TWI668436B - 用於增強檢測工具之檢測靈敏度之系統及方法 - Google Patents

用於增強檢測工具之檢測靈敏度之系統及方法 Download PDF

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Publication number
TWI668436B
TWI668436B TW105108129A TW105108129A TWI668436B TW I668436 B TWI668436 B TW I668436B TW 105108129 A TW105108129 A TW 105108129A TW 105108129 A TW105108129 A TW 105108129A TW I668436 B TWI668436 B TW I668436B
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TW
Taiwan
Prior art keywords
wafer
grayscale image
processor
grayscale
images
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TW105108129A
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English (en)
Chinese (zh)
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TW201636602A (zh
Inventor
緒方 李
佑仙 溫
賽分 史克威塔拉
普拉香特 艾吉
蕾娜 妮可雷德思
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美商克萊譚克公司
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Publication of TW201636602A publication Critical patent/TW201636602A/zh
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/22—Matching criteria, e.g. proximity measures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T5/00—Image enhancement or restoration
    • G06T5/50—Image enhancement or restoration using two or more images, e.g. averaging or subtraction
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10016—Video; Image sequence
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10024—Color image
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20212—Image combination
    • G06T2207/20224—Image subtraction
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Data Mining & Analysis (AREA)
  • Quality & Reliability (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • General Engineering & Computer Science (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Artificial Intelligence (AREA)
  • Evolutionary Computation (AREA)
  • Evolutionary Biology (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
TW105108129A 2015-03-16 2016-03-16 用於增強檢測工具之檢測靈敏度之系統及方法 TWI668436B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201562133959P 2015-03-16 2015-03-16
US62/133,959 2015-03-16
US15/068,320 US9747520B2 (en) 2015-03-16 2016-03-11 Systems and methods for enhancing inspection sensitivity of an inspection tool
US15/068,320 2016-03-11

Publications (2)

Publication Number Publication Date
TW201636602A TW201636602A (zh) 2016-10-16
TWI668436B true TWI668436B (zh) 2019-08-11

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW105108129A TWI668436B (zh) 2015-03-16 2016-03-16 用於增強檢測工具之檢測靈敏度之系統及方法

Country Status (7)

Country Link
US (1) US9747520B2 (enExample)
EP (1) EP3271939B1 (enExample)
JP (1) JP6807324B2 (enExample)
KR (1) KR102364951B1 (enExample)
CN (1) CN107580710B (enExample)
TW (1) TWI668436B (enExample)
WO (1) WO2016149285A1 (enExample)

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US10563973B2 (en) 2016-03-28 2020-02-18 Kla-Tencor Corporation All surface film metrology system
JP6233824B1 (ja) * 2017-04-25 2017-11-22 合同会社ウイングビジョン 画像検査装置、生産システム、画像検査方法、プログラム及び記憶媒体
KR102658977B1 (ko) * 2017-11-03 2024-04-18 도쿄엘렉트론가부시키가이샤 기능성 마이크로 전자 디바이스의 수율 향상
US11244873B2 (en) * 2018-10-31 2022-02-08 Tokyo Electron Limited Systems and methods for manufacturing microelectronic devices
US11221300B2 (en) 2020-03-20 2022-01-11 KLA Corp. Determining metrology-like information for a specimen using an inspection tool
US11935244B2 (en) 2020-10-29 2024-03-19 Changxin Memory Technologies, Inc. Method and apparatus for improving sensitivity of wafer detection, and storage medium
US11868119B2 (en) 2021-09-24 2024-01-09 Tokyo Electron Limited Method and process using fingerprint based semiconductor manufacturing process fault detection
CN113936002A (zh) * 2021-12-17 2022-01-14 成都数之联科技有限公司 周期提取方法、装置、计算机设备及可读存储介质
CN116107154B (zh) * 2023-04-13 2023-09-05 长鑫存储技术有限公司 掩膜版数据生成方法、装置、设备及介质
CN117269197B (zh) * 2023-11-21 2024-02-02 昆明理工大学 多晶硅原料表面质量检测方法及检测装置

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TW563345B (en) * 2001-03-15 2003-11-21 Canon Kk Image processing for correcting defects of read image
TW200612510A (en) * 2004-09-29 2006-04-16 Dainippon Screen Mfg Defect detection apparatus and defect detection method
US20080225286A1 (en) * 2005-09-09 2008-09-18 Yukihiro Shibata Method And Apparatus For Detecting Defects
TW200732650A (en) * 2006-02-07 2007-09-01 Hantech Co Ltd Apparatus and method for detecting defects in wafer using line sensor camera
TW201409022A (zh) * 2012-08-30 2014-03-01 Nat Applied Res Laboratories 檢知晶圓表面之缺陷的檢測方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI782324B (zh) * 2019-09-27 2022-11-01 台灣積體電路製造股份有限公司 缺陷檢測之方法

Also Published As

Publication number Publication date
WO2016149285A1 (en) 2016-09-22
JP2018516451A (ja) 2018-06-21
US20160275671A1 (en) 2016-09-22
US9747520B2 (en) 2017-08-29
CN107580710A (zh) 2018-01-12
KR102364951B1 (ko) 2022-02-17
JP6807324B2 (ja) 2021-01-06
CN107580710B (zh) 2019-05-14
KR20170128507A (ko) 2017-11-22
EP3271939A1 (en) 2018-01-24
EP3271939B1 (en) 2019-09-25
EP3271939A4 (en) 2018-09-12
TW201636602A (zh) 2016-10-16

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