CN204271128U - There is high-capacity LED lamp ceramic substrate and the lamp of corrupt split interface layer - Google Patents
There is high-capacity LED lamp ceramic substrate and the lamp of corrupt split interface layer Download PDFInfo
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- CN204271128U CN204271128U CN201420769057.3U CN201420769057U CN204271128U CN 204271128 U CN204271128 U CN 204271128U CN 201420769057 U CN201420769057 U CN 201420769057U CN 204271128 U CN204271128 U CN 204271128U
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- interface layer
- ceramic substrate
- split interface
- led lamp
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Abstract
A kind of high-capacity LED lamp ceramic substrate with corrupt split interface layer, confession arranges the LED element that luminous power is greater than ten watts on every square centimeter of area, this high-capacity LED lamp ceramic substrate comprises: one deck thin type ceramic substrate body, have an end face and one away from and the bottom surface of this end face relatively, wherein this end face and bottom thickness spacing are less than 2mm; One deck is arranged at the enable circuit of this end face; One deck sputter forms in the corrupt split interface layer of this bottom surface, and thickness is lower than 200 μm, and wherein this corrupt split interface layer has the thermal coefficient of expansion higher than above-mentioned ceramic substrate body, and this corrupt split interface layer is formed with the expansion gap of plural number; And one deck is bonded to the layers of copper of this corrupt split interface layer, be wherein formed with the heat exchanger fluid circulation duct that at least one diameter is greater than 5mm.
Description
Technical field
A kind of LED ceramic substrate, especially has high-capacity LED lamp ceramic substrate and the lamp of corrupt split interface layer, is greater than the LED element of ten watts for arranging luminous power on every square centimeter of area.
Background technology
Printing (print) refers to that the picture and text message on original copy is transferred to the technology on article to be printed by use forme or other modes, initial printing is only by original copy intactly slavish copying, along with the developing development of printing technology, the evolution of printing apparatus function, make the finished product after printing can merge different original copy content and present in the lump, formed and the distinct looks of original copy.The processing problems that traditional printing the most often runs into is exactly multicolor overprint, even if register trouble really also can make the complete distortion of image slightly; In addition, because the last color ink on surface does not have bone dry, to pollute each other during rear printing of the same colour, goods after prining must be waited for a period of time, until surperficial finish-drying just can carry out follow-up processing operation, procrastinate the whole efficiency of printing unavoidably, for effectively promoting production procedure efficiency, printer just can adopt the mode of surperficial glazing, takes precautions against still undried ink dye of swooning because of following process and exceeds predetermined printing zone, use and strive for valuable timeliness.
What traditional printing used mostly is by printed material material the material that paper etc. possesses good blotting characteristic, ink is made can effectively to allow by print materials adsorption, along with social high development, the demand of printed matter is also promoted gradually, once be replaced by plastic cement by printed material material, glass or metal etc. not easily absorb the material of ink, passing printing technology cannot Payload, for this reason, printer improves further, the mode of printing with ultraviolet curing ink (UV ink) reaches the printing demand of society now, the main component of UV ink is light-cured resin, light initiator (effectively bringing out the main component of ink setting after making Ultraviolet radiation), pigment and related auxiliaries, by the irradiation of ultraviolet light, the object making it cause physical-chemical reaction (cross-linking reaction) to reach dry.This also makes UV ink have than traditional ink and better uses elasticity.
But, in the environments of plant most now, still there is many problems according to UV printing to need to overcome, such as the light conversion efficiency of general quartz burner is not good, not only wastes energy, also can produce a large amount of used heat in irradiation process, have the effective cooling system of additional configuration only to reduce the serviceability temperature of UV fluorescent tube, just extended the useful life of UV fluorescent tube, this measure allows printer unnecessarily increase printing cost, quite helpless.Especially the luminous power of quartz burner is limited, and the cured printing ink time is elongated, and printing time cannot be shortened easily.
For solving foregoing problems, part dealer considers to eliminate with light-emitting diode (LED) ultra-violet lamp to change passing UV fluorescent tube, as UV printing ink solidifying lamp source, the heat energy that LED UV lamp produces is about 1/5th of passing UV fluorescent tube, effectively can reduce the use of the energy and the generation of high heat.But the luminous power of current LED UV lamp is not enough, still cannot solve the demand of high speed printing, market expects that output efficiency is subject to obvious restriction.
