CN105632956B - Method and system for evaluating surface appearance of chip after chemical mechanical polishing - Google Patents
Method and system for evaluating surface appearance of chip after chemical mechanical polishing Download PDFInfo
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Abstract
The invention discloses a method and a system for evaluating the surface appearance of a chip after chemical mechanical polishing, and belongs to the technical field of integrated circuit manufacturing. The method for evaluating the surface appearance of the chip after chemical mechanical polishing comprises the following steps: obtaining the surface appearance parameters of the chip in the last process stage and the selection ratio of the grinding fluid; acquiring the technological parameters of the current technological stage and the selection ratio of the grinding fluid; dividing a current surface layout of a chip into a plurality of continuous panes, and extracting layout characteristic parameters of each pane respectively; judging whether the selection ratio of the grinding fluid is changed, if so, calculating the surface topography parameter of the chip in the current process stage according to the surface topography parameter, the process parameter, the layout characteristic parameter and the selection ratio of the grinding fluid in the current process stage; and evaluating the surface appearance of the chip according to the surface appearance parameters of the current process stage. The method for evaluating the surface appearance of the chip after the chemical mechanical polishing can accurately evaluate the surface appearance of the chip.
Description
Technical field
The present invention relates to ic manufacturing technology field, chip surface morphology after more particularly to a kind of chemically mechanical polishing
Evaluating method and system.
Background technology
In integrated circuit (Integrated Circuit, abbreviation IC) manufacturing process, metal, dielectric and other materials
Material is used the various methods including physical vapour deposition (PVD), chemical vapor deposition such as and is applied to the surface of silicon chip, to form layering
Metal structure.Integrated circuit generally includes multi-layer metal structure, again with multiple metal filled through holes between every layer of metal
Be connected, will can be connected by metal structure between each layer of circuit so that integrated circuit have very high complexity and
Current densities.Therefore, a committed step is to form metal structure in ic manufacturing process.
Because layer on surface of metal flatness can influence the depth of focus required in photoetching and the stress distribution of interconnection structure.
In order to obtain flatness necessary to manufacture multilayer circuit, cause metallic dielectric layer usually using CMP process
Pattern planarizes.Wherein, it is by polishing to chemically-mechanicapolish polish (Chemical Mechanical Polishing, abbreviation CMP)
The chemical attack effect of liquid and the abrasive action of ultramicron form bright and clean, flat table on the dielectric surface being ground
Face, it is super large-scale integration stage best material global planarizartion method.
In CMP process, because different lapping liquids is different to the clearance of different materials, lapping liquid selection
The change of ratio causes during CMP and chip surface is not completely flat after CMP, but topology be present and rise and fall.In order to carry
High chip production yield, production cost is reduced, it is necessary to the pattern of chip surface after CMP be evaluated and tested in advance, so as to assess the shape
Whether looks can have an impact to follow-up photoetching process etc..
As shown in figure 1, be the flow chart of chip surface morphology evaluating method after chemically mechanical polishing of the prior art, tool
Body comprises the following steps：
Step 101：Obtain surface topography parameters of the chip in a upper operation stage；
Step 102：Obtain the technological parameter in current process stage；
Step 103：The Current surface domain of chip is divided into multiple continuous panes, extracts the domain of each pane respectively
Characteristic parameter；
Step 104：According to the surface topography parameters, technological parameter and domain characteristic parameter of a upper operation stage, core is calculated
Surface topography parameters of the piece in the current process stage；
Step 105：The surface topography of chip is evaluated and tested according to the surface topography parameters in current process stage.
Because CMP process is more complicated, it can specifically be divided into multiple operation stages, in the different process stage
Need to select different lapping liquids to be ground polishing, and different lapping liquids differs to the clearance of different materials,
The selection ratio that so would potentially result in lapping liquid changes.Above-mentioned evaluating method is in the selection of the lapping liquid feelings more constant than holding
Under condition, accurate assessment can be carried out to the chip surface morphology after chemically mechanical polishing, but select than becoming in lapping liquid
In the case of change, it will cause the surface topography of chip to change, so as to lead to not accurately to the surface topography of chip
Evaluated and tested.
