CN107546220A - LED light source and preparation method thereof - Google Patents
LED light source and preparation method thereof Download PDFInfo
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- CN107546220A CN107546220A CN201710113282.XA CN201710113282A CN107546220A CN 107546220 A CN107546220 A CN 107546220A CN 201710113282 A CN201710113282 A CN 201710113282A CN 107546220 A CN107546220 A CN 107546220A
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Abstract
The present invention relates to a kind of preparation method of LED light source, including：The substrate with LED chip array is provided, the surface of the substrate is formed with chemical gilding；The fluorescent film of semi-solid preparation is provided, by the fluorescent film hot-press solidifying on the LED chip array and substrate；And lens are provided, and the lens are arranged on the fluorescent film and substrate and form LED light source.The present invention also provides LED light source made from above-mentioned preparation method.
Description
Technical field
The present invention relates to LED light source and preparation method thereof.
Background technology
Encapsulation is the key link that LED productions are formed a connecting link, and in whole LED industry chain, 50% manufacturing cost is concentrated
In encapsulation.The function of encapsulation is to provide chip enough protections, prevents chip exposure or mechanical damage for a long time in atmosphere
And fail, to improve the stability of chip；Encapsulated for LED, it is also necessary to there is good light extraction efficiency and color developing, it is good
Encapsulation can allow LED to possess more preferable luminous efficiency and color displays, and then lift LED application fields.
For a kind of existing LED encapsulation method using powder injection process in chip surface sprayed with fluorescent powder, this process efficiency is low, is made
LED fluorescent films mechanical strength it is poor.
The content of the invention
In consideration of it, it is necessary to provide a kind of preparation side for the LED light source for improving packaging efficiency and improving LED mechanical strengths
Method.
A kind of preparation method of LED light source, including：
The substrate with LED chip array is provided, the surface of the substrate is formed with chemical gilding；
The fluorescent film of semi-solid preparation is provided, by the fluorescent film hot-press solidifying in the LED chip array
And on substrate；And
Lens are provided, and the lens are arranged on the fluorescent film and substrate and form LED light source.
In a preferred embodiment, the substrate is the aluminium base with multiple both positive and negative polarities, and the LED chip array integrates
In the centre position of multiple both positive and negative polarities.
In a preferred embodiment, the preheating of the substrate is to be heated to 150 DEG C using the warm table of chip package machine, is added
The hot time is 5-8 minutes.
In a preferred embodiment, the fluorescent film of the semi-solid preparation uses the hot pressing of IT hot presses in the LED chip array
Surrounding and top surface.
Further, fluorescent film is heating and curing using a microwave heating equipment while IT hot presses hot pressing.
In a preferred embodiment, the preparation of the fluorescent film of the semi-solid preparation includes A/B silica gel mixing shape with fluorescent material
Into arogel, arogel film is then formed by silk-screen printing, places into vacuum drying chamber 60-80 DEG C, it is solid that 30-60 minutes form half
The fluorescent film of change.
A kind of LED light source, including：
Substrate with LED chip array, the surface of the substrate is formed with chemical gilding；
Covering LED chip array and the fluorescent film contacted with the surface of the substrate；And
Cover the fluorescent film and fixed lens on the substrate.
In a preferred embodiment, the fluorescent film coats the surrounding and top surface of whole LED chip array.
Relative to prior art, the preparation method of LED light source provided by the present invention utilizes hot pressing semi-solid preparation fluorescent film
Method improves packaging efficiency, simultaneously because the substrate of chemical gilding has certain roughness and the capacity of heat transmission, fluorescent film is fixed on
Substrate surface, there is good conjugation, and the optical characteristics and increase fluorescence of increase LED light source are further encapsulated using lens
Film mechanical strength, lamp bead fluorescent film during long-time use is so avoided the risk to come off occur.After substrate is gold-plated simultaneously,
The capacity of heat transmission of substrate is enhanced, it is possible to prevente effectively from being damaged after lamp bead is bright for a long time because temperature is too high.
Brief description of the drawings
Fig. 1 is the schematic flow sheet of the preparation method for the LED light source that embodiments of the invention provide.
Fig. 2 is the structural representation of LED light source prepared by Fig. 1 preparation method.
Main element symbol description
| LED light source | 100 |
| LED chip array | 10 |
| Substrate | 20 |
| Fluorescent film | 30 |
| Lens | 40 |
Following embodiment will combine above-mentioned accompanying drawing and further illustrate the present invention.