For this reason, the utility model provides a kind of high-capacity LED lamp ceramic substrate with corrupt split interface layer, LED by high power (every square centimeter of area is arranged luminous power and be greater than ten watts) is irradiated by the UV ink on printed material material, by high-power UV-irradiation, UV ink just can complete solidification rapidly in work flow at a high speed, the print speed printing speed of production line thus significantly promote, more effectively can reduce cost of manufacture, make different material be engaged with each other smoothly with corrupt split interface layer simultaneously, the heating of LED can outwards be conducted smoothly, and utilization is bonded to the heat exchanger fluid circulation duct formed in the layers of copper of corrupt split interface layer, link a liquid circulation pump, the used heat of high-capacity LED lamp output is derived via heat exchanger fluid circulation duct, to guarantee that the temperature of operating environment can not be too high, guarantee optical output power and extend useful life of high-capacity LED lamp.
Utility model content
One of the utility model object is to provide a kind of high-capacity LED lamp ceramic substrate with corrupt split interface layer, keeps good heat radiating, keeps the luminous power of LED element by this.
Another object of the utility model is to provide a kind of high-capacity LED lamp ceramic substrate with corrupt split interface layer, keeps good heat radiating, extends the useful life of LED element by this.
A utility model again object is to provide a kind of high-capacity LED lamp ceramic substrate with corrupt split interface layer, by the structure of expansion gap, by pottery and intermetallic expanded by heating difference absorption, the structure of interface linking portion is avoided to damage because of thermal stress.
The another object of the utility model is to provide a kind of high-capacity LED lamp with corrupt split interface layer being formed with heat exchanger fluid circulation duct, UV ink energy rapid solidification is made by the luminous power of high strength, promote overall printing output efficiency, effectively reduce cost of manufacture.
The utility model again another object is to provide a kind of high-capacity LED lamp being provided with a slice optical lens, heat exchanger fluid circulation duct is linked a liquid circulation pump, the used heat of generation is made to conduct to outside and avoid used heat to pile up, to guarantee light power and to increase the service life.
For reaching above-mentioned purpose, the utility model provides a kind of high-capacity LED lamp ceramic substrate with corrupt split interface layer, comprise: one deck thin type ceramic substrate body, have an end face and one away from and the bottom surface of this end face relatively, wherein this end face and bottom thickness spacing are less than 2mm; One deck is arranged at the enable circuit of this end face; One deck sputter forms in the corrupt split interface layer of this bottom surface, and thickness is lower than 200 μm, and wherein this corrupt split interface layer has the thermal coefficient of expansion higher than above-mentioned ceramic substrate body, and this corrupt split interface layer is formed with the expansion gap of plural number; And one deck is bonded to the layers of copper of this corrupt split interface layer.
End face in above-mentioned high-capacity LED lamp ceramic substrate is additionally arranged at least one LED grain, namely high-capacity LED lamp of the present utility model is become, comprise: a high-capacity LED lamp ceramic substrate, comprise one deck thin type ceramic substrate body, have an end face and one away from and the bottom surface of this end face relatively, wherein this end face and bottom thickness spacing are less than 2mm; One deck is arranged at the enable circuit of this end face; One deck sputter forms in the corrupt split interface layer of this bottom surface, and thickness is lower than 200 μm, and wherein this corrupt split interface layer has the thermal coefficient of expansion higher than above-mentioned ceramic substrate body, and this corrupt split interface layer is formed with the expansion gap of plural number; And one deck is bonded to the layers of copper of this corrupt split interface layer, be wherein formed with the heat exchanger fluid circulation duct that at least one diameter is greater than 5mm; And at least one is arranged at the LED grain of this end face, and by this enable circuit power supply light emitting.
Therefore, a kind of high-capacity LED lamp ceramic substrate with corrupt split interface layer that the utility model discloses, can effectively keep the LED operating environment temperature in lamp suitable, ultraviolet leds is made to keep high luminous power, allow UV ink can in high speed printing board rapid solidification, guarantee that overall printing-flow is smooth and easy and also effectively reduce cost of manufacture.Simultaneously, due to the used heat produced during the luminescence of the utility model high-capacity LED lamp, can via the layer of metal of the bottom surface sputter at thin type ceramic substrate body in conjunction with interface layer, smooth heat transfer is in conjunction with good layers of copper, via the layers of copper of the coefficient of heat conduction far above ceramic substrate, used heat is continued to discharge, especially in the corrupt split interface layer of sputter, more be formed with the expansion gap of plural number, allow high-capacity LED lamp in the process that colds and heat succeed each other of Long-Time Service, pottery and intermetallic interface can not be made to peel off because of thermal stress, avoid the formation of the gap of high thermal resistance, also the useful life of lamp itself is extended further.
