μm.
In the technical scheme, according to the practical application requirement, the cross-sectional shape of the blind hole can be set in a diversified manner (namely, the cross-sectional shape can be oval, circular, kidney-shaped, triangular, polygonal and the like), the structural strength and the mechanical strength of the PCB are prevented from being influenced by the setting of the blind hole, the depth of the blind hole is preferably less than or equal to half of the thickness of the whole PCB, the bad condition of the PCB caused by the fact that welding liquid of the electronic component flows into the blind hole in the process of fixedly arranging the electronic component on the PCB is avoided, and therefore the distance between the central point of the blind hole and the edge of the electronic component adjacent to the blind hole is not less than 150 microns. Thereby meeting the requirements of the structural strength and the mechanical strength of the electronic component, the welding (SMT or pin welding) requirement, the plastic package and the performance requirements of the processing procedures (such as cutting, sputtering and the like) after the plastic package.
Further preferably, the PCB body comprises a number of interconnected sub-PCB bodies; the surface of the same side of each sub PCB main body is provided with the first preset position and the second preset position; a cutting channel is arranged between every two adjacent sub PCB main bodies; a part of hole walls of the blind holes are positioned at the cutting channels, and the other part of hole walls of the blind holes are positioned at the main body of the sub PCB; or, the PCB body comprises a plurality of sub PCB bodies which are connected with each other; the surface of the same side of each sub PCB main body is provided with the first preset position and the second preset position; a cutting channel is arranged between the two sub PCB main bodies; the number of the blind holes is at least two, and the blind holes comprise a first part of blind holes and a second part of blind holes; the first preset position comprises a first sub preset position and a second sub preset position, the first sub preset position is used for arranging the first part of blind holes, and the second sub preset position is used for arranging the second part of blind holes; a part of hole walls of the first part of blind holes are positioned at the cutting streets, and the other part of hole walls of the first part of blind holes are positioned at the main body of the sub PCB; the second part of blind holes are arranged at the second sub-preset positions.
Among this technical scheme, creative utilization each other through the structural feature of the whole PCB that the sub PCB main part of a plurality of cutting street connections formed (promptly in the production process after the plastic envelope, this a plurality of sub PCB main parts can be cut the separation and form solitary PCB), because the existence of cutting street for certain processing clearance has between two adjacent sub PCB, make things convenient for the processingequipment walking and the processing action of blind hole. Of course, the blind holes can be separately arranged at the junction of the cutting channel and the PCB; the blind holes can also be independently arranged on the surface of the PCB; the blind holes can also be arranged at the junction of the cutting channel and the PCB and the surface of the PCB at the same time. The setting mode is diversified, and the technicians in the field can select the setting mode according to the actual application condition.
Further preferably, the method further comprises the following steps:
s010, designing a first preset position of the PCB for arranging the rough surface and a second preset position for placing the electronic component, so that the first preset position is arranged at the periphery of the second preset position; or S020, designing a first preset position of the PCB, which is used for arranging the rough surface, so that the first preset position is arranged on the periphery of the second preset position.
In the technical scheme, the design of the rough surface can be designed and processed after the PCB is manufactured; it may also be designed with the PCB and preferably processed after the PCB is manufactured.
Further preferably, the method further comprises the following steps:
s200, cleaning the PCB main body to enable impurities on the rough surface to be cleaned.
In the technical scheme, because impurities such as burrs, floating dust and the like can appear on the rough surface in the rough surface processing process and even on the surface of the PCB except the rough surface, the quality assurance of the process can be influenced when the PCB is subjected to the subsequent process due to the impurities, and therefore, after the rough surface is processed, the impurities are preferably removed to ensure the quality of the subsequent process (such as welding electronic components, plastic package and the like).
Further preferably, when the cleaning method of the PCB main body is a wet cleaning method, after step S200, the method further includes the steps of:
s300, drying the PCB main body after wet cleaning.
In the technical scheme, when the cleaning mode of the PCB is a wet cleaning mode (such as a washing mode, a cleaning mode of liquid containing water or a cleaning mode of water which can generate water), in order to ensure the normal operation of subsequent welding and plastic packaging, the PCB after wet cleaning needs to be dried; of course, in order to increase the production efficiency, productivity and throughput of the PCB, when the cleaning process of the PCB is a wet cleaning process, it is preferable to dry the PCB by a drying device, and naturally, the PCB may be dried by air drying.
Further preferably, the method further comprises the following steps:
s400, fixedly arranging the electronic component at a second preset position of the PCB main body;
s500, the electronic component is subjected to plastic package, so that the plastic package body is in contact with the rough surface.
In the technical scheme, after the electronic component is preliminarily fixed on the PCB, the electronic component is subjected to plastic packaging in order to reinforce the connection between the electronic component and the PCB, prevent external dust and the like from entering the electronic component, avoid electric leakage of the electronic component, interference among the electronic components and the like, so that the plastic packaging body is contacted with the rough surface in the plastic packaging process, and when the plastic packaging body is in a fluid state, the plastic packaging body directly flows to the rough surface in the plastic packaging process; when the plastic package body is solid, the plastic package body in a solid state is heated and changed into a molten state, and the plastic package body is contacted with the rough surface in a fluid manner and cooled and solidified, so that the plastic package of the electronic component is realized.
