KR102364951B1 - 검사 도구의 검사 감도를 개선하기 위한 시스템 및 방법 - Google Patents

검사 도구의 검사 감도를 개선하기 위한 시스템 및 방법 Download PDF

Info

Publication number
KR102364951B1
KR102364951B1 KR1020177029582A KR20177029582A KR102364951B1 KR 102364951 B1 KR102364951 B1 KR 102364951B1 KR 1020177029582 A KR1020177029582 A KR 1020177029582A KR 20177029582 A KR20177029582 A KR 20177029582A KR 102364951 B1 KR102364951 B1 KR 102364951B1
Authority
KR
South Korea
Prior art keywords
wafer
grayscale
image
images
processor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020177029582A
Other languages
English (en)
Korean (ko)
Other versions
KR20170128507A (ko
Inventor
시팡 리
유시안 웬
스벤 스치위탈라
프라샨트 아지
레나 니콜라이데스
Original Assignee
케이엘에이 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 케이엘에이 코포레이션 filed Critical 케이엘에이 코포레이션
Publication of KR20170128507A publication Critical patent/KR20170128507A/ko
Application granted granted Critical
Publication of KR102364951B1 publication Critical patent/KR102364951B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/22—Matching criteria, e.g. proximity measures
    • G06K9/6201—
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T5/00—Image enhancement or restoration
    • G06T5/50—Image enhancement or restoration using two or more images, e.g. averaging or subtraction
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
    • H04N5/2256—
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10016—Video; Image sequence
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10024—Color image
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20212—Image combination
    • G06T2207/20224—Image subtraction
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Data Mining & Analysis (AREA)
  • Quality & Reliability (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • General Engineering & Computer Science (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Artificial Intelligence (AREA)
  • Evolutionary Computation (AREA)
  • Evolutionary Biology (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
KR1020177029582A 2015-03-16 2016-03-15 검사 도구의 검사 감도를 개선하기 위한 시스템 및 방법 Active KR102364951B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562133959P 2015-03-16 2015-03-16
US62/133,959 2015-03-16
US15/068,320 US9747520B2 (en) 2015-03-16 2016-03-11 Systems and methods for enhancing inspection sensitivity of an inspection tool
US15/068,320 2016-03-11
PCT/US2016/022497 WO2016149285A1 (en) 2015-03-16 2016-03-15 Systems and methods for enhancing inspection sensitivity of an inspection tool

Publications (2)

Publication Number Publication Date
KR20170128507A KR20170128507A (ko) 2017-11-22
KR102364951B1 true KR102364951B1 (ko) 2022-02-17

Family

ID=56919431

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177029582A Active KR102364951B1 (ko) 2015-03-16 2016-03-15 검사 도구의 검사 감도를 개선하기 위한 시스템 및 방법

Country Status (7)

Country Link
US (1) US9747520B2 (enExample)
EP (1) EP3271939B1 (enExample)
JP (1) JP6807324B2 (enExample)
KR (1) KR102364951B1 (enExample)
CN (1) CN107580710B (enExample)
TW (1) TWI668436B (enExample)
WO (1) WO2016149285A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109283800B (zh) * 2014-02-12 2021-01-01 Asml荷兰有限公司 过程窗口的优化方法
US10563973B2 (en) 2016-03-28 2020-02-18 Kla-Tencor Corporation All surface film metrology system
JP6233824B1 (ja) * 2017-04-25 2017-11-22 合同会社ウイングビジョン 画像検査装置、生産システム、画像検査方法、プログラム及び記憶媒体
KR102658977B1 (ko) * 2017-11-03 2024-04-18 도쿄엘렉트론가부시키가이샤 기능성 마이크로 전자 디바이스의 수율 향상
US11244873B2 (en) * 2018-10-31 2022-02-08 Tokyo Electron Limited Systems and methods for manufacturing microelectronic devices
US11953448B2 (en) 2019-09-27 2024-04-09 Taiwan Semiconductor Manufacturing Company Ltd. Method for defect inspection
US11221300B2 (en) 2020-03-20 2022-01-11 KLA Corp. Determining metrology-like information for a specimen using an inspection tool
US11935244B2 (en) 2020-10-29 2024-03-19 Changxin Memory Technologies, Inc. Method and apparatus for improving sensitivity of wafer detection, and storage medium
US11868119B2 (en) 2021-09-24 2024-01-09 Tokyo Electron Limited Method and process using fingerprint based semiconductor manufacturing process fault detection
CN113936002A (zh) * 2021-12-17 2022-01-14 成都数之联科技有限公司 周期提取方法、装置、计算机设备及可读存储介质
CN116107154B (zh) * 2023-04-13 2023-09-05 长鑫存储技术有限公司 掩膜版数据生成方法、装置、设备及介质
CN117269197B (zh) * 2023-11-21 2024-02-02 昆明理工大学 多晶硅原料表面质量检测方法及检测装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007074770A1 (ja) 2005-12-26 2007-07-05 Nikon Corporation 画像解析によって欠陥検査を行う欠陥検査装置
JP2009289818A (ja) 2008-05-27 2009-12-10 Tokyo Electron Ltd 針跡検査装置、プローブ装置、及び針跡検査方法、並びに記憶媒体
WO2014163375A1 (ko) 2013-04-02 2014-10-09 주식회사 고영테크놀러지 기판의 이물질 검사방법