Accompanying drawing explanation
Fig. 1 is the side sectional view of the utility model thin type ceramic substrate body, is placed by the mode turned upside down, and uses sputter on expression bottom surface and forms layer of metal in conjunction with interface layer.
Fig. 2 is the vertical view of the utility model thin type ceramic substrate body, and the polygon metal blocks of clear display corrupt split interface layer separated by expansion gap.
Fig. 3 is the vertical view of the utility model thin type ceramic substrate body, is to illustrate that enable circuit is formed at end face in the mode of sputter equally.
Fig. 4 is the side sectional view of the utility model high-capacity LED lamp ceramic substrate, is to illustrate that thin type ceramic substrate body engages with corrupt split interface layer with layers of copper.
Fig. 5 is the side schematic view of the utility model high-capacity LED lamp ceramic substrate, and the heat exchanger fluid circulation duct of expressing layers of copper is connected to pump with pipe joint.
Fig. 6 is the vertical view of the utility model high-capacity LED lamp, and display LED grain is by enable circuit power supply light emitting.
Fig. 7 is the end view of the utility model high-capacity LED lamp, and display LED grain concentrates lighting angle with optical lens, promotes luminous intensity.
Symbol description
1 ' ... high-capacity LED lamp 2,2 ' ... high-capacity LED lamp ceramic substrate
22 ... thin type ceramic substrate body 222,222 ' ... end face
224 ... bottom surface 24 ... corrupt split interface layer
242 ... expansion gap 244 ... polygon metal blocks
26,26 ' ... enable circuit 28 ... layers of copper
280 ... pipe joint 282 ... heat exchanger fluid circulation duct
284 ... radiating fin 3 ' ... LED grain
4 ' ... optical lens 5 ... pump
6 ' ... quartz glass
Embodiment
About aforementioned and other technology contents, feature and effect of the present utility model, in the detailed description of the preferred embodiment below in conjunction with accompanying drawing, can know and present; In addition, in embodiments, identical element represents with similar label.
The preferred embodiment with the high-capacity LED lamp ceramic substrate of corrupt split interface layer of the present utility model, please also refer to shown in Fig. 1 to Fig. 5, high-capacity LED lamp ceramic substrate 2 comprises the thin type ceramic substrate body 22 that a thickness is less than 2mm, for improving the capacity of heat transmission, its material selects aluminium nitride, especially for reducing the higher impact of ceramic coefficient, thin type ceramic substrate body 22 thickness selected is in this example about 1mm.And for ease of for the purpose of illustrating, this definition thin type ceramic substrate body 22 have an end face 222 and one away from and the bottom surface 224 of opposing top 222.In graphic explanation, for explaining that bottom surface 224 sputter has the corrupt split interface layer 24 of layer of metal thin layer, be therefore that the mode turned upside down is drawn in partial view.
In this example, by sputter copper, build up out in bottom surface 224 one deck and thin type ceramic substrate body 22 combine closely and thickness lower than the corrupt split interface layer 24 of 200 μm, and under the planning of the predetermined pattern of shade, a plurality of expansion gap 242 can be formed with by the region that aforementioned shade covers, otherwise, corrupt split interface layer 24 can be formed multiple each other via the polygon metal blocks 244 that expansion gap 242 is isolated in the region of non-crested, aforesaid expansion gap 242 and polygon metal blocks 244 present with exaggeration ratio for clear expression is special.Then by thin type ceramic substrate body about 22 180 degree upset, as shown in Figure 3, end face 222 upwards exposed and in the mode of sputter, one deck enable circuit 26 be set on end face 222 equally.Certainly, being familiar with the art personage can understand easily, even if enable circuit changes the mode with screen painting, makes conducting resinl uniform application to the end face of thin type ceramic substrate body, does not affect technology of the present utility model equally and implements.
After corrupt split interface layer 24 is arranged and temperature cools, layers of copper 28 preshaped for a slice is positioned in corrupt split interface layer 24, adopts the mode of hot pressing to allow the polygon metal blocks 244 of corrupt split interface layer 24 really be bonded to layers of copper 28 as metallic plate in this example.Because the thermal coefficient of expansion of thin type ceramic substrate body 22 is about 4.5*10
-6/ DEG C, layers of copper 28 is then 17.5*10
-6/ DEG C, both gaps more than four times, and be as the criterion with the crystal grain every square centimeter of area being arranged luminous power about 20 watts due to the LED installed in the present embodiment, no matter be the course of processing, or the use procedure that high-capacity LED lamp is lit, when high-capacity LED lamp ceramic substrate 2 entirety is rapidly heated, obvious thermal stress will be produced at thin type ceramic substrate body 22 and layers of copper 28 interface to each other, layers of copper 28 can be more flexible than thin type ceramic substrate body 22 quicker, cause high-capacity LED lamp ceramic substrate 2 easily thermal deformation to occur and bend and even peel off between interface, cause the situation that thermal resistance increases suddenly further, make high-capacity LED lamp rapid degradation.