The invention also provides a PCB processing line, which comprises:
the processing device is used for processing a rough surface at a first preset position of the PCB body to be processed;
the cleaning device is used for cleaning the PCB to be processed after the rough surface processing is finished;
the SMT device is used for arranging the electronic components on the PCB to be processed after the cleaning treatment is finished;
the plastic packaging device is used for plastically packaging the PCB to be processed after the SMT is finished, so that the plastic packaging body is contacted with the rough surface; and the number of the first and second groups,
and the control system is in communication connection with the processing device.
In the technical scheme, a rough surface is arranged at a first preset position of the surface of the PCB main body for arranging the electronic component, thereby increasing the roughness of the PCB main body, enabling the plastic package body to be contacted with the rough surface in the subsequent plastic package process, thereby improving the tightness, stability and sealing performance of the connection between the plastic package body and the PCB, ensuring the quality of the plastic package, only slightly changing the prior PCB, not changing the overall structure of the prior PCB (for example, not changing the prior installation position of electronic components on the PCB), of course, the structure of the PCB of the present invention is also suitable for a PCB with a novel design (i.e. the mounting position of the electronic component on the PCB is changed), and the position of the rough surface and the electronic component on the PCB, and the positional relationship between the rough surface and the electronic component, can be designed, produced, processed, etc. according to the actual product requirements.
In the technical scheme, because impurities such as burrs, floating dust and the like can appear on the rough surface in the rough surface processing process and even on the surface of the PCB except the rough surface, the quality assurance of the process can be influenced when the PCB is subjected to the subsequent process due to the impurities, and therefore, after the rough surface is processed, the impurities are preferably removed to ensure the quality of the subsequent process (such as welding electronic components, plastic package and the like).
In the technical scheme, after the electronic component is preliminarily fixed on the PCB, the electronic component is subjected to plastic packaging in order to reinforce the connection between the electronic component and the PCB, prevent external dust and the like from entering the electronic component, avoid electric leakage of the electronic component, interference among the electronic components and the like, so that the plastic packaging body is contacted with the rough surface in the plastic packaging process, and when the plastic packaging body is in a fluid state, the plastic packaging body directly flows to the rough surface in the plastic packaging process; when the plastic package body is solid, the plastic package body in a solid state is heated and changed into a molten state, and the plastic package body is contacted with the rough surface in a fluid manner and cooled and solidified, so that the plastic package of the electronic component is realized.
Further preferably, when the cleaning device is a wet cleaning device, the cleaning device further comprises a drying device, so that the PCB to be processed is dried by the drying device after the wet cleaning is completed.
In the technical scheme, when the PCB is cleaned in a wet manner, the PCB cleaned in the wet manner needs to be dried in order to ensure the normal operation of subsequent welding and plastic packaging; in order to accelerate the production efficiency, production yield, and throughput of PCBs, when the cleaning process of PCBs is wet cleaning, it is preferable that the drying process is performed on the PCBs by a drying device. Of course, the PCB may also be cleaned by dry cleaning, such as brush, dry ice cleaning, etc.
The PCB, the processing technology and the processing line provided by the invention can bring at least one of the following beneficial effects:
1. according to the invention, the rough surface is arranged at the first preset position of the surface of the PCB main body for arranging the electronic components, so that the roughness of the PCB main body is increased, the plastic package body is contacted with the rough surface in the subsequent plastic package process, the contact area of the plastic package body and the surface of the PCB is increased due to the existence of the rough surface, and further the tightness and the stability of the connection of the plastic package body and the PCB are improved, and the problems of the gradual reduction of the distance between the electronic components and the distance requirement between the electronic components in practical application are effectively solved, so that the product performance of the electronic product is ensured while the gradual integration, miniaturization and function integration of the electronic product are met, for example, the product anti-falling property, the stability and the strength of product signals, the service life of the electronic product and the like related to the connection of the electronic components and the PCB. Therefore, the electronic product which is miniaturized, integrated and functionally modularized meets the requirements of a user on small size, light weight, stable signal and good strength, greatly improves the market potential and competitiveness of the electronic product using the product, has good practicability, applicability and market prospect, and accords with the market trend that the electronic product is increasingly integrated, miniaturized and functionally integrated.