The content of the invention
Chip surface morphology evaluating method and system after being chemically-mechanicapolish polished the embodiments of the invention provide one kind, Neng Goujing
Really chip surface morphology is evaluated and tested.
Technical scheme provided in an embodiment of the present invention is as follows：
On the one hand, there is provided chip surface morphology evaluating method after one kind chemically mechanical polishing, including：
Chip is obtained in the surface topography parameters of a upper operation stage and the selection ratio of lapping liquid；
Obtain the technological parameter in current process stage and the selection ratio of lapping liquid；
The Current surface domain of chip is divided into multiple continuous panes, extracts the domain feature of each pane respectively
Parameter；
Judge that whether the selection of lapping liquid than changes, if it is, the surface shape according to a upper operation stage
Looks parameter, technological parameter, the selection ratio of domain characteristic parameter and the current process stage lapping liquid, calculate the chip and working as
The surface topography parameters of preceding operation stage；
The surface topography of the chip is evaluated and tested according to the surface topography parameters in the current process stage.
Preferably, the surface topography parameters, the technological parameter, the domain according to a upper operation stage are special
The selection ratio of parameter and the current process stage lapping liquid is levied, the surface topography for calculating the chip in the current process stage is joined
Number, including：
According to the surface topography parameters of a upper operation stage, the technological parameter, the domain characteristic parameter and institute
State the selection ratio of current process stage lapping liquid, the pressure distribution of computing chip；
According to the clearance of the calculation of pressure distribution chip；
The surface topography parameters in current process stage are calculated according to the clearance.
Preferably, methods described also includes：Judge whether the current process stage reaches grinding endpoint, if it is, terminating
Surface topography is evaluated and tested.
Preferably, if the current process stage does not reach grinding endpoint, according to the surface shape in the current process stage
The height Regional Distribution of Registered on looks parameter computing chip surface.
Preferably, methods described also includes：
Judge whether the height Regional Distribution of Registered of upper an operation stage and the chip surface in current process stage becomes
Change；
If it is, the relatively high area in the height Regional Distribution of Registered and relatively low area are mutually swapped.
On the other hand, there is provided chip surface morphology evaluating system after one kind chemically mechanical polishing, including：
First acquisition module, for obtaining selection of the chip in the surface topography parameters and lapping liquid of a upper operation stage
Than；
Second acquisition module, for obtaining the technological parameter in current process stage and the selection ratio of lapping liquid；
Domain division module, for the Current surface domain of chip to be divided into multiple continuous panes；
Characteristic extracting module, for extracting the domain characteristic parameter of each pane respectively；
First judge module, for judging that whether the selection of lapping liquid than changes；
Computing module, for judging selection than after changing in first judge module, according to a upper operation stage
Surface topography parameters, technological parameter, the selection ratio of domain characteristic parameter and current process stage lapping liquid, computing chip working as
The surface topography parameters of preceding operation stage；
Evaluation and test module, for being entered according to the surface topography parameters in the current process stage to the surface topography of the chip
Row evaluation and test.
Preferably, the computing module includes：
First computing unit, for surface topography parameters according to a upper operation stage, technological parameter, described
The selection ratio of domain characteristic parameter and the current process stage lapping liquid, the pressure distribution of computing chip；
Second computing unit, for the clearance according to the calculation of pressure distribution chip；
3rd computing unit, for calculating the surface topography parameters in current process stage according to the clearance.
Preferably, the system also includes：
Second judge module, for judging whether the current process stage reaches grinding endpoint；
The evaluation and test module, it is additionally operable to judge that the current process stage reaches grinding endpoint in second judge module
Afterwards, surface topography evaluation and test is terminated.
Preferably, the computing module, is additionally operable to judge that the current process stage does not reach in second judge module to grind
After grinding terminal, according to the height Regional Distribution of Registered on the surface topography parameters computing chip surface.