Embodiment
Referring to Fig. 1, a kind of preparation method of LED light source provided in an embodiment of the present invention, it comprises the following steps：
S101：The substrate with LED chip array is provided, the surface of the substrate is formed with chemical gilding；
S102：The fluorescent film of semi-solid preparation is provided, by the fluorescent film hot pressing on the LED chip array；
S103：Solidify the fluorescent film on the LED chip array and substrate；And
S104：Lens are provided, and the lens are arranged on the fluorescent film and substrate and form LED light source.
The substrate of offer is the aluminium base with multiple both positive and negative polarities, and its chemical gilding uses sulphite gold plating liquid, wherein
Gold sodium sulfide：3-5g/L；Sodium hypophosphite 4-8g/L；Sodium sulfite：15-20g/L；1,2- aminoethanes：1-5g/L；Bromination
Potassium：1-5g/L；After substrate is put into this sulphite gold plating liquid, using water bath heating temperature control at 60-80 DEG C, the time：30-
60min.In order to avoid the electrode on substrate is gold-plated, each electrode position is pasted respectively using one side acrylic glued membrane, it is to be electroplated
After the completion of, this glued membrane of tearing, then the LED chip array is integrated in the centre position of multiple both positive and negative polarities.In the present embodiment, institute
It is 3 × 3 arrays to state LED chip array.
The substrate of above-mentioned chemical gilding has certain roughness, is easy to be adhesively bonded with fluorescent film, chemical gilding also has
The capacity of heat transmission, fluorescent film durable bond can be made, and be radiated for LED.
The substrate is first preheated, and it is heated to 150 DEG C using the warm table of chip package machine, heat time 5-8
Minute.
The fluorescent film of the semi-solid preparation of offer can be prepared as follows：A/B silica gel and fluorescent material are mixed to form powder
Glue, arogel film is then formed by silk-screen printing, places into vacuum drying chamber 60-80 DEG C, 30-60 minutes form semi-solid preparation
Fluorescent film.
The fluorescent film of the semi-solid preparation uses the hot pressing of IT hot presses in the surrounding and top surface of the LED chip array.In order to
Fluorescent film separates with press upper holder block after being easy to hot pressing, adds a PET seperation films between fluorescent film and upper holder block before hot pressing,
Fluorescent film is bonded on upper holder block after this seperation film can effectively prevent hot pressing, so as to improve the qualification rate of hot pressing.
Given off heat while the IT hot presses hot pressing using a microwave heating equipment, it is solid to be heated to fluorescent film
Change, reduce the thermal stress in fluorescent film after solidifying, add the toughness of fluorescent film, be favorably improved the service life of lamp bead.
Also referring to Fig. 2, the LED light source 100 of the preparation method preparation of above-mentioned LED light source, including with LED chip battle array
The substrate 20 of row 10, the surface of the substrate 20 is formed with chemical gilding；Cover LED chip array and with the table of the substrate 20
The fluorescent film 30 of face contact；And the covering fluorescent film 30 and the lens 40 being fixed on the substrate 10.
The fluorescent film 30 coats the surrounding and top surface of whole LED chip array 10.The thickness of the fluorescent film 30 is
0.4-0.6mm.The lens 40 cover whole fluorescent film 30, and the lens 40 select PMMA (acrylic) material, are thickness
1.8-2.2mm convex lens.
The preparation method of LED light source provided by the present invention improves encapsulation effect using the method for hot pressing semi-solid preparation fluorescent film
Rate, simultaneously because the substrate of chemical gilding has certain roughness and the capacity of heat transmission, fluorescent film is fixed on substrate surface, has very
Good conjugation, and the optical characteristics and increase fluorescent film mechanical strength for increasing LED light source are further encapsulated using lens, so
Lamp bead fluorescent film during long-time use is avoided the risk to come off occur.After substrate is gold-plated simultaneously, leading for substrate is enhanced
Heat energy power, it is possible to prevente effectively from being damaged after lamp bead is bright for a long time because temperature is too high.
Although the present invention is disclosed above with embodiment, so it is not limited to the present invention, any art
Middle tool usually intellectual, it is without departing from the spirit and scope of the invention, therefore of the invention when a little change and retouching can be made
Protection domain when depending on after attached claim institute defender be defined.
Claims (10)
1. a kind of preparation method of LED light source, including：
The substrate with LED chip array is provided, the surface of the substrate is formed with chemical gilding；
The fluorescent film of semi-solid preparation is provided, by the fluorescent film hot-press solidifying on the LED chip array and substrate；And
Lens are provided, and the lens are arranged on the fluorescent film and substrate and form LED light source.