2. In the invention, only a little change is needed to be made on the existing PCB, and the whole structure of the existing PCB does not need to be changed (for example, the installation position of the electronic component on the PCB in the prior art does not need to be changed), and of course, the structure of the PCB of the invention is also suitable for the PCB with novel design (namely, the installation position of the electronic component on the PCB is changed), and the position of the rough surface and the position of the electronic component on the PCB and the position relation of the rough surface and the position relation of the electronic component on the PCB can be designed, produced, processed and the like according to the actual product requirements. 3. In the invention, because the PCB needs to be provided with a plurality of electronic components, wherein the electronic components needing to be subjected to plastic packaging can be distributed on different positions of the PCB, and in order to ensure the tightness and stability of the connection of the electronic components needing to be subjected to plastic packaging and the PCB as much as possible, the rough surface can be respectively arranged on different positions of the surface of the PCB according to actual needs and actual conditions, and is preferably wound on the periphery of the electronic components needing to be subjected to plastic packaging, and when the PCB is a single-panel, the rough surface only needs to be arranged on one side surface of the PCB; when the PCB is a double-sided board, the rough surfaces are arranged on the two side surfaces of the PCB.
4. In the invention, the rough surface is preferably composed of the surface of the PCB provided with at least one blind hole, and the contact area of the plastic package body and the PCB can be increased due to the hole wall of the blind hole, so that the connection tightness and stability of the plastic package body and the PCB are enhanced, and the connection tightness and stability of the electronic component and the PCB are ensured. The number of the blind holes can be set according to actual conditions, the cross section of the blind holes is oval, round or waist-shaped, even the blind holes can be of a polygonal structure, the shape is diversified and individualized, the blind holes can be set according to the size, the shape and the like of a PCB provided with the blind holes, if the PCB provided with the blind holes is in a long strip shape, the blind holes are preferably oval holes or waist-shaped holes, and the extension direction of the major diameter direction of the blind holes is the same as that of the long strip holes; the depth dimension of the blind hole is not more than half of the thickness dimension of the PCB main body, so that the structural strength and the mechanical strength of the PCB are effectively prevented from being influenced by the arrangement of the blind hole, and the PCB is effectively prevented from generating adverse phenomena (such as cracks, breakage, even fragmentation and the like) in the subsequent processing process; preferably, in order to avoid the bad phenomenon of the product caused by the fact that welding liquid flows into the blind holes when the PCB is used for welding components, the distance value between the blind holes and the edge of one side, close to the electronic component, of the electronic component is preferably not less than 150 micrometers, and when the PCB is a double-sided board, the blind holes arranged on two side faces of the PCB are preferably staggered in space, so that the bad phenomenon (such as the bad influence of the subsequent processing technology of the PCB, namely the phenomena of failure or bad effect, and the phenomena of cracks, breakage, even fragmentation and the like caused by the bad structural strength of the PCB) caused by the fact that the blind holes penetrate through the PCB are.
5. In the invention, when the PCB is composed of a plurality of single sub-PCBs, the blind holes can be arranged on the surface of the PCB, and the blind holes can also be optionally arranged on the cutting channels, namely, part of the hole walls of the blind holes are positioned on the cutting channels; therefore, when the plurality of sub PCBs are subjected to plastic package together, the plastic package body flows into and fills the blind hole, after the plastic package body is cooled and solidified, although the plurality of sub PCBs are finally cut and separated to form a single sub PCB, and the part of the plastic package body, which is positioned in the cutting channel, of the plastic package body in the blind hole is cut off along with the cutting channel, the other part of the plastic package body, which is positioned in the sub PCB, of the plastic package body in the blind hole is reserved, and because the hole wall, which is positioned in the other part of the sub PCB, of the blind hole enlarges the contact surface between the plastic package body and the PCB, the tightness and the stability of the connection between the plastic package body and the PCB can be enhanced, and the tightness and the stability of the connection between an electronic component and the; of course, the blind holes may be partially disposed on the surface of the PCB between the electronic components and partially disposed on both the PCB and the scribe line.
Drawings
The above features, technical features, advantages and implementations of PCBs and processes and flow lines will be further described in the following detailed description of preferred embodiments in a clearly understandable manner, with reference to the accompanying drawings.
FIG. 1 is a schematic structural diagram of one embodiment of a PCB of the present invention;
FIG. 2 is a schematic sectional view B-B of FIGS. 1-2;
FIG. 3 is a flow chart of a first embodiment of the process of the present invention;
FIG. 4 is a flow chart of a second embodiment of the process of the present invention;
FIG. 5 is a flow chart of a third embodiment of the process of the present invention;
FIG. 6 is a flow chart of a fourth embodiment of the process of the present invention;
fig. 7 is a flow chart of a fifth embodiment of the process of the present invention.
The reference numbers illustrate:
1. the PCB comprises a first sub PCB body, a second sub PCB body, a cutting path, a rough surface, a blind hole 41, a first part inner wall 411, a second part inner wall 412, a second preset position 5 and a first preset position 6.
Detailed Description
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following description will be made with reference to the accompanying drawings. It is obvious that the drawings in the following description are only some examples of the invention, and that for a person skilled in the art, other drawings and embodiments can be derived from them without inventive effort.
For the sake of simplicity, the drawings only schematically show the parts relevant to the present invention, and they do not represent the actual structure as a product. In addition, in order to make the drawings concise and understandable, components having the same structure or function in some of the drawings are only schematically illustrated or only labeled. In this document, "one" means not only "only one" but also a case of "more than one".