Preferably, the system also includes：
3rd judge module, for judging the high low area point of upper an operation stage and the chip surface in current process stage
Whether cloth situation changes；
Switching Module, for the chip list in an operation stage and current process stage in the 3rd judge module judgement
After the height Regional Distribution of Registered in face changes, by the relatively high area in the height Regional Distribution of Registered and relatively low area's phase
Mutually swap.
Chip surface morphology evaluating method and system after chemically mechanical polishing provided in an embodiment of the present invention, in a upper technique
In the case that the selection of the lapping liquid in stage and current process stage is than changing, joined according to the surface topography of a upper operation stage
Number, technological parameter, the selection ratio of domain characteristic parameter and current process stage lapping liquid, computing chip is in the current process stage
Surface topography parameters, surface topography evaluation and test is then carried out, take into full account that lapping liquid selection compares the influence of chip surface morphology, energy
Enough surface topographies to chip are accurately evaluated and tested.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to institute in embodiment
The accompanying drawing needed to use is briefly described, it should be apparent that, drawings in the following description are only one described in the present invention
A little embodiments, for those of ordinary skill in the art, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the flow chart of chip surface morphology evaluating method after chemically mechanical polishing of the prior art；
Fig. 2 is the flow of chip surface morphology evaluating method after a kind of chemically mechanical polishing provided in an embodiment of the present invention
Figure；
Fig. 3 is the flow of chip surface morphology evaluating method after second of chemically mechanical polishing provided in an embodiment of the present invention
Figure；
Fig. 4 is the flow of chip surface morphology evaluating method after the third chemically mechanical polishing provided in an embodiment of the present invention
Figure；
Fig. 5 is the flow of chip surface morphology evaluating method after the 4th kind of chemically mechanical polishing provided in an embodiment of the present invention
Figure；
Fig. 6 is that the structure of chip surface morphology evaluating system after a kind of chemically mechanical polishing provided in an embodiment of the present invention is shown
It is intended to；
Fig. 7 is the structure of chip surface morphology evaluating system after second of chemically mechanical polishing provided in an embodiment of the present invention
Schematic diagram；
Fig. 8 is the structure of chip surface morphology evaluating system after the third chemically mechanical polishing provided in an embodiment of the present invention
Schematic diagram；
Fig. 9 is the structure of chip surface morphology evaluating system after the 4th kind of chemically mechanical polishing provided in an embodiment of the present invention
Schematic diagram.
Embodiment
In order that those skilled in the art more fully understand the scheme of the embodiment of the present invention, below in conjunction with the accompanying drawings and implement
Mode is described in further detail to the embodiment of the present invention.
The embodiment of the present invention provides chip surface morphology evaluating method after a kind of chemically mechanical polishing, as shown in Fig. 2 including
Following steps：
Step 201：Chip is obtained in the surface topography parameters of a upper operation stage and the selection ratio of lapping liquid.
Because CMP process is essentially by selected lapping liquid, to core under certain process conditions
The process that the material on piece surface is ground, removed.Wherein, the selection ratio of lapping liquid is a key parameter, and lapping liquid is to material
Expect A and material B selection than under the conditions of same process materials A to the ratio between material B clearance.If selection ratio is more than 1,
Then chip surface materials A is depression after CMP, and material B is protrusion；, whereas if selection ratio is less than 1, then
Chip surface materials A is protrusion after CMP, and material B is depression.In modern CMP, in different works
The skill stage often use different choice than lapping liquid to reach required process goal.
Step 202：Obtain the technological parameter in current process stage and the selection ratio of lapping liquid.
CMP process is complex, is generally divided into multiple stages such as P1, P2, P3, wherein, a upper operation stage it is defeated
Go out input of the result as next operation stage.It is different in the material that each stage removes required for, it is therefore possible to use different
Grinding pad, the running stores such as lapping liquid, while using technological parameters such as different pressure, rotating speeds, to reach different technique mesh
Mark.
Step 203：The Current surface domain of chip is divided into multiple continuous panes, extracts the domain of each pane respectively
Characteristic parameter.
