CN107580710B - 用于增强检验工具的检验灵敏度的系统及方法 - Google Patents

用于增强检验工具的检验灵敏度的系统及方法 Download PDF

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Publication number
CN107580710B
CN107580710B CN201680013835.8A CN201680013835A CN107580710B CN 107580710 B CN107580710 B CN 107580710B CN 201680013835 A CN201680013835 A CN 201680013835A CN 107580710 B CN107580710 B CN 107580710B
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wafer
images
grayscale
processor
image
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CN107580710A (zh
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李诗芳
温友贤
S·施维塔拉
P·阿吉
L·尼古拉德斯
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KLA Corp
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KLA Tencor Corp
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/22—Matching criteria, e.g. proximity measures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T5/00—Image enhancement or restoration
    • G06T5/50—Image enhancement or restoration using two or more images, e.g. averaging or subtraction
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10016—Video; Image sequence
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10024—Color image
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20212—Image combination
    • G06T2207/20224—Image subtraction
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Data Mining & Analysis (AREA)
  • Quality & Reliability (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • General Engineering & Computer Science (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Artificial Intelligence (AREA)
  • Evolutionary Computation (AREA)
  • Evolutionary Biology (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
CN201680013835.8A 2015-03-16 2016-03-15 用于增强检验工具的检验灵敏度的系统及方法 Active CN107580710B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562133959P 2015-03-16 2015-03-16
US62/133,959 2015-03-16
US15/068,320 US9747520B2 (en) 2015-03-16 2016-03-11 Systems and methods for enhancing inspection sensitivity of an inspection tool
US15/068,320 2016-03-11
PCT/US2016/022497 WO2016149285A1 (en) 2015-03-16 2016-03-15 Systems and methods for enhancing inspection sensitivity of an inspection tool

Publications (2)

Publication Number Publication Date
CN107580710A CN107580710A (zh) 2018-01-12
CN107580710B true CN107580710B (zh) 2019-05-14

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Country Link
US (1) US9747520B2 (enExample)
EP (1) EP3271939B1 (enExample)
JP (1) JP6807324B2 (enExample)
KR (1) KR102364951B1 (enExample)
CN (1) CN107580710B (enExample)
TW (1) TWI668436B (enExample)
WO (1) WO2016149285A1 (enExample)

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US10563973B2 (en) 2016-03-28 2020-02-18 Kla-Tencor Corporation All surface film metrology system
JP6233824B1 (ja) * 2017-04-25 2017-11-22 合同会社ウイングビジョン 画像検査装置、生産システム、画像検査方法、プログラム及び記憶媒体
KR102658977B1 (ko) * 2017-11-03 2024-04-18 도쿄엘렉트론가부시키가이샤 기능성 마이크로 전자 디바이스의 수율 향상
US11244873B2 (en) * 2018-10-31 2022-02-08 Tokyo Electron Limited Systems and methods for manufacturing microelectronic devices
US11953448B2 (en) 2019-09-27 2024-04-09 Taiwan Semiconductor Manufacturing Company Ltd. Method for defect inspection
US11221300B2 (en) 2020-03-20 2022-01-11 KLA Corp. Determining metrology-like information for a specimen using an inspection tool
US11868119B2 (en) 2021-09-24 2024-01-09 Tokyo Electron Limited Method and process using fingerprint based semiconductor manufacturing process fault detection
CN113936002A (zh) * 2021-12-17 2022-01-14 成都数之联科技有限公司 周期提取方法、装置、计算机设备及可读存储介质
CN116107154B (zh) * 2023-04-13 2023-09-05 长鑫存储技术有限公司 掩膜版数据生成方法、装置、设备及介质
CN117269197B (zh) * 2023-11-21 2024-02-02 昆明理工大学 多晶硅原料表面质量检测方法及检测装置

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CN101346623A (zh) * 2005-12-26 2009-01-14 株式会社尼康 根据图像分析进行缺陷检查的缺陷检查装置
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Also Published As

Publication number Publication date
WO2016149285A1 (en) 2016-09-22
JP2018516451A (ja) 2018-06-21
US20160275671A1 (en) 2016-09-22
TWI668436B (zh) 2019-08-11
US9747520B2 (en) 2017-08-29
CN107580710A (zh) 2018-01-12
KR102364951B1 (ko) 2022-02-17
JP6807324B2 (ja) 2021-01-06
KR20170128507A (ko) 2017-11-22
EP3271939A1 (en) 2018-01-24
EP3271939B1 (en) 2019-09-25
EP3271939A4 (en) 2018-09-12
TW201636602A (zh) 2016-10-16

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