Therefore, this example makes the polygon metal blocks 244 engaged with layers of copper 28 when expanded by heating by above-mentioned expansion gap 242, enough spacing can be had to stretch, absorb the differences in expansion that thermal stress produces, take precautions against the structure damage of thin type ceramic substrate body 22 by this, in the fabrication process, significantly output yield is promoted; During to use, then extended the useful life of substrate.
In addition, for strengthening heat conduction efficiency and increasing enough heat exchange areas, aforesaid layers of copper 28 thickness system is greater than 20mm, and at least one diameter of formation is greater than the heat exchanger fluid circulation duct 282 of 5mm in layers of copper 28, wherein the liquid that uses of heat exchanger fluid circulation duct 282 in this example example be interpreted as distilled water, and in being formed with the radiating fin 284 of plural number away from corrupt split interface layer 24 place, then each pipe joint 280 of aforementioned hot exchanging liquid circulation duct 282 is connected to a pump 5 with water pipe (non-label) respectively, the distilled water that in this example, the left side of pump 5 can make temperature rise by passing heat exchanger fluid circulation duct 282 is extracted out and is cooled, the distilled water of low temperature (being about 25 DEG C) then pours in heat exchanger fluid circulation duct 282 by opposite side once again, iterative cycles like this, set up a cooling recirculation system by this, be beneficial to high-capacity LED lamp ceramic substrate 2 by the waste thermal energy of generation in order by thin type ceramic substrate body 22, corrupt split interface layer 24 and layers of copper 28, most heat energy is allowed to discharge by the distilled water heat exchange in heat exchanger fluid circulation duct 282, to keep the operating environment temperature of high-capacity LED lamp can not be too high, guarantee its luminous efficiency and useful life.
Certainly, be familiar with the art person can think and, if the luminous power of high-capacity LED lamp only arranges the LED grain of about ten watts on every square centimeter of area, then also can consider to adopt ventilation type heat radiation, aforementioned pump is only replaced with air-blast device, and carry out heat exchange by radiating fin, still do not affect the execution of this technology.In addition, in this example, the bore of heat exchanger fluid circulation duct is then the size adopting 10mm, in the hope of effectively improving heat exchanger effectiveness.
By the description of previous embodiment, some characteristic of the present utility model can be found.Wherein, in the bottom surface sputter layer of metal of thin type ceramic substrate body in conjunction with interface layer, and engage the layers of copper of the coefficient of heat conduction far above high-capacity LED lamp ceramic substrate with this, can effectively keep the operating environment temperature of high-capacity LED lamp suitable, it is made to keep good luminous power, allow UV ink can in high speed printing board rapid solidification, guarantee that overall printing-flow is smooth and easy and also effectively reduce cost of manufacture.Simultaneously, due to the used heat produced during the luminescence of the utility model high-capacity LED lamp, can via the layer of metal of the bottom surface sputter at thin type ceramic substrate body in conjunction with interface layer, smooth heat transfer is in conjunction with good layers of copper, via the layers of copper of the coefficient of heat conduction far above thin type ceramic substrate body, used heat is continued to discharge, especially in the corrupt split interface layer of sputter, more be formed with the expansion gap of plural number, allow high-capacity LED lamp in the process that colds and heat succeed each other of hot binding process or Long-Time Service, thin type ceramic substrate body and intermetallic interface can not be made to peel off because of thermal stress, avoid the formation of the gap of high thermal resistance, also the useful life of high-capacity LED lamp itself is extended further.
The preferred embodiment of the utility model high-capacity LED lamp, please refer to shown in Fig. 6 and Fig. 7, after the assembling completing high-capacity LED lamp ceramic substrate 2 ' in as previous embodiment, for convenient subsequent job, the end face 222 ' being provided with a plurality of LED grain 3 ' is upwards exposed, the activation terminal of LED grain 3 ' is soldered to enable circuit 26 ', with by enable circuit 26 ' power supply light emitting.In addition, for effectively promoting the luminous efficiency of LED grain 3 ', the high-capacity LED lamp 1 ' of this example is also provided with a slice optical lens 4 ' on the optical axis of LED grain 3 ', rising angle is controlled to change, the shell (not shown) of high-capacity LED lamp more can be closed by a pieces of quartz glass 6 ', the aqueous vapor in the external world is effectively isolated, guarantee LED grain 3 ' not by external contamination or oxidation.