Wherein, domain characteristic parameter be characterize chip surface domain structure relevant parameter, can include equivalent line width, etc.
Spacing and density etc. are imitated, specifically needs which domain characteristic parameter extracted, can be selected according to being actually needed.Above-mentioned steps
201st, step 202 and step 203 are not limited to above-mentioned execution sequence, and specific execution sequence can be adjusted arbitrarily as needed
Whole, the embodiment of the present invention is not specifically limited.
Step 204：Judge that whether the selection of lapping liquid than changes, if it is, the table according to a upper operation stage
Face structural parameters, technological parameter, the selection ratio of domain characteristic parameter and current process stage lapping liquid, computing chip is in current work
The surface topography parameters in skill stage.
Wherein, the selection ratio of lapping liquid changes and can included：It is big in the selection ratio of the lapping liquid of a upper operation stage
Compare in 1 and the selection of the lapping liquid of this operation stage less than 1, and the selection of the lapping liquid in a upper operation stage is compared less than 1
And more than 1 two kinds situations are compared in the selection of the lapping liquid of this operation stage, that is, the selection of the lapping liquid of two neighboring operation stage
Than not being to be more than 1 entirely or entirely less than 1, then it is assumed that the selection ratio of lapping liquid changes.
In the case where the selection ratio of lapping liquid changes, it will the surface topography of chip is had an impact, therefore,
Examined during the surface topography parameters for calculating the current process stage, it is necessary to which the selection of lapping liquid is used for into input factor
Consider.Wherein, the method for specific gauging surface structural parameters can use method of the prior art, and those skilled in the art are easy
Know, here is omitted.
Step 205：The surface topography of chip is evaluated and tested according to the surface topography parameters in current process stage.
The surface topography of chip can be characterized by surface topography parameters after chemically mechanical polishing, and be passed through conventional
Include metal dish and erosion medium resistance etc. to describe the characteristic parameter of surface topography.Wherein, metal dish has been normally defined figure
The difference of shape Region Medium thickness degree and metal thickness；And erosion medium resistance is normally defined no graphics field thickness of dielectric layers and has figure
The difference of shape Region Medium thickness degree.The variable such as metal dish and line width of the erosion medium resistance generally to figure, spacing is related, shows
Very big is systemic and regular.Surface topography after CMP rises and falls as metal dish and erosion medium resistance can influence follow-up photoetching work
The depth of focus of skill, while the electrical characteristics such as the resistance of interconnection line can be also influenceed, so as to influence Interconnect Delay, yield and property to chip
It can simultaneously impact, surface topography is evaluated and tested by surface topography parameters, according to being actually needed in design and processes mistake
Cheng Zhong, this surface topography can be controlled within the acceptable range.
As shown in figure 3, for the surface topography parameters according to a upper operation stage, technological parameter, domain characteristic parameter and work as
The selection ratio of preceding operation stage lapping liquid, computing chip specifically may be used in the flow chart of the surface topography parameters in current process stage
To comprise the following steps：
Step 301：According to the surface topography parameters of a upper operation stage, technological parameter, domain characteristic parameter and current work
The selection ratio of skill stage lapping liquid, the pressure distribution of computing chip.
Step 302：According to the clearance of calculation of pressure distribution chip.
Step 303：The surface topography parameters in current process stage are calculated according to clearance.
Because many factors such as the surface topography of pressure distribution situation and chip, process conditions are related, and pressure distribution
Material remove rate can be had an impact, pass through the surface topography parameters, technological parameter, domain characteristic parameter of a upper operation stage
With lapping liquid selection than after calculating pressure distribution, pressure distribution is multiplied by into particular factor can calculate clearance, wherein, spy
Determining coefficient can be obtained by test data fitting.Because the species of lapping liquid is specific and it is specific to remove material, according to clearance,
Surface topography parameters can be calculated.