2. the preparation method of LED light source as claimed in claim 1, it is characterised in that the substrate is with multiple both positive and negative polarities
Aluminium base, the LED chip array is integrated in the centre position of multiple both positive and negative polarities.
3. the preparation method of LED light source as claimed in claim 1, it is characterised in that the preheating of the substrate is to use chip
The warm table of packaging machine is heated to 150 DEG C, and the heat time is 5-8 minutes.
4. the preparation method of LED light source as claimed in claim 1, it is characterised in that the fluorescent film of the semi-solid preparation uses IT
Surrounding and top surface of the hot press hot pressing in the LED chip array.
5. the preparation method of LED light source as claimed in claim 4, it is characterised in that while the IT hot presses hot pressing
Fluorescent film is heating and curing using a microwave heating equipment.
6. the preparation method of LED light source as claimed in claim 1, it is characterised in that the preparation of the fluorescent film of the semi-solid preparation
Including A/B silica gel and fluorescent material are mixed to form into arogel, arogel film is then formed by silk-screen printing, places into vacuum drying chamber
Interior 60-80 DEG C, 30-60 minutes form the fluorescent film of semi-solid preparation.
7. a kind of LED light source, including：
Substrate with LED chip array, the surface of the substrate is formed with chemical gilding；
Covering LED chip array and the fluorescent film contacted with the surface of the substrate；And
Cover the fluorescent film and fixed lens on the substrate.
8. LED light source as claimed in claim 7, it is characterised in that the fluorescent film coats the surrounding of whole LED chip array
And top surface.
9. LED light source as claimed in claim 8, it is characterised in that the thickness of the fluorescent film is 0.4-0.6mm.
10. LED light source as claimed in claim 8, it is characterised in that the lens cover whole fluorescent film, and the lens are
Thickness 1.8-2.2mm convex lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710113282.XA CN107546220A (en) | 2017-02-28 | 2017-02-28 | LED light source and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710113282.XA CN107546220A (en) | 2017-02-28 | 2017-02-28 | LED light source and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107546220A true CN107546220A (en) | 2018-01-05 |
Family
ID=60966803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710113282.XA Pending CN107546220A (en) | 2017-02-28 | 2017-02-28 | LED light source and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107546220A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111106228A (en) * | 2018-10-26 | 2020-05-05 | 江西省晶能半导体有限公司 | LED lamp bead preparation method |
| CN111653658A (en) * | 2020-06-09 | 2020-09-11 | 福建天电光电有限公司 | Preparation process of light-emitting diode with C-stage PIS solid fluorescent film |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203836739U (en) * | 2014-02-18 | 2014-09-17 | 江苏新广联光电股份有限公司 | Silicon-substrate LED road lamp light source module |
| CN104617205A (en) * | 2015-01-23 | 2015-05-13 | 厦门多彩光电子科技有限公司 | Combined type round high power integration LED (light emitting diode) light source |
| CN105932144A (en) * | 2016-07-03 | 2016-09-07 | 江苏罗化新材料有限公司 | Chip-level LED packaging equipment and method and preparation method of fluorescent film |
| CN106058013A (en) * | 2016-07-29 | 2016-10-26 | 江苏罗化新材料有限公司 | Chip level LED packaging technology |
-
2017
- 2017-02-28 CN CN201710113282.XA patent/CN107546220A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203836739U (en) * | 2014-02-18 | 2014-09-17 | 江苏新广联光电股份有限公司 | Silicon-substrate LED road lamp light source module |
| CN104617205A (en) * | 2015-01-23 | 2015-05-13 | 厦门多彩光电子科技有限公司 | Combined type round high power integration LED (light emitting diode) light source |
| CN105932144A (en) * | 2016-07-03 | 2016-09-07 | 江苏罗化新材料有限公司 | Chip-level LED packaging equipment and method and preparation method of fluorescent film |
| CN106058013A (en) * | 2016-07-29 | 2016-10-26 | 江苏罗化新材料有限公司 | Chip level LED packaging technology |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111106228A (en) * | 2018-10-26 | 2020-05-05 | 江西省晶能半导体有限公司 | LED lamp bead preparation method |
| CN111653658A (en) * | 2020-06-09 | 2020-09-11 | 福建天电光电有限公司 | Preparation process of light-emitting diode with C-stage PIS solid fluorescent film |
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