Only as described above, be only preferred embodiment of the present utility model, can not limit with this scope that the utility model implements, every simple equivalence change done according to the utility model claims and description with modify, all should still belong in scope that the utility model patent contains.
Claims (8)
1. have a high-capacity LED lamp ceramic substrate for corrupt split interface layer, it is characterized in that, confession arranges the LED element that luminous power is greater than ten watts on every square centimeter of area, and this high-capacity LED lamp ceramic substrate comprises:
One deck thin type ceramic substrate body, have an end face and one away from and the bottom surface of this end face relatively, wherein this end face and bottom thickness spacing are less than 2mm;
One deck is arranged at the enable circuit of this end face;
One deck sputter forms in the corrupt split interface layer of this bottom surface, and thickness is lower than 200 μm, and wherein this corrupt split interface layer has the thermal coefficient of expansion higher than above-mentioned thin type ceramic substrate body, and this corrupt split interface layer is formed with the expansion gap of plural number; And
One deck is bonded to the layers of copper of this corrupt split interface layer.
2. have the high-capacity LED lamp ceramic substrate of corrupt split interface layer as claimed in claim 1, it is characterized in that, wherein this corrupt split interface layer comprises multiple polygon metal blocks of isolating via above-mentioned expansion gap each other.
3. have the high-capacity LED lamp ceramic substrate of corrupt split interface layer as claimed in claim 1, it is characterized in that, wherein the material of this high-capacity LED lamp ceramic substrate is aluminium nitride.
4. as having the high-capacity LED lamp ceramic substrate of corrupt split interface layer in claims 1 to 3 as described in any one, it is characterized in that, wherein the thickness of above-mentioned layers of copper is greater than 20mm, be formed with the heat exchanger fluid circulation duct that at least one diameter is greater than 5mm in aforementioned layers of copper, and the diameter of above-mentioned heat exchanger fluid circulation duct is not less than 10mm.
5. have the high-capacity LED lamp ceramic substrate of corrupt split interface layer as claimed in claim 1, it is characterized in that, wherein this layers of copper is away from above-mentioned corrupt split interface layer place, is more formed with plurality of radiating fins.
6. have the high-capacity LED lamp ceramic substrate of corrupt split interface layer as claimed in claim 4, it is characterized in that, wherein this heat exchanger fluid circulation duct more comprises a pipe joint, is for connecting at least one pump.
7. a high-capacity LED lamp, is characterized in that, comprising:
A high-capacity LED lamp ceramic substrate, comprises
One deck thin type ceramic substrate body, have an end face and one away from and the bottom surface of this end face relatively, wherein this end face and bottom thickness spacing are less than 2mm;
One deck is arranged at the enable circuit of this end face;
One deck sputter forms in the corrupt split interface layer of this bottom surface, and thickness is lower than 200 μm, and wherein this corrupt split interface layer has the thermal coefficient of expansion higher than above-mentioned ceramic substrate body, and this corrupt split interface layer is formed with plural expansion gap; And
One deck is bonded to the layers of copper of this corrupt split interface layer, is wherein formed with the heat exchanger fluid circulation duct that at least one diameter is greater than 5mm; And
At least one is arranged at the LED grain of this end face, and by this enable circuit power supply light emitting.
8. high-capacity LED lamp as claimed in claim 7, is characterized in that, more comprise an optical lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420769057.3U CN204271128U (en) | 2014-12-09 | 2014-12-09 | There is high-capacity LED lamp ceramic substrate and the lamp of corrupt split interface layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420769057.3U CN204271128U (en) | 2014-12-09 | 2014-12-09 | There is high-capacity LED lamp ceramic substrate and the lamp of corrupt split interface layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204271128U true CN204271128U (en) | 2015-04-15 |
Family
ID=52805976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420769057.3U Expired - Fee Related CN204271128U (en) | 2014-12-09 | 2014-12-09 | There is high-capacity LED lamp ceramic substrate and the lamp of corrupt split interface layer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204271128U (en) |
-
2014
- 2014-12-09 CN CN201420769057.3U patent/CN204271128U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150415 Termination date: 20161209 |
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| CF01 | Termination of patent right due to non-payment of annual fee |