As shown in figure 4, chip surface morphology evaluating method can further include step after above-mentioned chemically mechanical polishing
206：Judge whether the current process stage reaches grinding endpoint；If it is determined that the current process stage has arrived at grinding endpoint, then
Terminate surface topography evaluation and test；If it is determined that the current process stage does not reach grinding endpoint, then step 207 is transferred to：According to current work
The height Regional Distribution of Registered on the surface topography parameters computing chip surface in skill stage.
The surface topography of chip can be evaluated and tested in real time during CMP, for specific operation stage, work as arrival
After grinding endpoint, surface topography evaluation and test will be terminated.Wherein it is possible to it is by grinding the judgements such as duration, grinding thickness
No arrival grinding endpoint, specifically can accordingly it be judged according to the standard set by reality.
As shown in figure 5, after the height Regional Distribution of Registered of chip surface is calculated, after above-mentioned chemically mechanical polishing
Chip surface morphology evaluating method can also comprise the following steps：
Step 208：Judging the height Regional Distribution of Registered of upper an operation stage and the chip surface in current process stage is
It is no to change.
If the selection ratio of lapping liquid changes, the height Regional Distribution of Registered for making chip surface may be become
Change, for the up-and-down chip surface of height, height Regional Distribution of Registered can be subject to by relatively high area and relatively low area
Characterizing, height Regional Distribution of Registered changes the relatively high area for referring to an operation stage chip surface and relatively low area,
The relatively low area of current process stage chip surface and relatively high area are changed to respectively, i.e., relatively high area and relatively low area are handed over
Change.
Step 209：If it is, the relatively high area in height Regional Distribution of Registered and relatively low area are mutually handed over
Change.
If changed by the height Regional Distribution of Registered for judging to find chip surface, illustrate to select by lapping liquid
Select than change, cause the clearance of different materials to change, and then cause the relatively high of since certain particular moment script
Area has been changed to relatively low area by grinding.Such as：In the P1 stages, the clearance of materials A is more than material B clearance, then exists
After the P1 stages, materials A is depression, and material B is protrusion；However, in the P2 stages, the clearance of materials A is less than material B's
Clearance, then at some time point in P2 stages, materials A will be switched to protrude by depression, and material B will be switched to be recessed by protrusion.
That is, in the case where selecting than changing, will cause to hand between originally higher region and originally relatively low region
Change.After height Regional Distribution of Registered changes, script upper zone is changed into lower region, and script lower region is changed into higher
Region, correspondingly need to be adjusted relevant parameter, for example, the density of script upper zone is ρB, the density of lower region
For ρA, and the density of upper zone is ρ after exchangingA, the density of lower region is ρB, wherein, ρA=1- ρB。
Because the height Regional Distribution of Registered after exchange can reflect the real surface topography of chip, therefore, will exchange
Height Regional Distribution of Registered afterwards is as the surface topography parameters input for calculating the current process stage, so as to ensure evaluation result
Accuracy.In addition, the input by the way that the height Regional Distribution of Registered after exchange to be fed back to next operation stage, so as to
Ensure that the chip surface morphology that next operation stage is obtained is more nearly actual conditions, and then ensure the standard of follow-up evaluation result
True property.
Chip surface morphology evaluating method after chemically mechanical polishing provided in an embodiment of the present invention, in a upper operation stage and
In the case that the lapping liquid selection in current process stage is than changing, according to the surface topography parameters of a upper operation stage, work
The selection ratio of skill parameter, domain characteristic parameter and current process stage lapping liquid, computing chip is on the surface in current process stage
Structural parameters, surface topography evaluation and test is then carried out, take into full account that lapping liquid selection compares the influence of chip surface morphology, can be right
The surface topography of chip is accurately evaluated and tested.