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5050230A (en) * 1989-11-29 1991-09-17 Eastman Kodak Company Hybrid residual-based hierarchical storage and display method for high resolution digital images in a multiuse environment
US6578188B1 (en) * 1997-09-17 2003-06-10 Numerical Technologies, Inc. Method and apparatus for a network-based mask defect printability analysis system
IL131092A (en) * 1999-07-25 2006-08-01 Orbotech Ltd Optical inspection system
TW563345B (en) * 2001-03-15 2003-11-21 Canon Kk Image processing for correcting defects of read image
US6859565B2 (en) * 2001-04-11 2005-02-22 Hewlett-Packard Development Company, L.P. Method and apparatus for the removal of flash artifacts
DE10330003B4 (de) 2003-07-03 2007-03-08 Leica Microsystems Semiconductor Gmbh Vorrichtung, Verfahren und Computerprogramm zur Wafer-Inspektion
JP4562126B2 (ja) * 2004-09-29 2010-10-13 大日本スクリーン製造株式会社 欠陥検出装置および欠陥検出方法
JP4778755B2 (ja) * 2005-09-09 2011-09-21 株式会社日立ハイテクノロジーズ 欠陥検査方法及びこれを用いた装置
JP4723362B2 (ja) 2005-11-29 2011-07-13 株式会社日立ハイテクノロジーズ 光学式検査装置及びその方法
US8055058B2 (en) * 2006-02-07 2011-11-08 Hantech Co., Ltd. Apparatus and method for detecting defects in wafer using line sensor camera
US7589869B2 (en) * 2006-04-28 2009-09-15 Electro Scientific Industries, Inc. Adjusting image quality using multi-wavelength light
JP5144202B2 (ja) * 2007-10-05 2013-02-13 オリンパス株式会社 画像処理装置およびプログラム
US8223327B2 (en) * 2009-01-26 2012-07-17 Kla-Tencor Corp. Systems and methods for detecting defects on a wafer
CN102414612B (zh) * 2009-05-01 2015-03-11 皇家飞利浦电子股份有限公司 用于基于图像的照明控制和安全控制的系统和设备
US8855403B2 (en) * 2010-04-16 2014-10-07 Koh Young Technology Inc. Method of discriminating between an object region and a ground region and method of measuring three dimensional shape by using the same
TWI502549B (zh) 2012-02-20 2015-10-01 Univ Nat Kaohsiung Applied Sci 元件影像檢測方法及其系統
US9939386B2 (en) 2012-04-12 2018-04-10 KLA—Tencor Corporation Systems and methods for sample inspection and review
US8643836B1 (en) * 2012-08-30 2014-02-04 National Applied Research Laboratories Inspection method for inspecting defects of wafer surface
JP5862522B2 (ja) * 2012-09-06 2016-02-16 株式会社島津製作所 検査装置
US9658150B2 (en) 2015-01-12 2017-05-23 Kla-Tencor Corporation System and method for semiconductor wafer inspection and metrology

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007074770A1 (ja) 2005-12-26 2007-07-05 Nikon Corporation 画像解析によって欠陥検査を行う欠陥検査装置
JP2009289818A (ja) 2008-05-27 2009-12-10 Tokyo Electron Ltd 針跡検査装置、プローブ装置、及び針跡検査方法、並びに記憶媒体
WO2014163375A1 (ko) 2013-04-02 2014-10-09 주식회사 고영테크놀러지 기판의 이물질 검사방법

Also Published As

Publication number Publication date
WO2016149285A1 (en) 2016-09-22
JP2018516451A (ja) 2018-06-21
US20160275671A1 (en) 2016-09-22
TWI668436B (zh) 2019-08-11
US9747520B2 (en) 2017-08-29
CN107580710A (zh) 2018-01-12
JP6807324B2 (ja) 2021-01-06
CN107580710B (zh) 2019-05-14
KR20170128507A (ko) 2017-11-22
EP3271939A1 (en) 2018-01-24
EP3271939B1 (en) 2019-09-25
EP3271939A4 (en) 2018-09-12
TW201636602A (zh) 2016-10-16

Similar Documents

Publication Publication Date Title
KR102364951B1 (ko) 검사 도구의 검사 감도를 개선하기 위한 시스템 및 방법
TWI621849B (zh) 用於偵測晶圓上之缺陷之電腦實施方法、非暫時性電腦可讀媒體及系統
KR102019534B1 (ko) 결함 특유의, 다중 채널 정보를 이용한 웨이퍼 상의 결함 검출
KR102177682B1 (ko) 모든 표면 막 계측 시스템
KR102438828B1 (ko) 설계 기반의 정렬의 성능 모니터링
KR101843055B1 (ko) 검사 방법 및 템플릿
US10393671B2 (en) Intra-die defect detection
US10557802B2 (en) Capture of repeater defects on a semiconductor wafer
TWI865814B (zh) 用於判定一樣品之資訊之系統、方法及非暫時性電腦可讀媒體
US9702827B1 (en) Optical mode analysis with design-based care areas
KR102755838B1 (ko) 노이즈가 있는 패턴화된 피처들의 검사
KR20220041126A (ko) 광학 검사를 이용한 프로세스 모니터링 방법
KR102621488B1 (ko) Dram 및 3d nand 디바이스에 대한 디자인 지원 검사
US12100132B2 (en) Laser anneal pattern suppression
KR20230148710A (ko) 반도체 소자 검사 계측 장치 및 방법
KR20250130191A (ko) 뉴슨스 억제를 위한 패턴 분할

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20171013

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
A302 Request for accelerated examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20210315

Comment text: Request for Examination of Application

PA0302 Request for accelerated examination

Patent event date: 20210315

Patent event code: PA03022R01D

Comment text: Request for Accelerated Examination

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20210707

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20211117

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20220215

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20220215

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20250123

Start annual number: 4

End annual number: 4