Example one
As shown in fig. 1 and 2, a PCB includes: the PCB main body (namely the first sub PCB main body 1 and/or the second PCB main body 2) is provided with a first preset position 6 and a second preset position 5 on the same side surface (not marked in the figure) of the PCB main body; the first preset position 6 is used for arranging the rough surface 4; the second predetermined position 5 is used for arranging electronic components (not shown). According to the invention, the second preset position 5 for arranging the rough surface 4 is arranged on the board surface of the PCB except the second preset position 5 for arranging the electronic component, and the existence of the rough surface 4 enables the PCB (or the PCB main body) to increase the roughness of the PCB main body and simultaneously increase the contact area (namely the acting area of force) of the plastic package body and the PCB main body in the subsequent plastic package process, thereby increasing the friction force between the PCB and the PCB, ensuring the tightness, stability and sealing performance of the connection between the plastic package body and the PCB, and ensuring the quality of plastic package, thereby indirectly ensuring the hardware quality (drop test of the product, the insulating performance of the electronic component and the like) and the software quality (stability, strength and the like of signals of the electronic component and the like) of the electronic product provided with the PCB. For the existing PCB, the invention only needs to design and process the rough surface 4 on the surface provided with the electronic components, and does not need to change the whole structure of the existing PCB (for example, the installation position of the electronic components on the PCB in the prior art is not required to be changed, the structure between layers of the existing PCB is not required to be changed, and the like). Not to mention a new PCB (i.e. a PCB with electronic components redesigned and arranged at the installation positions on the PCB), at this time, the positions of the rough surface 4 and the electronic components on the PCB, and the positional relationship between the two, can be designed, produced, processed, etc. according to the actual product requirements; of course, the rough surface 4 may be designed after a new PCB is processed. Preferably, the rough surface 4 can be processed automatically, intelligently and in batch by an automatic device, so that the PCB can be produced automatically, intelligently and in batch, and the production efficiency, the product quality and the product performance of the product and the electronic product thereof are ensured. It is worth pointing out that the second preset position 5 and the first preset position 6 of the present invention are independently provided without overlapping. The electronic components described in the invention particularly refer to electronic components needing plastic packaging.
Example two
As shown in fig. 1 and 2, on the basis of the first embodiment, the first embodiment further includes a rough surface 4 disposed at a first preset position 6, the rough surface 4 is disposed at the periphery of a second preset position 5, and in the plastic package process, a plastic package layer with a certain thickness is formed on the surface of the PCB by the plastic package body, so that no matter where the rough surface 4 is disposed, the connection relationship between the electronic component and the PCB is strengthened for the electronic component connected with the electronic component through the plastic package layer. Thus, the perimeter of this embodiment, one is a narrow perimeter: in particular to the side of a certain electronic component or a plurality of electronic components which need to be sealed together by plastic (namely, no other electronic components are arranged between the surface of the PCB provided with the rough surface 4 and the one or a plurality of electronic components). In practical application, the rough surface 4 is only arranged on the periphery of one or some electronic components with higher requirements on plastic package quality, and the rough surface 4 is not arranged on the periphery of some electronic components with lower requirements on the plastic package quality, so that the contact area between the plastic package body of one or more electronic components needing integral plastic package and the PCB can be increased in a targeted manner. The other is the generalized perimeter: the side of one electronic component or a plurality of electronic components which need to be sealed together by plastic and the side between other adjacent electronic components (namely more than one other electronic component is arranged between the surface of the PCB provided with the rough surface 4 and the one or a plurality of electronic components at intervals).
EXAMPLE III
As shown in fig. 1 and 2, in the first or second embodiment, the rough surface 4 includes a plurality of sub-rough surfaces 4, and the plurality of sub-rough surfaces 4 are respectively disposed on the same side surface of the PCB body. And the PCB body includes a plurality of sub-PCB bodies (i.e., a first sub-PCB body 1 and a second sub-PCB body 2) connected to each other; the surface of the same side of each sub PCB main body is provided with a first preset position 6 and a second preset position 5; a cutting channel 3 is arranged between every two adjacent sub PCB main bodies; one part of the rough surface 4 (i.e. the first part inner wall 411 of the blind hole 41) is located at the scribe line 3, and the other part of the rough surface 4 (i.e. the second part inner wall 412 of the blind hole 41) is located at the sub PCB body. It should be noted that the scribe line 3 refers not only to the connection board between two PCBs, but also to the connection board between several (at least one) electronic components (i.e. the board body of the PCB itself) that are required to be diced and separated on a single PCB.
Example four
As shown in fig. 1 and 2, unlike the third embodiment, the rough surface 4 is not only provided at the boundary of the scribe line 3 and the sub PCB body, but also a part of the rough surface 4 is provided at other positions of the sub PCB body. It is worth mentioning that the rough surface 4 may also be provided only on the PCB body, not at its interface with the cutting street 4. The cutting lines may refer to all cutting lines or part of cutting lines.