Correspondingly, the embodiment of the present invention additionally provides chip surface morphology evaluating system after a kind of chemically mechanical polishing, such as
Described in Fig. 6, chip surface morphology evaluating system can include after the chemically mechanical polishing：
First acquisition module 401, for obtaining choosing of the chip in the surface topography parameters and lapping liquid of a upper operation stage
Select ratio；
Second acquisition module 402, for obtaining the technological parameter in current process stage and the selection ratio of lapping liquid；
Domain division module 403, for the Current surface domain of chip to be divided into multiple continuous panes；
Characteristic extracting module 404, for extracting the domain characteristic parameter of each pane respectively；
First judge module 405, for judging that whether the selection of lapping liquid than changes；
Computing module 406, for judging selection than after changing in the first judge module 405, according to upper technique rank
Surface topography parameters, technological parameter, the selection ratio of domain characteristic parameter and current process stage lapping liquid of section, computing chip exist
The surface topography parameters in current process stage；
Evaluation and test module 407, the surface topography of chip is commented for the surface topography parameters according to the current process stage
Survey.
As shown in fig. 7, computing module 406 can include：
First computing unit 501, for the surface topography parameters according to a upper operation stage, technological parameter, domain feature
The selection ratio of parameter and current process stage lapping liquid, the pressure distribution of computing chip；
Second computing unit 502, for the clearance according to calculation of pressure distribution chip
3rd computing unit 503, for calculating the surface topography parameters in current process stage according to clearance.
As shown in figure 8, chip surface morphology evaluating system can also further include after above-mentioned chemically mechanical polishing：
Second judge module 408, for judging whether the current process stage reaches grinding endpoint；
Evaluation and test module 407, it is additionally operable to after the second judge module 408 judges that the current process stage reaches grinding endpoint, knot
Beam surface topography is evaluated and tested.
As shown in figure 9, chip surface morphology evaluating system can also further include after above-mentioned chemically mechanical polishing：
3rd judge module 409, for judging the height area of upper an operation stage and the chip surface in current process stage
Whether domain distribution situation changes；
Switching Module 410, for an operation stage and the chip in current process stage in the judgement of the 3rd judge module 409
It is after the height Regional Distribution of Registered on surface changes, the relatively high area in height Regional Distribution of Registered and relatively low area is mutual
Swap.
Chip surface morphology evaluating system after chemically mechanical polishing provided in an embodiment of the present invention, in a upper operation stage and
In the case that the lapping liquid selection in current process stage is than changing, according to the surface topography parameters of a upper operation stage, work
The selection ratio of skill parameter, domain characteristic parameter and current process stage lapping liquid, computing chip is on the surface in current process stage
Structural parameters, surface topography evaluation and test is then carried out, take into full account that lapping liquid selection compares the influence of chip surface morphology, can be right
The surface topography of chip is accurately evaluated and tested.
Each embodiment in this specification is described by the way of progressive, identical similar portion between each embodiment
Divide mutually referring to what each embodiment stressed is the difference with other embodiment.It is real especially for system
For applying example, because it is substantially similar to embodiment of the method, so describing fairly simple, related part is referring to embodiment of the method
Part explanation.System embodiment described above is only schematical, wherein described be used as separating component explanation
Unit can be or may not be physically separate, can be as the part that unit is shown or may not be
Physical location, you can with positioned at a place, or can also be distributed on multiple NEs.Can be according to the actual needs
Some or all of module therein is selected to realize the purpose of this embodiment scheme.Those of ordinary skill in the art are not paying
In the case of creative work, you can to understand and implement.
The foregoing is only presently preferred embodiments of the present invention, be not intended to limit the invention, it is all the present invention spirit and
Within principle, any modification, equivalent substitution and improvements made etc., it should be included in the scope of the protection.
Claims (6)
1. chip surface morphology evaluating method after one kind chemically mechanical polishing, it is characterised in that including：
Chip is obtained in the surface topography parameters of a upper operation stage and the selection ratio of lapping liquid；
Obtain the technological parameter in current process stage and the selection ratio of lapping liquid；
The Current surface domain of chip is divided into multiple continuous panes, extracts the domain feature ginseng of each pane respectively
Number；
Judge that whether the selection of lapping liquid than changes, if it is, joining according to the surface topography of a upper operation stage
Number, technological parameter, the selection ratio of domain characteristic parameter and the current process stage lapping liquid, calculate the chip in current work
The surface topography parameters in skill stage；
The surface topography of the chip is evaluated and tested according to the surface topography parameters in the current process stage；
Judge whether the current process stage reaches grinding endpoint, if it is not, then the surface topography parameters according to the current process stage
The height Regional Distribution of Registered on computing chip surface；
Judge whether the height Regional Distribution of Registered of upper an operation stage and the chip surface in current process stage changes；
If it is, the relatively high area in the height Regional Distribution of Registered and relatively low area are mutually swapped.