EXAMPLE five
As shown in fig. 1 and 2, on the basis of the first, second, third or fourth embodiments, the electronic component further includes an electronic component, which is disposed at a second preset position 5; when the single surface of the PCB main body is provided with the electronic component (namely the PCB is a single-panel or a multilayer board with the single surface provided with the electronic component), the rough surface 4 only needs to be arranged on the surface of one side of the PCB main body; when the two sides of the PCB main body are provided with electronic components (i.e. the PCB is a double-sided board or a multilayer board with electronic components arranged on the two sides), the rough surfaces 4 need to be arranged on the two side surfaces of the PCB main body, and the area and the space position of the rough surfaces 4 on the two side surfaces are set, and even the arrangement mode, the size, the space position relation and the like of the sub rough surfaces 4 of the rough surfaces 4 on the two side surfaces can be selected and planned according to actual conditions, and the details are not repeated here.
EXAMPLE six
As shown in fig. 1 and 2, on the basis of the first, second, third, fourth or fifth embodiment, a plurality of blind holes 41 for accommodating the plastic package body are formed on the surface of the PCB main body at intervals; the surface of the PCB body provided with the blind holes 41 forms a roughened surface 4. The cross section of the blind hole 41 is oval, round or kidney-shaped; the depth dimension of the blind hole 41 is not more than half of the thickness dimension of the PCB body; the number of blind holes 41 is at least two; the distance value between the center points of two adjacent blind holes 41 is not less than twice of the sum of the sizes along the central line direction thereof (i.e. the distance value between the center points of two adjacent blind holes 41 is not less than the sum of the sizes along the central line direction thereof of the two blind holes 41, for example, when the blind holes 41 are circles and the centers of the circles pass through the central line, the distance value between two adjacent blind holes 41 is at least twice of the diameter of the circle, and when the blind holes 41 are ellipses and the major diameters of the ellipses are located on the central line of the adjacent blind holes 41, the distance value between two adjacent blind holes 41 is at least twice of the major diameter of the ellip; the distance value between the center point of the blind hole 41 and the edge of the electronic component adjacent thereto is not less than 150 μm. The blind holes 41 in this embodiment may also be through holes, or grooves that do not penetrate through the PCB body, or even protrusions protruding from the surface of the PCB body, or grooves and protrusions arranged at intervals, which can enhance the connection relationship between the plastic package body and the PCB body.
EXAMPLE seven
A PCB processing technology comprises the following steps: s100, fixing a PCB main body, processing a rough surface 4 at a first preset position 6 of the PCB main body, and arranging a first preset position 6 and a second preset position 5 on the same side surface of the PCB main body; and the second preset position 5 is used for arranging an electronic component.
In practical application, the position, size, number and the like of the rough surface 4 are all variable; the PCB can be a circuit board with one side surface needing to be provided with electronic components; the PCB may also be a circuit board with electronic components on both surfaces, and when the electronic components are disposed on both sides of the PCB main body, at least one surface of the circuit board may be provided with the rough surface 4, so that the first preset position 6 in this embodiment does not only refer to a certain position or a certain position, but refers to all the first preset positions 6 in the PCB main body. When the first preset positions 6 are multiple and located at different positions, the rough surface 4 needs to be processed according to a predetermined sequence.
Example eight
As shown in fig. 3, a PCB processing process, step S100, includes the steps of:
s110, fixing the PCB main body;
s121, moving a processing device for processing the blind hole to the first preset position;
and S122, processing the blind hole by the processing device, so that the rough surface is formed on the surface of the PCB main body provided with the blind hole.
It is worth pointing out that, in order to guarantee smooth going on of rough surface processing, need fix the PCB main part when reprocessing rough surface to guaranteed the stability of PCB main part in the course of working, and then guaranteed especially in automatic, the intelligent production process, rough surface processingequipment is to the accurate location of first preset position and the accurate setting of rough surface, thereby guaranteed the processingquality of rough surface. When only one side surface of the PCB main body needs to be provided with a rough surface, the fixing of the PCB main body only needs to be carried out once, but when both sides of the PCB main body need to be provided with rough surfaces, the rough surface on one side surface is preferably processed firstly, and then the rough surface on the other side surface is processed, in the process, the PCB main body is fixed after being overturned, the position of a processing device of the rough surface is not changed, or the rough surface is realized by the displacement of the processing device of the rough surface, and the position of the PCB main body is not changed; of course, the rough surfaces can be processed on the surfaces of the two sides of the PCB main body at the same time, so that two sets of processing devices for processing the rough surfaces are required to be arranged at the sides of the surfaces of the two sides of the PCB main body, and the forming speed of the rough surfaces can be accelerated. In addition, the blind holes in this embodiment may be through holes, or grooves that do not penetrate through the PCB main body, or even protrusions protruding from the surface of the PCB main body, or grooves and protrusions arranged at intervals, etc. that can enhance the connection relationship between the plastic package body and the PCB main body.
It should be noted that the processing depth of the blind hole, the cross-sectional shape thereof, the distance between two adjacent blind holes, and the positional relationship between the blind hole and the electronic component can be set according to actual requirements. Preferably, the cross section of the blind hole is oval, round or kidney-shaped; the depth dimension of the blind hole is not more than half of the thickness dimension of the PCB body; the number of the blind holes is at least one; when the number of the blind holes is multiple (more than or equal to two), the distance value of the central points of the two adjacent blind holes is not less than twice of the sum of the sizes of the two blind holes along the central line direction (namely, the distance value of the central points of the two adjacent blind holes is not less than the sum of the sizes of the two blind holes along the central line direction, for example, when the blind holes are circles and the circle centers of the circles pass through the central line, the distance value of the two adjacent blind holes is at least twice of the diameter of the circles; the distance value between the center point of the blind hole and the edge of the electronic component adjacent to the blind hole is not less than 150 mu m.
It is worth mentioning that when the PCB main body needs to be processed with blind holes on both sides, the blind holes on both sides are preferably staggered with each other, and the depth thereof is less than 1/2 of the thickness of the PCB main body; therefore, the structural strength and the mechanical strength of the PCB main body after the blind hole is processed are ensured, and the normal operation of the subsequent processing technology and the quality guarantee of the PCB finished product are ensured. And the processing of blind hole can be realized through laser device and digit control machine tool etc..
Example nine
As shown in fig. 4, a PCB processing process includes the steps of:
s100, fixing a PCB main body, processing a rough surface at a first preset position of the PCB main body, wherein the same side surface of the PCB main body is provided with a first preset position and a second preset position; the second preset position is used for arranging an electronic component;
s200, cleaning the PCB main body to enable impurities on the rough surface to be cleaned;
s400, fixedly arranging the electronic component at a second preset position of the PCB main body;
s500, the electronic component is subjected to plastic package, so that the plastic package body is in contact with the rough surface.
It should be noted that, since impurities (substances that are not good for the subsequent processes) are inevitably generated when the rough surface is processed, the PCB main body needs to be cleaned so that the PCB main body performs the subsequent processes with good cleanliness. If part of impurities enter a second preset position for placing an electronic component during processing, the electronic component needs to be fixedly arranged in a welding mode regardless of the pin welding mode or the Surface Mount Technology (SMT) mode, and the existence of the impurities can influence the welding effect and cause the bad effect of the PCB, so that the stability and firmness of the connection between the PCB and the electronic component are influenced. Of course, if no foreign matter is generated when the rough surface is processed, the steps S400 and S500 may be sequentially performed directly after the step S100 is performed, and thus, the step S200 is an unnecessary step. And the manner of cleaning the PCB main body may be classified into a dry type (brush cleaning manner, dry ice cleaning manner) and a wet type (water washing, cleaning manner containing or generating water).
Example ten
As shown in fig. 5, unlike the ninth embodiment, before step S100, the method further includes the steps of: and S010, designing a first preset position of the PCB for arranging the rough surface and a second preset position for placing the electronic component, so that the first preset position is arranged at the periphery of the second preset position.
It is worth pointing out that the rough surface (i.e. the first preset position) of the invention can be designed together with the second preset position for placing the electronic component at the beginning of the PCB design, which is convenient for the layout of the PCB and makes the position relationship between the rough surface and the electronic component more reasonable. Of course, for the existing PCB, the rough surface may also be designed after the PCB is manufactured, and spaced from the second predetermined position (i.e. the electronic component) adjacent to the rough surface by a second predetermined position or a plurality of second predetermined positions (i.e. the electronic component).
EXAMPLE eleven
As shown in fig. 6, a PCB processing process includes the steps of:
s010, designing a first preset position of the PCB for arranging the rough surface and a second preset position for placing the electronic component, so that the first preset position is arranged at the periphery of the second preset position;
s100, fixing a PCB main body, processing a rough surface at a first preset position of the PCB main body, wherein the same side surface of the PCB main body is provided with a first preset position and a second preset position; the second preset position is used for arranging an electronic component;
s210, washing the PCB main body by water to enable impurities on the rough surface to be cleaned;
s310, drying the washed PCB main body;
s400, fixedly arranging the electronic component at a second preset position of the PCB main body;
s500, the electronic component is subjected to plastic package, so that the plastic package body is in contact with the rough surface.
In practical applications, if the surface of the PCB main body is cleaned by water washing, the PCB main body is preferably dried by a drying device, so as to shorten the processing time of the process and improve the production efficiency and production capacity of the process.
Example twelve
As shown in fig. 7, unlike the eleventh embodiment, the step S100 includes the steps of:
s110, fixing the PCB main body;
s121, moving a processing device for processing the blind hole to the first preset position;
and S122, processing the blind hole by the processing device, so that the rough surface is formed on the surface of the PCB main body provided with the blind hole.