2. chip surface morphology evaluating method after chemically mechanical polishing according to claim 1, it is characterised in that described
According to the surface topography parameters of a upper operation stage, the technological parameter, the domain characteristic parameter and the current process
The selection ratio of stage lapping liquid, surface topography parameters of the chip in the current process stage are calculated, including：
According to the surface topography parameters of a upper operation stage, the technological parameter, the domain characteristic parameter and it is described work as
The selection ratio of preceding operation stage lapping liquid, the pressure distribution of computing chip；
According to the clearance of the calculation of pressure distribution chip；
The surface topography parameters in current process stage are calculated according to the clearance.
3. chip surface morphology evaluating method after the chemically mechanical polishing according to any one of claim 1 or 2, its feature exist
In methods described also includes：Judge whether the current process stage reaches grinding endpoint, if it is, terminating surface topography evaluation and test.
4. chip surface morphology evaluating system after one kind chemically mechanical polishing, it is characterised in that including：
First acquisition module, for obtaining chip in the surface topography parameters of a upper operation stage and the selection ratio of lapping liquid；
Second acquisition module, for obtaining the technological parameter in current process stage and the selection ratio of lapping liquid；
Domain division module, for the Current surface domain of chip to be divided into multiple continuous panes；
Characteristic extracting module, for extracting the domain characteristic parameter of each pane respectively；
First judge module, for judging that whether the selection of lapping liquid than changes；
Computing module, for judging selection than after changing in first judge module, according to the table of a upper operation stage
Face structural parameters, technological parameter, the selection ratio of domain characteristic parameter and current process stage lapping liquid, computing chip is in current work
The surface topography parameters in skill stage；
Evaluation and test module, for being commented according to the surface topography parameters in the current process stage the surface topography of the chip
Survey；
Second judge module, for judging whether the current process stage reaches grinding endpoint, if it is not, then the computing module root
According to the height Regional Distribution of Registered on the surface topography parameters computing chip surface in current process stage；
3rd judge module, for judging the height area distribution feelings of upper an operation stage and the chip surface in current process stage
Whether condition changes；
Switching Module, for an operation stage and the chip surface in current process stage in the 3rd judge module judgement
After height Regional Distribution of Registered changes, the relatively high area in the height Regional Distribution of Registered and relatively low area are mutually entered
Row exchanges.
5. chip surface morphology evaluating system after chemically mechanical polishing according to claim 4, it is characterised in that the meter
Calculating module includes：
First computing unit, for surface topography parameters, the technological parameter, the domain according to a upper operation stage
The selection ratio of characteristic parameter and the current process stage lapping liquid, the pressure distribution of computing chip；
Second computing unit, for the clearance according to the calculation of pressure distribution chip；
3rd computing unit, for calculating the surface topography parameters in current process stage according to the clearance.
6. chip surface morphology evaluating system after the chemically mechanical polishing according to any one of claim 4 or 5, its feature exist
In the system also includes：
The evaluation and test module, it is additionally operable to after second judge module judges that the current process stage reaches grinding endpoint,
Terminate surface topography evaluation and test.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410643976.0A CN105632956B (en) | 2014-11-07 | 2014-11-07 | Method and system for evaluating surface appearance of chip after chemical mechanical polishing |
Applications Claiming Priority (1)
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| WO2021168610A1 (en) | 2020-02-24 | 2021-09-02 | Yangtze Memory Technologies Co., Ltd. | Systems having light source with extended spectrum for semiconductor chip surface topography metrology |
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