In practical application, no matter carry out the processing of blind hole through radium-shine or CNC mode, at the in-process that carries out the drilling to the PCB main part, because ray or drill bit and the contact of PCB main part, when the blind hole formed, prepreg (PP) and/or copper foil and/or solder mask etc. can produce piece (impurity promptly) when being bored through, in this piece can be stayed the blind hole, also can splash to other positions of PCB main part, consequently, wash the clearance to this piece through the washing mode to guarantee the cleanliness of PCB main part.
EXAMPLE thirteen
A PCB processing line, comprising: the PCB machining device comprises a control system, a conveying line and a machining device, wherein the conveying line is used for conveying a PCB main body to be machined; the conveying line is arranged beside the processing device; and the control system is respectively in communication connection with the conveying line and the processing device. The control system controls the matching work of the conveying line and the processing device, so that the automatic, intelligent and controllable production of the rough surface is realized, and the working efficiency of the production line is greatly improved; and the control system can realize the accurate processing and control of the rough surface, thereby ensuring the yield of the PCB. In practical application, because the layout of the PCB of the same electronic product is standardized and unified, the position of the rough surface on the PCB of the type can be standardized and unified, thereby realizing the pipelining of rough surface processing. And the processing flow line of the PCB can be connected before the processing flow line of the rough surface, and the manufacture of the PCBA can be started and connected after the processing flow line of the rough surface. So as not to affect the pipelined implementation of the inventive PCB.
Example fourteen
On the basis of the thirteenth embodiment, the cleaning device is further included; the cleaning device is arranged at the side of the conveying line and behind the processing device along the conveying direction of the conveying line, so that the PCB main body to be processed is cleaned by the cleaning device after the rough surface is processed, and impurities of the rough surface are cleaned. The cleaning device may be divided into a dry type cleaning device and a wet type cleaning device, and when the cleaning device is the wet type cleaning device, it preferably further includes a drying device; the wet type cleaning device is arranged beside the conveying line and behind the wet type cleaning device along the conveying direction of the conveying line, so that the PCB to be processed is dried by the drying device after wet type cleaning is finished.
Example fifteen
On the basis of thirteen or fourteen embodiments, the device also comprises an SMT device and a plastic packaging device; the SMT device and the plastic packaging device are sequentially arranged beside the conveying line along the conveying direction of the conveying line; and the PCB to be processed after the rough surface processing is finished sequentially finishes SMT and plastic package, so that the plastic package body is contacted with the rough surface. Of course, along the direction of the conveying line, a cutting device, a sputtering device, a detecting device, a packaging device and the like can also be included.
It should be noted that the above embodiments can be freely combined as necessary. The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (13)
1. A PCB, comprising:
the PCB comprises a PCB main body, wherein a first preset position and a second preset position are arranged on the same side surface of the PCB main body;
the first preset position is used for arranging a rough surface; the rough surface is obtained by processing the PCB main body to be processed at a first preset position by a processing device;
the second preset position is used for arranging an electronic component;
the PCB main body comprises a plurality of sub PCB main bodies which are connected with each other;
a cutting channel is arranged between every two adjacent sub PCB main bodies;
the surface of the same side of each sub PCB main body is provided with the first preset position and the second preset position;
a portion of the rough surface is located at the scribe line, and another portion of the rough surface is located at the sub-PCB body;
the surface of the PCB main body is provided with a plurality of blind holes at intervals for accommodating the plastic package body;
the surface of the PCB main body provided with the blind hole forms the rough surface;
the depth dimension of the blind hole is not more than half of the thickness dimension of the PCB body.
2. The PCB of claim 1, wherein:
the PCB main body comprises a plurality of sub PCB main bodies which are connected with each other;
the surface of the same side of each sub PCB main body is provided with the first preset position and the second preset position;
a cutting channel is arranged between every two adjacent sub PCB main bodies;
the rough surface is arranged far away from the cutting path.
3. The PCB of claim 1, wherein:
the section of the blind hole is oval, round or kidney-shaped;
and/or the presence of a gas in the gas,
the number of the blind holes is at least two;
the distance value of the center points of two adjacent blind holes is not less than the sum of the sizes of the two blind holes along the direction of the center lines of the two blind holes;
and/or the presence of a gas in the gas,
the distance value between the center point of the blind hole and the electronic component adjacent to the blind hole is not less than 150 mu m.
4. A process for manufacturing a PCB adapted for use in any of the above claims 1-3, comprising the steps of:
s100, fixing the PCB main body, processing a rough surface at a first preset position of the PCB main body, wherein the same side surface of the PCB main body is provided with a first preset position and a second preset position; the second preset position is used for arranging an electronic component;
the PCB main body comprises a plurality of sub PCB main bodies which are connected with each other;
the surface of the same side of each sub PCB main body is provided with the first preset position and the second preset position;
a cutting channel is arranged between every two adjacent sub PCB main bodies;
the surface of the same side of each sub PCB main body is provided with the first preset position and the second preset position;
a portion of the rough surface is located at the scribe line, and another portion of the rough surface is located at the sub-PCB body;
the step S100 includes the steps of:
s121, moving a processing device for processing the blind hole to the first preset position;
s122, processing a blind hole by the processing device, so that the rough surface is formed on the surface of the PCB main body provided with the blind hole;
the depth dimension of the blind hole is not more than half of the thickness dimension of the PCB body.
5. The process of claim 4, wherein:
the PCB main body comprises a plurality of sub PCB main bodies which are connected with each other;
the surface of the same side of each sub PCB main body is provided with the first preset position and the second preset position;
a cutting channel is arranged between every two adjacent sub PCB main bodies;
the rough surface is arranged far away from the cutting path.
6. The process of claim 4, wherein:
the section of the blind hole is oval, round or kidney-shaped;
and/or the presence of a gas in the gas,
the number of the blind holes is at least two;
the distance value of the center points of two adjacent blind holes is not less than the sum of the sizes of the two blind holes along the direction of the center lines of the two blind holes;
and/or the presence of a gas in the gas,
the distance value between the center point of the blind hole and the electronic component adjacent to the blind hole is not less than 150 mu m.
7. The process of claim 4, wherein:
the PCB main body comprises a plurality of sub PCB main bodies which are connected with each other;
the surface of the same side of each sub PCB main body is provided with the first preset position and the second preset position;
a cutting channel is arranged between every two adjacent sub PCB main bodies;
a part of hole walls of the blind holes are positioned at the cutting channels, and the other part of hole walls of the blind holes are positioned at the main body of the sub PCB;
or the like, or, alternatively,
the PCB main body comprises a plurality of sub PCB main bodies which are connected with each other;
the surface of the same side of each sub PCB main body is provided with the first preset position and the second preset position;
a cutting channel is arranged between the two sub PCB main bodies;
the number of the blind holes is at least two, and the blind holes comprise a first part of blind holes and a second part of blind holes;
the first preset position comprises a first sub preset position and a second sub preset position, the first sub preset position is used for arranging the first part of blind holes, and the second sub preset position is used for arranging the second part of blind holes;
a part of hole walls of the first part of blind holes are positioned at the cutting streets, and the other part of hole walls of the first part of blind holes are positioned at the main body of the sub PCB;
the second part of blind holes are arranged at the second sub-preset positions.
8. The process of claim 4, further comprising the steps of:
s010, designing a first preset position of the PCB for arranging the rough surface and a second preset position for placing the electronic component, so that the first preset position is arranged at the periphery of the second preset position;
or the like, or, alternatively,
s020, designing a first preset position of the PCB, wherein the first preset position is used for arranging the rough surface, and enabling the first preset position to be arranged on the periphery of a second preset position.
9. The process of claim 4, further comprising the steps of:
s200, cleaning the PCB main body to enable impurities on the rough surface to be cleaned.
10. The process of claim 9, wherein:
when the cleaning method of the PCB main body is a wet cleaning method, after the step S200, the method further includes the steps of:
s300, drying the PCB main body after wet cleaning.
11. The process of any one of claims 4 to 10, further comprising the steps of:
s400, fixedly arranging the electronic component at a second preset position of the PCB main body;
s500, the electronic component is subjected to plastic package, so that the plastic package body is in contact with the rough surface.
12. A process line adapted for use with the PCB of any of claims 1-3, comprising:
the processing device is used for processing a rough surface at a first preset position of the PCB body to be processed;
the cleaning device is used for cleaning the PCB to be processed after the rough surface processing is finished;
the SMT device is used for arranging the electronic components on the PCB to be processed after the cleaning treatment is finished;
the plastic packaging device is used for plastically packaging the PCB to be processed after the SMT is finished, so that the plastic packaging body is contacted with the rough surface; and the number of the first and second groups,
and the control system is in communication connection with the processing device.
13. The process line of claim 12, wherein:
when the cleaning device is a wet cleaning device, the PCB processing device further comprises a drying device, so that the PCB to be processed is dried by the drying device after wet cleaning is finished.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19947092A1 (en) * | 1998-10-30 | 2000-05-11 | Matsushita Electric Ind Co Ltd | Printed circuit board has electronic component(s) mounted in positioning area for separation from circuit board for another application |
| CN102214646A (en) * | 2010-11-01 | 2011-10-12 | 连展科技（深圳）有限公司 | Coarsening structure of carrier plate |
| CN202565580U (en) * | 2012-05-15 | 2012-11-28 | 深圳天珑无线科技有限公司 | Printed circuit board and electronic device and universal serial bus (USB) interface |
-
2017
- 2017-09-08 CN CN201710804254.2A patent/CN107613649B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19947092A1 (en) * | 1998-10-30 | 2000-05-11 | Matsushita Electric Ind Co Ltd | Printed circuit board has electronic component(s) mounted in positioning area for separation from circuit board for another application |
| CN102214646A (en) * | 2010-11-01 | 2011-10-12 | 连展科技（深圳）有限公司 | Coarsening structure of carrier plate |
| CN202565580U (en) * | 2012-05-15 | 2012-11-28 | 深圳天珑无线科技有限公司 | Printed circuit board and electronic device and universal serial bus (USB) interface |
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